JPH02180405A - Plane antenna board - Google Patents

Abstract

PURPOSE:To make the whole board into a small plane and to improve the conformability of a circuit condition by using a common ground layer and making an antenna board and a pre-antenna board into a shortest, conductive and integral three-layer structure. CONSTITUTION:An antenna board 2, which forms an antenna pattern 3 corresponding to the reception of a microwave band and a semi-microwave band on an external surface, and a pre-antenna board 5 arranged immediately below it are integrally bonded by commonly using a ground layer 4 to obtain the three-layer board structure of the small plane. Conductive parts 7, 8 and 9 necessary for the plane antenna board can be composed only of a shortest through hole plating conductive structure. For this reason, a wiring pattern part or an unnecessary land part which disturb the circuit constitution can be prevented from being formed. Such a plane antenna board 1 can be sealed and housed in an armor case such as a resin member, and the mechanical strength and weatherability, etc., of the whole board can be secured.

Description

Detailed Description of the Invention "Field of Industrial Application" The present invention relates to a microwave band or quasi-microwave band planar antenna device configured using a planar antenna, in which a planar antenna board and a preamplifier board are combined. The present invention relates to a planar antenna board that can be made smaller and planar while minimizing signal attenuation or loss by integrally forming a three-layer structure via a shared ground layer.

[Prior art and its problems] A conventional receiving antenna device in the microwave band or quasi-microwave band consists of a helical antenna or a planar antenna and a preamplifier separately, and connects the two via a cable. Since the structure is generally connected by connectors, the overall size of the device increases.However, because the two are connected via cables and multiple connectors, the cost of the device is unavoidable, and the signal Attenuation and loss are also difficult to ignore. Increasing the size of the entire receiving antenna device poses a practical problem in terms of difficulty in installation work or restrictions on the installation location.

``Object and Structure of the Invention'' The Ice invention suitably solves the problems of the conventional pot antenna device described above, and provides a planar antenna substrate and a preamplifier that are optimal for a receiving antenna device in the microwave band or quasi-microwave band. The circuit board is integrated into a three-layer structure under a common ground layer, achieving a compact and flat design and minimizing signal attenuation, without forming unnecessary lands or open end lines. The purpose of the present invention is to provide a planar antenna substrate that can operate under stable circuit conditions.

Therefore, the planar antenna board according to the present invention is used in a planar antenna device that receives microwave band or quasi-microwave band signals, so that the planar antenna board and the preamplifier board share a ground layer. Both the antenna and preamplifier boards are integrated into a three-layer structure with the ground layer interposed therebetween, and there is a gap between the antenna pattern of the planar antenna board and the preamplifier board, and between the preamplifier board, the antenna pattern, and the ground layer. Such a planar antenna board can be configured to have the necessary conductive parts between the antennas, and can constitute a small planar antenna board with extremely good matching conditions without forming undesirable impedance. Installation of the board is also easy.

"Embodiment" The drawing shows one embodiment of the invention, and as shown in FIG. It consists of a small, planar, three-layer board structure in which the formed antenna board 2 and the preamplifier board 5 placed directly below are integrally joined together with the ground layer 4 in common.

FIG. 2 shows a conceptual cross-sectional view of essential parts of such a planar antenna board 1. In this embodiment, the ground layer 4 is formed separately facing the bonding layer 6 for the antenna board 2 and preamplifier board 5. Both substrates 2.5 are configured to be double-sided, and the ground layers 4 on each substrate 2.5 are electrically connected in advance through through-hole conductive portions 7.8. A conductive portion 9 is provided between the antenna pattern 3 and the preamplifier board 5 using a conductive bottle as appropriate. Note that 5A indicates a circuit wiring pattern on the side of the preamplifier board 5, and on the side where the circuit wiring pattern 5A is formed, chip-type electronic circuit elements (not shown) which should constitute the preamplifier are appropriately mounted.

In the case of a planar antenna board with this structure, the mounting process of the conductive bottle is complicated, and the ground layer 4 is attached to each board 2.5.
Since each ground layer 4 is provided independently, many connections and conductions are required to maintain each ground layer 4 at the same potential, resulting in detour patterns and unnecessary lands, which act as undesirable inductance and capacitance. Therefore, there is a possibility that the circuit conditions may differ.

Figure 3 shows a three-layer board structure that can eliminate such obstacles,
The antenna board 2 and the preamplifier board 5 are constructed so that they can completely share a single ground layer 4. The conductive parts 7, 8, and 9 necessary for this planar antenna board can be constructed using only the shortest through-hole plating conductive structure, so it is possible to eliminate the formation of wiring pattern parts or unnecessary land parts that would impede the circuit conditions. .

Such a planar antenna board l can be hermetically housed in an exterior case made of a resin member or the like to ensure the mechanical strength, weather resistance, etc. of the entire board.

"Effects of the Invention J As described above, the planar antenna board according to the present invention is suitable for a microwave band or quasi-microwave band receiving antenna device, and the antenna board and preamplifier board can be connected in the shortest possible distance under the common ground layer. Since the integrated three-layer structure is configured to allow electrical conduction, the entire board can be made smaller and more flat, and a planar antenna board with good circuit conditions and high matching can be provided.

Since the antenna board and the preamplifier board are integrated into a three-layer structure with a common ground layer, attenuation or loss of the received signal can be minimized.

[Brief explanation of the drawing]

FIG. 1 is a conceptual perspective view of a planar antenna board according to the present invention, FIG. 2 is a conceptual cross-sectional view of main parts of a planar anti-board according to an embodiment of the present invention, and FIG. FIG. 3 is a conceptual cross-sectional configuration diagram of main parts of a planar anti-substrate having a three-layer structure in which the planar antenna substrate of FIG. 2 is improved and a ground layer is shared. l: 2: 3: 4: 5 = 5 A: 6 Near ~ 9: Planar antenna board Antenna pattern As layer Preamplifier board Circuit wiring pattern body Adhesive layer Conductive part 1 Fig. 2 Figure 3

Claims (1)

[Claims] In a planar antenna device that receives signals in the microwave band or quasi-microwave band, the planar antenna and preamplifier board are integrated through the ground layer so that the ground layer is shared between the planar antenna board and the preamplifier board. The planar antenna substrate has a three-layer structure, and is configured to include required conductive portions between the antenna pattern of the planar antenna board and the preamplifier board, and between the preamplifier board, the antenna pattern, and the ground layer. A flat antenna board characterized by: