JPH02141793A - Light emitting diode type display device - Google Patents

Light emitting diode type display device

Info

Publication number
JPH02141793A
JPH02141793A JP1256918A JP25691889A JPH02141793A JP H02141793 A JPH02141793 A JP H02141793A JP 1256918 A JP1256918 A JP 1256918A JP 25691889 A JP25691889 A JP 25691889A JP H02141793 A JPH02141793 A JP H02141793A
Authority
JP
Japan
Prior art keywords
light
emitting diode
display device
light emitting
base body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1256918A
Other languages
Japanese (ja)
Inventor
Karl-Ulrich Stein
カールウルリツヒ、シユタイン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of JPH02141793A publication Critical patent/JPH02141793A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F13/00Illuminated signs; Luminous advertising
    • G09F13/20Illuminated signs; Luminous advertising with luminescent surfaces or parts
    • G09F13/22Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F13/00Illuminated signs; Luminous advertising
    • G09F13/20Illuminated signs; Luminous advertising with luminescent surfaces or parts
    • G09F13/22Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent
    • G09F2013/222Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent with LEDs

Abstract

PURPOSE: To obtain a light emitting diode type display device enabling SMD (surface mounting device) mounting with low costs by setting a plastic in which a light emitting diode is buried as the carrier of a light emitting face or a light emitting code. CONSTITUTION: A plastic in which a light emitting diode 3 is buried is constituted as a planar transparent substrate 1 in which light transmission is operated by full reflection on the upper face and the lower face and reflection on a short hand side face. Moreover, this is formed as the carrier of a light emitting face or a light emitting code 2, and the case of a light emitting diode 3. The code 2 to be illuminated is provided as a light scattering film on the upper face (front face) of the plastic in which the light emitting diode 3 is buried, that is, the substrate by marking. Thus, a light emitting diode type display device which can be easily formed, and especially which is suitable to SMD mounting can be obtained with low costs.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、ケース内において導体路上に配設され光導体
として使用されるプラスチック内に埋設された少なくと
も1つの発光ダイオード(LED)を備え、この発光ダ
イオードがケースの前面に備えられた発光面または発光
符号を照明するために使われる発光ダイオード式表示装
置に関する。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Application] The invention comprises at least one light emitting diode (LED) embedded in a plastic arranged on a conductor track in a case and used as a light guide, The present invention relates to a light emitting diode display device in which the light emitting diode is used to illuminate a light emitting surface or a light emitting sign provided on the front surface of a case.

〔従来の技術〕[Conventional technology]

この種のLEDデイスプレィは知られており、関係文献
には詳細に記載されている。
LED displays of this type are known and described in detail in the relevant literature.

特に遊戯用電子装置および自動車用電子装置においては
LED照明による多数の発光面または発光符号が使用さ
れており、これらによって機器の所定の運転状態が表示
される。
Particularly in entertainment electronic devices and automotive electronic devices, a large number of light-emitting surfaces or symbols with LED lighting are used, which indicate certain operating states of the device.

これらの発光符号は今日では大面積LEDとして、また
は側光放射式LEDを備えた反射装置として実現されて
いる。
These luminescent symbols are today realized as large-area LEDs or as reflective devices with side-emitting LEDs.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

この種の表示装置にとっては縁部被覆体および前面被覆
体を含めて多数の個別部品が必要であり、これらはロジ
ック上および実装上多くのコストを招いている。
A large number of individual parts are required for this type of display, including edge and front covers, which incur high logic and implementation costs.

さらに、多数の部品が必要であることは最近ますます熱
望されているSMD (面実装デバイス)実装に応じる
ことが出来ない。
Additionally, the large number of components required does not support the increasingly popular SMD (surface mount device) implementation.

そこで、本発明は、コンパクトな集積構成によって僅か
な個別部品でも十分であり、簡単に製作可能でかつコス
ト的に良好であり、しかも特にSMD実装に適するよう
な発光ダイオード式表示装置を提供することを課題とす
る。
SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a light emitting diode display device that has a compact integrated structure, requires only a small number of individual parts, is easy to manufacture, is cost effective, and is particularly suitable for SMD mounting. The task is to

〔課題を解決するための手段〕[Means to solve the problem]

このような課題を解決するために、本発明は、冒頭で述
べた種類の発光ダイオード(LED)式表示装置におい
て、発光ダイオードが埋設されるプラスチックは、光伝
導が上面および下面での全反射ならびに短手側面での反
射によって行われる平坦状透明基体として構成され、し
かも発光面または発光符号の但持体としてかつ発光ダイ
オードのケースとして形成されることを特徴とする。
In order to solve these problems, the present invention provides a light-emitting diode (LED) display device of the type mentioned at the beginning, in which the plastic in which the light-emitting diode is embedded has a structure in which light conduction is caused by total reflection on the top and bottom surfaces and It is characterized in that it is constructed as a flat transparent substrate that undergoes reflection on its short sides, and is formed as a holder for a light-emitting surface or a light-emitting code and as a case for a light-emitting diode.

