JPH03101197A - Hybrid ic package - Google Patents

Hybrid ic package

Info

Publication number
JPH03101197A
JPH03101197A JP23791889A JP23791889A JPH03101197A JP H03101197 A JPH03101197 A JP H03101197A JP 23791889 A JP23791889 A JP 23791889A JP 23791889 A JP23791889 A JP 23791889A JP H03101197 A JPH03101197 A JP H03101197A
Authority
JP
Japan
Prior art keywords
package
hybrid
earth
circuit board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23791889A
Other languages
Japanese (ja)
Inventor
Yukio Yoshida
幸雄 吉田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP23791889A priority Critical patent/JPH03101197A/en
Publication of JPH03101197A publication Critical patent/JPH03101197A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

PURPOSE:To reduce a distance between an IC package and an earth pattern on a printed board and provide a large contact area so as to ensure grounding by a method wherein a thin conducting member for grounding is attached to the outer surface of the package main part. CONSTITUTION:The fixing part 11 of a spring board 10 which is a thin conducting member is soldered to the bottom of the outer surface of a package main part 3. The spring board 10 is attached to earth patterns 14 on the upper surface of a printed board with contact parts 12 and 13 provided on both the sides of the fixing part 11. With this constitution, not only the earth terminals of an IC are connected to conventional earth patterns 2 with leads 5 but also are connected to the earth patterns through the package main part 3 and the spring board 10, so that the IC can be grounded with a shorter distance than a distance with a conventional method. Moreover, the areas of the contact parts 12 and 13 of the spring board 10 and the earth patterns 14 can be enlarged to provide ensured grounding.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明はハイブリッドＩＣ用パッケージの改良に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] This invention relates to an improvement of a package for a hybrid IC.

〔従来の技術〕[Conventional technology]

第４図は従来のパラレルシーム溶接形パッケージをプリ
ント基板に実装した状態を示す断面図である。FIG. 4 is a sectional view showing a conventional parallel seam welded package mounted on a printed circuit board.

この図において、（１）はプリンＩ・基板、（２）はプ
リント基板の下面に装着されたアースパターン、（３）
はハイブリッドＩＣの回路部を収容するパッケージ本体
、け）はパッケージ本体内に収容され、底面に装着され
たハイブリッドＩＣの回路部、（（５）はパッケージ本
体を貫通して外方に延在し、ハイブリッドＩＣの回路部
と外部回路とを電気的に接続するための複数のリードで
、その外端は図示のように、プリン１〜基板（１）の所
定の挿入部（６）に挿入される。図はアース接続用のリ
ードを示しており、アースパターン（２に半田（７）に
よって接続されている。In this figure, (1) is the printed circuit board, (2) is the ground pattern attached to the bottom of the printed circuit board, and (3)
(5) is the package body that houses the circuit section of the hybrid IC; , a plurality of leads for electrically connecting the circuit section of the hybrid IC and an external circuit, the outer ends of which are inserted into predetermined insertion parts (6) of the printed circuit board (1) as shown in the figure. The figure shows a lead for ground connection, which is connected to the ground pattern (2) by solder (7).

（８）はパッケージ本体のリード貫通部に充填され、リ
ードを固定すると共にパッケージ本体との絶縁を保持す
るハーメデックガラス、（９）はリードとハイブリッド
ＩＣの回路部のアース端子及びパッケージ本体とを接続
する接続線である。(8) is a Hermedic glass that is filled in the lead penetration part of the package body to fix the lead and maintain insulation from the package body; (9) is a glass that connects the lead to the ground terminal of the circuit section of the hybrid IC and the package body. This is the connection line to be connected.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

従来のハイブリッドＩＣ用パッケージは以上のように構
成されており、ハイブリッドＩＣの回路部のアース端子
とプリント基板のアースパターンとの距離が長いため、
高周波用として使用した場合、ハイブリッドＩＣの回路
部が電気的に不安定になるという問題点があった。Conventional hybrid IC packages are configured as described above, and because the distance between the ground terminal of the circuit section of the hybrid IC and the ground pattern of the printed circuit board is long,
When used for high frequency applications, there is a problem in that the circuit section of the hybrid IC becomes electrically unstable.

この発明はこのような問題点を解消するためになされた
もので、ハイブリッドＩＣの回路部のアース端子を短い
距離で、しかも確実にプリント基板のアースパターンに
接続することができるハイブリッドＩＣ用パッケージを
提供しようとするものである。This invention was made to solve these problems, and provides a hybrid IC package that can connect the ground terminal of the circuit section of the hybrid IC to the ground pattern of the printed circuit board over a short distance and reliably. This is what we are trying to provide.

