JPH02118474A - Testing device for propagation delay time - Google Patents

Testing device for propagation delay time

Info

Publication number
JPH02118474A
JPH02118474A JP63272166A JP27216688A JPH02118474A JP H02118474 A JPH02118474 A JP H02118474A JP 63272166 A JP63272166 A JP 63272166A JP 27216688 A JP27216688 A JP 27216688A JP H02118474 A JPH02118474 A JP H02118474A
Authority
JP
Japan
Prior art keywords
test
output
results
time
memory
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63272166A
Other languages
Japanese (ja)
Inventor
Koichiro Ueda
浩一郎 上田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP63272166A priority Critical patent/JPH02118474A/en
Priority to US07/424,042 priority patent/US5053698A/en
Priority to EP89402954A priority patent/EP0366553B1/en
Priority to DE68927147T priority patent/DE68927147T2/en
Priority to KR1019890015564A priority patent/KR930001547B1/en
Publication of JPH02118474A publication Critical patent/JPH02118474A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317Testing of digital circuits
    • G01R31/3181Functional testing
    • G01R31/319Tester hardware, i.e. output processing circuits
    • G01R31/3193Tester hardware, i.e. output processing circuits with comparison between actual response and known fault free response
    • G01R31/31937Timing aspects, e.g. measuring propagation delay
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317Testing of digital circuits
    • G01R31/3181Functional testing
    • G01R31/3183Generation of test inputs, e.g. test vectors, patterns or sequences
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE:To obtain data in a short time and at the time of a normal/defective test by storing respective memories with respective decision results of outputs of a body to be measured under various test conditions which differ in decision timing, and reading them out and making a normal/defective decision. CONSTITUTION:Various test inputs are supplied from a test unit to the body DUT to be measured and its outputs are supplied to comparators DC in parallel to decide whether or not the outputs are normal at different timing. The decision results are written in the memories CM which are provided separately. The contents of the memories CM are checked to know whether the tested body is normal or not and the maximum delay when the tested body is abnormal. The results of the memories CM are read every time a test is conducted and results of respective tests which are conducted under various conditions are stored; and the test results under the respective conditions can be read out at a time and decided after a series of the tests.

Description

【発明の詳細な説明】 〔発明の(111要] 半導体素子などの被dlll定物の伝(番遅延時間の試
験装置に関し、 短時間にデータ取得を可11ヒとし、良/不良試験時に
もデータ取得が可能であり、また間欠的な出力信号の変
化がないことを保証する場合も良/不良判定にて検出可
能である試験装置を提供することを目的とし、 被測定物に各種試験入力を供給するテストユニ71−と
、該被測定物の出力を並列に供給され、各々異なるタイ
ミングで該出力の良否を判定する複数個,の:Iンパレ
ータと、各コンパレークの判定結果をど込まれるメモリ
とを備えるよう+i’!成する。
[Detailed Description of the Invention] [111 points of the invention] Regarding a testing device for a fixed object such as a semiconductor device (delay time), it is possible to acquire data in a short period of time, and it can be used even during a good/bad test. The purpose is to provide a test device that can acquire data and also detect the pass/fail judgment when ensuring that there are no intermittent changes in the output signal. a test unit 71- which supplies the output of the object to be measured, a plurality of :I comparators which are supplied with the output of the object to be measured in parallel and which judge the quality of the output at different timings, and a memory into which the judgment results of each comparator are stored. +i'! to prepare for +i'!

(産業.」二の利用分野〕 本発明は、半導体素子などの被測定物の伝1(5遅延時
間のU,N験装置に関する。
(Industry. Second Field of Application) The present invention relates to an apparatus for testing U and N of a test object such as a semiconductor device (5 delay times).

近年の半導体素子は益々大容量、超高速になってきてお
り、その性能評価のためのデータ取得には益々多大な時
間が必要となってきている。本発明は特に半導体素子の
評価のためのデータ取得をGO/No″GO試験状態(
1試験条件下におけるGO(良) /No Go (不
良)判定)でも可能とした試験装置に係るものである。
Semiconductor devices in recent years have become increasingly large-capacity and ultra-high-speed, and it has become increasingly time-consuming to acquire data for evaluating their performance. The present invention particularly provides data acquisition for evaluating semiconductor devices in GO/No''GO test conditions (
The present invention relates to a test device that is capable of making GO (good)/No Go (defective) judgments under one test condition.

〔従来の技術〕[Conventional technology]

半導体素子などではある1つの試験条件下において一連
の試験パターンを通ずることにより良/否判定をし、条
件を変更して試験を繰り返して所要のデータを得ている
。このため試験時間が膨大となっている。
In semiconductor devices, pass/fail is determined by passing a series of test patterns under one test condition, and the test is repeated under different conditions to obtain the required data. For this reason, the test time is enormous.

