JPH0198674A - Conductive composition - Google Patents
Conductive compositionInfo
- Publication number
- JPH0198674A JPH0198674A JP62255719A JP25571987A JPH0198674A JP H0198674 A JPH0198674 A JP H0198674A JP 62255719 A JP62255719 A JP 62255719A JP 25571987 A JP25571987 A JP 25571987A JP H0198674 A JPH0198674 A JP H0198674A
- Authority
- JP
- Japan
- Prior art keywords
- powder
- conductive
- conductive composition
- metal
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 28
- 239000000843 powder Substances 0.000 claims abstract description 43
- 239000011230 binding agent Substances 0.000 claims abstract description 6
- 239000002904 solvent Substances 0.000 claims abstract description 6
- 229910052751 metal Inorganic materials 0.000 claims description 24
- 239000002184 metal Substances 0.000 claims description 24
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 229920003002 synthetic resin Polymers 0.000 description 6
- 239000000057 synthetic resin Substances 0.000 description 6
- 238000007639 printing Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical compound ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 230000000740 bleeding effect Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical compound CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- -1 trichlorethylene Chemical class 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910002012 Aerosil® Inorganic materials 0.000 description 1
- 229920002134 Carboxymethyl cellulose Polymers 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 150000001242 acetic acid derivatives Chemical class 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000001768 carboxy methyl cellulose Substances 0.000 description 1
- 235000010948 carboxy methyl cellulose Nutrition 0.000 description 1
- 239000008112 carboxymethyl-cellulose Substances 0.000 description 1
- 150000008280 chlorinated hydrocarbons Chemical class 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- YZASAXHKAQYPEH-UHFFFAOYSA-N indium silver Chemical compound [Ag].[In] YZASAXHKAQYPEH-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 229940057995 liquid paraffin Drugs 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 229920006186 water-soluble synthetic resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
Landscapes
- Inks, Pencil-Leads, Or Crayons (AREA)
- Conductive Materials (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は導電性インクあるいは導電性ペーストとして用
いられる導電性組成物に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a conductive composition used as a conductive ink or a conductive paste.
この種の導電性インクあるいは導電性ペーストは、一般
にスクリーン印刷によって基板上に塗布され焼成される
ことなく単に乾燥せしめられることにより、該基板上に
導電膜を形成するものである。したがって導電性インク
あるいは導電性ペーストは金属分散性および流動性が良
好で印刷適正に優れ、同時に形成される塗膜の導電性が
良好であることが望まれている。This type of conductive ink or conductive paste is generally applied onto a substrate by screen printing and simply dried without baking, thereby forming a conductive film on the substrate. Therefore, it is desired that the conductive ink or conductive paste has good metal dispersibility and fluidity, is suitable for printing, and at the same time, the formed coating film has good conductivity.
従来は金属粉の分散性を改良して優れた印刷適正を得る
ためにチタネート系カップリング剤を添加する方法（特
開昭５９−１５５９８８号）や。Conventionally, there has been a method of adding a titanate coupling agent to improve the dispersibility of metal powder and obtain excellent printing suitability (Japanese Patent Laid-Open No. 155988/1983).
導電性を改良するために金属粉として結晶質銅粉を用い
る方法（特開昭６０−１１５１０２号）が提供されてい
る。In order to improve conductivity, a method using crystalline copper powder as the metal powder (Japanese Patent Application Laid-Open No. 115102/1982) has been proposed.
しかしながら前者のようなカップリング剤を用いる方法
では金属粉相互の直接的な接触性が低下するために高導
電率が得られにくいし、後者のような結晶質銅粉を用い
る方法では流動性が低下し印刷適正が悪くなる。However, in the former method using a coupling agent, it is difficult to obtain high conductivity because the direct contact between the metal powders decreases, and in the latter method using crystalline copper powder, fluidity is poor. This decreases and print suitability deteriorates.