〔課題を解決するための手段〕[Means to solve the problem]

この発明に係るハイブリッドＩＣ用パッケージは、パッ
ケージ本体の外面にアース接続端子となり得る導電部材
を装着するようにしたものである。In the hybrid IC package according to the present invention, a conductive member that can serve as a ground connection terminal is attached to the outer surface of the package body.

〔作　　用〕[For production]

この発明によれば、パッケージ本体の外面に装着された
導電部材が、プリント基板のアースパターンに直接接触
し得るため、ハイブリッドＩＣの回路部のアース端子と
プリント基板のアースパターンとの距離を非常に短くす
ることができる。又、導電部材とアースパターンとの接
触面積を大きくすることが可能であるためアースを確実
にすることができる。According to this invention, since the conductive member attached to the outer surface of the package body can directly contact the ground pattern of the printed circuit board, the distance between the ground terminal of the circuit section of the hybrid IC and the ground pattern of the printed circuit board can be kept very small. Can be shortened. Furthermore, since it is possible to increase the contact area between the conductive member and the ground pattern, the grounding can be ensured.

〔発明の実施例〕[Embodiments of the invention]

以下、この発明の一実施例を第１図について説明する。 An embodiment of the present invention will be described below with reference to FIG.

この図において［０１はパッケージ本体の外面の底部に
設けられた導電部材からなるばね板で、パッケージ本体
にろう付は等で固着される固着部（１１）と、この固着
部の両側に位置してプリント基板のアースパターンと接
触する接触部（１２）　（１３）とを有し、全体として
アース接続端子を構成するものである。又、（１４）は
プリント基板の上面に装着されたアースパターンである
。In this figure, [01] is a spring plate made of a conductive material provided at the bottom of the outer surface of the package body, and includes a fixing part (11) that is fixed to the package body by brazing or the like, and a spring plate located on both sides of this fixing part. It has contact portions (12) and (13) that come into contact with the ground pattern of the printed circuit board, and constitutes a ground connection terminal as a whole. Further, (14) is a ground pattern attached to the top surface of the printed circuit board.

その他の構成は従来のものと同様であるため説明を省略
する。The rest of the configuration is the same as the conventional one, so the explanation will be omitted.

このように構成されたハイブリッドＩＣ用パッケージを
プリント基板（１）に装着すると、第１図に示すように
、ばね板００）の接触部（１２）　（１３）がアースパ
ターン（Ｉ４）に接触する他、リード（５１は従来と同
様にアースパターン（２に半田（７）によって接続され
る。When the hybrid IC package configured in this way is mounted on the printed circuit board (1), the contact portions (12) (13) of the spring plate 00) come into contact with the ground pattern (I4), as shown in Figure 1. In addition, the lead (51) is connected to the ground pattern (2) by solder (7) as in the conventional case.

従ってハイブリッドＩＣの回路部のアース端子はリード
（５１による従来のアースパターン（２１への接続に加
えて、パッケージ本体（３）及びばね板ＱＯ）を経てア
ースパターン（１４）に至る接続が加わるため従（３） 来に比して短い距離でのアース接続が可能となる。Therefore, in addition to the connection to the conventional ground pattern (21) by the lead (51), the ground terminal of the circuit section of the hybrid IC is connected to the ground pattern (14) via the package body (3) and the spring plate QO. (3) Ground connection can be made over a shorter distance than before.

又、ばね板の接触部（１２）　（１３）の面積及びアー
スパターン（Ｉ４）の面積を大きくすることにより接触
面積を十分なものとすることができるため確実なアース
ができる。更に接触部（１２）　（１３）がばね板で構
成され、弾力性を有するため、接触部（１２）　（１３
）とアースパターン（１４）との接触状態が良好となり
、この面からもアースを確実にすることができる。Further, by increasing the area of the contact portions (12) and (13) of the spring plate and the area of the ground pattern (I4), the contact area can be made sufficient, so that reliable grounding can be achieved. Furthermore, since the contact parts (12) (13) are composed of spring plates and have elasticity, the contact parts (12) (13)
) and the ground pattern (14) are in good contact with each other, and grounding can be ensured from this surface as well.

