JPH0227277A - Method for testing tab product - Google Patents

Abstract

PURPOSE:To stably hold the temp. of a semiconductor chip by providing a fixing element for preventing the bending of both of a lead and a tape so as to be brought into contact with the lead and the tape on the surface side of the semiconductor chip to perform a test. CONSTITUTION:A fixing element 21a is formed from a non-conductive material, for example, Teflon having function for preventing the bending of both of a lead 4 and a tape 6 and provided so as to be brought into contact with the surfaces on the side opposite to a semiconductor chip 5 of the lead 4 and the tape 6 to perform a test. By this method, the bending of the lead 4 and the tape 6 can be prevented and the temp. of the semiconductor chip 5 can be held almost accurately and stably without losing reliability.

Description

[Detailed Description of the Invention] [Summary] Regarding the TAB product testing method, it is possible to maintain the semiconductor chip temperature almost accurately and stably without impairing reliability by preventing lead and tape bending and bump contact defects. The purpose of the TAB product testing method is to provide a TAB product testing method that can be used to test TAB products. A TAB that carries out a reliability test of the TAB product while dissipating heat from the semiconductor chip by bringing a heat sink or a cooling body into contact with the back surface of at least one semiconductor chip constituting the TAB product. In the product testing method, a stator that prevents bending of the leads and tape due to the pressing force of the heat dissipation body or the cooling body against the semiconductor chip is brought into contact with the leads and the tape from the front side of the semiconductor chip. or a semiconductor chip having a bump formed on its periphery, and one end connected to the bump. 33 The TAB product consists of a lead and a tape that fixes the lead, and at least one of the heat dissipating bodies or the cooling body
In the TAB product testing method, the reliability of the TAB product is tested while dissipating the heat of the semiconductor chips by contacting with the back surface of the semiconductor chips. A wind force means for preventing bending of the tape by wind force is provided near the surface side of the semiconductor chip, and the test is performed while blowing wind onto the surface of the semiconductor chip, the leads, and the tape.

[Industrial application field]

The present invention performs reliability tests on TAB products while dissipating heat from the semiconductor chips by bringing a heat sink (or cooling body) into contact with at least one semiconductor chip (also referred to as an IC chip) constituting the TAB product. The present invention relates to a TAB product testing method, and more particularly, to a TAB product testing method that can prevent bending of leads and tapes due to crimping of heat sinks (or cooling bodies).

In general, LSIs are sealed using ceramic or metal lids, for example, to protect semiconductor chips from contamination and damage from the surrounding atmosphere, but with the diversification of LSI packaging technology, flip-chip and beam lead , wireless bonding methods such as tape carriers have been put into practical use. This wireless bonding method forms specific bumps on all pads on a semiconductor chip,
Metal leads are bonded to the bumps and connected to the terminals on the package all at once.

Although this method is complicated as a wafer-based process,
The high speed of future LSIs is possible due to the fact that bonding can be performed at once without depending on the number of electrodes during assembly, and the semiconductor chip can be mounted in an extremely small volume, making it suitable for multi-chip implementation. , is expected to be the optimal assembly method for high integration.

One of the wireless bonding methods is TAB (ta −
pe automated bonding) method, and conventional TAB products obtained by this type of TAB method include, for example, U.S. Patent No. 4,069,496.
The one described in the specification is known. TAB products are composed of leads, tape, and semiconductor chips, and are obtained by first adhering conductive leads to tape, and then crimping and fixing the tape-adhered leads to semiconductor chips.

High reliability is required for this TAB product because it is mounted directly on a board, etc. However, since the semiconductor chip has a structure in which it is suspended in the air, it is extremely easy to generate heat when it is electrically connected, especially during low-temperature tests. The problem remains that it is difficult.

Therefore, there is a need to accurately test TAB products under temperature control.

[Conventional technology]

Figure 4 is a diagram explaining the conventional TAB product testing method, and Figure 5 is a diagram illustrating the conventional TAB product testing method.
FIG. 6, which is a diagram showing product B, is a diagram showing details of a conventional cooling body.

In these figures, 1 is a slide carrier, 2 is a sprocket hole, 3 is a pad, and 4 is a metal lead made of Sn-plated Cu, for example, with a thickness of 30 μm and a width of 100 to 120 μm, for example. It is. 5 is a semiconductor chip, 6 is made of, for example, polyimide resin (polyester resin may also be used), and has a thickness of, for example, 30μ.
m tape, also called film. 7 is the window part,
8 is a contact bottle, 9 is, for example, a metal heat sink, 10
is a medium such as water, 11 is a cooling body, and 12 is a bump made of Au, for example, with a diameter of 120 to 140 μm and a height of 2.
It is 0 to 30 μm.

As shown in Figure 5, TAB products mainly have lead 4.
, a tape 6 and a semiconductor chip 5,
It is fixed to the slide carrier 1. The semiconductor chip 5 is placed inside a window 7 provided in the center of the tape 6, and is connected to the pad 3 via the lead 4. The contact pin 8 is configured to be driven up and down by a spring or the like.

