JPH024469A - Device for applying thin film - Google Patents
Device for applying thin filmInfo
- Publication number
- JPH024469A JPH024469A JP15557688A JP15557688A JPH024469A JP H024469 A JPH024469 A JP H024469A JP 15557688 A JP15557688 A JP 15557688A JP 15557688 A JP15557688 A JP 15557688A JP H024469 A JPH024469 A JP H024469A
- Authority
- JP
- Japan
- Prior art keywords
- coating liquid
- coating
- solvent
- tank
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010409 thin film Substances 0.000 title claims abstract description 27
- 238000000576 coating method Methods 0.000 claims abstract description 111
- 239000011248 coating agent Substances 0.000 claims abstract description 108
- 239000007788 liquid Substances 0.000 claims abstract description 66
- 239000002904 solvent Substances 0.000 claims abstract description 48
- 239000010408 film Substances 0.000 claims abstract description 27
- 238000009501 film coating Methods 0.000 claims description 14
- 239000000203 mixture Substances 0.000 abstract description 9
- 230000015572 biosynthetic process Effects 0.000 abstract description 3
- 238000009834 vaporization Methods 0.000 abstract 1
- 230000008016 vaporization Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 12
- 238000007598 dipping method Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 2
- 108091008695 photoreceptors Proteins 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 241001367053 Autographa gamma Species 0.000 description 1
- 241001417527 Pempheridae Species 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、物体の表面に薄膜を形成する薄膜塗布装置
に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a thin film coating device for forming a thin film on the surface of an object.
近年、磁気記録媒体の表面保護膜、電子写真用感光体の
感光層、プリント基板へのフランクス塗布膜やＩＣ基板
へのレジスト塗布膜など、ミクロンオーダーあるいはそ
れ以下の膜厚の？゛・γ膜で、かつ、所定の機能を有す
る膜が必要となる技術分野が増大してきている。In recent years, film thicknesses on the order of microns or less have been developed, such as surface protective films for magnetic recording media, photosensitive layers for electrophotographic photoreceptors, Franks coatings on printed circuit boards, and resist coatings on IC boards. The number of technical fields in which a film that is a .gamma. film and has a predetermined function is required is increasing.
このような膜は、その機能が均一であることが要求され
るが、薄膜であるためにわずかな膜厚の差が機能の大幅
なばらつきを引き起こすことになるので、厚みのばらつ
きのできるだけ少ない均一な膜厚の膜が望まれる。その
ため、従来のはけ塗りやスプレーガン塗装などの塗膜形
成法は適用できず、より均一な膜厚の塗膜を得ることの
可能なスピンコード法やディッピング法が用いられる。Such a film is required to have uniform function, but since it is a thin film, a slight difference in film thickness will cause large variations in function, so it is necessary to have uniformity with as little variation in thickness as possible. A film with a certain thickness is desired. For this reason, conventional coating film formation methods such as brush coating and spray gun coating cannot be applied, and spin cord methods and dipping methods are used, which can obtain a coating film with a more uniform thickness.
しかしながら、スピンコード法は高速回転の駆動系を必
要とし、塗膜を形成すべき物体の表面の面積が広い場合
とか１表面の形状が複雑な場合には塗布が困難あるいは
不可能となるので、ディッピング法が広く用いられてき
た。However, the spin code method requires a high-speed rotation drive system, and coating becomes difficult or impossible when the surface area of the object on which the coating film is to be formed is large or when the shape of one surface is complex. Dipping methods have been widely used.
ディッピング法は、機能性の材料を有機溶媒中に溶解あ
るいは分１１にさせ、場合によっては、さらに粘着剤、
可塑剤などを加えて塗布液とし、塗布液溜としての塗布
液槽に充填し、この塗布液中に被塗布物体を浸漬して塗
膜形成面に塗布液を接触させ、ついで被塗布物体を引き
上げて乾燥させ塗膜を形成する方法で、簡便であり、し
かも塗布液の粘度、被塗布物体の塗布液からの引き上げ
速度を調節することにより、比較的簡単に薄膜を得るこ
とができる。The dipping method involves dissolving or diluting the functional material in an organic solvent, and in some cases, adding an adhesive,
The coating liquid is prepared by adding a plasticizer, etc., and filled into a coating liquid tank serving as a coating liquid reservoir.The object to be coated is immersed in this coating liquid to bring the coating liquid into contact with the surface on which the coating film will be formed, and then the object to be coated is This is a method of forming a coating film by pulling it up and drying it, which is simple and allows a thin film to be obtained relatively easily by adjusting the viscosity of the coating solution and the rate at which the object to be coated is pulled up from the coating solution.
