JPH02279027A - Radio transmitter-receiver - Google Patents
Radio transmitter-receiverInfo
- Publication number
- JPH02279027A JPH02279027A JP1100612A JP10061289A JPH02279027A JP H02279027 A JPH02279027 A JP H02279027A JP 1100612 A JP1100612 A JP 1100612A JP 10061289 A JP10061289 A JP 10061289A JP H02279027 A JPH02279027 A JP H02279027A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- soldered
- section
- circuit boards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 9
- 229910000679 solder Inorganic materials 0.000 claims 2
- 230000005540 biological transmission Effects 0.000 abstract description 8
- 230000000694 effects Effects 0.000 description 5
- 239000002184 metal Substances 0.000 description 3
- 238000002955 isolation Methods 0.000 description 2
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Combinations Of Printed Boards (AREA)
- Transceivers (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は同時送受信を）テう小型の無線送受信機に関す
る。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a compact wireless transceiver that performs simultaneous transmission and reception.
従来、この種の無線送受信機では、第４図（ａ）及び（
ｂ）に夫々平面図及び正面図を示すように、１枚のプリ
ント基板１０上の一部領域に各種部品２０を搭載して送
信部ｌを構成し、同様にしてプリント基板１０の他の領
域に受信部２を構成している。この場合、プリント基板
１０では、基板の一方の面に各種部品を取り付け、基板
反対面に突出された部品リードを半田等により接続して
いる。Conventionally, in this type of wireless transceiver, Fig. 4(a) and (
As shown in a plan view and a front view, respectively, in b), various parts 20 are mounted on a partial area on one printed circuit board 10 to constitute a transmitter l, and in the same way, other areas of the printed circuit board 10 are mounted. The receiving section 2 is configured in the following. In this case, in the printed circuit board 10, various components are attached to one side of the board, and component leads protruding from the opposite side of the board are connected by soldering or the like.
上述した無線送受信機では、１枚のプリント基板ＩＯに
送信部１と受信部２を一体に組立てているため、アース
に流れる共通電流による送受信の干渉が生じ易い。この
ため、送信部と受信部とのアイソレーションをとって、
両者間の相互干渉を最小にするように各種部品の配置を
考慮することが必要とされている。例えば、第４図に示
した例では、図示鎖線で示す位置で送信部と受信部との
電磁遮蔽を行なって両者のアイソレーションをとってい
る。In the above-mentioned wireless transceiver, since the transmitter 1 and the receiver 2 are integrally assembled on one printed circuit board IO, interference between transmission and reception is likely to occur due to a common current flowing to the ground. For this reason, the transmitter and receiver are isolated,
It is necessary to consider the arrangement of various parts so as to minimize mutual interference between the two. For example, in the example shown in FIG. 4, electromagnetic shielding is performed between the transmitting section and the receiving section at the position indicated by the chain line in the drawing to ensure isolation between the two.
しかしながら、このような構成では、送受信部間の干渉
を避けるための各種部品の配設位置に制限を受け、設計
上の自由度が小さくなる。また、電磁遮蔽用シールド構
造の付設によって送受信機が大型になり易く、小型化を
図ることが難しいという問題がある。However, in such a configuration, there are restrictions on the placement positions of various parts to avoid interference between the transmitter and receiver, and the degree of freedom in design is reduced. Further, there is a problem that the transmitter/receiver tends to become large due to the addition of the electromagnetic shielding structure, and it is difficult to reduce the size of the transmitter/receiver.
本発明は送受信部間での干渉防止を図るとともに、小型
化を可能にした無線送受信機を提供することを目的とす
る。SUMMARY OF THE INVENTION An object of the present invention is to provide a wireless transmitter/receiver that can prevent interference between transmitting and receiving sections and can be downsized.
本発明の無線送受信機は、１のプリント基板の片面に各
種部品を搭載しかつ反対面で半田付けを行って送信部を
構成し、他の異なるプリント基板の片面に各種部品を搭
載しかつ反対面で半田付けを行って受信部を構成し、こ
れらプリント基板の各半田付は面を近接乃至接触させた
状態で両プリント基板を対向配置した構成としている。The wireless transmitter/receiver of the present invention has various parts mounted on one side of one printed circuit board and soldered on the other side to form a transmitting section, and various parts mounted on one side of another different printed circuit board and the opposite side. The receiving section is constructed by soldering on the surfaces, and the soldering of each of these printed circuit boards is such that the two printed circuit boards are placed facing each other with their surfaces close to each other or in contact with each other.
この構成では、各プリント基板に設けたアースパターン
でシールド効果を得ることができ、送信部と受信部との
間のアイソレーションをとって両者の干渉を防止する。With this configuration, a shielding effect can be obtained by the ground pattern provided on each printed circuit board, and isolation between the transmitting section and the receiving section is achieved to prevent interference between the two.
〔実施例〕 次に、本発明を図面を参照して説明する。〔Example〕 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の第１実施例の正面図である。FIG. 1 is a front view of a first embodiment of the present invention.
