JPH02134466A - Bellows structure - Google Patents
Bellows structureInfo
- Publication number
- JPH02134466A JPH02134466A JP28565288A JP28565288A JPH02134466A JP H02134466 A JPH02134466 A JP H02134466A JP 28565288 A JP28565288 A JP 28565288A JP 28565288 A JP28565288 A JP 28565288A JP H02134466 A JPH02134466 A JP H02134466A
- Authority
- JP
- Japan
- Prior art keywords
- bellows
- housing
- opening
- flow path
- gap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims abstract description 23
- 239000003507 refrigerant Substances 0.000 claims abstract description 11
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 12
- 229910000679 solder Inorganic materials 0.000 description 6
- 238000005219 brazing Methods 0.000 description 2
- 239000002826 coolant Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C49/00—Blow-moulding, i.e. blowing a preform or parison to a desired shape within a mould; Apparatus therefor
- B29C49/02—Combined blow-moulding and manufacture of the preform or the parison
- B29C49/04—Extrusion blow-moulding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/703—Bellows
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Diaphragms And Bellows (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はベローズの構造および製造方法に係り、特に複
数のベローズを用いた構造体の組立に好適なベローズお
よびそのｉｌ造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to the structure and manufacturing method of a bellows, and particularly to a bellows suitable for assembling a structure using a plurality of bellows and a method for manufacturing the bellows.
従来のベローズを利用した一例としては、特開昭５９−
２００４９５号あるいはその改善案である特開昭６０−
９４７４９号に示すような電子計算機用モジュールの冷
媒流路としての使用例が挙げられる。この冷却方式によ
り、接触面Ｍｌｃｄの冷却部材を用いれば約り℃／Ｗ以
下の低熱抵抗を実現できる。An example of using a conventional bellows is JP-A-59-
No. 200495 or its improvement plan, JP-A-60-
An example of its use as a refrigerant flow path in a computer module as shown in No. 94749 is given. With this cooling method, it is possible to achieve a low thermal resistance of about 0.degree. C./W or less by using a cooling member for the contact surface Mlcd.
上記従来技術の問題点は、ベローズへ冷媒を供給するハ
ウジングとベローズの接合にある。Ａｇローあるいは半
田等の接合材を用いる場合、ハウジングとベローズの隙
間が狭くなると、接合材の濡れ性が悪く冷媒流路として
十分な気密性が得られない。一方隙間が広くなると、接
合材がハウジングとベローズの間に保持されず流出して
しまうので、これも冷媒流路として十分な気密性が得ら
れない。これに対し、成形ベローズは成形型に完全に追
従して成−形することは難しく、ベローズ開口部の直径
にバラツキを生ずるため、上記所望の隙間を実現するこ
とは容易ではない、さらに、接合の際、ベローズがハウ
ジングに片当たりするので、ベローズ外周全てにわたっ
て均一な隙間を得ることは難しい。The problem with the prior art described above lies in the connection between the bellows and the housing that supplies the refrigerant to the bellows. When a bonding material such as Ag solder or solder is used, if the gap between the housing and the bellows becomes narrow, the wettability of the bonding material is poor and sufficient airtightness cannot be obtained as a refrigerant flow path. On the other hand, if the gap becomes wide, the bonding material will not be held between the housing and the bellows and will flow out, so that sufficient airtightness cannot be obtained as a refrigerant flow path. On the other hand, it is difficult to mold bellows to completely follow the mold, and the diameter of the bellows opening varies, so it is not easy to achieve the desired gap. At this time, since the bellows contacts the housing unevenly, it is difficult to obtain a uniform gap over the entire outer circumference of the bellows.
本発明の目的は、複数のベローズとハウジングとの接合
の隙間をベローズ外周全てにわたって均一にするための
簡便かつ生産性に優れたベローズの製造方法を提供する
ものである。SUMMARY OF THE INVENTION An object of the present invention is to provide a simple and highly productive method for manufacturing bellows, which makes the joining gaps between a plurality of bellows and a housing uniform over the entire outer circumference of the bellows.
上記目的は、ベローズ末端の開口部を円錐状に成形する
ということにより達成される。The above object is achieved in that the opening at the end of the bellows is shaped conically.
ベローズ末端の開口部が円錐状なので、ベローズをハウ
ジングに挿入、接触させればベローズとハウジングの片
当たりは無くなり、ベローズとハウジングの隙間はベロ
ーズ外周全てにわたって均一になる。また、ベローズが
ハウジングと接触する時点で隙間が決まるので、個々の
ベローズのサイズのバラツキにかかわらずその隙間を一
定とすることができる。Since the opening at the end of the bellows is conical, when the bellows is inserted into the housing and brought into contact, there is no uneven contact between the bellows and the housing, and the gap between the bellows and the housing becomes uniform over the entire outer circumference of the bellows. Furthermore, since the gap is determined when the bellows comes into contact with the housing, the gap can be kept constant regardless of variations in the size of the individual bellows.