本発明の1つの実施態様によれば、平坦状透明基体の内
部では1つまたは複数の発光ダイオードが適当な方法に
て導体路上に配設され、照明されるべき発光符号は基体
の上面に光散乱膜として設けられるかまたは基体内に光
散乱窪みとして形成される。
According to one embodiment of the invention, inside the flat transparent substrate one or more light-emitting diodes are arranged in a suitable manner on the conductor track, and the luminescent symbol to be illuminated is provided with a light beam on the top surface of the substrate. It is provided as a scattering film or formed as a light scattering depression within the substrate.

本発明の他の実施態様は請求項3以下に記載されている
Other embodiments of the invention are described in claims 3 and below.

〔作用および発明の効果〕[Action and effect of the invention]

本発明によって得られる利点は、特に、平坦状SMD形
デバイスがLED、反射体および符号但持体の組合わせ
の代わりに実現されるという点にある。
The advantage provided by the invention lies, inter alia, in that a flat SMD type device is realized instead of a combination of LED, reflector and code holder.

照明されるべき符号は発光ダイオードが埋設されるプラ
スチックつまり基体の上面(前面)に例えば刻印によっ
て光散乱膜として設けられるか、または基体内に光散乱
窪みとして形成することが出来る。平坦状透明基体はそ
の場合には上面および下面での全反射による光導体とし
て、ならびに短手側面での鏡面または散乱反射膜として
作用する。基体の先導体作用は液晶表示装置の螢光照明
と比較し得る。
The code to be illuminated can be provided as a light-scattering film, for example by stamping, on the top side (front side) of the plastic or base body in which the light-emitting diode is embedded, or it can be formed as a light-scattering recess in the base body. The flat transparent substrate then acts as a light guide by total internal reflection on the top and bottom sides, and as a mirror or diffusely reflective coating on the shorter sides. The conductor action of the substrate can be compared to the fluorescent illumination of a liquid crystal display.

発光ダイオードが埋設されるプラスチックつまり符号邑
持体は少なくともその1つの側面にインライン実装また
は面実装デバイス(SMD)実装用接続端子を有する。
The plastic or code carrier in which the light emitting diode is embedded has connection terminals for in-line mounting or surface mount device (SMD) mounting on at least one of its sides.

1つまたは複数の同一または異種の色のL已Dチップを
備えたこの表示装置を構成するために、特に平坦状リー
ドフレームが使用される。チップは例えばリードフレー
ムの注型または射出成形によって製作可能な基体の縁部
または角部に設けられる。
In particular, a flat lead frame is used to construct this display device with one or more L-width-D chips of the same or different colors. The chips are provided at the edges or corners of the substrate, which can be produced, for example, by casting or injection molding the lead frame.

チップは特に水平に、すなわち上面に対して平行に光放
射すべきである。このことは例えばチップの前側または
後側の少なくとも一方を鏡面に形成することによって、
もしくはダイボンディングまたはワイヤボンディングに
基づいて反射体としてリードフレーム部分を構成するこ
とによって達成され、それによってチップは観察者から
は遮蔽される。さらに、このことは基体の上面を散乱反
射面または鏡面に形成することによって達成される。光
導体を改善するために、その光導体が存在する縁部には
散乱反射膜または散乱鏡面膜が設けられる0本発明によ
るデバイスが実装されるプリント板はその上面が特に黒
色に着色される。
The chip should emit light in particular horizontally, ie parallel to the top surface. This can be achieved, for example, by forming at least one of the front or rear sides of the chip into a mirror surface.
Alternatively, this can be achieved by configuring the lead frame part as a reflector based on die bonding or wire bonding, so that the chip is shielded from the observer. Furthermore, this is achieved by forming the upper surface of the substrate to be a scattering reflective surface or a mirror surface. In order to improve the light guide, the edge where the light guide is present is provided with a scattering-reflection coating or a scattering-mirror coating.The printed circuit board on which the device according to the invention is mounted is preferably colored black on its upper side.

〔実施例〕〔Example〕

次に、本発明の実施例を図面に基づいて詳細に説明する
Next, embodiments of the present invention will be described in detail based on the drawings.