また間欠的な出力信号の変化がないことを保証する場合
も、繰り返して試験判定している。
Tests are also repeated to ensure that there are no intermittent changes in the output signal.

〔発明が解決しようとする課題] 従来は被測定物の試験データを取得するのに繰り返して
試験していたため、評価所要時間が人になっていた。
[Problems to be Solved by the Invention] Conventionally, testing was repeated to obtain test data on the object to be measured, resulting in a time-consuming evaluation process.

本発明は、短時間にデータ取得を可能とし、G。The present invention enables data acquisition in a short time, and G.

(良) /No GO(不良)試験時にもデータ取得が
可能であり、また間欠的な出力信号の変化がないことを
保証する場合もGO/NOGo判定にて検出可能である
試験装置を提供することを目的とするものである。
To provide a test device that is capable of acquiring data even during a (good)/No GO (bad) test, and can also be detected by GO/NOGo judgment even when ensuring that there is no intermittent change in an output signal. The purpose is to

〔課題を解決するための手段〕[Means to solve the problem]

第1図(a)に示すように本発明の試験装置は、制13
11川のホス1−コンピュータCPUと、被δIII定
物(こ\ではテストヘッドT H)に試験条件を供給す
るテストユニット クTO,パターンゼネレークPC,フォーマット二lン
トロールFC, レベルゼネレータVl/VOと、被測
定物から出力された信号を判定するデジタルコンパレー
タDCと、その判定結果を記1、αするメモリCMと、
測定結果を出力する出力機器OPと、測定条件を定義し
た試験プログラムをコンピュータCPUへ入力可能な入
力機器IPを有する。
As shown in FIG. 1(a), the test device of the present invention has a
11 - Computer CPU, test unit TO which supplies test conditions to the δIII constant object (test head TH in this case), pattern generator PC, format controller FC, level generator Vl/VO , a digital comparator DC that judges the signal output from the object to be measured, and a memory CM that records the judgment result.
It has an output device OP that outputs measurement results, and an input device IP that can input a test program defining measurement conditions to a computer CPU.

半導体素子などの被測定物D U’r’ (Devic
e Und−er Test)とコンパレータDC,メ
モリCMの関係は、第1図(b)に示す如くであり、D
C,CMとも複数(N)個ある。被測定物DUTの出力
、例えばメモリであれば読出し出力は、各コンパレータ
DCに並列に入力する。判定用ストローブ信号Sは各コ
ンパレータDCへ供給されるが、逐次遅延とされるので
、時間軸上で見ると第1図(C)の如く、lサイクル中
にN個のストローブが入ったようになる。
Object to be measured D U'r' (Device
The relationship between the comparator DC and the memory CM is as shown in FIG. 1(b).
There are a plurality (N) of both C and CM. The output of the device under test DUT, for example a readout output in the case of a memory, is input in parallel to each comparator DC. The determination strobe signal S is supplied to each comparator DC, but it is delayed sequentially, so when viewed on the time axis, as shown in Figure 1 (C), it appears as if N strobes were input in one cycle. Become.

(作用) この装置では被測定物OUTは、ある1つの条件でそれ
に対する出力を生じ、N個のコンパレータDCに入力す
る。コンパレータはストローブ信号Sが入った時点で入
力を判定する。例えば、被測定物DUTの出力が第1図
(C)のOUTaであったとする、ストローブS1のタ
イミングで動作するコンパレータ(DC. とする)は
入力Lレベルとし、それよりT,時間遅れたストローブ
S2のタイミングで動作するコンパレータ(DC.とす
る)も入力はLレベルとし、しかしそれより更にT2時
間遅れたストローブS3のタイミングで動作するコンパ
レータ(DC,とする)は入力はI−ルベルとし、更に
T3時間遅れたストローブS4のタイミングで動作する
コンパレータ(r5c.とする)も人ツノはHレベルと
する。期待値はOUTeの如くオールHであれば、コン
パレータ1,  2の比較結果は不良(1す1待値と異
なる)°“ビ、そしてコンパレータ3,4の比較結果は
良“0゛°となる。メモリCMにはこの不良1を書込む
。従ってごのメモリCMを読出してみると良/不良、不
良ならその最大遅れなどを知ることができる。
(Operation) In this device, the object to be measured OUT produces an output under one condition, and inputs the output to N comparators DC. The comparator determines the input when the strobe signal S is input. For example, assuming that the output of the DUT under test is OUTa in Figure 1 (C), a comparator (DC.) that operates at the timing of the strobe S1 has an input L level, and a strobe that is delayed by a time T. The comparator (DC) that operates at the timing of strobe S2 also has an L level input, but the input of the comparator (DC) that operates at the timing of strobe S3, which is further delayed by T2 time, has an input of I-level. Further, a comparator (r5c.) that operates at the timing of strobe S4 delayed by T3 time is also set to H level. If the expected values are all H like OUTe, the comparison results of comparators 1 and 2 will be bad (different from the expected values of 1 and 1), and the comparison results of comparators 3 and 4 will be good. . This defect 1 is written into the memory CM. Therefore, by reading each memory CM, you can find out whether it is good or bad, and if it is bad, the maximum delay.

