JPH0199911A - Method for taping small-sized electronic part - Google Patents

Abstract

PURPOSE:To prevent the occurrence of improper taping, by fixing a small-sized electronic part from the side or bottom of an embossing of emboss carrier tape, upon inserting of said electronic parts individually in the embossings thereof. CONSTITUTION:Emboss carrier tape 2 is passed on along a feeding rail 3 and an embossing thereof is provided with a hole of a small diameter at its side. A small-sized electronic part 1 is carried from a stage 7 by a vacuum suction nozzle 4. The small-sized electronic parts 1 are inserted in the emboss carrier tape 2 by the vacuum suction nozzle 4 and, at the same time, fixed in a proper position with a work fixing pin 6 actuated by a link 5. In this condition, the suction nozzle moves upwards to come in the next operation. By this method, the poor appearance of improperly taped parts can be eliminated.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method of taping small electronic components to an embossed carrier tape as a shipping form, particularly when inserting the small electronic components into the recesses of the embossed carrier tape.
It relates to an improved taping method that allows taping to be done in the correct posture.

[Conventional technology]

Conventionally, this type of taping was performed as shown in Fig. 3(a), (
Using a carrier tape as shown in b-), move the small electronic component suction-chucked by a vacuum suction nozzle to the feeding rail of the embossed carrier tape and place it on the positioned embossed carrier tape using the vacuum suction nozzle. It was inserted by a downward movement, and the embossed part was only opened by cutting off the vacuum.

[Problem that the invention seeks to solve]

The conventional taping method described above uses a vacuum suction nozzle,
This method involves inserting the small electronic component into the embossed part of the embossed carrier tape, but due to contamination on the suction surface at the tip of the vacuum suction nozzle, adhesive force is generated, and when the vacuum suction nozzle rises after inserting the small electronic component into the embossed part, the small electronic component This may cause the person to lose his or her posture and be taken outside the factory. Further, if the timing at which the vacuum is turned off does not follow the vertical movement of the vacuum suction nozzle, a similar phenomenon will occur, resulting in a disadvantage of causing taping defects in the taping device.

[Means for solving problems]

In the taping method of the present invention, when inserting a small electronic component into a recessed portion of an embossed carrier tape, in order to fix the posture, the small electronic component is forcibly fixed in the correct posture from the side or bottom of the recessed portion. .

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a longitudinal sectional view of an embodiment of the present invention.

The embossed carrier tape 2 is sequentially fed on the feed rail 3. The embossed carrier tape also has small diameter holes on the embossed side surface.

The small electronic component 1 is transferred by the suction nozzle 4 by repeatedly operating from the other stage 7 in the direction of the arrow.

At the same time when the small electronic component 1 is inserted into the embossed carrier tape by the suction nozzle 4, the workpiece fixing pin 6 is operated by the link 5 to fix it in the correct posture. In this state, the suction nozzle rises and begins the next operation.

FIG. 2 is a longitudinal sectional view of another embodiment of the invention. Embossed carrier feed rail 9 and embossed carrier tape 8
A vacuum suction nozzle is raised in a state in which a hole is provided and the small package device l is fixed by vacuum suction. This embodiment has the advantage of being easier to adopt than the previously described embodiments, since no mechanism is required.

〔Effect of the invention〕

As described above, the present invention has the advantage of being able to eliminate defects in the appearance of taping due to not being taped in the correct posture by being adopted in a taping apparatus for small electronic components.

[Brief explanation of the drawing]

FIG. 1 is a longitudinal cross-sectional view showing one step of the taping method of the present invention, and FIG. 2 is a cross-sectional view of one step showing another embodiment of the present invention. FIGS. 3(a) and 3(b) are a plan view and a sectional view of the embossed carrier tape. 1... Small electronic component, 2... Embossed carrier tape, 3... Embossed carrier feed rail, 4... Vacuum suction nozzle, 5...・
・Pin movement link for fixing the workpiece, 6... Pin for fixing the workpiece, 7... Other stages, 8... Embossed carrier tape, 9... Embossed carrier feed rail . Agent Patent Attorney Otoso Uchihara I12 Go Group 3

Claims (1)

[Claims] In the taping method for small electronic components, the small electronic components are transferred from another stage using a suction nozzle to the embossed carrier tape that is being fed sequentially, and the small electronic components are inserted one by one into the recesses of the embossed carrier tape. A method for taping small electronic components, characterized in that when inserting the small electronic components one by one into the recesses of the tape, the small electronic components are held and fixed from the side or bottom of the recess of the embossed carrier tape. .