JPH02143860A - Screen printing method onto substrates having different thicknesses - Google Patents
Screen printing method onto substrates having different thicknessesInfo
- Publication number
- JPH02143860A JPH02143860A JP29873588A JP29873588A JPH02143860A JP H02143860 A JPH02143860 A JP H02143860A JP 29873588 A JP29873588 A JP 29873588A JP 29873588 A JP29873588 A JP 29873588A JP H02143860 A JPH02143860 A JP H02143860A
- Authority
- JP
- Japan
- Prior art keywords
- mask
- printing
- screen printing
- face
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007650 screen-printing Methods 0.000 title claims abstract description 22
- 239000000758 substrate Substances 0.000 title claims abstract description 12
- 238000000034 method Methods 0.000 title claims description 14
- 238000007639 printing Methods 0.000 claims abstract description 21
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims 2
- 229910000679 solder Inorganic materials 0.000 abstract description 24
- 239000006071 cream Substances 0.000 abstract description 23
- 230000000694 effects Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
Landscapes
- Screen Printers (AREA)
- Printing Methods (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
この発明は、基準面から厚みの異なる実装面を持つ基板
へのスクリーン印刷方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a screen printing method for a substrate having a mounting surface having a different thickness from a reference surface.
［従来の技術］
第４図は従来の実装面に段差を持つ基板への半田塗布方
法を示す斜視図であり、図において（ｌａ）は厚みの異
なる実装面を持つ基板、（１ｂ）は基板（１ａ）の高い
方の実装面、（ＩＣ）は基板（１ａ）の低い方の実装面
、（２）は基板（１ａ）の実装面の厚みの差、（３）は
クリーム半田（４）は基板（ｌ ａ）にクリーム半田（
３）を塗布するディスペンス装置である。このディスペ
ンス装置（４）により一々クリーム半田（３）を実装面
（ｌｂ）、（ｌｃ）の所定位置（３１）へ塗布する。[Prior Art] Fig. 4 is a perspective view showing a conventional method of applying solder to a board with a step on the mounting surface. (1a) is the higher mounting surface, (IC) is the lower mounting surface of the board (1a), (2) is the difference in thickness of the mounting surface of the board (1a), (3) is the cream solder (4) is cream solder (
This is a dispensing device that applies 3). The cream solder (3) is applied one by one to predetermined positions (31) on the mounting surfaces (lb) and (lc) using this dispensing device (4).
第５図および第６図は従来のスクリーン印刷機を示す斜
視図及び断面図であり、（５）は基板（ｌａ）を位置決
め収納するステージ、（６）はクリーム半田（３）の塗
布形状に合ったパターン穴（３２）を有するマスク、（
７）はこのマスク（６）を張りつけ固定する保持枠、（
８）は上記保持枠（７）を固定するフレーム、（９）は
マスク（６）に接触した状態で移動してマスク（６）の
パターン穴（３２）より基板（１ａ）にクリーム半田（
３）を塗布するスキージ、（１０）はスキージ（９）を
取り付けるプレート、（１１）はスキージ（９）を上下
動させるエアシリンダ、（１２）はプレート（１０）に
連結されスキージ（９）を移動させるためのシリンダ、
（１３）はシリンダ（１２）をフレーム（８）に固定さ
せるブラケットである。Figures 5 and 6 are a perspective view and a sectional view showing a conventional screen printing machine, in which (5) is a stage for positioning and storing the board (la), and (6) is a stage for applying cream solder (3). a mask with matched pattern holes (32), (
7) is a holding frame to which this mask (6) is attached and fixed, (
8) is a frame that fixes the holding frame (7), and (9) moves while in contact with the mask (6) and applies cream solder (
3), a squeegee (10) is a plate to which the squeegee (9) is attached, (11) is an air cylinder that moves the squeegee (9) up and down, and (12) is connected to the plate (10) to move the squeegee (9). cylinder for moving,
(13) is a bracket that fixes the cylinder (12) to the frame (8).