図示されたLED式表示装置は主として平坦状透明基体
1から構成されている。この基体1の材料としては例え
ばLED式イフィンジケータランプいても使用されてい
る透明プラスチックが適する。基体lのプラスチックは
LEDチップ3のために必要な保護機能およびLEDチ
ップ3の電気的接続の他に、他の半導体デバイスとは異
なり、チップ3からの光出射と、光案内すなわちこの例
ではアルファベット文字Pで示されている発光符号2へ
の光伝導との補助機能を有している。光伝導は透明基体
1の内部においてその上面および下面での全反射ならび
に短手側面での反射によって行われるべきであり、その
ために鏡面または散乱反射膜5が設けられている。鏡面
または散乱反射wA5はこの実施例においては縁部被覆
体として基体1の短手側面上にまで延在し、そして基体
lの上面においては発光符号2のための空所領域を取り
囲んでいる0例えば型式の刻印は基体lの上面の縁部領
域で行うのが好ましい、LEDチップ3は基体lの内部
に設けられて部分的に隠蔽して表示されたリードフレー
ム4上に取付けられ、しかもその取付けは基体1の縁部
領域、すなわち発光符号2のための空所領域の外側でか
つ縁部被覆体つまり反射膜5の内側で行われている。S
MD実装のためにリードフレーム4の接続端子は基体l
の外側において適当に折曲げられている。
The illustrated LED display device is mainly composed of a flat transparent substrate 1 . A suitable material for the base body 1 is, for example, transparent plastic, which is also used in LED type iffindicator lamps. In addition to the necessary protective functions for the LED chip 3 and the electrical connection of the LED chip 3, the plastic of the substrate 1, unlike other semiconductor devices, also controls the light output from the chip 3 and the light guide, i.e. the alphabet in this example. It has an auxiliary function with light conduction to the luminous code 2 indicated by the letter P. Light conduction should be carried out inside the transparent substrate 1 by total reflection on its upper and lower surfaces and reflection on its shorter sides, and for this purpose a specular or scattering reflection film 5 is provided. The specular or diffuse reflection wA5 extends in this embodiment as an edge covering onto the shorter side of the base body 1 and on the upper side of the base body l surrounds the void area for the luminous symbol 20. For example, the type stamping is preferably carried out in the edge area of the upper surface of the base l. The mounting takes place in the edge area of the basic body 1, ie outside the recess area for the luminous code 2 and inside the edge covering or reflective coating 5. S
For MD mounting, the connection terminals of the lead frame 4 are connected to the base l.
It is properly bent on the outside.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明による表示装置の斜視図、第2図は第1
図に示した装置の平面図である。 l・・・基体 2・・・発光符号 3・・・発光ダイオード 4・・・リードフレーム 5・・・鏡面または散乱反射膜 IG 2
FIG. 1 is a perspective view of a display device according to the present invention, and FIG. 2 is a perspective view of a display device according to the present invention.
1 is a plan view of the device shown in the figure; FIG. l...Base 2...Light emitting code 3...Light emitting diode 4...Lead frame 5...Mirror surface or scattering reflection film IG 2

Claims (1)