第１図（ａ）（ｂ）は本発明によるベローズの製造方法
を示す断面図である。まず、第１図（ａ）に示すように
ベローズ素管１の上下に蓋板２、及び底板５を当接して
密閉し、周辺に成形型３を複数個配置する。次に底板５
から流体による圧力Ｐをベローズ素管１内壁に加え、同
時に蓋板２．成形型３及び底板５がお互いに接触する方
向に荷重を加える。FIGS. 1(a) and 1(b) are cross-sectional views showing a method of manufacturing a bellows according to the present invention. First, as shown in FIG. 1(a), a lid plate 2 and a bottom plate 5 are brought into contact with the top and bottom of a bellows blank tube 1 to seal it, and a plurality of molds 3 are placed around the bellows blank tube 1. Next, the bottom plate 5
Pressure P due to fluid is applied to the inner wall of the bellows tube 1 from the cover plate 2. A load is applied in the direction in which the mold 3 and the bottom plate 5 come into contact with each other.
その時蓋板２の内壁をあらかじめ円錐形状４に加工して
おく、第１図（ｂ）に示すようにベローズ素管１は蓋板
２．成形型３及び底板５にそって蛇腹状に変形される。At this time, the inner wall of the cover plate 2 is processed in advance into a conical shape 4, and the bellows material tube 1 is attached to the cover plate 2 as shown in FIG. 1(b). It is deformed into a bellows shape along the mold 3 and the bottom plate 5.
そして円錐形状４に当接する部分には円錐状の開口部が
形成される。A conical opening is formed in the portion that comes into contact with the conical shape 4.
第２図は本発明により成形したベローズを用いた構造体
の一実施例である１本実施例は電子計算機用冷却モジュ
ール１０１の一部を示している。FIG. 2 shows an embodiment of a structure using bellows molded according to the present invention. This embodiment shows a part of a cooling module 101 for an electronic computer.
冷却部材１０２は熱伝導部材１２を介して集積回路チッ
プ１３ど接触し、ベローズ８を通じてハウジング７と接
続している。一方チツブ１３は半田端子１４を介して配
線基板１５と電気的に接続している。The cooling member 102 is in contact with the integrated circuit chip 13 via the heat conducting member 12 and is connected to the housing 7 via the bellows 8. On the other hand, the chip 13 is electrically connected to a wiring board 15 via a solder terminal 14.
集積回路チップ１３で発生する熱は熱伝導部材１２を通
じて冷却部材１０２に伝わり、冷却部材１０２内部を循
環する冷媒により冷却される。冷媒は、ハウジング７、
蓋６により構成される流路からベローズ８に流入し、冷
却部材１０２を経てもう一方のベローズ８に流入し、再
びハウジング７へと排出される。Heat generated in the integrated circuit chip 13 is transmitted to the cooling member 102 through the heat conduction member 12 and is cooled by the coolant circulating inside the cooling member 102. The refrigerant is in the housing 7,
It flows into the bellows 8 from the flow path formed by the lid 6, passes through the cooling member 102, flows into the other bellows 8, and is discharged into the housing 7 again.
以下、本実施例の組立方法を説明する。The assembly method of this embodiment will be explained below.
まず、冷却部材１０２を構成する冷却フィン１１とキャ
ップ１０、及びベローズ９を接合材（ろう材あるいは半
田材）を用いて接合する０次にこの冷却部材１０２とベ
ローズ８の接合体をハウジング７に接合する。この時の
ベローズ８とハウジング７の接続形確を第３図に示す。First, the cooling fins 11, cap 10, and bellows 9 that make up the cooling member 102 are joined using a bonding material (brazing material or solder material).Next, the assembly of the cooling member 102 and the bellows 8 is attached to the housing 7. Join. The connection between the bellows 8 and the housing 7 at this time is shown in FIG.