本発明は上記従来の問題点を解決する手段として、金属
粉と、バインダと、溶剤とを主体とし、該金属粉は球状
の粉末とフレーク状の粉末との重量比で９：１から５＝
５の混合物からなる導電性組成物を提供するものである
。The present invention, as a means to solve the above-mentioned conventional problems, mainly consists of metal powder, a binder, and a solvent, and the metal powder has a weight ratio of spherical powder to flake powder of 9:1 to 5.
The present invention provides a conductive composition comprising a mixture of 5.
本発明に用いられる金属粉としてはパラジウム、インジ
ウム、銀、銅、ニッケル、クロム等の金属単体、あるい
は該金属の二種以上の混合物、あるいは銀−パラジウム
、ニッケルー銅、銀−インジウム等の二種以上の該金属
からなる合金の粉末が含まれる。そして該金属あるいは
合金は耐蝕性の良好なものが望ましい、該金属あるいは
合金の粉末は球状の粉末とフレーク状の粉末との重量比
で９＝１から５：５の混合物とされる。そして球状粉末
の場合には望ましくは径が１０μｍ以下、更に望ましく
は５μｍ以下とされ、フレーク状粉末の場合には長径が
１０μｍ以下、更に望ましくは５μｍ以下とされ、厚さ
は０．１〜２．０μｍ程度とされる。The metal powders used in the present invention include single metals such as palladium, indium, silver, copper, nickel, and chromium, mixtures of two or more of these metals, or two types of metals such as silver-palladium, nickel-copper, and silver-indium. Powders of alloys made of the above metals are included. The metal or alloy preferably has good corrosion resistance, and the metal or alloy powder is a mixture of spherical powder and flake powder in a weight ratio of 9=1 to 5:5. In the case of spherical powder, the diameter is preferably 10 μm or less, more preferably 5 μm or less, and in the case of flake-like powder, the major axis is 10 μm or less, more preferably 5 μm or less, and the thickness is 0.1 to 2 μm. It is assumed to be about .0 μm.
（バインダ）
本発明に用いられるバインダは主として合成樹脂である
。該合成樹脂としてはエポキシ樹脂、メラミン樹脂、フ
ェノール樹脂、レゾルシノール樹脂、ウレタン樹脂、ア
クリル樹脂、ポリエステル樹脂、ポリアミド樹脂、ポリ
ビニルアルコール。(Binder) The binder used in the present invention is mainly a synthetic resin. Examples of the synthetic resin include epoxy resin, melamine resin, phenol resin, resorcinol resin, urethane resin, acrylic resin, polyester resin, polyamide resin, and polyvinyl alcohol.
カルボキシメチルセルロース等の通常この種のインクあ
るいはペーストに用いられている熱硬化性合成樹脂、熱
可塑性合成樹脂が含まれる。Included are thermosetting synthetic resins and thermoplastic synthetic resins that are usually used in this type of ink or paste, such as carboxymethyl cellulose.
本発明に用いられる溶剤としてはメタノール。 The solvent used in the present invention is methanol.
エタノール、ｎ−ブタノール等のアルコール、トリオー
ル、キジロール等の芳香族系、酢酸エチル。Alcohols such as ethanol and n-butanol, aromatic systems such as triol and quidylol, and ethyl acetate.
酢酸ｎ−ブチル等の酢酸エステル系、メチルエチルケト
ン、メチルイソブチルケトン等のケトン系、セルソルブ
アセテート、ｎ−ブチルセロソルブ等のセロソルブ系、
ヘキサン、ヘプタン、シクロヘキサン等のパラフィン系
、メチレンクロライド。Acetate esters such as n-butyl acetate, ketones such as methyl ethyl ketone, methyl isobutyl ketone, cellosolve acetate, cellosolves such as n-butyl cellosolve,
Paraffin series such as hexane, heptane, cyclohexane, methylene chloride.