第４図に示されたディスペンス装置（４）により、基準
面から厚みの異なる実装面（ｌｂ）、（ｌｃ）を持った
基板（１ａ）へのクリーム半田（３）の塗布方法につい
て詳しく説明する。ディスペンス装置（４）により基板
（１ａ）の低い方の実装面（ＩＣ）の所定の位置（３１
）にクリーム半田（３）を塗布する。次いで同様にディ
スペンス装置（４）により基板（１ａ）の高い方の実装
面（１ｂ）の所定の位置（３１）にクリーム半田（３）
を塗布する。あるいは、この高い方の実装面（１ｂ）に
ついては以下で説明するスクリーン印刷機によりクリー
ム半田（３）を印刷する。A method of applying cream solder (3) to a board (1a) having mounting surfaces (lb) and (lc) having different thicknesses from a reference surface using a dispensing device (4) shown in FIG. 4 will be explained in detail. . The lower mounting surface (IC) of the board (1a) is placed at a predetermined position (31) by the dispensing device (4).
) apply cream solder (3). Next, cream solder (3) is similarly applied to a predetermined position (31) on the higher mounting surface (1b) of the board (1a) using the dispensing device (4).
Apply. Alternatively, cream solder (3) is printed on the higher mounting surface (1b) using a screen printer as described below.
次に、第５図に示された従来のスクリーン印刷機の動作
について詳しく説明する。基板（１ａ）をステージ（５
）上に位置決め載置する。次いでステージ（５）をマス
ク（６）の下の所定の位置へ移動させる（矢印Ｐ）。次
いで、エアシリンダ（１１）を動作させスキージ（９）
を下降させてマスク（６）に接触させる。この状態でシ
リンダ（１２）によりスキージ（９）をマスク（６）の
面に沿って移動させる（矢印Ｑ）。かくしてマスク（６
）のパターン穴（３２）より基板（１ａ）上にクリーム
半田（３）が付着する。なお、このスクリーン印刷機は
基板（１ａ）の実装面に段差があると高い方の実装面（
１ｂ）にしかクリーム半田を塗布することが出来ない。Next, the operation of the conventional screen printing machine shown in FIG. 5 will be explained in detail. The substrate (1a) is placed on the stage (5
). Next, the stage (5) is moved to a predetermined position under the mask (6) (arrow P). Next, operate the air cylinder (11) and press the squeegee (9).
is lowered to make contact with the mask (6). In this state, the cylinder (12) moves the squeegee (9) along the surface of the mask (6) (arrow Q). Thus the mask (6
) Cream solder (3) adheres to the substrate (1a) through the pattern holes (32). Note that this screen printing machine prints the printed circuit board (1a) on the higher mounting surface (
Cream solder can only be applied to 1b).
［発明が解決しようとする課題〕
第４図に示すディスペンス装置により基準面から厚みの
異なる実装面を持つ基板へクリーム半田を塗布する方法
は塗布形状や塗布厚の管理が難しく半田量がばらつくと
共に１カ所ずつ塗布を行うため時間がかかる等の問題点
があった。[Problems to be Solved by the Invention] The method of applying cream solder from a reference surface to a board having a mounting surface of different thickness using the dispensing device shown in FIG. There were problems such as it was time consuming because the coating was applied to each location one by one.
また第５図に示す従来のスクリーン印刷機は、マスク面
が平坦になっているため実装面が平坦な基板あるいは、
基準面から厚みの異なる実装面を持つ基板の場合、高い
実装面しか印刷出来ないなどの問題点があった。In addition, the conventional screen printing machine shown in Fig. 5 has a flat mask surface, so the mounting surface is flat on a board or
In the case of a board with a mounting surface that is different in thickness from the reference surface, there are problems such as only being able to print on the higher mounting surface.
この発明は上記のよう′な問題点を解消するためになさ
れたもので、基準面から厚みの異なる実装面を持つ基板
の各々の実装面にクリーム半田をスクリーン印刷する方
法を得ることを目的とする。This invention was made to solve the above-mentioned problems, and its purpose is to provide a method for screen printing cream solder on each mounting surface of a board having mounting surfaces with different thicknesses from a reference surface. do.
