JPH0247896A - Connection structure of high-frequency circuit board - Google Patents

Connection structure of high-frequency circuit board

Info

Publication number
JPH0247896A
JPH0247896A JP19921288A JP19921288A JPH0247896A JP H0247896 A JPH0247896 A JP H0247896A JP 19921288 A JP19921288 A JP 19921288A JP 19921288 A JP19921288 A JP 19921288A JP H0247896 A JPH0247896 A JP H0247896A
Authority
JP
Japan
Prior art keywords
frequency circuit
circuit board
high frequency
shield
shield cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19921288A
Other languages
Japanese (ja)
Other versions
JPH0638559B2 (en
Inventor
Eiichi Hiroeda
廣枝 栄一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP19921288A priority Critical patent/JPH0638559B2/en
Publication of JPH0247896A publication Critical patent/JPH0247896A/en
Publication of JPH0638559B2 publication Critical patent/JPH0638559B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Abstract

PURPOSE:To heighten a shielding effect while making high integration possible by holding all side parts of a shielding plate between a shielding cover and a second high frequency circuit board while making its tip to contact with a gland pattern of a first high frequency circuit board. CONSTITUTION:A hole is opened in the central part of a first high frequency circuit board 1, while gland patterns 21 are formed on a peripheral positions of the upper surface of a second high frequency circuit substrate 2 while the gland patterns are formed also on the peripheral part of the underside. Further, a shield cover 3 consisting of a conductive member of a metal or the like is formed in the shape of a reversed container having inside projection pieces 31 on its four corners. A shield plate 5 is interposed inside the shield cover 3. All sides 51 of the shield plate 5 are held between the shield cover 3 and a second high frequency circuit board 2, while putting the shield cover 3 and the gland pattern 21 of the second high frequency circuit board 2 on all side part 51 for making them to electrically contact so as to heighten a shield effect.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は2枚の高周波回路基板を接続し、かつ高周波部
分をシールドする接続構造に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a connection structure for connecting two high frequency circuit boards and shielding the high frequency portion.

〔従来の技術〕[Conventional technology]

従来、異なる寸法の高周波回路基板を接続し、かつその
高周波部分をシールドする構造として、第4図及び第5
図に示す構造が採用されている。
Conventionally, as a structure for connecting high-frequency circuit boards of different dimensions and shielding the high-frequency parts, the structures shown in Figs. 4 and 5 have been proposed.
The structure shown in the figure is adopted.

この構造は、第4図のように、第1の高周波回路基板1
上に第2の高周波回基板2を搭載し、かつこの第2の高
周波回路基板2の高周波部分をシールドカバー3で遮蔽
する構成となっている。そして、この構造では第4図の
B−B線断面及びC−C線断面を夫々第5図(a)及び
第5図(b)に示すように、シールドカバー3の四隅に
内側突片31を設け、この内側突片31において第1及
び第2の高周波回路基板1.2及びシールドカバー3を
ねじ4により一体的に固定することにより、各基板1.
2のグランドパターンを相互に接続させ、かつこのグラ
ンドパターンにシールドカバー3を接続させる構成とな
ついる。
This structure includes a first high frequency circuit board 1 as shown in FIG.
A second high-frequency circuit board 2 is mounted thereon, and the high-frequency portion of the second high-frequency circuit board 2 is shielded by a shield cover 3. In this structure, as shown in FIG. 5(a) and FIG. 5(b), respectively, the cross section taken along the line B-B and the cross-section taken along the line C-C in FIG. are provided, and the first and second high-frequency circuit boards 1.2 and the shield cover 3 are integrally fixed on the inner protruding piece 31 with screws 4, whereby each board 1.2 is integrally fixed with screws 4.
The configuration is such that the two ground patterns are connected to each other and the shield cover 3 is connected to this ground pattern.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

上述した従来の接続構造では、シールドカバー3の四隅
においては各基板1,2及びシールドカバー3がねじ4
により強固に接続されるが、中間の辺部においては、第
5図(b)のように各基板1.2とシールドカバー3の
各縁部が単に接触するのみである。このため、これら辺
部における接続性が低下され、かつシールド効果が低下
され易いという問題がある。
In the conventional connection structure described above, each board 1, 2 and the shield cover 3 are connected to the screws 4 at the four corners of the shield cover 3.
However, at the intermediate edge, each board 1.2 and each edge of the shield cover 3 simply contact each other, as shown in FIG. 5(b). For this reason, there is a problem that the connectivity at these side portions is reduced and the shielding effect is likely to be reduced.