ベローズ８をハウジング７と嵌合してその間隙にろう材
あるいは半田材を充填し、加熱溶融して接合を形成する
。成形ベローズの場合、ベローズと成形型とは完全に追
従せず開口径ｄに加工バラツキを生ずる。第３図（ａ）
に示すようにベローズ８とハウジング７との隙間が小さ
いと、接合材９の濡れ性が悪く、冷媒流路として十分な
気密性が得られない、また第３図（ｂ）に示すようにベ
ローズ８とハウジング７との隙間が大きいと、接合材が
ハウジングとベローズの間に保持されず流出してしまう
ので、これも冷媒流路として十分な気密性が得られない
、また仮に所望の開口径ｄが得られたとしても、第３図
（ｃ）に示すようにベローズ８とハウジング７の片当た
りにより隙面のバラツキが生じるので上記の問題が発生
する。すなわち冷媒流路として好適な接合を得るために
は、ベローズ外周全てにわたって均一な隙間を得ること
が必要である。The bellows 8 is fitted into the housing 7, and the gap therebetween is filled with brazing material or solder material, which is heated and melted to form a joint. In the case of a molded bellows, the bellows and the mold do not completely follow each other, resulting in processing variations in the opening diameter d. Figure 3(a)
If the gap between the bellows 8 and the housing 7 is small as shown in FIG. If the gap between 8 and the housing 7 is large, the bonding material will not be held between the housing and the bellows and will flow out, making it impossible to obtain sufficient airtightness as a refrigerant flow path. Even if d is obtained, as shown in FIG. 3(c), uneven contact between the bellows 8 and the housing 7 causes variations in the gap surface, resulting in the above-mentioned problem. That is, in order to obtain a suitable joint as a refrigerant flow path, it is necessary to obtain a uniform gap over the entire outer circumference of the bellows.
本発明により得られるベローズは第２図に示すように開
口部が円錐形状となっているので、ベローズ８をハウジ
ング７に挿入、接触させれば、ベローズとハウジングの
片当たりは無くなる。また隙間ｇｌ＋ｇ！はベローズ８
がハウジング７に接触した時点で決まる。すなわちｇｌ
ｓｇ！のバラツキはハウジング７の加工精度で決まるの
で、ベローら
ズの開口径ｄｌ、ｄｚのバラツキ如何にかがゎ−ず隙間
ｇｌ＊ ｇＺを一定とすることができる。これによりベ
ローズとハウジングの接合部の気密性が改善される。Since the bellows obtained according to the present invention has a conical opening as shown in FIG. 2, when the bellows 8 is inserted into the housing 7 and brought into contact, uneven contact between the bellows and the housing is eliminated. Gap gl+g again! is bellows 8
is determined at the time when it contacts the housing 7. That is, gl
sg! Since the variation in is determined by the processing accuracy of the housing 7, the gap gl*gZ can be made constant regardless of the variation in the opening diameters dl and dz of the bellows. This improves the airtightness of the joint between the bellows and the housing.
ベローズ８とハウジング７の接合後は、あらかじめ配線
基板１５上に搭載された集積回路チップ１３と冷却部材
１０２を熱伝導部材１２を用いて接合する。熱伝導部材
１２としては、例えば取りはすしの容易なグリースある
いは低融点金属等を用いる。最後にハウジング７に蓋６
をかぶせることで、冷却モジュール１０１の組立が完了
する。After the bellows 8 and the housing 7 are joined, the integrated circuit chip 13 mounted in advance on the wiring board 15 and the cooling member 102 are joined together using the heat conductive member 12. As the heat conductive member 12, for example, easily removed grease or a low melting point metal is used. Finally, attach the lid 6 to the housing 7.
By covering the cooling module 101, assembly of the cooling module 101 is completed.
以上説明したように、本発明により成形したベローズを
用いれば、複数のベローズとハウジングの隙間をベロー
ズ外周全てにわたって均一にすることが簡便に実現でき
る。これにより気密性の高い冷媒流路が実現できる。こ
の冷媒流路を半導体素子の冷却モジュールに用いること
により、冷却モジュール及び冷却モジュールを含む電子
計算機の信頼性が向上する。As explained above, by using the bellows molded according to the present invention, it is possible to easily make the gaps between the plurality of bellows and the housing uniform over the entire outer circumference of the bellows. This makes it possible to realize a highly airtight refrigerant flow path. By using this coolant flow path in a cooling module for semiconductor devices, the reliability of the cooling module and the computer including the cooling module is improved.
第１図（ａ）、（ｂ）は本発明によるベローズの製造方
法を示す工程図、第２図は本発明により形成したベロー
ズを用いた冷却モジュールの断面図、第３図（ａ）、（
ｂ）、（ｃ）は従来のベローズを用いたときのベローズ
とハウジングの接続形態を示す断面図である。
１・・・ベローズ素管、２・・・蓋板、３・・・成形型
、４・・・円錐形状、５・・・底板、６・・・蓋、７・
・・ハウジング、８・・・ベローズ、９・・・接合材、
１０・・・キャップ、１１・・・フィン、１２・・・熱
伝導部材、１３・・・集積回路チップ、１４・・・半田
端子、１５・・・配線基板、１０１・・・冷却モジュー
ル、１０２・・・冷却部材。
へ
■
墳
−Ｎｍ 寸梢鳩〉へが〉（＼ Ｎ１ｆ）ψＮ−＼ ＋
＋ ＋ １Ｎ
７ ハクジン２パ
θ Ｎロース゛′
９ 縛８−精FIGS. 1(a) and 1(b) are process diagrams showing a method for manufacturing a bellows according to the present invention, FIG. 2 is a cross-sectional view of a cooling module using the bellows formed according to the present invention, and FIGS. 3(a) and (
b) and (c) are cross-sectional views showing the connection form between the bellows and the housing when a conventional bellows is used. DESCRIPTION OF SYMBOLS 1... Bellows base tube, 2... Lid plate, 3... Molding mold, 4... Conical shape, 5... Bottom plate, 6... Lid, 7...
