JPH02283094A - Manufacture of circuit board with aluminum pad - Google Patents
Manufacture of circuit board with aluminum padInfo
- Publication number
- JPH02283094A JPH02283094A JP10337689A JP10337689A JPH02283094A JP H02283094 A JPH02283094 A JP H02283094A JP 10337689 A JP10337689 A JP 10337689A JP 10337689 A JP10337689 A JP 10337689A JP H02283094 A JPH02283094 A JP H02283094A
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- foil
- aluminum
- pad
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 47
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 47
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 239000011888 foil Substances 0.000 claims abstract description 26
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000011889 copper foil Substances 0.000 claims abstract description 17
- 238000005530 etching Methods 0.000 claims abstract description 17
- 239000000853 adhesive Substances 0.000 claims abstract description 10
- 230000001070 adhesive effect Effects 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims abstract description 8
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 abstract description 9
- 239000011800 void material Substances 0.000 abstract 1
- 238000005253 cladding Methods 0.000 description 5
- 230000007547 defect Effects 0.000 description 3
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、銅箔回路パターン上にアルミバンドを有する
アルミパッド付き回路基板の製造方法に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of manufacturing a circuit board with an aluminum pad having an aluminum band on a copper foil circuit pattern.
従来のアルミパッド付き回路基板の製造方法を図−６な
いし図−８に示す、まず図−６に示すようにアルミＷＭ
１と銅箔２を複合したクラッド箔３を絶縁性の接着剤４
を介して板状またはフィルム状のベース材５に張り付け
る０次いで図−７（ａｔ（ｂ）に示すようにクラッド箔
３のアルミ箔１をパターンエツチングしてアルミバンド
６を形成する。これによりアルミバフドロ以外の領域に
銅Ｐｇ ２が露出することになる０次いで図−８１ａｌ
（ｂｌに示すように銅箔２をパターンエツチングして回
路パターン７を形成すれば、アルミパツド付き回路基板
８が得られる。The conventional method for manufacturing circuit boards with aluminum pads is shown in Figures 6 to 8. First, as shown in Figure 6, aluminum WM is manufactured.
A cladding foil 3 made of a composite of 1 and a copper foil 2 is bonded to an insulating adhesive 4.
The aluminum band 6 is formed by pattern etching the aluminum foil 1 of the cladding foil 3 as shown in FIG. Copper Pg 2 will be exposed in areas other than aluminum buffing.
(If a circuit pattern 7 is formed by pattern etching the copper foil 2 as shown in bl, a circuit board 8 with an aluminum pad is obtained.
（！１ｌｆｉ）
従来の製造方法によると、銅箔をパターンエツチングす
るため感光性ドライフィルムをラミネートすると、アル
ミバンドの厚みによる凹凸のためアルミパッド側面に密
着不良が生じやすく、これが原因で銅箔のパターンエツ
チング時にパターン欠は不良が発生しやすい、また接着
剤の表面から回路パターンとアルミパッドが２段に突出
した状態となるため、アルミパッド以外の部分にソルダ
ーレジストを印刷する際に、隙間やボイドが発生しやす
い等の問題もある。(!1lfi) According to conventional manufacturing methods, when a photosensitive dry film is laminated to pattern-etch copper foil, poor adhesion tends to occur on the side of the aluminum pad due to unevenness due to the thickness of the aluminum band. Missing patterns are likely to cause defects during pattern etching, and the circuit pattern and aluminum pad protrude from the surface of the adhesive in two stages, so when printing solder resist on areas other than the aluminum pad, avoid gaps or There are also problems such as the tendency for voids to occur.
上記のような従来技術の問題点に鑑み本発明は、パター
ン欠けが発生するおそれのない、またソルダーレジスト
の印刷も容易なアルミパッド付き回路基板を製造する方
法を提供するものである。In view of the problems of the prior art as described above, the present invention provides a method for manufacturing a circuit board with aluminum pads, which is free from the risk of pattern chipping and in which solder resist can be easily printed.
本発明によれば、その製造方法は、アルミ７銅クラッド
箔の銅箔側を得ようとする回路パターンのミラーイメー
ジ（鏡に写した形）にパターンエツチングし、そのパタ
ーンエツチングした方の面を接着剤を介してベース材に
張り付けた後、上記クラッド箔のアルミ箔側をパターン
エツチングしてアルミパッドを形成することを特徴とす
る。According to the present invention, the manufacturing method involves etching a pattern into a mirror image (mirror shape) of the circuit pattern to be obtained on the copper foil side of the aluminum 7 copper clad foil, and then etching the pattern-etched side. The aluminum pad is characterized in that after being attached to the base material via an adhesive, the aluminum foil side of the cladding foil is pattern-etched to form an aluminum pad.