試験条件を変えると被測定物DUTの出力OUTaは変
り(H,I−変化点が遅、進する、0部分がなくなる等
)、コンパレータDCの出力も変る。
When the test conditions are changed, the output OUTa of the device under test DUT changes (the H, I change point becomes slower or more advanced, the 0 part disappears, etc.), and the output of the comparator DC also changes.

これもメモリCMへ書込まれ、該メモリを3売出すこと
により良/不良等を知ることができる。
This is also written to the memory CM, and by selling the memory three times, it is possible to know whether it is good or bad.

メモリCMは試験の度毎に読出して結果を見てもよく、
または種々試験条件を変えて行なう各試験の結果を逐次
メモIJcMに格納し、一連の試験が終ったのちメモリ
CMの格納データを読出してみて、各試験条件の下での
試験結果を一括して取出し、判定することもできる。
You can read out the memory CM every time you take an exam to see the results.
Alternatively, you can sequentially store the results of each test performed under various test conditions in the memo IJcM, read out the data stored in the memory CM after a series of tests are completed, and collect the test results under each test condition at once. It can also be taken out and judged.

このように本発明では各種試験条件での被測定物の出力
の、判定タイミングを異ならせた各判定結果を各メモリ
に書込み、これらのメモリの格納データを読出し−で良
否判定するので、極めて多数の試験条件での試験も迅速
に行なうことができる。
In this way, in the present invention, each judgment result of the output of the measured object under various test conditions with different judgment timings is written in each memory, and the data stored in these memories is read out and judged as pass/fail. Tests under test conditions can also be conducted quickly.

例えば第1図(C)の31〜S4による判定も、従来万
代では同じ条件でD[JTに4回出力させ、それをSl
+SM+・・・・・・で判定するごとになるが、本発明
ではこれを1回で行なうことができる。か\る試験を多
数種行なう場合は、本発明の利点は更に効果的になる。
For example, in the conventional Bandai, the judgments from 31 to S4 in Fig. 1(C) are made by making D[JT output four times and
+SM+ . . . is determined each time, but according to the present invention, this can be done only once. The advantages of the present invention become even more effective when a large number of such tests are performed.

〔実施例〕〔Example〕

第2図に実施例を示す。二\ではデジタルコンパレータ
DCとコンベアメモリCMを含めて判定回路Jとする。
An example is shown in FIG. In 2\, the judgment circuit J includes the digital comparator DC and the conveyor memory CM.

判定ストローブ信号Sは最初の判定回路1へは直接入力
するが、他の判定回路へはレンジ(遅延)回路Rを介し
て逐次入力する。
The determination strobe signal S is directly input to the first determination circuit 1, but is sequentially input to the other determination circuits via the range (delay) circuit R.

被測定物DUTの出力0UTaは実線で示すようにLか
らHに立上る信号またはHからLへ立下る信号であるが
、コンパレータCO?’IPを置いて、闇値以−ヒであ
ればH出力、闇値以下であればL出力などとする。判定
回路1〜Nへはこの闇値でH。
The output 0UTa of the DUT under test is a signal that rises from L to H or falls from H to L as shown by the solid line, but the comparator CO? 'IP is set, and if the dark value is higher than the dark value, the H output is set, and if the dark value is lower than the L output, etc. This dark value is H for judgment circuits 1 to N.

Lに区別された出力(やはり0UTaとする)が入力す
る。
The output differentiated into L (also assumed to be 0UTa) is input.

