JPH02253620A - Washing device for semiconductor substrate - Google Patents

Abstract

PURPOSE:To enable fine foreign objects, dust, etc., to be removed efficiently by rotary-driving a semiconductor substrate in both left and right directions and by spraying a fluid or a gas matching to the rotation onto the front and rear surfaces of the semiconductor substrate. CONSTITUTION:A semiconductor substrate 46 is supported by a rotary-drive pulley 43 and two supporting guide pulleys 42, rotation of a motor for rotary- driving wafer 41 is transmitted to the rotary-drive pulley 43 by the drive belt 42, thus enabling the semiconductor substrate 46 to rotate at high speed. Then, each fluid is sprayed out of a pressurized water, a chemical solution, and an inactive gas jet-out port 44 and is sprayed over the semiconductor substrate 46. Thus, the semiconductor substrate 46 is fitted vertically and the front and rear surfaces of the substrate 46 are washed simultaneously while being rotated so that the rear surface can be washed simultaneously. Also, foreign objects, dust, etc., separated from the semiconductor substrate 46 by the fluid drop effectively and do not remain on the surface of the semiconductor substrate.

Description

[Detailed description of the invention] (Industrial application field) The present invention relates to a semiconductor substrate cleaning apparatus.

(Prior Art) Conventionally, as technologies in this field, there have been the following, for example.

In other words, this type of device places a semiconductor substrate horizontally, generally fixes the back side of the semiconductor substrate by vacuum suction, rotates it, and sprays water, chemical solution, inert gas, etc. onto the surface of the semiconductor substrate. , to remove foreign matter, dust, etc. adhering to the surface.

FIG. 3 is a configuration diagram of such a first conventional semiconductor substrate surface cleaning apparatus.

In the figure, 1 is a chemical liquid nozzle, 2 is a semiconductor substrate, 3 is a suction chuck for fixing the semiconductor substrate 2, and 4 is a motor for rotationally driving the semiconductor substrate 2.

Therefore, the semiconductor substrate 2 attracted by the suction chuck 3
While rotating, supply the chemical liquid with the chemical liquid nozzle l,
The surface of the semiconductor substrate 2 is cleaned.

FIG. 4 is a configuration diagram of a second conventional semiconductor substrate surface cleaning apparatus.

In this figure, 11 is a chemical liquid nozzle, 12 is a semiconductor substrate, 13 is a suction chuck for fixing the semiconductor substrate 12, 14 is a motor for rotationally driving the semiconductor substrate 12, 15 is a semiconductor substrate cleaning brush, and 16 is a This is a rotary drive motor for the cleaning brush 15.

Therefore, the chemical liquid is supplied from the chemical liquid nozzle 11 while rotating the semiconductor substrate 12 that is attracted by the suction chuck 13 . The semiconductor substrate cleaning brush 15 is rotated over the surface of the semiconductor substrate 12 to which the chemical solution has been supplied, thereby cleaning the surface.

Further, FIG. 5 is an overall perspective view of a third conventional semiconductor substrate cleaning apparatus, and FIG. 6 is a partial sectional view of the third conventional semiconductor substrate cleaning apparatus.

In the figure, the processing equipment includes a transfer robot 25, a wafer 2
1 to the jig 24, a dip etching tank 27, a rinsing tank 28, 29, a tank 30 for both final rinsing and drying, and an unloader part 31 for returning the wafer 21 from the jig 24 to the carrier 22. ing. First, the vertically erected wafer 21 is immersed in the dip etching tank 27 by the intermittent movement of the transfer robot 25 in the direction of the arrow and the movement of the wafer in the direction of the arrow E. After the etching is completed, the wafer 21 is pulled up from the etching tank 27, thoroughly washed with water in the washing tanks 28 and 29, and further processed in the final washing tank 30. When the wafer 21 is gradually pulled up in the direction F, as shown in FIG. As shown in FIG.
Dry by blowing warmer air or nitrogen gas.

As such prior art, for example, Japanese Patent Application Laid-Open No. 611213
No. 37 is mentioned.

(Problem B to be Solved by the Invention) However, in the apparatus shown in FIGS. 3 and 4 above, only one side of the semiconductor substrate can be cleaned, and since the semiconductor substrate is fixed horizontally, fine foreign particles can be removed. There were problems such as the inability to completely remove dust and the like.

In addition, in the apparatus shown in FIGS. 5 and 6, since the semiconductor substrate is not rotated, a uniform chemical solution is applied to the substrate.
There was a problem in that it was not possible to spray gas, that is, it was not possible to completely coat the cleaning film.

The present invention eliminates the above-mentioned problems when cleaning semiconductor substrates, and provides a semiconductor substrate cleaning device that can simultaneously rotate and clean the front and back surfaces of a semiconductor substrate and effectively remove fine foreign matter, dust, etc. The purpose is to donate money.

(Means for Solving the Problems) The present invention provides a semiconductor substrate cleaning apparatus in which a semiconductor substrate to be cleaned is vertically installed, a mechanism for applying high-speed rotation to the semiconductor substrate in both left and right directions, and a mechanism for rotating the semiconductor substrate at high speed in both left and right directions. A mechanism is provided for spraying pressurized water, chemical liquid, or inert gas onto the front and back surfaces of the semiconductor substrate from different directions.