図において、１は送信部であり、１枚のプリント基板１
１の一方の面に各種部品１２を搭載し、反対側の面で半
田付けを行って送信部を構成している。また、２は受信
部であり、送信部１とは異なる１枚のプリント基板２１
の一方の面に各種部品２２を搭載し、反対側の面で半田
付けを行って受信部を構成している。In the figure, 1 is a transmitter, and one printed circuit board 1
Various parts 12 are mounted on one side of the device 1 and soldered on the opposite side to form a transmitting section. Further, 2 is a receiving section, which is a printed circuit board 21 different from the transmitting section 1.
Various parts 22 are mounted on one side of the receiver and soldered on the opposite side to form a receiving section.
そして、両プリント基板１１．２１は夫々半田付けを行
った面が対向するように近接させ、或いは対向させた面
を接触させ、図外の固定手段により両者を固定させて一
体化している。また、必要に応じて両プリント基板１１
．２１間での電気的接続を行っている。The printed circuit boards 11 and 21 are placed close to each other so that their soldered surfaces face each other, or their opposing faces are brought into contact with each other, and the two are fixed and integrated by a fixing means not shown. Also, if necessary, both printed circuit boards 11
．． Electrical connections are made between 21.
この構成によれば、プリント基板１１．２１の半田付は
面、或いは部品搭載面に設けたアースパターンが送信部
ｌと受信部２とを遮蔽するシールド板として機能するこ
とになり、送受信部間での干渉を防止する。また、この
ときシールド板を付加する必要がないため、小型化が実
現できる。更に、各プリント基板１１．２１には比較的
自由に各種部品１２．２２が搭載できるため、設計の自
由度を高めることも可能である。According to this configuration, the soldering surface of the printed circuit board 11.21 or the ground pattern provided on the component mounting surface functions as a shield plate that shields the transmitting section l and the receiving section 2. to prevent interference. Further, since there is no need to add a shield plate at this time, miniaturization can be realized. Furthermore, since various parts 12.22 can be mounted relatively freely on each printed circuit board 11.21, it is also possible to increase the degree of freedom in design.
第２図は本発明の第２実施例の正面図であり、第１図と
同一部分には同一符号を付しである。FIG. 2 is a front view of a second embodiment of the present invention, and the same parts as in FIG. 1 are given the same reference numerals.
この実施例では、両プリント基板１１．２１の間に絶縁
シート３を介挿している。この絶縁シート３により、両
プリント基板１１．２１の半田付は面における意に反す
る電気的接触、即ち短絡を防止することができる。In this embodiment, an insulating sheet 3 is inserted between both printed circuit boards 11 and 21. This insulating sheet 3 makes it possible to prevent unintentional electrical contact between the two printed circuit boards 11 and 21 during soldering, that is, a short circuit.
なお、両プリント基板１１．２１の半田付は面での短絡
が心配されない場合には、前記絶縁シート３の代わりに
金属シートを介挿し、送受信部間でのシールド効果を高
めるようにしてもよい。Note that when soldering both printed circuit boards 11 and 21, if there is no concern about surface short circuit, a metal sheet may be inserted instead of the insulating sheet 3 to enhance the shielding effect between the transmitting and receiving parts. .
第３図は本発明の第３実施例の正面図である。FIG. 3 is a front view of a third embodiment of the present invention.
ここでも、第１実施例と同一部分には同一符号を付しで
ある。Here too, the same parts as in the first embodiment are given the same reference numerals.
この実施例では、絶縁シート４，５間に金属シート６を
挟んだ多層構造のシートを両プリント基板１−１．２１
間に介挿している。これにより、両プリント基板１１．
２１の半田付は面での短絡を防止するとともに、送受信
部間でのシールド効果を高めて相互の干渉を防止するこ
とが可能となる。In this embodiment, a sheet with a multilayer structure in which a metal sheet 6 is sandwiched between insulating sheets 4 and 5 is attached to both printed circuit boards 1-1.2.
It is inserted in between. As a result, both printed circuit boards 11.
Soldering No. 21 prevents surface short circuits, and also enhances the shielding effect between the transmitting and receiving sections, thereby making it possible to prevent mutual interference.
以上説明したように本発明は、送信部を構成するプリン
ト基板と、受信部を構成するプリント基板の各半田付は
面を近接乃至接触させた状態で両プリント基板を対向配
置しているので、プリント基板のアースパターン等を利
用して送受信部間での相互干渉を防止することができ、
かつ小型化を図ることができる。また、送信部と受信部
を夫々側のプリント基板に設けることにより、各プリン
ト基板の設計の自由度を大きくすることもできる。As explained above, in the present invention, the printed circuit boards constituting the transmitting section and the printed circuit boards constituting the receiving section are disposed facing each other with their soldering surfaces close to each other or in contact with each other. Mutual interference between the transmitter and receiver can be prevented by using the ground pattern of the printed circuit board, etc.