コンパレータCOMPの出力0UTaを各判定回路1〜
Nへ入力する信号線2の長ざは各判定回路で笠しくはム
く、伝115近延を考えると出力0UTaは各判定回路
へ同時には入力せず、その入力タイミングはずれること
になる。レンジ回路Rはこの遅延も補正する。即し第1
図(C)の遅延T I + T 2 +・・・・・・を
仝”ζ等しく、Tとすると、各レンジ回路Rは遅延Tを
持てばよいが、この他に各判定回路間の信号・線Pの伝
播遅延(これも等しくΔTとする)を持ら、”f−トΔ
′(゛とする。これを第3図(C)に示す。
The output 0UTa of comparator COMP is determined by each judgment circuit 1~
The length of the signal line 2 input to N is not large enough for each determination circuit, and considering the 115th generation, the output 0UTa is not input to each determination circuit at the same time, and the input timings are staggered. The range circuit R also compensates for this delay. Immediately the first
Assuming that the delay T I + T 2 +... in Figure (C) is equal to ``ζ'' and is T, each range circuit R only needs to have a delay T, but in addition to this, the signal between each judgment circuit・With the propagation delay of the line P (also taken as ΔT), “f−tΔ
'(') This is shown in FIG. 3(C).

動作を説明すると、被測定物DUTの出ツノ信号OU 
T aはコンパレータCOMPに入ノjされ、Hレヘル
と判定されると、その11レヘル判定された時点で立−
しる矩形波(0(JTa)とし゛ζ出力され、各判定回
路1−Nへ入力する。判定ストローブ信号Sは前記遅延
を与えられ°C刊定回路へ入力し、この結果(、)り線
上の遅延も補正されて第3図(1))に示すように、出
力0UTaを、判定回路1は時点しで、判定回路2ば時
点L2で、・・・・・・判定回路Nは111I点し、4
で、H/ L判定することになる。本例では判定回路4
までがし判定、判定回路5以降がl(判定である。試験
条件によっては第3図(a)に示すように出力OU T
 aがII)間τだけ遅れ−COU T bになったり
する。この場合はII / L判定結果も変る。これら
の判定結果は、不良と判定したものをメモリCMへ書込
む。
To explain the operation, the output signal OU of the DUT under test
Ta is input to the comparator COMP, and when it is determined to be H level, it is turned on at the time when the 11th level is determined.
A rectangular wave (0 (JTa)) is output as ゛ζ and inputted to each judgment circuit 1-N.The judgment strobe signal S is given the delay and inputted to the °C evaluation circuit, and as a result (,) As shown in FIG. 3 (1)), the delay of the determination circuit 1 is corrected, and the output 0UTa is at the time point L2, the determination circuit 2 is at the time point L2, and the determination circuit N is at the 111I point. 4
Then, H/L judgment will be made. In this example, the judgment circuit 4
Judgment until the end of the judgment circuit 5 and beyond is l (judgment).Depending on the test conditions, the output OUT
a is delayed by II) τ -COUT b. In this case, the II/L determination result also changes. These determination results are written to the memory CM if they are determined to be defective.

各判定タイミングLI+ L 2+・・・・・・の間の
時間差を小にすると、出力OU ’I’ aのH/ L
を微細に検査することになる。即t)該時間差は分解能
を規定し、該時間差が小であれば分解11ピは高い。但
し、判定回路の個数は増す。
If the time difference between each judgment timing LI+L 2+... is made small, the H/L of the output OU 'I' a
will be examined in detail. i.e. t) The time difference defines the resolution, and if the time difference is small, the resolution is high. However, the number of determination circuits increases.

テストパターンでの91(験が完了した後、メモリのブ
ロンクセレフト信号CMLISをアドレスとしてメモリ
CM1つずつ読出し、その続出し出力CMI?13(C
M IJ−ドパツク)より被測定物DUTの良否判定、
伝(11!遅延時間の最悪値などを取出す。
After completing the test pattern 91 (experiment), the memory CM is read out one by one using the memory bronch select signal CMLIS as an address, and the successive output CMI?13 (C
Judging the quality of the DUT under test using
(11! Extract the worst value of delay time, etc.

メモリCMは試験前に予めCPUにより゛′0パに初1
(11化しておく。この場合良判定結果の’ 0 ”は
冴込む必要がない(既に書込まれている)。また、判定
の結果が良であればメモリの更新は行なわないようにす
ると、パターンゼネレークPCが発生可能な全°Cのパ
ターン及びメモリデバイスのようなセル依存性の高い品
種にも遅延時間の最悪値を検出可能である。
The memory CM is set to 1 in advance by the CPU before the test.
(It is converted to 11. In this case, there is no need to store the '0' of the good judgment result (it has already been written). Also, if the judgment result is good, the memory is not updated. It is possible to detect the worst value of the delay time even for patterns of all degrees Celsius that can be generated by the pattern generator PC and for highly cell-dependent products such as memory devices.

出力OLJ T aば第3図(b)に点線で示すように
、■1になったのちLに落ら、再び■]に変化すること
がある。このような間欠的に出力信号が変化する1、7
性のデバイスに対しても本発明は有効である。
As shown by the dotted line in FIG. 3(b), the output OLJ T may become ■1, then drop to L, and then change again to ■]. 1, 7 where the output signal changes intermittently like this
The present invention is also effective for sexual devices.