これを改善するためには、各基板1,2やシールドカバ
ー3の接触部分に広い面積のグランドパターン部を設け
る対策、或いは接触部に半田を施す対策、更にはねじ4
の本数を増やして中間辺部においてもねし固定を行う対
策等がとられている。
In order to improve this, measures must be taken to provide a wide area ground pattern section at the contact area of each board 1, 2 and the shield cover 3, or to apply solder to the contact area, and furthermore, the screw 4.
Countermeasures are being taken, such as increasing the number of screws and fixing screws also at the middle side.

しかしながら、この対策では、グランドパターンを設け
ることにより回路基板のデッドスペースが増大し、高集
積化に不利となる。また、半田を施したり、ねじ数を増
やすことは、上記デッドスペースの増大とともに作業工
数を増加して作業効率を低下させるという問題も生ずる
However, with this measure, the dead space of the circuit board increases due to the provision of the ground pattern, which is disadvantageous to high integration. Further, applying solder or increasing the number of screws causes the problem that the dead space increases and the number of work steps increases, reducing work efficiency.

本発明は上述した問題を解消し、シールド効果が高く、
しかも高集積化に有利な高周波回路基板の接続構造を提
供することを目的としている。
The present invention solves the above-mentioned problems, has a high shielding effect,
Moreover, it is an object of the present invention to provide a connection structure for a high frequency circuit board that is advantageous for high integration.

〔課題を解決するための手段〕[Means to solve the problem]

本発明の高周波回路基板の接続構造は、第1の高周波回
路基板と、この上に搭載される第2の高周波回路基板と
、この第2の高周波回路基板上に被せられ、かつその四
隅において前記第1及び第2の高周波回路基板を貫通す
るねじによりこれら基板に締結固定されるシールドカバ
ーと、このシールドカバーと第2の高周波回路基板との
間に介挿される金属製のシールド板とを備えており、シ
ールド板はその四辺部を階段状に折曲げ加工するととも
に、この四辺部をシールドカバーと第2の高周波回路基
板との間で挟持されるように配設し、かつ四辺部の先端
を第1の高周波回路基板に設けたグランドパターンに接
触させるように構成している。
The high frequency circuit board connection structure of the present invention includes a first high frequency circuit board, a second high frequency circuit board mounted on the first high frequency circuit board, and a first high frequency circuit board that is placed on the second high frequency circuit board and that A shield cover is fastened and fixed to the first and second high-frequency circuit boards by screws passing through the boards, and a metal shield plate is inserted between the shield cover and the second high-frequency circuit board. The shield plate has four sides bent into a step-like shape, and the four sides are arranged so as to be sandwiched between the shield cover and the second high-frequency circuit board, and the tips of the four sides are bent. is configured to be brought into contact with a ground pattern provided on the first high frequency circuit board.

〔作用〕[Effect]

上述した構成では、シールド板の四辺部がシールドカバ
ーと第2の高周波回路基板との間に挟持されることでこ
れらの間の接触を良好にしてシールド効果を高め、かつ
シールド板の四辺部の先端を第1の高周波回路基板のグ
ランドパターンに接触させることで第1及び第2の高周
波回路基板の相互グランド接触をも改善する。
In the above-described configuration, the four sides of the shield plate are sandwiched between the shield cover and the second high-frequency circuit board, thereby improving the contact between them and enhancing the shielding effect. By bringing the tip into contact with the ground pattern of the first high frequency circuit board, mutual ground contact between the first and second high frequency circuit boards is also improved.

[実施例] 次に、本発明を図面を参照して説明する。[Example] Next, the present invention will be explained with reference to the drawings.

第1図は本発明の一実施例の一部破断斜視図、第2図は
そのA−A線に沿う断面図である。これらの図において
、■は比較的大きな寸法の第1の高周波回路基板であり
、その中央部には穴11が開設され、かつ上面には穴1
1の周辺位置にグランドパターン12を形成している。
FIG. 1 is a partially cutaway perspective view of an embodiment of the present invention, and FIG. 2 is a sectional view taken along line A--A. In these figures, ■ is a first high-frequency circuit board with relatively large dimensions, with a hole 11 in the center and a hole 1 in the top surface.
A ground pattern 12 is formed at a peripheral position of 1.