Moreover, it is possible to achieve miniaturization. Furthermore, by providing the transmitting section and the receiving section on the respective printed circuit boards, it is possible to increase the degree of freedom in designing each printed circuit board.
【図面の簡単な説明】
第１図は本発明の第１実施例の正面図、第２図は本発明
の第２実施例の正面図、第３図は本発明の第３実施例の
正面図、第４図は従来構造を示し、同図（ａ）は平面図
、同図（ｂ）は正面図である。
ｌ・・・送信部、２・・・受信部、３，４．５・・・絶
縁シート、６・・・金属シート、１０，１１．２１・・
・プリント基板、１２，２０．２２・・・各種部品。
第４
図[Brief Description of the Drawings] Fig. 1 is a front view of the first embodiment of the present invention, Fig. 2 is a front view of the second embodiment of the invention, and Fig. 3 is a front view of the third embodiment of the invention. 4A and 4B show a conventional structure, in which FIG. 4A is a plan view and FIG. 4B is a front view. l... Transmitting section, 2... Receiving section, 3, 4.5... Insulating sheet, 6... Metal sheet, 10, 11.21...
・Printed circuit boards, 12, 20, 22... Various parts. Figure 4
Claims (1)
対面で半田付けを行って送信部を構成し、他の異なるプ
リント基板の片面に各種部品を搭載しかつ反対面で半田
付けを行って受信部を構成し、これらプリント基板の各
半田付け面を近接乃至接触させた状態で両プリント基板
を対向配置したことを特徴とする無線送受信機。1. Mount various parts on one side of the printed circuit board in 1 and solder them on the other side to form a transmitting section, and mount various parts on one side of another different printed circuit board and solder them on the other side. 1. A wireless transmitter/receiver characterized in that both printed circuit boards are arranged to face each other with the soldering surfaces of the printed circuit boards being close to each other or in contact with each other.
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1100612A JPH02279027A (en) | 1989-04-20 | 1989-04-20 | Radio transmitter-receiver |
| AU53658/90A AU5365890A (en) | 1989-04-20 | 1990-04-18 | Miniature mobile radio communication equipment having a shield structure |
| KR9005478A KR930008782B1 (en) | 1989-04-20 | 1990-04-19 | Miniature mobile radio communication equipment having a shield structure |
| CA002014917A CA2014917C (en) | 1989-04-20 | 1990-04-19 | Miniature mobile radio communication equipment having a shield structure |
| EP90304235A EP0394053B1 (en) | 1989-04-20 | 1990-04-20 | Miniature mobile radio communication equipment having a shield structure |
| DE90304235T DE69003727T2 (en) | 1989-04-20 | 1990-04-20 | Mobile miniature radio with shielding arrangement. |
| HK61794A HK61794A (en) | 1989-04-20 | 1994-06-30 | Miniature mobile radio communication equipment having a shield structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1100612A JPH02279027A (en) | 1989-04-20 | 1989-04-20 | Radio transmitter-receiver |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02279027A true JPH02279027A (en) | 1990-11-15 |
Family
ID=14278670
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1100612A Pending JPH02279027A (en) | 1989-04-20 | 1989-04-20 | Radio transmitter-receiver |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02279027A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5740527A (en) * | 1994-11-24 | 1998-04-14 | Nec Corporation | Transceiver |
| KR100626860B1 (en) * | 1998-06-02 | 2006-09-20 | 소니 가부시끼 가이샤 | Method for practically loading transmission or receiving module for optical link and its rigid flexible board |
| JP2008512903A (en) * | 2004-09-03 | 2008-04-24 | アソカ ユーエスエー コーポレーション | Power supply method and system using internal power line |
| US7565116B2 (en) | 2004-11-15 | 2009-07-21 | Tdk Corporation | High frequency module |
| JP2010186848A (en) * | 2009-02-12 | 2010-08-26 | Fujitsu Ltd | Method of manufacturing electronic component unit |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63209197A (en) * | 1987-02-25 | 1988-08-30 | 松下電器産業株式会社 | Control equipment |
-
1989
- 1989-04-20 JP JP1100612A patent/JPH02279027A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63209197A (en) * | 1987-02-25 | 1988-08-30 | 松下電器産業株式会社 | Control equipment |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5740527A (en) * | 1994-11-24 | 1998-04-14 | Nec Corporation | Transceiver |
| KR100626860B1 (en) * | 1998-06-02 | 2006-09-20 | 소니 가부시끼 가이샤 | Method for practically loading transmission or receiving module for optical link and its rigid flexible board |
| JP2008512903A (en) * | 2004-09-03 | 2008-04-24 | アソカ ユーエスエー コーポレーション | Power supply method and system using internal power line |
| US7565116B2 (en) | 2004-11-15 | 2009-07-21 | Tdk Corporation | High frequency module |
| JP2010186848A (en) * | 2009-02-12 | 2010-08-26 | Fujitsu Ltd | Method of manufacturing electronic component unit |
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