U[Iらこの場合は判定回路1−Nの゛I’ll定結果
がooo。
In this case, the determination result of the judgment circuit 1-N is ooo.

111001・・・・・・などとなる(通常は0001
11111・・・・・・〕から、これにより異常出力で
あることが分る。
111001...etc. (usually 0001
11111...], it can be seen that this is an abnormal output.

メモリCMはIソード×Nピッl−’tf+¥成(lツ
ー1′つまり■アドレスのみでそのlアドレスがIビッ
ト容星のものN個。第2図はこれを想定)とする代りに
Mワード×Nビ・ント(MワードまたはMアドレスあり
各アドレスは1ビツト容量のものN(1/、I )とし
てもよく、この場合の例を第4図に示す。
The memory CM is I-sword × N pin-'tf + ¥ (l-to-1', that is, ■ address only, and the l address is N pieces of I-bit data star. Figure 2 assumes this), instead of M Words×N bits (M words or M addresses, each address having a capacity of 1 bit N(1/, I) may be used. An example of this case is shown in FIG.

メモリCMへのアドレス信号ADDと被測定体DUTへ
のアドレス信号を一致させて試験プログラムに設定して
おく。これにより、各試験条件での試験結果をメモリC
Mのアドレス1,2.・・・・・・Mへ)δ納し、DL
ITがメモリならその各セルにつぃての試験結果を一括
して読出ずことができ、セルアレイに対応した伝播遅延
時間の最悪値などを迅速に取出すことができる。第3図
((」)にこの場合のメモリCMの構成を示す。
The address signal ADD to the memory CM and the address signal to the DUT under test are made to match and are set in the test program. This allows the test results under each test condition to be stored in the memory C.
M's address 1, 2. ......to M) δ payment, DL
If the IT is a memory, the test results for each cell can be read out at once, and the worst value of the propagation delay time corresponding to the cell array can be quickly retrieved. FIG. 3('') shows the configuration of the memory CM in this case.

第5図(21)にレンジ回路Rの具体例を示ず。G11
G2.・・・・・・は遅延素子を構成するゲート回路、
S。
A specific example of the range circuit R is not shown in FIG. 5 (21). G11
G2. ... is a gate circuit that constitutes a delay element,
S.

S2+・・・・・・は出力取出し用のスイッチ、S E
 I−は選択信号である。選択信号SELによりSIよ
り出力を取出すようにずれば、ゲートG1だけの遅延が
加えられ、S2より出力を取出すようにすればG、、G
、の各遅延の和の遅延が加えられる。こうして所望の遅
延を入力S(ストローブ信号)に加えることができる。
S2+... is a switch for output output, S E
I- is a selection signal. If the selection signal SEL is used to take out the output from SI, a delay of only gate G1 will be added, and if the output is taken out from S2, G, , G
The delay of the sum of each delay of , is added. In this way, a desired delay can be added to the input S (strobe signal).

第5図(b)に、被測定物DUTの出力をH/L刊定す
るコンパレークCOM 11等の具体例を示ず。コンパ
レータCOMPは、Hレベルの基準値■。Hと比較する
比較÷!:i Cl と、I、レベルのJ、(準値■。
FIG. 5(b) does not show a specific example of the comparator COM 11 and the like that publishes the H/L output of the DUT to be measured. The comparator COMP is the H level reference value ■. Comparison to compare with H ÷! : i Cl and I, level J, (quasi value ■.

、と比較する比較器C2で構成される。ごれらの出力V
、、V2は、DUTの出力が■。、4以上ならV + 
= V 2 = l’l、VOL以下ならV、 −Vz
 =L、、VooとVOLの間なうV + = L、V
、=11である。これを比較器C3で比較データREF
と比較すると良/不良が分る。
, and a comparator C2 that compares with . Gorera's output V
,, V2 is the output of the DUT is ■. , if it is 4 or more, V +
= V 2 = l'l, if below VOL, V, -Vz
= L, V between Voo and VOL + = L, V
,=11. This is used as comparison data REF by comparator C3.
You can tell whether it is good or bad by comparing it.