トリクロルエチレン等の塩素化炭化水素系等の通常この
種のインクあるいはペーストに用いられている有機溶剤
の単独あるいは該有機溶剤の二種以上の混合溶剤が含ま
れるが、水溶性の合成樹脂の場合には水、あるいは水と
メタノール、エタノール等の水溶性有機溶剤との混合物
が用いられる。Contains organic solvents such as chlorinated hydrocarbons such as trichlorethylene, which are usually used in this type of ink or paste, or a mixture of two or more of these organic solvents, but in the case of water-soluble synthetic resins. Water or a mixture of water and a water-soluble organic solvent such as methanol or ethanol is used.
上記成分以外に本発明の導電性組成物には更にステアリ
ン酸、流動パラフィン、アルキルベンゼンスルホン酸塩
、アエロジル等の流動性付与剤。In addition to the above-mentioned components, the conductive composition of the present invention further contains fluidity imparting agents such as stearic acid, liquid paraffin, alkylbenzene sulfonate, and Aerosil.
分散剤、増粘剤等が添加されてもよい。Dispersants, thickeners, etc. may be added.
本発明の導電性組成物においては通常金属粉を７０〜９
０重量％１合成樹脂分３０〜５０重量％の合成樹脂溶液
３０〜１０重量％の割合で混合されペースト状ないしは
インキ状とされる。In the conductive composition of the present invention, the metal powder is usually 70 to 9
A synthetic resin solution containing 0% by weight and 30% to 50% by weight of synthetic resin is mixed to form a paste or ink.
本発明の導電性組成物に含まれる金属の球状粉末は該組
成物中に極めて良好に分散しかつ望ましい流動性を与え
る。しかし該球状粉末は相互接触面積が非常に小さいの
で金属のフレーク状粉末との割合が９：１重量比を越え
ると該導電性組成物を塗布して得られる導電膜の導電率
が低下する。The spherical metal powder contained in the conductive compositions of the present invention disperses very well in the compositions and provides desirable fluidity. However, since the spherical powder has a very small mutual contact area, if the ratio by weight with the metal flake powder exceeds 9:1, the conductivity of the conductive film obtained by applying the conductive composition will decrease.
本発明の導電性組成物に含まれる金属のフレーク状粉末
は相互接触面積が大きいので得られる導電膜の導電率は
高くなる。しかし形状的要因によって分散性が悪く、ま
た導電性組成物に良好な流動性を与えないので金属の球
状粉末との割合が５：５重量比を越えると該導電性組成
物の印刷適正が悪くなる。Since the metal flake-like powder contained in the conductive composition of the present invention has a large mutual contact area, the conductivity of the obtained conductive film is high. However, the dispersibility is poor due to shape factors, and the conductive composition does not have good fluidity, so if the ratio with the metal spherical powder exceeds 5:5 by weight, the conductive composition will not be suitable for printing. Become.
〔発明の効果］
したがって本発明の導電性組成物においては金属の球状
粉末とフレーク状粉末とが９：１〜５：５の範囲内で混
合されているから良好な印刷適正を有するとともに得ら
れる導電膜の導電率は良好なのものとなる。[Effects of the Invention] Therefore, in the conductive composition of the present invention, since the metal spherical powder and the flaky powder are mixed in a ratio of 9:1 to 5:5, it has good printability and can be obtained. The conductivity of the conductive film becomes good.
以下に本発明の実施例を示す。 Examples of the present invention are shown below.
下記の成分を混合して導電性組成物を調整する。A conductive composition is prepared by mixing the following components.
金属粉 ８０重量部
エポキシ樹脂 ８重量部
トリオール ６重量部
ｎ−ブチルセルソルブ ６重量部
上記組成物にエポキシ樹脂硬化剤を５重量部添加して直
ちにシルクスクリーン印刷によってアルミナ基板表面に
上記組成物を印刷する。その後１００℃で５分間の加熱
乾燥を行い、厚さ３０μｍの導電膜を得る。該金属粉に
おける球状粉とフレーク状粉との混合比率を種々に変化
させて該組成物の印刷適正および導電膜の抵抗値を測定
する。Metal powder 80 parts by weight Epoxy resin 8 parts by weight Triol 6 parts by weight n-butyl cellosolve 6 parts by weight 5 parts by weight of an epoxy resin curing agent was added to the above composition, and immediately the above composition was applied to the surface of an alumina substrate by silk screen printing. Print. Thereafter, heat drying is performed at 100° C. for 5 minutes to obtain a conductive film with a thickness of 30 μm. The printing suitability of the composition and the resistance value of the conductive film are measured by varying the mixing ratio of the spherical powder and the flaky powder in the metal powder.