【特許請求の範囲】 1)ケース内において導体路上に配設され光導体として
使用されるプラスチック内に埋設された少なくとも1つ
の発光ダイオード(LED)を備え、この発光ダイオー
ドが前記ケースの前面に備えられた発光面または発光符
号を照明するために使われる発光ダイオード式表示装置
において、前記発光ダイオードが埋設されるプラスチッ
クは、光伝導が上面および下面での全反射ならびに短手
側面での反射によって行われる平坦状透明基体(1)と
して構成され、しかも前記発光面または発光符号(2)
の但持体としてかつ前記発光ダイオード(3)のケース
として形成されることを特徴とする発光ダイオード式表
示装置。 2)前記基体(1)の内部では1つまたは複数の発光ダ
イオード(3)が前記導体路(4)上に配設され、前記
照明されるべき発光符号は前記基体(1)の上面に光散
乱膜として設けられるかまたは前記基体(1)内に光散
乱窪みとして形成されることを特徴とする請求項1記載
の表示装置。 3)1つまたは複数の同一または異種の色のLEDチッ
プ(3)を前記導体路(4)上に配設するために平坦状
リードフレームが設けられることを特徴とする請求項1
または2記載の表示装置。 4)前記基体(1)は少なくとも前記短手側面に鏡面ま
たは散乱反射膜(5)が設けられることを特徴とする請
求項1ないし3の1つに記載の表示装置。 5)前記基体(1)は少なくとも1つの短手側面にイン
ライン実装または面実装用接続端子を有することを特徴
とする請求項1ないし4の1つに記載の表示装置。 6)前記LEDチップ(3)は前記リードフレーム(導
体路4)の注型または射出成形によって製作された基体
(1)の縁部または角部内に設けられることを特徴とす
る請求項1ないし5の1つに記載の表示装置。 7)前記LEDチップ(3)はその前側または後側の少
なくとも一方が鏡面に形成されることを特徴とする請求
項1ないし6の1つに記載の表示装置。 8)前記LEDチップ(3)の領域内に存在するリード
フレーム(4)の部分は反射体として形成されることを
特徴とする請求項1ないし7の1つに記載の表示装置。
[Claims] 1) at least one light-emitting diode (LED) disposed in a case on a conductor track and embedded in plastic used as a light guide, the light-emitting diode being provided on the front side of the case; In a light-emitting diode display device used for illuminating a light-emitting surface or a light-emitting sign, the plastic in which the light-emitting diode is embedded is such that light conduction is performed by total internal reflection on the top and bottom surfaces and reflection on the shorter sides. The light-emitting surface or the light-emitting code (2) is configured as a flat transparent substrate (1) that is
A light emitting diode type display device, characterized in that it is formed as a holder for the light emitting diode (3) and as a case for the light emitting diode (3). 2) Inside the base body (1) one or more light emitting diodes (3) are arranged on the conductor track (4), and the luminescent symbol to be illuminated is illuminated on the top surface of the base body (1). 2. Display device according to claim 1, characterized in that it is provided as a scattering film or formed as a light-scattering depression in the substrate (1). 3) A flat lead frame is provided for arranging one or more LED chips (3) of the same or different colors on the conductor track (4).
Or the display device according to 2. 4) The display device according to claim 1, wherein the base body (1) is provided with a mirror surface or a scattering reflection film (5) on at least the shorter side surface. 5) The display device according to claim 1, wherein the base body (1) has a connection terminal for in-line mounting or surface mounting on at least one short side. 6) The LED chip (3) is provided in an edge or a corner of the base body (1) produced by casting or injection molding of the lead frame (conductor path 4). The display device according to one of the above. 7) The display device according to claim 1, wherein at least one of the front side and the rear side of the LED chip (3) is formed to have a mirror surface. 8) Display device according to one of claims 1 to 7, characterized in that the part of the lead frame (4) present in the area of the LED chip (3) is formed as a reflector.
JP1256918A 1988-09-30 1989-09-28 Light emitting diode type display device Pending JPH02141793A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3833315A DE3833315A1 (en) 1988-09-30 1988-09-30 Light-emitting diode (LED) display device
DE3833315.5 1988-09-30

Publications (1)

Publication Number Publication Date
JPH02141793A true JPH02141793A (en) 1990-05-31

Family

ID=6364116

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1256918A Pending JPH02141793A (en) 1988-09-30 1989-09-28 Light emitting diode type display device

Country Status (2)

Country Link
JP (1) JPH02141793A (en)
DE (1) DE3833315A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9470346B2 (en) 2012-11-21 2016-10-18 Hitachi High-Technologies Corporation Pipe connection joint

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Publication number Priority date Publication date Assignee Title
US5167556A (en) * 1990-07-03 1992-12-01 Siemens Aktiengesellschaft Method for manufacturing a light emitting diode display means
DE4142175A1 (en) * 1991-12-20 1993-06-24 Hella Kg Hueck & Co LED display device for aircraft cabin - has diodes for symbols to be illuminated simultaneously or separately which have different colours when switched on
DE4321823C2 (en) * 1993-07-01 1997-03-06 Telefunken Microelectron Illumination unit for illuminated signs
DE29603006U1 (en) * 1996-02-08 1996-04-18 Osa Elektronik Gmbh Light rail for marking areas, bodies and the like. as well as for lighting display elements
TW326623B (en) * 1996-06-22 1998-02-11 Taiwan Liton Electronic Co The manufacturing method of surface mount technology for photodiode display
CN1252668C (en) 2000-01-06 2006-04-19 皇家菲利浦电子有限公司 Luminaire and light-emitting panel
DE10248475B4 (en) * 2002-10-17 2008-01-24 Bremicker Verkehrstechnik Gmbh & Co. Kg display device
GB2438440B (en) 2006-05-26 2008-04-23 Design Led Products Ltd A composite light guiding device

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GB1166442A (en) * 1966-02-08 1969-10-08 English Electric Co Ltd Bulb-Lit Panels
GB1445840A (en) * 1972-11-27 1976-08-11 Thorn Electrical Ind Ltd Illuminating panel for instrument consoles
US4019196A (en) * 1974-11-22 1977-04-19 Stanley Electric Co., Ltd. Indicating element and method of manufacturing same
FR2352359A1 (en) * 1976-05-17 1977-12-16 Int Vibration Engineer LUMINOUS PANEL
DE8313500U1 (en) * 1983-05-06 1983-09-15 knitter-switch, elektrotechnische Erzeugnisse, Knitter & Co KG, 8011 Baldham LIGHTING DIODE ARRANGEMENT
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9470346B2 (en) 2012-11-21 2016-10-18 Hitachi High-Technologies Corporation Pipe connection joint

Also Published As

Publication number Publication date
DE3833315A1 (en) 1990-04-05

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