不良ならメモリCMへ1を書込む。この実施例の場合は
第2図の信ひ線lは2本になる。  第6図Gに試験装
置の各要素PG、TO,FC,・・・・・・の結線関係
を示す。パターンゼネレークPGはナス1−ハターンヲ
出力し、フォーマットコントロ−ルFCはDUTの駆動
波形を出力する。レベルゼネレータVIVOはDUTの
ドライバであって、駆動信号(メモリならアドレス信号
)のレベルを定める。
If it is defective, write 1 to memory CM. In this embodiment, the number of wires l shown in FIG. 2 is two. FIG. 6G shows the connection relationship of each element PG, TO, FC, . . . of the test equipment. The pattern generator PG outputs an eggplant pattern, and the format control FC outputs a DUT drive waveform. The level generator VIVO is a driver for the DUT and determines the level of the drive signal (or address signal in the case of a memory).

例えば’I’ T’ LならLはOV,Hは3V,IE
CLならしは−1.8V,IIは−0. 9 Vなどと
なるが、ドライバνIVOはこのレベルを作る。
For example, if 'I'T' L, L is OV, H is 3V, IE
CL normalization is -1.8V, II is -0. 9 V, etc., and the driver νIVO creates this level.

被測定物DUTがメモリである場合、そのテスト方法は
既知のように種々ある。その若干を説明するに、SCA
Nと呼ばれるテストがあり、その簡単なものは、メモリ
′7ドレスを0〜rlとし、WOO。
When the DUT to be measured is a memory, there are various known testing methods. To explain some of them, SCA
There is a test called N, and the simple one is to set the memory '7 address to 0 to rl and perform WOO.

WO l, ・・・・・・はアドレスO,・・・・・・
へのO,lの書込み、lマ00,ROI,・・・・・・
はアドレス0,・・・・・・の上記0,1の11ゾき出
しとして、Woo,WIO。
WO l, ... is the address O, ...
Writing O, l to lma00, ROI,...
is Woo, WIO as the above 0, 1 of address 0, . . .

−−−  ・−−Wri  O,   R  O  O
,   R  1  0,   −−−−R  r+ 
 O,   WOl、Wl  l,−=−Wn I,R
O 1,R l  1,−−−−Rnlとする。ストラ
イブと呼ばれるSCANテストではwo o,wt i
 W2 0,・・・・・・ROO,R11、R20,・
・・・・・WO l,Wl O,W2 1,・・・・・
・Rot,RIO,R21,・・・・・・とする。また
ピンポンと呼ばれる方式では第3図((コ)に示すよう
に、メモリを最初クリアしておき、O,O (H初の数
字はローアドレス、次の数字はコラl、アドレス)にl
をSいたら0,IO)0を読み、次はまたOOにlをど
き、0.2の0を読み、また0.0にlを書き、0.3
の0を読め・・・・・・という処理を繰り返す。本発明
はか\るテストのり−1・時の出力の良、不良、遅延判
定に適用できる。
--- ・--Wri O, R O O
, R 1 0, -----R r+
O, WOl, Wl l, -=-Wn I,R
Let O 1, R l 1,---Rnl. In the SCAN test called Strive, wo o, wt i
W2 0,...ROO, R11, R20,...
...WO l, Wl O, W2 1, ...
・Rot, RIO, R21, ...... In addition, in a method called ping pong, as shown in Figure 3, the memory is first cleared, and O, O (the first number of H is the row address, the next number is the address),
If S, read 0, IO) 0, then add l to OO again, read 0 of 0.2, write l to 0.0 again, 0.3
The process of reading 0 is repeated. The present invention can be applied to determining whether the output is good, bad, or delayed during a test.

簡単に捉えることができ、メモリセル毎のアクセスデー
タの取得、ロジックであれば試験パス毎のアクセスデー
タ取得が1パターンAsE験(GO/No GO)可能
である。
This can be easily grasped, and in the case of logic, it is possible to obtain access data for each memory cell, or for logic, to obtain access data for each test pass in one pattern AsE experiment (GO/No GO).

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の原理説明図、 第2図は本発明の実施例のブロック図、第3図は各部の
構成動作の説明図、 第4図は本発明の他の実施例のブロック図、第5図は各
部の具体例の説明図、 第6図は各部の結線状態の11)ト明図である。 第1図でSは判定用ストローブ信号、OUT.、Iは被
測定物の出力、OUTeはその1υ11、Y値である。 〔発明の効果] 以上説明したように本発明によれば、繰り返し多数回の
試験を行なって長時間を要する被測定物の出力の伝播遅
延時間の試験を短時間で効率よく行なうことができる。 また出力の異常変化なども出 願人 富士通株式会社 代理人弁理士  青  柳      稔(a) N 第1凹 (b) 各部の構成、動作の説明図 第3図 出力
Fig. 1 is an explanatory diagram of the principle of the present invention, Fig. 2 is a block diagram of an embodiment of the invention, Fig. 3 is an explanatory diagram of the configuration and operation of each part, and Fig. 4 is a block diagram of another embodiment of the invention. , FIG. 5 is an explanatory diagram of a specific example of each part, and FIG. 6 is a clear diagram of the connection state of each part in 11). In FIG. 1, S is a strobe signal for determination, and OUT. , I is the output of the object to be measured, and OUTe is its 1υ11, Y value. [Effects of the Invention] As described above, according to the present invention, it is possible to efficiently test the propagation delay time of the output of a device to be measured, which requires repeated testing many times and takes a long time. In addition, abnormal changes in output, etc. Applicant: Minoru Aoyagi, Patent Attorney, Fujitsu Limited (a) N No. 1 concavity (b) Figure 3, an explanatory diagram of the configuration and operation of each part Output