さらに、このディッピング法と原理的に類似する薄膜塗
布方法は種々考えられる。そのような方法の一つとして
、本出願人は、被塗布物体の鉛直な塗膜形成面に対して
塗布液を貯留し得る間隙を介して対向する而を有する塗
布治具を備え、がっ、塗膜形成面と塗布治具とを鉛直方
向に相対的に移動させる機掃を設けた薄膜塗布装置を用
い、デインピング法における塗布液槽のかわりに塗膜形
成面とこれに対向する塗布治具の面との間の空隙を塗布
液貯留部とし、この空隙に塗布液を貯留させて塗膜形成
面と接触させ、塗膜形成面と塗布治具とを鉛直方向に相
対的に移動させ、塗膜形成面上に薄膜を形成することを
提案した（特願昭６０−１７４９３０号）。このような
貯留部を塗布液溜として利用することにより、使用する
塗布液量をディッピング法に比べて大幅に低減でき、し
かもより均一な膜厚の薄膜を形成することができる。Furthermore, various thin film coating methods can be considered that are similar in principle to this dipping method. As one such method, the present applicant has provided a coating jig that faces the vertical coating film forming surface of the object to be coated with a gap in which the coating liquid can be stored. In this method, a thin film coating device equipped with a sweeper that moves the coating film forming surface and the coating jig relative to each other in the vertical direction is used. The gap between the surface of the tool and the coating jig is used as a coating liquid reservoir, the coating liquid is stored in this gap and brought into contact with the coating film forming surface, and the coating film forming surface and the coating jig are moved relative to each other in the vertical direction. proposed forming a thin film on the coating surface (Japanese Patent Application No. 174930/1982). By using such a reservoir as a coating liquid reservoir, the amount of coating liquid used can be significantly reduced compared to the dipping method, and a thin film with a more uniform thickness can be formed.
上述のディッピング法では、塗布液槽は被塗布物体が充
分通過できるだけの開口部を持っていなければならない
し、少なくとも塗布作業中はその開口部は開いたままと
なる。塗布液に揮発性の高い溶媒が含まれている場合（
薄膜塗布の場合には一般的にそうである）、その塗布液
槽の密閉性がこわされる時間、いわゆる開口時間によっ
て、塗布液からの溶媒の揮発が無視できな（なる。すな
わち、溶媒の揮発により塗布液の組成が変わり、それに
つれて塗膜の膜厚が変化してしまう。このような現象を
防ぐために、粘度モニターなどにより溶媒の揮発量を常
時監視して、揮発分を補充するような＆１１．Ｗを付加
することが考えられる。しかし、粘度などをモニターし
ながら揮発分を補充する方法は、応答が遅くて、塗布作
業環境の突発的な変化などにより、塗布液の溶媒の揮発
量が突発的に変化した場合には対応できにくいという欠
点があった。In the dipping method described above, the coating liquid tank must have an opening large enough for the object to be coated to pass through, and the opening remains open at least during the coating operation. If the coating solution contains a highly volatile solvent (
This is generally the case in the case of thin film coating), but the volatilization of the solvent from the coating liquid cannot be ignored depending on the time during which the sealing of the coating liquid tank is broken, the so-called opening time. The composition of the coating solution changes, and the thickness of the coating film changes accordingly.In order to prevent this phenomenon, the amount of solvent volatilization is constantly monitored using a viscosity monitor, etc., and measures are taken to replenish the volatile content. &11.Adding W is considered.However, the method of replenishing volatile components while monitoring viscosity etc. has a slow response and may cause the amount of volatilization of the solvent in the coating solution to change due to sudden changes in the coating work environment. The disadvantage is that it is difficult to respond to sudden changes in
前述の一例のような、ディッピング法と原理的に類似す
る塗布方法においても、塗布液溜の開口部からの塗布液
の溶媒の揮発は同様に問題となる。Even in a coating method similar in principle to the dipping method as in the above example, volatilization of the solvent of the coating liquid from the opening of the coating liquid reservoir similarly poses a problem.