［課題を解決するための手段］
この発明に係るスクリーン印刷方法は、基板の実装面の
厚みの差と等しい段差のある印刷面を有する印刷マスク
を設け、印刷マスクの異なる印刷面ごとに個別のスキー
ジを設け、これらのスキージを駆動することによりスク
リーン印刷を行うものである。[Means for Solving the Problems] The screen printing method according to the present invention provides a printing mask having a printing surface with a level difference equal to the difference in thickness of the mounting surface of the board, and separates each printing surface for each different printing surface of the printing mask. Squeegees are provided and screen printing is performed by driving these squeegees.
［作用１
この発明に係るスクリーン印刷方法は、基板の実装面の
厚みの差と等しい段差のある印刷面を有する印刷マスク
を設け、印刷マスクの異なる印刷面ごとに個別のスキー
ジを設けることにより、これらスキージを駆動して厚み
の差の異なる高低の両実装面にクリーム半田を印刷出来
る。[Function 1] The screen printing method according to the present invention provides a printing mask having a printing surface with a step equal to the difference in thickness of the mounting surface of the board, and providing a separate squeegee for each different printing surface of the printing mask. By driving these squeegees, cream solder can be printed on both high and low mounting surfaces with different thicknesses.
［実施例１
以下、このスクリーン印刷方法の一実施例を第１図乃至
第３図について説明する。第１図は本発明の段差のある
マスクを示す斜視図であり、図において（６ａ）は高い
実装面（１ｂ）に対応するマスク区分、（６ｂ）は低い
実装面（ＩＣ）に対応するマスク区分であり、（７）は
マスク区分（６ａ）、（６ｂ）を張りつけ固定する保持
枠、（１４）はマスク区分（６ａ）とマスク区分（６ｂ
）の段差である。第２図および第３図は第１図のマスク
にスキージを組み合わせてなるスクリーン印刷機を示す
斜視図と断面図であり、図において（ｌａ）は基板、（
１ｂ）は高い実装面、（ｌｃ）は低い実装面、（３）は
クリーム半田、（５）は基板（１ａ）を位置決め載置す
るステージ、（８）は保持枠（７）を固定するフレーム
、（９ａ）はマスク区分（６ａ）に接触し移動する第１
スキージ、（９ｂ）はマスク区分（６ｂ）に接触し移動
する第２スキージ、（１０）は両スキージ（９ａ）、（
９ｂ）を取付けるプレート、（１１ａ）は第１スキージ
（９ａ）を上下動させる第１エアシリンダ、（ｌｌｂ）
は第２スキージ（９ｂ）を上下動させる第２エアシリン
ダ、（１２）はプレート（１０）に連結され両スキージ
（９ａ）。[Embodiment 1] An embodiment of this screen printing method will be described below with reference to FIGS. 1 to 3. FIG. 1 is a perspective view showing a mask with steps according to the present invention, in which (6a) is a mask section corresponding to a high mounting surface (1b), and (6b) is a mask section corresponding to a low mounting surface (IC). (7) is a holding frame for attaching and fixing mask sections (6a) and (6b), and (14) is a holding frame for attaching and fixing mask sections (6a) and (6b).
). FIGS. 2 and 3 are a perspective view and a sectional view showing a screen printing machine in which the mask shown in FIG. 1 is combined with a squeegee;
1b) is a high mounting surface, (lc) is a low mounting surface, (3) is cream solder, (5) is a stage for positioning and placing the board (1a), and (8) is a frame for fixing the holding frame (7). , (9a) is the first contacting and moving mask section (6a).
Squeegee (9b) is a second squeegee that moves in contact with mask section (6b), (10) is both squeegees (9a), (
9b) is the first air cylinder that moves the first squeegee (9a) up and down; (11a) is the first air cylinder that moves the first squeegee (9a) up and down;
(12) is a second air cylinder that moves the second squeegee (9b) up and down, and both squeegees (9a) are connected to the plate (10).
（９ｂ）を移動させるためのシリンダ、（１３）はシリ
ンダ（１２）をプレート（８）に固定するブラケットで
ある。(9b) is a cylinder for moving, and (13) is a bracket that fixes the cylinder (12) to the plate (8).