Claims (1)

【特許請求の範囲】 1、被測定物(DUT)に各種試験入力を供給するテス
トユニット(TU)と、 該被測定物の出力を並列に供給され、各々異なるタイミ
ングで該出力の良否を判定する複数個のコンパレータ(
DC)と、 各コンパレータ(DC)の判定結果を書込まれるメモリ
(CM)とを備えることを特徴とする伝播遅延時間の試
験装置。
[Claims] 1. A test unit (TU) that supplies various test inputs to a device under test (DUT), and an output of the device under test that is supplied in parallel and determines the quality of the output at different timings. multiple comparators (
What is claimed is: 1. A propagation delay time testing device comprising: a DC); and a memory (CM) into which the judgment results of each comparator (DC) are written.
JP63272166A 1988-10-28 1988-10-28 Testing device for propagation delay time Pending JPH02118474A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP63272166A JPH02118474A (en) 1988-10-28 1988-10-28 Testing device for propagation delay time
US07/424,042 US5053698A (en) 1988-10-28 1989-10-19 Test device and method for testing electronic device and semiconductor device having the test device
EP89402954A EP0366553B1 (en) 1988-10-28 1989-10-25 Test device and method for testing electronic device and semiconductor device having the test device
DE68927147T DE68927147T2 (en) 1988-10-28 1989-10-25 Test device and method for testing an electronic device and semiconductor device with this test device
KR1019890015564A KR930001547B1 (en) 1988-10-28 1989-10-28 Test device and method for testing electronic device and semiconductor device having the test device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63272166A JPH02118474A (en) 1988-10-28 1988-10-28 Testing device for propagation delay time

Publications (1)

Publication Number Publication Date
JPH02118474A true JPH02118474A (en) 1990-05-02

Family

ID=17510001

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63272166A Pending JPH02118474A (en) 1988-10-28 1988-10-28 Testing device for propagation delay time

Country Status (5)

Country Link
US (1) US5053698A (en)
EP (1) EP0366553B1 (en)
JP (1) JPH02118474A (en)
KR (1) KR930001547B1 (en)
DE (1) DE68927147T2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002103379A1 (en) * 2001-06-13 2002-12-27 Advantest Corporation Semiconductor device testing instrument and semiconductor device testing method