・・Housing, 8・Bellows, 9・Joining material,
DESCRIPTION OF SYMBOLS 10... Cap, 11... Fin, 12... Heat conductive member, 13... Integrated circuit chip, 14... Solder terminal, 15... Wiring board, 101... Cooling module, 102 ...Cooling member. To ■ Mound - Nm Senkozuhato〉Hega〉 (＼ N1f)ψN−＼ ＋
+ + 1N 7 Hakujin 2pa θ N loin' 9 Bind 8- Sei
Claims (1)
ーズ構造。 ２、テーパー状の開口部を塑性加工により形成すること
を特徴とするベローズの製造方法。 ３、特許請求の範囲第１項記載のベローズを含むことを
特徴とする冷媒流路。 ４、特許請求の範囲第３項記載の冷媒流路からなる半導
体素子の冷却モジュール。 ５、特許請求の範囲第４項記載の冷却モジュールを含む
電子計算機。[Claims] 1. A bellows structure characterized by having a tapered opening. 2. A method for manufacturing a bellows, characterized in that a tapered opening is formed by plastic working. 3. A refrigerant flow path comprising the bellows according to claim 1. 4. A semiconductor device cooling module comprising the refrigerant flow path according to claim 3. 5. An electronic computer including the cooling module according to claim 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28565288A JPH02134466A (en) | 1988-11-14 | 1988-11-14 | Bellows structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28565288A JPH02134466A (en) | 1988-11-14 | 1988-11-14 | Bellows structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02134466A true JPH02134466A (en) | 1990-05-23 |
Family
ID=17694310
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28565288A Pending JPH02134466A (en) | 1988-11-14 | 1988-11-14 | Bellows structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02134466A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1325784A1 (en) * | 2002-01-08 | 2003-07-09 | NHK Spring Co., Ltd. | Method of making a metallic bellows |
-
1988
- 1988-11-14 JP JP28565288A patent/JPH02134466A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1325784A1 (en) * | 2002-01-08 | 2003-07-09 | NHK Spring Co., Ltd. | Method of making a metallic bellows |
| US6820317B2 (en) | 2002-01-08 | 2004-11-23 | Nhk Spring Co., Ltd. | Method of making a metallic bellows |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5652461A (en) | Semiconductor device with a convex heat sink | |
| US4285002A (en) | Integrated circuit package | |
| US5444304A (en) | Semiconductor device having a radiating part | |
| JPH08510358A (en) | Interconnection of integrated circuit chips and substrates | |
| JPH08306853A (en) | Semiconductor device, manufacture thereof and manufacture of lead frame | |
| JP2005203497A (en) | Semiconductor device and method for manufacturing same | |
| JPH08148603A (en) | Ball grid array type semiconductor device and manufacture thereof | |
| JPH08191114A (en) | Resin sealed semiconductor and manufacturing method thereof | |
| JP5233853B2 (en) | Semiconductor device | |
| KR100526667B1 (en) | Resin sealed-type semiconductor device and method of manufacturing the same | |
| JPH02134466A (en) | Bellows structure | |
| JPH11177007A (en) | Transistor package | |
| JP2710986B2 (en) | Electronic equipment | |
| JPH06204385A (en) | Semiconductor device mounted pin grid array package substrate | |
| JP3234614B2 (en) | Semiconductor device and manufacturing method thereof | |
| JP2785917B2 (en) | Semiconductor chip module | |
| JP2718299B2 (en) | Large-scale integrated circuits | |
| JPH08181168A (en) | Semiconductor device | |
| JPH05291739A (en) | Connecting terminal and connecting method for device using same | |
| KR100253383B1 (en) | Micro bga package and its manufacturing method | |
| JPH0582978B2 (en) | ||
| JPH0241866Y2 (en) | ||
| JPS5927537A (en) | Semiconductor device | |
| KR100336762B1 (en) | Chip size package and manufacturing method thereof | |
| JP3711669B2 (en) | Electronic component mounting board |