なお、以上の説明では、ばね板で構成された導電部材を
パッケージ本体の外面に装着するようにした実施例を示
したが、第２図及び第３図に示すように、Ｌ形に折り曲
げられた適宜の長さの導電部材（１５）をパッケージ本
体（３）の外側面下部に装着すると共に、プリント基板
（１）の上面にアースパターン（１６）を設け、パッケ
ージをプリント基板に装着した際、第２図に示すように
、Ｌ形の導電部材（１５）とアースパターン（１６）と
を半田（１７）によって接続するようにしても同様な効
果を期待することができる。In the above explanation, an example has been shown in which a conductive member made of a spring plate is attached to the outer surface of the package body, but as shown in FIGS. 2 and 3, it is bent into an L shape. A conductive member (15) of an appropriate length is attached to the lower part of the outer surface of the package body (3), and a grounding pattern (16) is provided on the top surface of the printed circuit board (1), so that when the package is attached to the printed circuit board, As shown in FIG. 2, the same effect can be expected even if the L-shaped conductive member (15) and the ground pattern (16) are connected by solder (17).

〔発明の効果〕〔Effect of the invention〕

（４） 以上のように、この発明によればパッケージ本体の外面
に、アース接続端子となり得る導電部材を装着するよう
にしたため、ハイブリッドＩＣの回路部のアース端子を
短い距離で、しかも確実にアース接続することができ、
高周波用として使用した場合の電気的安定性を向上する
ことができるものである。(4) As described above, according to the present invention, since a conductive member that can serve as a ground connection terminal is attached to the outer surface of the package body, the ground terminal of the circuit section of the hybrid IC can be connected to the ground within a short distance and reliably. can be connected,
This can improve electrical stability when used for high frequency applications.

【図面の簡単な説明】[Brief explanation of drawings]

第１図はこの発明の一実施例をプリント基板に装着した
状態を示ず断面図、第２図及び第３図はこの発明の他の
実施例を示すもので、第３図は外観を示ず斜視図、第２
図はプリント基板に装着した状態を示す断面図、第４図
は従来のハイブリッドＩＣ用パッケージをプリント基板
に装着した状態を示す断面図である。 図において（１）はプリント基板、（２）（１４）　（
１６）はアースパターン、（３）はパッケージ本体、（
４）はハイブリッドＩＣの回路部、（（５）はリード、
（７）（１７）は半田、（８）はハーメチックガラス、
（１０）はばね板、（１１）は固着部、（１２）　（１
３）は接触部、（１５）はＬ形の導電部材である。 なお、 図中、 同一符号は同−又は相当部分を示 す。Fig. 1 is a cross-sectional view of one embodiment of the present invention, not showing the state in which it is mounted on a printed circuit board, and Figs. 2 and 3 show other embodiments of the invention, and Fig. 3 shows the external appearance. Perspective view, 2nd
The figure is a sectional view showing a state in which the conventional hybrid IC package is mounted on a printed circuit board, and FIG. 4 is a sectional view showing a state in which a conventional hybrid IC package is mounted on a printed circuit board. In the figure, (1) is a printed circuit board, (2) (14) (
16) is the ground pattern, (3) is the package body, (
4) is the circuit part of the hybrid IC, ((5) is the lead,
(7) (17) is solder, (8) is hermetic glass,
(10) is a spring plate, (11) is a fixed part, (12) (1
3) is a contact portion, and (15) is an L-shaped conductive member. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.

Claims (1)

【特許請求の範囲】[Claims] 　ハイブリッドＩＣの回路部を収容するパッケージ本体
の外面に、アース接続端子となり得る導電部材を装着し
たことを特徴とするハイブリッドＩＣ用パッケージ。A package for a hybrid IC, characterized in that a conductive member that can serve as a ground connection terminal is attached to the outer surface of a package body that accommodates a circuit section of the hybrid IC.
JP23791889A 1989-09-13 1989-09-13 Hybrid ic package Pending JPH03101197A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23791889A JPH03101197A (en) 1989-09-13 1989-09-13 Hybrid ic package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23791889A JPH03101197A (en) 1989-09-13 1989-09-13 Hybrid ic package

Publications (1)

Publication Number Publication Date
JPH03101197A true JPH03101197A (en) 1991-04-25

Family

ID=17022376

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23791889A Pending JPH03101197A (en) 1989-09-13 1989-09-13 Hybrid ic package

Country Status (1)

Country Link
JP (1) JPH03101197A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003019999A1 (en) * 2001-08-23 2003-03-06 Raytheon Company Low cost, large scale rf hybrid package for simple assembly onto mixed signal printed wiring boards

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003019999A1 (en) * 2001-08-23 2003-03-06 Raytheon Company Low cost, large scale rf hybrid package for simple assembly onto mixed signal printed wiring boards

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