次に本発明のスクリーン印刷方法について説明する。第
１図に示すように、基板（１ａ）の高い実装面（１ｂ）
と低い実装面（ＩＣ）の厚みの差（２）と等しい段差（
１４）になるようマスク区分（６ａ）とマスク区分（６
ｂ）を保持枠（７）に張り付は固定する。次いで、基板
（１ａ）の高い実装面（１ｂ）とマスク区分（６ａ）の
面、低い実装面（ＩＣ）とマスク区分（６ｂ）の面を合
わせ、両スキージ（９ａ）、（９ｂ）を両マスク区分（
６ａ）、（６ｂ）に接触した状態で移動させることによ
り基板（１ａ）の両実装面（１ｂ）（１ｃ）に同時にク
リーム半田（３）を印刷する。Next, the screen printing method of the present invention will be explained. As shown in Figure 1, the high mounting surface (1b) of the board (1a)
and the lower mounting surface (IC) thickness difference (2) equal to the difference (2)
14), mask classification (6a) and mask classification (6
b) is attached and fixed to the holding frame (7). Next, align the high mounting surface (1b) of the board (1a) with the surface of the mask section (6a), and the surface of the low mounting surface (IC) with the mask section (6b), and press both squeegees (9a) and (9b) together. Mask classification (
6a) and (6b), the cream solder (3) is simultaneously printed on both mounting surfaces (1b) and (1c) of the board (1a).
勿論、その前に基板（１ａ）はステージ（５）上に位置
決め載置する。次いでステージ（５）をマスク区分（６
ａ）、（６ｂ）の下の所定の位置へ移動させる。次いで
両スキージ（９ａ）、（９ｂ）が下降しマスク区分（６
ａ）、（６ｂ）に接触すべくエアシリンダ（ｌｌａ）、
（Ｉｌｂ）を動作させる。Of course, before that, the substrate (1a) is positioned and placed on the stage (5). Next, the stage (5) is divided into mask sections (6
a), move it to the predetermined position below (6b). Next, both squeegees (9a) and (9b) descend to move the mask section (6
a), an air cylinder (lla) to contact (6b),
(Ilb) is activated.
この状態でシリンダ（１２）により両スキージ（９ａ）
、（９ｂ）をマスクの面に沿って移動させるとマスク区
分（６ａ）、（６ｂ）のパターン穴（３２）よりクリー
ム半田は基板（１ａ）の実装面（ｌｂ）、（ｌｃ）へ押
し出されクリーム半田（３）を印刷するのである。In this state, both squeegees (9a) are removed by the cylinder (12).
, (9b) along the mask surface, the cream solder is pushed out from the pattern holes (32) of mask sections (6a) and (6b) onto the mounting surfaces (lb) and (lc) of the board (1a). Cream solder (3) is printed.
尚、本実施例では、クリーム半田のスクリーン印刷の場
合について説明したが、クリーム半田ではなく接着剤や
レジストインク等のスクリーン印刷についても同様の効
果を奏する。In this embodiment, the case of screen printing with cream solder has been described, but the same effect can be obtained by screen printing with adhesive, resist ink, etc. instead of cream solder.
また、第２図及び第３図に示された実施例においては両
スキージ（９ａ）、（９ｂ）は−個のプレート（１０）
とこれを駆動する一個のシリンダ（１２）とで同期的に
駆動されるようになされているが、別個のプレートと別
個のシリンダとで別個に駆動するようにしてもよい。In addition, in the embodiment shown in FIGS. 2 and 3, both squeegees (9a) and (9b) have - plates (10).
Although it is configured to be driven synchronously by a single cylinder (12) that drives the plate, it may also be driven separately by separate plates and separate cylinders.
［発明の効果］
以上のようにこの発明によれば、印刷マスクに基板の実
装面の厚みの差と等しい差を持った印刷面を設け、各印
刷面ごとにスキージを設けることにより、厚みの異なる
実装面を持った基板へスクリーン印刷を迅速に為す効果
がある。[Effects of the Invention] As described above, according to the present invention, the printing mask is provided with printing surfaces having a difference equal to the difference in thickness of the mounting surface of the board, and a squeegee is provided for each printing surface, thereby reducing the thickness. This has the effect of quickly performing screen printing on boards with different mounting surfaces.