(Function) According to the present invention, as described above, since the semiconductor substrate is mounted vertically and is cleaned while being rotated, foreign matter, dirt, etc. separated from the semiconductor substrate are effectively dropped down by the fluid.
Does not remain on the surface of the semiconductor substrate.

Furthermore, since the front and back surfaces of the substrate are cleaned at the same time, the back surface, which was generally not cleaned in the past, can also be cleaned at the same time.

(Example) Hereinafter, an example of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a front view of a semiconductor substrate cleaning apparatus showing an embodiment of the present invention, and FIG. 2 is a side view of the semiconductor substrate cleaning apparatus.

In the figure, 41 is a wafer rotation drive motor, 42 is a drive belt, 43 is a semiconductor substrate rotation drive pulley, 44 is a pressurized water, chemical solution, or inert gas outlet, 45 is a semiconductor substrate support guide pulley, and 46 is a semiconductor substrate. be.

To explain the operation of this device, a semiconductor substrate 46 is supported by a rotation drive pulley 43 and two support guide pulleys 45, and the rotation of the wafer rotation drive motor 41 is transmitted to the rotation drive boolean IJ43 by a drive belt 42. Fi4
6 is rotated at high speed, and pressurized water, chemical liquid, and inert gas fluids are ejected from the ejection port 44 and sprayed onto the semiconductor substrate 46, thereby cleaning and drying the semiconductor substrate 46.

Note that the pressurized water, chemical liquid, and inert gas jet ports 44 are installed at four locations, two on the front and back sides of the semiconductor substrate 46, and the supply of pressurized water, chemical liquid, and inert gas from the jet ports depends on the direction of rotation of the semiconductor substrate 46. It has a structure in which the fluids are switched, and these fluids are ejected from one location on the front and back depending on the direction of rotation.

Note that it is desirable to have a plurality of pressurized water, chemical liquid, and inert gas jet ports 44, as shown in FIG. 1, for example, so as to uniformly spray the fluid (gas) onto the substrate to be processed.

In addition, the reason why pressurized water, chemical liquid, and inert gas jet ports 44 are installed in four locations, two each on the front and back sides of the substrate to be processed, is because fluid (gas) is ) is to be sprayed.

The present invention can also be fully applied to etching, spin coating of viscous liquid such as resist, and development in photolithography steps.

The semiconductor substrate to be processed may have a circular shape or a shape close to it for rotational operation. In the case of a normal wafer, an orientation flat is provided and the shape is not circular, but in such a case,
By providing a spring or the like to the rotation drive pulley 43, the support guide pulley 45, etc., the board can be rotated even if it has a distorted shape.

Note that the present invention is not limited to the above embodiments,
Various modifications are possible based on the spirit of the present invention, and these are not excluded from the scope of the present invention.

(Effects of the Invention) As described above in detail, according to the present invention, the following effects can be achieved.

(1) Since the semiconductor substrate is mounted vertically and is cleaned while being rotated, foreign matter, dirt, etc. separated from the semiconductor substrate by fluid or gas are effectively dropped down and do not remain on the surface of the semiconductor substrate.

(2) Since the front and back surfaces of the semiconductor substrate are cleaned at the same time, the back surface, which was generally not cleaned in the past, can also be cleaned at the same time.

(3) Furthermore, by using the feature that the front and back sides can be cleaned simultaneously, it can be applied to cleaning masks for manufacturing semiconductor integrated circuits.

[Brief explanation of drawings]

FIG. 1 is a front view of a semiconductor substrate cleaning apparatus showing an embodiment of the present invention, FIG. 2 is a side view of the semiconductor substrate cleaning apparatus, and FIG.
FIG. 4 is a configuration diagram of a first conventional semiconductor substrate surface cleaning device, FIG. 4 is a configuration diagram of a second conventional semiconductor substrate surface cleaning device,
FIG. 5 is an overall perspective view of a third conventional semiconductor substrate cleaning apparatus, and FIG. 6 is a partial sectional view of the third conventional semiconductor substrate cleaning apparatus. 41... Wafer rotation drive motor, 42... Drive belt, 43... Semiconductor substrate rotation drive pulley, 44...
... Pressurized water, chemical solution, inert gas jet port, 45... Semiconductor substrate support guide pulley, 46... Semiconductor substrate. This is Q9 Semiconductor J and base 4 Ao Shi f, correct illumination Figure 1 Patent applicant Oki Electric Industry Co., Ltd. agent Patent attorney Mamoru Shimizu (1 other person) q Junsha drama book board design Figure 2 Figure 3 Figure 5 Figure 6

Claims (2)

[Claims] (1) (a) means for vertically holding the semiconductor substrate; (b) means for rotationally driving the semiconductor substrate in both left and right directions; and (c) means for applying fluid or gas to the front and back surfaces of the semiconductor substrate in accordance with the rotation. A semiconductor substrate cleaning device comprising a spraying means. (2) The semiconductor substrate cleaning apparatus according to claim 1, further comprising a structure for simultaneously cleaning and drying the front and back surfaces of the semiconductor substrate.