The conventional TAB product testing method, as shown in FIG.
The semiconductor chip 5 is dissipated while dissipating the heat of the semiconductor chip 5.
The reliability test for TAB products is conducted by setting the temperature appropriately.

Although the case where the heat of the semiconductor chip 5 is dissipated by the heat dissipation body 9 has been described, as shown in FIG. In some cases, heat is dissipated by

(Problem to be solved by the invention) However, in the conventional TAB product testing method,
In order to maintain stable contact between the leads 4 and the semiconductor chip 5, the heat sink 9 (or the cooling body 11) needs to have enough pressure to bend the leads 4 and the tape 6, as shown in FIG. Since the lead 4 and tape 6 are bent and unreasonable force is applied to the bump 12, there is a problem in that the reliability of the contact portion between the lead 4, tape 6, and bump 12 is reduced. Specifically, if the leads 4 and tape 6 are bent, cracks are likely to occur in the leads 4 and tape 6, and defects in soldering and positioning to the board in the next process are likely to occur. Testing this is TAB
This has resulted in a significant decrease in product reliability. Note that the tests here are electrical property tests (shipping tests, etc.) before and after the burn-in test, and reliability tests based on accelerated deterioration, and are tests that require keeping the temperature constant.

In addition, since the semiconductor chip 5, leads 4, and tape 6 tend to vary during production and are not necessarily parallel to each other, the leads 4
There was also a problem that the contact between the semiconductor chip 5 and the semiconductor chip 5 could not be made uniformly, resulting in unstable thermal resistance and variations in the temperature of the semiconductor chip 5.

Semiconductor chip 5 temperature at a certain predetermined temperature (high temperature and low temperature)
If we try to keep it constant, 5 semiconductor chips for each sample.
This causes the temperature to fluctuate.

Therefore, the present invention has developed a TA that can maintain the semiconductor chip temperature almost accurately and stably without impairing reliability by preventing bending of leads and tapes and defects in bump contact areas.
The purpose is to provide a method for testing B products.

[Means to solve the problem]

In order to achieve the above object, the TAB product testing method according to the first invention consists of a semiconductor chip having a bump formed on its periphery, a lead having one end connected to the bump, and a tape for fixing the lead. has TAB products that are
In a TAB product testing method, the TAB product is tested for reliability while dissipating heat from the semiconductor chip by bringing a heat sink or a cooling body into contact with the back surface of at least one semiconductor chip constituting the TAB product, A stator that prevents bending of the leads and tape due to the pressing force of the heat dissipation body or the cooling body against the semiconductor chip is placed in contact with the leads and tape from the surface side of the semiconductor chip, or The test was conducted by placing the tape in contact with both sides of the tape.

In order to achieve the above object, the TAB product testing method according to the second invention comprises a semiconductor chip having bumps formed on its periphery, leads having one end connected to the bumps, and a tape for fixing the leads. has TAB products that are
In a TAB product testing method, the TAB product is tested for reliability while dissipating heat from the semiconductor chip by bringing a heat sink or a cooling body into contact with the back surface of at least one semiconductor chip constituting the TAB product, A wind force means for preventing bending of the leads and the tape due to the pressing force of the heat dissipation body or the cooling body by wind force is provided near the surface side of the semiconductor chip, and wind force is applied to the surface of the semiconductor chip, the leads, and the tape. The test was conducted while spraying.

[Effect]

In the first invention, the stator that prevents the leads and tape from bending due to the compression force of the heat dissipating body or the cooling body is arranged on the surface (front side) of the leads and tape opposite to the semiconductor chip, or on the surface of the leads and tape that is opposite to the semiconductor chip. TAB products are tested by being placed in contact with both sides.

In the second aspect of the present invention, the wind force means for preventing bending of the lead and tape due to the pressure of the heat dissipating body or the cooling body by wind force is provided near the surface of the lead and tape on the opposite side to the semiconductor chip (near the surface side). TAB products are tested while being set up and blowing with wind.

Therefore, according to the first and second inventions, almost no unreasonable force is applied to the leads, tapes, and bumps.
It becomes possible to prevent bending of the leads and tape and defects in the bump contact portion, and it becomes possible to maintain the temperature of the semiconductor chip almost accurately without impairing reliability.

〔Example〕

Hereinafter, the present invention will be explained based on the drawings.

FIG. 1 is a diagram illustrating an embodiment of the TAB product testing method according to the first invention.

In these figures, the same reference numerals as in FIGS. 4 to 6 indicate the same or corresponding parts, and 21a indicates the lead 4 and the tape 6.
A stator made of a non-conductive material (any insulator is sufficient) such as Teflon, which has the function of preventing bending of the first stator.
2 to the stator according to the invention.

Note that here, the heat dissipation of the semiconductor chip 5 is performed using the heat sink 9.
Although the embodiment is shown in which heat is dissipated from the semiconductor chip 5 using a cooling body 11 as shown in FIG.