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3253296B2 (en) * 1989-12-20 2002-02-04 セイコーエプソン株式会社 Storage device and data processing device
JPH045583A (en) * 1990-04-23 1992-01-09 Ando Electric Co Ltd Data log circuit
US5550845A (en) * 1990-08-03 1996-08-27 Siemens Aktiengesellschaft Method for dynamic testing of digital logic circuits
US5258986A (en) * 1990-09-19 1993-11-02 Vlsi Technology, Inc. Tightly coupled, low overhead RAM built-in self-test logic with particular applications for embedded memories
JP2765771B2 (en) * 1991-08-07 1998-06-18 ローム株式会社 Test method for semiconductor memory device
US5422852A (en) * 1992-02-27 1995-06-06 Texas Instruments Incorporated Method and system for screening logic circuits
JPH063424A (en) * 1992-06-22 1994-01-11 Mitsubishi Electric Corp Integrated circuit device and test data generation circuit assembled into the device
US5477160A (en) * 1992-08-12 1995-12-19 Fujitsu Limited Module test card
US5363038A (en) * 1992-08-12 1994-11-08 Fujitsu Limited Method and apparatus for testing an unpopulated chip carrier using a module test card
US5528602A (en) * 1992-12-30 1996-06-18 International Business Machines Corporation Method for determining computer subsystem property
US5381419A (en) * 1993-03-01 1995-01-10 At&T Corp. Method and apparatus for detecting retention faults in memories
US5956280A (en) * 1998-03-02 1999-09-21 Tanisys Technology, Inc. Contact test method and system for memory testers
JP2000021193A (en) * 1998-07-01 2000-01-21 Fujitsu Ltd Method and apparatus for testing memory and storage medium
DE19845409A1 (en) * 1998-10-02 2000-04-20 Ibm Rapid determination of the flush delay for chips with LSSD design
US7385385B2 (en) * 2001-10-03 2008-06-10 Nextest Systems Corporation System for testing DUT and tester for use therewith
US6868212B2 (en) * 2003-03-06 2005-03-15 Evans & Sutherland Computer Corporation Method and apparatus for controlling wavelength and dominant mode in fiber lasers
US7461304B1 (en) 2003-07-07 2008-12-02 Marvell Israel (M.I.S.L.) Ltd. Integrated circuit test using clock signal modification
JP2007010606A (en) * 2005-07-04 2007-01-18 Matsushita Electric Ind Co Ltd Lsi inspection module, control method for lsi inspection module, communication method between lsi inspection module and lsi inspection device, and lsi inspection method
EP2104930A2 (en) 2006-12-12 2009-09-30 Evans & Sutherland Computer Corporation System and method for aligning rgb light in a single modulator projector
US8358317B2 (en) 2008-05-23 2013-01-22 Evans & Sutherland Computer Corporation System and method for displaying a planar image on a curved surface
US8702248B1 (en) 2008-06-11 2014-04-22 Evans & Sutherland Computer Corporation Projection method for reducing interpixel gaps on a viewing surface
US8077378B1 (en) 2008-11-12 2011-12-13 Evans & Sutherland Computer Corporation Calibration system and method for light modulation device
DE102009010886B4 (en) * 2009-02-27 2013-06-20 Advanced Micro Devices, Inc. Detecting the delay time in a built-in memory self-test using a ping signal
US9641826B1 (en) 2011-10-06 2017-05-02 Evans & Sutherland Computer Corporation System and method for displaying distant 3-D stereo on a dome surface

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1278694A (en) * 1969-07-04 1972-06-21 Sperry Rand Corp Improvements in or relating to apparatus for testing electronic circuits
JPS5832178A (en) * 1981-08-19 1983-02-25 Advantest Corp Ic tester
JPS59176892A (en) * 1983-03-26 1984-10-06 富士ファコム制御株式会社 Analog data collection system
US4710932A (en) * 1986-01-15 1987-12-01 Kashiwagi Hiroshi Method of and apparatus for fault detection in digital circuits by comparison of test signals applied to a test circuit and a faultless reference circuit
JPS647400A (en) * 1987-06-29 1989-01-11 Hitachi Ltd Ic tester

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002103379A1 (en) * 2001-06-13 2002-12-27 Advantest Corporation Semiconductor device testing instrument and semiconductor device testing method

Also Published As

Publication number Publication date
DE68927147D1 (en) 1996-10-17
US5053698A (en) 1991-10-01
EP0366553B1 (en) 1996-09-11
EP0366553A2 (en) 1990-05-02
KR900006789A (en) 1990-05-08
EP0366553A3 (en) 1991-10-23
DE68927147T2 (en) 1997-01-23
KR930001547B1 (en) 1993-03-04

Similar Documents

Publication Publication Date Title
JPH02118474A (en) Testing device for propagation delay time
US5796745A (en) Memory array built-in self test circuit for testing multi-port memory arrays
US3961252A (en) Testing embedded arrays
KR0134751B1 (en) Semiconductor memory device having register for holding test resultant signal
US6297997B1 (en) Semiconductor device capable of reducing cost of analysis for finding replacement address in memory array
US6442724B1 (en) Failure capture apparatus and method for automatic test equipment
US6993696B1 (en) Semiconductor memory device with built-in self test circuit operating at high rate
EP0600655A2 (en) Integrated circuit test arrangement and method
US6671836B1 (en) Method and apparatus for testing memory
US6247153B1 (en) Method and apparatus for testing semiconductor memory device having a plurality of memory banks
JPH10170607A (en) Test device of semiconductor device
US6256757B1 (en) Apparatus for testing memories with redundant storage elements
US20080137456A1 (en) Method of testing memory device
US7028236B2 (en) Semiconductor memory testing device
JPH10106300A (en) Method and equipment for processing variable data word width and array depth
JPH11211793A (en) Ic tester
JPS62263475A (en) Memory testing apparatus
JPH11316259A (en) Semiconductor test device and method for testing semiconductor using it
US11657892B1 (en) Repairable latch array
JP2000137996A (en) Memory ic testing system
JP2001222897A (en) Semiconductor test device
JP2002008391A (en) Semiconductor test device and test method using it
JP3165131B2 (en) Test method and test circuit for semiconductor integrated circuit
JP2967917B2 (en) Semiconductor memory test equipment
JPH0926460A (en) Semiconductor testing device