このようにすれば、クラッド箔の銅箔側をパターンエツ
チングするときも、アルミ箔側をパターンエツチングす
るときも、感光性ドライフィルムを平面上にラミネート
できるので、密着不良が生じるおそれがなくなる。また
製造される回路基板は銅箔回路パターン表面と接着剤表
面が同レベルとなり、アルミパッドだけが突出する状態
となるので、ソルダーレジストの印刷も容易である。In this way, the photosensitive dry film can be laminated on a flat surface both when pattern etching the copper foil side of the clad foil and when pattern etching the aluminum foil side, eliminating the risk of poor adhesion. Furthermore, in the manufactured circuit board, the surface of the copper foil circuit pattern and the surface of the adhesive are on the same level, with only the aluminum pads protruding, making it easy to print the solder resist.
以下、本発明の実施例を図面を参照して詳細に説明する
。Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
図−１ないし図−４は本発明の一実施例を示す。1 to 4 show an embodiment of the present invention.
図−１（ａＨｂ）は例えば０．１１１１Ｉ厚のアルミ箔
１と０．０５１厚の＃ＲＦ＆２が複合されたクラッド箔
３を示す。FIG. 1 (aHb) shows a cladding foil 3 made of a composite of, for example, an aluminum foil 1 with a thickness of 0.1111I and #RF&2 with a thickness of 0.051I.
このようなりう７ド箔３の銅箔２側をまずパターンエツ
チングして、図−２（ａｌ（ｂ）に示すように得ようと
する回路パターンを裏返した形のミラーイメージ回路パ
ターン７ａを形成する。エンチング液には過酸化水素硫
酸を使用できる０次にそのミラーイメージ回路パターン
７ａ側の面を図−３に示すように接着剤４を介してベー
ス材５に張り付ける。その後、アルミ箔ｌをパターンエ
ツチングして図−４（ａ）（ｂｌに示すようにアルミパ
ッド６を形成すれば、回路パターン７が表面を露出させ
て接着剤４に埋め込まれた形のアルミバンド付き回路基
板８が得られる。アルミＦ６ｉ １のエツチング液とし
ては塩化第二鉄を使用できる。First, pattern etching is performed on the copper foil 2 side of the copper foil 3 to form a mirror image circuit pattern 7a that is an inverted version of the circuit pattern to be obtained, as shown in Figure 2 (al(b)). Hydrogen peroxide and sulfuric acid can be used as the enching liquid.Next, attach the surface of the mirror image circuit pattern 7a side to the base material 5 via the adhesive 4 as shown in Figure 3.After that, attach the aluminum foil to the base material 5. If the aluminum pad 6 is formed by pattern etching the aluminum pad 6 as shown in FIGS. Ferric chloride can be used as an etching solution for aluminum F6i 1.
図−５（ａ）（ｂ）は製造されたアルミパッド付き回路
基板８にソルダーレジスト９を印刷した状態を示す。ア
ルミバッド６以外の面は平坦であるからソルダーレジス
ト９の印刷は容易であり、隙間やボイドが発生するおそ
れがない。5(a) and 5(b) show the solder resist 9 printed on the manufactured circuit board 8 with aluminum pads. Since the surfaces other than the aluminum pad 6 are flat, printing of the solder resist 9 is easy, and there is no risk of creating gaps or voids.
以上説明したように本発明によれば、アルミ／銅クラッ
ド筒の銅箔をパターンエツチングするときも、アルミ箔
をパターンエツチングするときも、感光性ドライフィル
ムを平面上にラミネートできるので、同フィルムの密着
不良が生じなくなり、パターンエツチング時にパターン
欠は不良が発生することがなくなる。また製造される回
路基板は銅箔回路パターン表面と接着剤表面が同レベル
となり、アルミパッドだけが突出する状態となるため、
ソルダーレジストの印刷も容易に、欠陥なく行えるとい
う利点がある。As explained above, according to the present invention, the photosensitive dry film can be laminated on a flat surface both when pattern etching the copper foil of the aluminum/copper clad tube and when pattern etching the aluminum foil. Poor adhesion will no longer occur, and pattern defects will no longer occur during pattern etching. In addition, in the manufactured circuit board, the surface of the copper foil circuit pattern and the surface of the adhesive will be on the same level, and only the aluminum pad will protrude.
It has the advantage that solder resist can be printed easily and without defects.