この発明は、上述の欠点を除去して、デインピング法ま
たはそれと原理的に類似する薄膜塗布方法において、塗
布液溜の開口部から塗布液の溶媒が揮発するのを防止し
、塗布液の組成を一定に保つことができ、膜厚均一な薄
膜を安定して形成することができる薄膜塗布装置を提供
することを目的とする。The present invention eliminates the above-mentioned drawbacks and prevents the solvent of the coating solution from evaporating from the opening of the coating solution reservoir in the deimping method or a thin film coating method similar in principle to the deimping method, and improves the composition of the coating solution. It is an object of the present invention to provide a thin film coating device that can maintain a constant thickness and stably form a thin film with a uniform thickness.
上記の目的を達成するために、この発明によれば、被塗
布物体の鉛直な塗膜形成面に塗布液溜内の塗布液を接触
させ、これ、ら被塗布物体と塗布液溜とを鉛直方向に相
対的に移動させて前記塗膜形成面上に塗布液を塗布して
薄膜を形成する薄膜塗布装置において、前記塗布液溜の
開口部の塗布液面上に溶媒蒸気雰囲気を形成できるよう
に前記塗布液溜の開口部のまわりを囲む溶媒槽を設けた
薄膜塗布装置とする。In order to achieve the above object, according to the present invention, the coating liquid in the coating liquid reservoir is brought into contact with the vertical coating film forming surface of the object to be coated, and the object to be coated and the coating liquid reservoir are vertically connected. In a thin film coating device that forms a thin film by applying a coating solution onto the coating film forming surface by moving the coating solution relatively in a direction, The thin film coating apparatus is provided with a solvent tank surrounding the opening of the coating liquid reservoir.
塗布装置の塗布液溜の開口部のまわりを取り囲むように
設けた溶媒槽に、塗布液に用いたのと同じ溶媒を入れ、
この溶媒槽から蒸発する溶媒蒸気を塗布液溜の開口部の
塗布液面上に供給し液面を覆うことにより、塗布液自体
からの溶媒の揮発を抑えることができ、塗布液の組成を
一定に保つことが可能となる。Pour the same solvent used for the coating liquid into the solvent tank provided so as to surround the opening of the coating liquid reservoir of the coating device,
By supplying the solvent vapor that evaporates from this solvent tank onto the coating liquid surface at the opening of the coating liquid reservoir and covering the liquid surface, it is possible to suppress the volatilization of the solvent from the coating liquid itself, and to maintain a constant composition of the coating liquid. It is possible to maintain the
第１図は、この発明に係わる薄膜塗布装置の一実施例の
模式的断面図であって、ディッピング法で用いられる一
般的な播溝式の塗布装置で、塗布液槽、６の開口部から
オーバーフローした塗布液７が循環装置８により塗布液
槽６に送りこまれる構成となっている。この塗布液、Ｆ
ｆｆ ６の開口部を取り囲むように、この発明による溶
媒槽１が設けられ、そのまわりには液体を媒体とした熱
交換器５が取り付けられていて、溶媒槽１中の溶媒２を
加熱または冷却できるようになっている。４は溶媒漕１
の上方部を覆う蒸気流制御板で、双方向矢印へに示すよ
うに溶媒槽１に対して上下動可能となっている。FIG. 1 is a schematic cross-sectional view of an embodiment of a thin film coating device according to the present invention, which is a general trench-type coating device used in the dipping method, and is formed from the opening of the coating liquid tank 6. The overflowing coating liquid 7 is sent into the coating liquid tank 6 by a circulation device 8. This coating liquid, F
A solvent tank 1 according to the present invention is provided so as to surround the opening of the ff 6, and a heat exchanger 5 using a liquid as a medium is installed around the solvent tank 1 to heat or cool the solvent 2 in the solvent tank 1. It is now possible to do so. 4 is solvent tank 1
A vapor flow control plate covering the upper part of the tank 1 can be moved up and down with respect to the solvent tank 1 as shown by the double-headed arrow.