また、2はこれよりも小さい寸法をした第2の高周波回
路基板であり、その上面の周辺部にはグランドパターン
21を形成し、また図示は省略するが下面の周辺部にも
グランドパターン22を形成している。更に、3は金属
等の導電性部材からなるシールドカバーであり、遊客器
状に形成され、その四隅には内側突片31を有している
。そして、このシールドカバー3は、前記第1の高周波
回路基板1上に搭載された第2の高周波回路基板2上に
被せられ、四隅の内側突片31において前記第1及び第
2の各高周波回路基板1.2を貫通するねじ4によって
締結固定される。
Further, 2 is a second high-frequency circuit board having smaller dimensions, and a ground pattern 21 is formed on the periphery of the upper surface, and a ground pattern 22 is also formed on the periphery of the lower surface, although not shown. is forming. Furthermore, 3 is a shield cover made of a conductive member such as metal, which is formed in the shape of an amusement machine, and has inner protruding pieces 31 at its four corners. This shield cover 3 is placed over the second high-frequency circuit board 2 mounted on the first high-frequency circuit board 1, and the first and second high-frequency circuits are placed on the inner protrusions 31 at the four corners. It is fastened and fixed by screws 4 passing through the substrate 1.2.

ここで、前記シールドカバー3の内側には、第3図に示
すシールド板5が介挿されている。このシールド板5は
、若干のばね性を有する金属板を打抜き、折曲げ加工し
て、略シールドカバー3に近い箱型形状とし、更にその
四隅部を削除するとともに、四辺部51を階段状に曲げ
形成し、この四辺部51を周辺方向及び下方に向けて突
出させている。
Here, a shield plate 5 shown in FIG. 3 is inserted inside the shield cover 3. This shield plate 5 is made by punching and bending a metal plate with some spring properties to form a box-like shape approximately similar to the shield cover 3.Furthermore, the four corners are removed, and the four sides 51 are shaped into a stepped shape. The four sides 51 are bent and protrude toward the periphery and downward.

そして、このシールド板5を前記シールドカバー3と第
2の高周波回路基板2との間に介挿し、四辺部51がシ
ールドカバー3の四辺部と第2の高周波回路基板2との
間に挟持されるようにして前記ねじ4により締結を行っ
ている。
Then, this shield plate 5 is inserted between the shield cover 3 and the second high-frequency circuit board 2, and the four sides 51 are sandwiched between the four sides of the shield cover 3 and the second high-frequency circuit board 2. The screws 4 are used for fastening.

この構成によれば、シールド板5は四辺部51がシール
ドカバー3と第2高周波回路基板2との間に挟持される
ことにより、シールドカバー3と第2高周波回路基板2
のグランドパターン21とをその四辺部51に置いて電
気的に接触させ、シールド効果を高めることができる。
According to this configuration, the four sides 51 of the shield plate 5 are sandwiched between the shield cover 3 and the second high frequency circuit board 2, so that the shield cover 3 and the second high frequency circuit board
The shielding effect can be enhanced by placing the ground pattern 21 on the four sides 51 and electrically contacting the ground pattern 21.

また、この四辺部51の下側先端は第1の高周波回路基
板1のグランドパターン12にも接触し、第1及び第2
の各高周波回路基板1.2間におけるグランド接触をも
良好なものとする。
Further, the lower tips of the four sides 51 also come into contact with the ground pattern 12 of the first high frequency circuit board 1, and
The ground contact between each of the high frequency circuit boards 1 and 2 is also made good.

したがって、ねじ4による締結がシールドカバー3の四
隅のみに限定されていても、周辺部において良好なグラ
ンド接触を確保でき、第1及び第2の高周波回路基板1
,2間はもとより、第2の高周波回路基板2とシールド
カバー3との間のシールド効果を高めることができる。
Therefore, even if the screws 4 are fastened only to the four corners of the shield cover 3, good ground contact can be ensured in the periphery, and the first and second high frequency circuit boards 1
, 2 as well as between the second high frequency circuit board 2 and the shield cover 3.