第１図は、本発明の方法を実施するためのマスクを示す
斜視図、第２図は本発明の方法を実施するためのスクリ
ーン印刷機を示す斜視図、第３図は第２図のスクリーン
印刷機の断面図、第４図は従来のクリーム半田塗布方法
を示す斜視図、第５図は従来のスクリーン印刷機を示す
斜視図、第６図は第５図のスクリーン印刷機の断面図で
ある。
図において、（１）は基板、（２）は厚みの差（３）は
クリーム半田、（６ａ）、、（６ｂ）はマスク区分、（
９ａ）、（９ｂ）はスキージ、（１４）は段差である。
尚、図中、同一符号は同一、又は相当部分を示す。
代理人 弁理士 大 ・岩 増 雄第
■
図
３２：Ｒ’９−し八
第
図FIG. 1 is a perspective view showing a mask for implementing the method of the present invention, FIG. 2 is a perspective view showing a screen printing machine for implementing the method of the present invention, and FIG. 3 is a perspective view of the screen of FIG. 4 is a perspective view showing a conventional cream solder application method, FIG. 5 is a perspective view showing a conventional screen printing machine, and FIG. 6 is a sectional view of the screen printing machine shown in FIG. 5. be. In the figure, (1) is the substrate, (2) is the difference in thickness (3) is the cream solder, (6a), (6b) is the mask classification, (
9a) and (9b) are squeegees, and (14) is a step. In addition, in the figures, the same reference numerals indicate the same or corresponding parts. Agent Patent Attorney Dai Masuo Iwa ■ Figure 32: R'9-Shihachi Diagram
Claims (1)
定の位置に塗布物を塗布する基板へのスクリーン印刷方
法において、上記基板の実装面の厚みの差と等しい段差
によって構成された基準面からの高さの異なる印刷面を
もつ印刷マスクを設け、この印刷マスクの基準面から高
さの異なる印刷面ごとに個別のスキージを設け、各スキ
ージを印刷面に接触させた状態で移動させることにより
上記基板の厚みの異なる実装面に塗布物を印刷すること
を特徴とする厚みが異なる基板へのスクリーン印刷方法
。(1) In a screen printing method for a board in which a coating material is applied to a predetermined position of a board having a mounting surface with a different thickness from a reference surface, a reference formed by a step equal to the difference in thickness of the mounting surface of the board. A printing mask with printing surfaces at different heights from the reference surface is provided, separate squeegees are provided for each printing surface at different heights from the reference surface of the printing mask, and each squeegee is moved while being in contact with the printing surface. A method for screen printing on substrates having different thicknesses, characterized in that a coating material is printed on mounting surfaces of the substrates having different thicknesses.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29873588A JPH02143860A (en) | 1988-11-26 | 1988-11-26 | Screen printing method onto substrates having different thicknesses |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29873588A JPH02143860A (en) | 1988-11-26 | 1988-11-26 | Screen printing method onto substrates having different thicknesses |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02143860A true JPH02143860A (en) | 1990-06-01 |
Family
ID=17863584
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29873588A Pending JPH02143860A (en) | 1988-11-26 | 1988-11-26 | Screen printing method onto substrates having different thicknesses |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02143860A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0480085U (en) * | 1990-11-27 | 1992-07-13 | ||
| JP2015066693A (en) * | 2013-09-26 | 2015-04-13 | 日本電気株式会社 | Printer and printing method |
| JP2015109398A (en) * | 2013-12-06 | 2015-06-11 | パナソニックＩｐマネジメント株式会社 | Electronic component mounting method and electronic component mounting system |
| CN106624249A (en) * | 2016-11-30 | 2017-05-10 | 江西洪都航空工业集团有限责任公司 | Fixing method for soldering paste scraping |
-
1988
- 1988-11-26 JP JP29873588A patent/JPH02143860A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0480085U (en) * | 1990-11-27 | 1992-07-13 | ||
| JP2015066693A (en) * | 2013-09-26 | 2015-04-13 | 日本電気株式会社 | Printer and printing method |
| JP2015109398A (en) * | 2013-12-06 | 2015-06-11 | パナソニックＩｐマネジメント株式会社 | Electronic component mounting method and electronic component mounting system |
| CN106624249A (en) * | 2016-11-30 | 2017-05-10 | 江西洪都航空工业集团有限责任公司 | Fixing method for soldering paste scraping |
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