このような構成において、溶媒槽１に塗布液７に用いた
のと同じ溶媒２を満たし、熱交換器５で所要の温度とし
、溶媒槽１から蒸発する溶媒２の蒸気を蒸気流制御板４
により導いて、塗布液槽６の開口部の塗布液７の表面を
覆うように溶媒蒸気雰囲気３を形成する。溶媒蒸気雲囲
気３の高さは、蒸気流制御板４を上下動させることによ
り適切な高さに調整される。このようにして、開口部の
塗布液面を溶媒槽からの溶媒蒸気雰囲気で覆うことによ
り、開口部が例えば蓋などで密閉されていなくても、塗
布作業中でも、塗布液自体からの溶媒の揮発を抑制する
ことができ、塗布液槽内の塗布液の組成は一定に保たれ
ることになる。このような塗布装置を用いることにより
塗布液の組成変動による塗膜の膜厚の変動を防ぐことが
可能となる。In such a configuration, the solvent tank 1 is filled with the same solvent 2 used for the coating liquid 7, the heat exchanger 5 is used to maintain the desired temperature, and the vapor of the solvent 2 evaporated from the solvent tank 1 is transferred to the vapor flow control plate 4.
A solvent vapor atmosphere 3 is formed so as to cover the surface of the coating liquid 7 at the opening of the coating liquid tank 6. The height of the solvent vapor cloud enclosure 3 is adjusted to an appropriate height by moving the vapor flow control plate 4 up and down. In this way, by covering the surface of the coating liquid at the opening with the solvent vapor atmosphere from the solvent tank, the solvent can be volatilized from the coating liquid itself even during coating operations, even if the opening is not sealed with a lid, for example. Therefore, the composition of the coating liquid in the coating liquid tank can be kept constant. By using such a coating device, it is possible to prevent variations in the thickness of the coating film due to variations in the composition of the coating liquid.
以上、実施例ではディッピング法の場合について説明し
たが、その他の原理的に類似する方法の場合にも、塗布
液溜の開口部の塗布液面を溶媒蒸気で覆う機構を設けた
塗布装置は、均一な膜厚の薄膜を得るのに極めて有効で
ある。In the above examples, the case of the dipping method has been explained, but even in the case of other methods similar in principle, a coating apparatus equipped with a mechanism for covering the coating liquid surface at the opening of the coating liquid reservoir with solvent vapor can be used. This is extremely effective in obtaining a thin film with uniform thickness.
この発明によれば、薄膜塗布装置に、塗布液溜の開口部
の塗布液面上に溶媒蒸気雰囲気を人為的に形成できるよ
うに塗布液溜の開口部のまわりを取り囲む溶媒槽を設け
る。このような塗布装置を用い、溶媒槽から蒸発させた
塗布液に用いたのと同じ溶媒の蒸気を開口部の塗布液面
上に充満させて液面を溶媒蒸気雰囲気で覆うことにより
、塗布液自体からの溶媒の揮発を抑制し、塗布液の組成
を一定に保つことができ、組成変動による塗膜の膜厚の
変動を防ぎ、安定して均一な膜厚の薄膜を形成すること
が可能となる。この発明による薄膜塗布装置は、わずか
な膜厚の差が機能の大幅なばらつきをひきおこすことに
なる磁気記録媒体の表面保護膜、電子写真用感光体の感
光層など、ミクロンオーダーの機能性薄膜の形成に用い
て極めて有効である。According to this invention, the thin film coating apparatus is provided with a solvent tank surrounding the opening of the coating liquid reservoir so that a solvent vapor atmosphere can be artificially formed on the surface of the coating liquid at the opening of the coating liquid reservoir. Using such a coating device, the surface of the coating liquid in the opening is filled with vapor of the same solvent used in the coating liquid evaporated from the solvent tank, and the liquid surface is covered with a solvent vapor atmosphere. It is possible to suppress the volatilization of the solvent from itself, keep the composition of the coating solution constant, prevent changes in the thickness of the coating film due to changes in the composition, and form a thin film with a stable and uniform thickness. becomes. The thin film coating device according to the present invention can be used to coat functional thin films on the micron order, such as surface protective films of magnetic recording media and photosensitive layers of electrophotographic photoreceptors, where a slight difference in film thickness can cause large variations in functionality. It is extremely effective when used in formation.