これにより、グランドパターンの拡大や半田付け、更に
はねじを増加する等の対策をとる必要はなく、高集積化
を可能としかつ作業効率の低下が防止できる。
This eliminates the need to take measures such as enlarging the ground pattern, soldering, and even increasing the number of screws, making it possible to achieve high integration and prevent a decrease in work efficiency.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明は、シールドカバーと第2の
高周波回路基板との間にシールド板を介挿し、このシー
ルド板の四辺部をシールドカバーと第2の高周波回路基
板との間で挟持させ、かつその先端を第1の高周波回路
基板のグランドパターンに接触させているので、シール
ドカバーと第2の高周波回路基板との間のシールド効果
を高めるとともに、第1及び第2の高周波回路基板の相
互グランド接触をも改善し、シールド効果を向上できる
。また、シールドカバーを四隅でねし締結するだけでも
十分なシールド効果が得られるので、グランドパターン
の拡大や半田付は及びねじ数の増加を行う必要がなく、
作業効率を改善できる効果もある。
As explained above, in the present invention, a shield plate is inserted between a shield cover and a second high-frequency circuit board, and the four sides of this shield plate are sandwiched between the shield cover and the second high-frequency circuit board. , and its tip is in contact with the ground pattern of the first high-frequency circuit board, thereby increasing the shielding effect between the shield cover and the second high-frequency circuit board, and increasing the shielding effect between the first and second high-frequency circuit boards. It also improves mutual ground contact and improves the shielding effect. In addition, a sufficient shielding effect can be obtained by simply tightening the shield cover at the four corners, so there is no need to enlarge the ground pattern, solder, or increase the number of screws.
It also has the effect of improving work efficiency.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の一実施例の一部破断斜視図、第2図は
第1図のA−A線に沿う縦断面図、第3図はシールド板
の斜視図、第4図は従来の高周波回路基板接続構造の斜
視図、第5図(a)及び(b)は夫々第4図のB−B線
、C−C線に沿う縦断面図である。 1・・・第1の高周波回路基板、2・・・第2の高周波
回路基板、3・・・シールドカバー、4・・・ねじ、5
・・・シールド板、11・・・穴、12・・・グランド
パターン、21・・・グランドパターン、31・・・内
側突片、51・・・四辺部。 第5図
Fig. 1 is a partially cutaway perspective view of an embodiment of the present invention, Fig. 2 is a longitudinal cross-sectional view taken along line A-A in Fig. 1, Fig. 3 is a perspective view of a shield plate, and Fig. 4 is a conventional FIGS. 5(a) and 5(b) are vertical cross-sectional views taken along line B-B and line C-C in FIG. 4, respectively. DESCRIPTION OF SYMBOLS 1... First high frequency circuit board, 2... Second high frequency circuit board, 3... Shield cover, 4... Screw, 5
... Shield plate, 11 ... Hole, 12 ... Ground pattern, 21 ... Ground pattern, 31 ... Inner protrusion piece, 51 ... Four sides. Figure 5

Claims (1)

【特許請求の範囲】[Claims] 1.第1の高周波回路基板と、この上に搭載される第2
の高周波回路基板と、この第2の高周波回路基板上に被
せられ、かつその四隅において前記第1及び第2の高周
波回路基板を貫通するねじによりこれら基板に締結固定
されるシールドカバーと、このシールドカバーと第2の
高周波回路基板との間に介挿される金属製のシールド板
とを備え、このシールド板はその四辺部を階段状に折曲
げ加工するとともに、この四辺部をシールドカバーと第
2の高周波回路基板との間で挟持されるように配設し、
かつ四辺部の先端を第1の高周波回路基板に設けたグラ
ンドパターンに接触させるように構成したことを特徴と
する高周波回路基板の接続構造。
1. A first high frequency circuit board and a second high frequency circuit board mounted thereon.
a high-frequency circuit board, a shield cover placed over the second high-frequency circuit board and fastened and fixed to the first and second high-frequency circuit boards at its four corners by screws passing through the first and second high-frequency circuit boards; and the shield. A metal shield plate is inserted between the cover and the second high-frequency circuit board, and the four sides of the shield plate are bent into a step shape, and the four sides are connected to the shield cover and the second high-frequency circuit board. arranged so as to be sandwiched between the high frequency circuit board of
A connection structure for a high frequency circuit board, characterized in that the tips of the four sides are brought into contact with a ground pattern provided on the first high frequency circuit board.
JP19921288A 1988-08-10 1988-08-10 High-frequency circuit board connection structure Expired - Lifetime JPH0638559B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19921288A JPH0638559B2 (en) 1988-08-10 1988-08-10 High-frequency circuit board connection structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19921288A JPH0638559B2 (en) 1988-08-10 1988-08-10 High-frequency circuit board connection structure

Publications (2)

Publication Number Publication Date
JPH0247896A true JPH0247896A (en) 1990-02-16
JPH0638559B2 JPH0638559B2 (en) 1994-05-18

Family

ID=16403997

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19921288A Expired - Lifetime JPH0638559B2 (en) 1988-08-10 1988-08-10 High-frequency circuit board connection structure

Country Status (1)

Country Link
JP (1) JPH0638559B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5323299A (en) * 1992-02-12 1994-06-21 Alcatel Network Systems, Inc. EMI internal shield apparatus and methods
US5335147A (en) * 1992-02-12 1994-08-02 Alcatel Network Systems, Inc. EMI shield apparatus and methods

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5323299A (en) * 1992-02-12 1994-06-21 Alcatel Network Systems, Inc. EMI internal shield apparatus and methods
US5335147A (en) * 1992-02-12 1994-08-02 Alcatel Network Systems, Inc. EMI shield apparatus and methods

Also Published As

Publication number Publication date
JPH0638559B2 (en) 1994-05-18

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