That is, in the above embodiment, as shown in FIG.
Since the test is conducted by placing the lead 4 and tape 6 in contact with the surface opposite to the semiconductor chip 5, bending of the leads 4 and tape 6 can be prevented, and the semiconductor chip 5 can be tested without losing reliability. The temperature of the chip 5 can be maintained almost accurately and stably. Specifically, almost no unreasonable force is applied to the leads 4, tape 6, and bumps 12, resulting in cranking of the leads 4 and tape 6, and defects in the next process (defects in soldering to the board, positioning, etc.) Also, defects in the contact portion of the bump 12 hardly occur.

In addition, in the above embodiment, as shown in FIG.
Although a case has been described in which the test is conducted by providing the lead 4 and the tape 6 on the surface opposite to the semiconductor chip 5, the first invention is not limited to this. , as shown in FIG.
1b is provided on both sides of the lead 4 and the tape 6.
In this case, the lead 4, the tape 6, and the bump 12 are further relieved from being subjected to unreasonable force than in the above embodiment, and the lead 4 is Also, bending of the tape 6 and failure of the contact portion of the bump 12 can be more reliably prevented. In FIG. 2, the stator 21b is provided with air holes 22 (not necessary) to improve the heat dissipation effect of the heat dissipation body 9.

FIG. 3 is a diagram illustrating an embodiment of the TAB product testing method according to the second invention.

In these figures, the same reference numerals as in FIGS. 1 and 2 indicate the same or corresponding parts, and 31 indicates the lead 4 and tape 6.
This wind power means has a function of preventing bending of the wind power means, and corresponds to the wind power means according to the second invention.

Note that although the case where the heat of the semiconductor chip 5 is dissipated by the heat sink 9 is shown here, the mode is not the case where the heat of the semiconductor chip 5 is dissipated by the heat dissipation body 11 as shown in FIG. You can. In addition, the stator 21b has an air hole 22 (
) is provided to improve the heat dissipation effect of the heat dissipation body 9.

That is, in the above embodiment, as shown in FIG. 3, the wind force means 31 that prevents the leads 4 and tape 6 from bending due to the pressing force of the heat sink 9 is attached to the semiconductor chip 5 of the leads 4 and tape 6. Since the test is carried out while blowing wind by installing the tape near the opposite surface (near the surface side), bending of the lead 4 and tape 6 and failure of the contact portion of the bump 12 due to the wind force of the wind force means 31 can be prevented. Therefore, the temperature of the semiconductor chip 5 can be maintained almost accurately and stably without impairing reliability. Specifically, by appropriately adjusting the wind force of the wind force means 31, the lead 4 and tape 6 of the heat dissipating body 9 (or cooling body) as in the conventional case can be adjusted.
This makes it possible to maintain stable contact between the leads 4 and the semiconductor chip 5 without requiring a pressing force that would bend the leads 4 and the semiconductor chip 5.

〔effect〕

According to the first and second aspects of the present invention, it is possible to prevent bending of the lead and tape and failure of the contact portion of the bump 12, thereby maintaining the semiconductor chip temperature almost accurately and stably without impairing reliability. There is an effect.

[Brief explanation of the drawing]

FIG. 1 is a diagram explaining one embodiment of the TAB product testing method according to the first invention, FIG. 2 is a diagram explaining another embodiment of the TAB product testing method according to the first invention, and FIG. is a diagram for explaining an embodiment of the TAB product testing method according to the second invention, FIGS. 4 to 6 are diagrams for explaining the conventional TAB product testing method, and FIG. 4 is a diagram for explaining an example of the TAB product testing method according to the second invention. Figure 5 is a diagram explaining the test method for TAB mounted on a conventional slide carrier.
FIG. 6 is a diagram showing the details of the conventional cooling body, and FIG. 7 is a diagram explaining the problems of the conventional example. 8... Contact pin, 9... Heat sink, 11... Cooling body, 12... Bump, 21a, 21b... Stator , 31...Wind power means. 1... Slide carrier, 4... Lead, 5... Semiconductor chip, 6... Tape, Figure, Figure, Figure

Claims (2)

[Claims] (1) It has a TAB product consisting of a semiconductor chip with bumps formed on its periphery, leads with one end connected to the bumps, and tape that fixes the leads;
In a TAB product testing method, the TAB product is tested for reliability while dissipating heat from the semiconductor chip by bringing a heat sink or a cooling body into contact with the back surface of at least one semiconductor chip constituting the TAB product, A stator that prevents bending of the leads and tape due to the pressing force of the heat dissipation body or the cooling body against the semiconductor chip is placed in contact with the leads and tape from the surface side of the semiconductor chip, or and a TAB product testing method, characterized in that the test is conducted by placing the tape in contact with each other from both sides so as to sandwich the tape. (2) A TAB product consisting of a semiconductor chip with bumps formed on its periphery, leads with one end connected to the bumps, and tape for fixing the leads;
In a TAB product testing method, the TAB product is tested for reliability while dissipating heat from the semiconductor chip by bringing a heat sink or a cooling body into contact with the back surface of at least one semiconductor chip constituting the TAB product, A wind force means for preventing bending of the leads and the tape due to the pressing force of the heat dissipation body or the cooling body by wind force is provided near the surface side of the semiconductor chip, and wind force is applied to the surface of the semiconductor chip, the leads, and the tape. A TAB product testing method characterized by testing while spraying.