図−１ないし図−４は本発明に係る製造方法の一実施例
を示すもので、図−１ｔａｌ（ｂｌはアルミ／銅クラッ
ド筒の断面図および平面図、図−２＋ａｌ（ｂｌはその
クラッド箔の銅箔側をパターンエンチングした状態を示
す断面図および底面図、図−３はパターンエツチングし
たものをベース材に張り付けた状態を示す断面図、図−
４＋ａｌ（ｂ）は製造されたアルミバンド付き回路基板
を示す断面図および平面図、図−５（ａ）（ｂｌはその
回路基板にソルダーレジストを印刷した状態を示す断面
図および平面図、図−６ないし図−８は従来の製造方法
を示すもので、図−６はアルミ／銅クラッド筒をベース
材に張り付けた状態の断面図、図−７１ａｌ（ｂｌはそ
のアルミ箔をパターンエツチングした状態を示す断面図
および平面図、図−８（ａゆ）は製造されたアルミバン
ド付き回路基板を示す断面図および平面図である。
ｌニアルミ箔、２：銅箔、３：クラッド箔、４：接着剤
、５：ベース材、６：アルミパッド、７：回路パターン
、７ａ：ミラーイメージ回路パターン、８ニアルミパッ
ド付き回路基板、９：ソルダーレジスト。
図
図−２
図
図
図−６
図−７Figures 1 to 4 show an embodiment of the manufacturing method according to the present invention, in which Figure 1tal (bl is a cross-sectional view and plan view of an aluminum/copper clad tube, Figure 2+al (bl is the cladding foil) A cross-sectional view and a bottom view showing a state where the copper foil side of the copper foil side is pattern-etched.
4+al(b) is a sectional view and a plan view showing the manufactured circuit board with an aluminum band, FIG. Figures 6 to 8 show the conventional manufacturing method. Figure 6 is a cross-sectional view of the aluminum/copper clad tube attached to the base material, and Figure 71al (bl shows the aluminum foil pattern-etched). Figure 8 (ayu) is a cross-sectional view and a plan view showing a manufactured circuit board with an aluminum band. 1 aluminum foil, 2: copper foil, 3: clad foil, 4: adhesive agent, 5: base material, 6: aluminum pad, 7: circuit pattern, 7a: mirror image circuit pattern, circuit board with 8 aluminum pad, 9: solder resist. Figure-2 Figure-6 Figure-7
Claims (1)
パターンのミラーイメージにパターンエッチングし、そ
のパターンエッチングした方の面を接着剤を介してベー
ス材に張り付けた後、上記クラッド箔のアルミ箔側をパ
ターンエッチングしてアルミパッドを形成することを特
徴とするアルミパッド付き回路基板の製造方法。1. After pattern-etching the mirror image of the circuit pattern to be obtained on the copper foil side of the aluminum/copper clad foil, and pasting the pattern-etched side to the base material via adhesive, the aluminum foil of the above clad foil is attached. A method of manufacturing a circuit board with an aluminum pad, the method comprising forming an aluminum pad by pattern etching the side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10337689A JPH02283094A (en) | 1989-04-25 | 1989-04-25 | Manufacture of circuit board with aluminum pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10337689A JPH02283094A (en) | 1989-04-25 | 1989-04-25 | Manufacture of circuit board with aluminum pad |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02283094A true JPH02283094A (en) | 1990-11-20 |
Family
ID=14352381
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10337689A Pending JPH02283094A (en) | 1989-04-25 | 1989-04-25 | Manufacture of circuit board with aluminum pad |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02283094A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6518514B2 (en) | 2000-08-21 | 2003-02-11 | Matsushita Electric Industrial Co., Ltd. | Circuit board and production of the same |
| US6532651B1 (en) | 1998-05-14 | 2003-03-18 | Matsushita Electric Industrial Co., Ltd. | Circuit board and method of manufacturing the same |
| US6565954B2 (en) | 1998-05-14 | 2003-05-20 | Matsushita Electric Industrial Co., Ltd. | Circuit board and method of manufacturing the same |
| US6703565B1 (en) | 1996-09-06 | 2004-03-09 | Matsushita Electric Industrial Co., Ltd. | Printed wiring board |
| US7006386B2 (en) | 1991-11-26 | 2006-02-28 | Renesas Technology Corp. | Storage device employing a flash memory |
-
1989
- 1989-04-25 JP JP10337689A patent/JPH02283094A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7006386B2 (en) | 1991-11-26 | 2006-02-28 | Renesas Technology Corp. | Storage device employing a flash memory |
| US6703565B1 (en) | 1996-09-06 | 2004-03-09 | Matsushita Electric Industrial Co., Ltd. | Printed wiring board |
| US7059039B2 (en) | 1996-09-06 | 2006-06-13 | Matsushita Electric Industrial Co., Ltd. | Method for producing printed wiring boards |
| US6532651B1 (en) | 1998-05-14 | 2003-03-18 | Matsushita Electric Industrial Co., Ltd. | Circuit board and method of manufacturing the same |
| US6565954B2 (en) | 1998-05-14 | 2003-05-20 | Matsushita Electric Industrial Co., Ltd. | Circuit board and method of manufacturing the same |
| US6748652B2 (en) | 1998-05-14 | 2004-06-15 | Matsushita Electric Industrial Co., Ltd. | Circuit board and method of manufacturing the same |
| US6518514B2 (en) | 2000-08-21 | 2003-02-11 | Matsushita Electric Industrial Co., Ltd. | Circuit board and production of the same |
| US6691409B2 (en) | 2000-08-21 | 2004-02-17 | Matsushita Electric Industrial Co., Ltd. | Method of producing a circuit board |
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