第１図は、この発明の薄膜塗布装置の一実施例の模式的
断面図である。
ｌ 溶媒槽、２ 溶媒、３ 溶媒蒸気雲囲気、４ 蒸気
流制御板、５ 熱交換器、６ 塗布液槽、第１図FIG. 1 is a schematic cross-sectional view of an embodiment of the thin film coating apparatus of the present invention. l Solvent tank, 2 Solvent, 3 Solvent vapor cloud, 4 Vapor flow control plate, 5 Heat exchanger, 6 Coating liquid tank, Figure 1
Claims (1)
液を接触させ、これら被塗布物体と塗布液溜とを鉛直方
向に相対的に移動させて前記塗膜形成面上に塗布液を塗
布して薄膜を形成する薄膜塗布装置において、前記塗布
液溜の開口部の塗布液面上に溶媒蒸気雰囲気を形成でき
るように前記塗布液溜の開口部のまわりを囲む溶媒槽を
設けたことを特徴とする薄膜塗布装置。1) Bringing the coating liquid in the coating liquid reservoir into contact with the vertical coating film forming surface of the object to be coated, and moving the coating liquid and the coating liquid reservoir relative to each other in the vertical direction so as to apply the coating liquid onto the coating film forming surface. In a thin film coating apparatus for forming a thin film by applying a coating liquid, a solvent tank is provided around the opening of the coating liquid reservoir so as to form a solvent vapor atmosphere on the surface of the coating liquid at the opening of the coating liquid reservoir. A thin film coating device characterized in that:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15557688A JPH024469A (en) | 1988-06-23 | 1988-06-23 | Device for applying thin film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15557688A JPH024469A (en) | 1988-06-23 | 1988-06-23 | Device for applying thin film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH024469A true JPH024469A (en) | 1990-01-09 |
Family
ID=15609070
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15557688A Pending JPH024469A (en) | 1988-06-23 | 1988-06-23 | Device for applying thin film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH024469A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06123989A (en) * | 1992-10-13 | 1994-05-06 | Matsushita Electric Ind Co Ltd | Coating method of photosensitive body |
| JP2008212825A (en) * | 2007-03-05 | 2008-09-18 | Seiko Epson Corp | Apparatus and method of forming coating film |
| JP2008289982A (en) * | 2007-05-23 | 2008-12-04 | Fuji Xerox Co Ltd | Coating apparatus, coating method and electrophotographic photoreceptor |
| CN112570230A (en) * | 2019-09-30 | 2021-03-30 | 深圳硅基仿生科技有限公司 | Method for coating film on surface of micro electrode |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60110374A (en) * | 1983-11-21 | 1985-06-15 | Konishiroku Photo Ind Co Ltd | Coating and drying apparatus |
-
1988
- 1988-06-23 JP JP15557688A patent/JPH024469A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60110374A (en) * | 1983-11-21 | 1985-06-15 | Konishiroku Photo Ind Co Ltd | Coating and drying apparatus |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06123989A (en) * | 1992-10-13 | 1994-05-06 | Matsushita Electric Ind Co Ltd | Coating method of photosensitive body |
| JP2008212825A (en) * | 2007-03-05 | 2008-09-18 | Seiko Epson Corp | Apparatus and method of forming coating film |
| JP2008289982A (en) * | 2007-05-23 | 2008-12-04 | Fuji Xerox Co Ltd | Coating apparatus, coating method and electrophotographic photoreceptor |
| CN112570230A (en) * | 2019-09-30 | 2021-03-30 | 深圳硅基仿生科技有限公司 | Method for coating film on surface of micro electrode |
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