該組成物の印刷適正を第１表に示す。The print suitability of the composition is shown in Table 1.
Ｏ：にじみ、目づまりなし
０：若干にじみあり
Ｘ：にじみ、目づまりあり
該導電膜の抵抗値を第１図に示す。第１図はフレーク状
粉の含有量（重量％）と該導電膜の抵抗値との関係を示
すものである。O: No bleeding or clogging 0: Slight bleeding X: Smearing or clogging The resistance value of the conductive film is shown in FIG. FIG. 1 shows the relationship between the content (weight %) of flaky powder and the resistance value of the conductive film.
第１表によれば球状粉：フレーク状粉の比率が５：５ま
では印刷適正に問題はないが、４：６になるとにじみ、
目づまりを生じ印刷適正が低下することがわかる。According to Table 1, there is no problem with printing properly when the ratio of spherical powder to flake powder is up to 5:5, but when it becomes 4:6, bleeding occurs.
It can be seen that clogging occurs and print suitability deteriorates.
第１図によればフレーク状粉の含有量が１０重量％以上
であれば良好な導電性を示すことがわかる。According to FIG. 1, it can be seen that good conductivity is exhibited when the content of flaky powder is 10% by weight or more.
第１図は横軸にフレーク状粉の含有量（重量％）をとり
、縦軸に導電膜の抵抗値（Ω−ａ−）をとったグラフで
ある。
図中、０−０・・・ニッケル、Δ−−−Δ・・・銅、×
・・・・×・・・銀
特許出願人 大同特殊鋼株式会社FIG. 1 is a graph in which the horizontal axis represents the content (% by weight) of the flaky powder, and the vertical axis represents the resistance value (Ω-a-) of the conductive film. In the figure, 0-0...Nickel, Δ---Δ...Copper, ×
・・・×・・・Silver patent applicant Daido Steel Co., Ltd.
Claims (1)
は球状の粉末とフレーク状の粉末との重量比で９：１か
ら５：５の混合物からなることを特徴とする導電性組成
物A conductive composition mainly consisting of a metal powder, a binder, and a solvent, the metal powder being a mixture of spherical powder and flake powder in a weight ratio of 9:1 to 5:5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62255719A JPH0198674A (en) | 1987-10-09 | 1987-10-09 | Conductive composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62255719A JPH0198674A (en) | 1987-10-09 | 1987-10-09 | Conductive composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0198674A true JPH0198674A (en) | 1989-04-17 |
Family
ID=17282697
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62255719A Pending JPH0198674A (en) | 1987-10-09 | 1987-10-09 | Conductive composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0198674A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0536307A (en) * | 1991-07-31 | 1993-02-12 | Fukuda Metal Foil & Powder Co Ltd | Conductive adhesive |
| EP0820217A1 (en) * | 1996-07-18 | 1998-01-21 | E.I. Du Pont De Nemours And Company | Composition and process for filling vias |
| WO2001022789A1 (en) * | 1999-09-22 | 2001-03-29 | Telefonaktiebolaget Lm Ericsson (Publ) | An electrically conductive ink |
| WO2001048762A1 (en) * | 1999-12-24 | 2001-07-05 | Ngk Insulators, Ltd. | Ceramic capacitor electrode-forming paste |
| US6322620B1 (en) | 2000-11-16 | 2001-11-27 | National Starch And Chemical Investment Holding Corporation | Conductive ink composition |
| WO2003019998A1 (en) * | 2001-08-24 | 2003-03-06 | E. I. Du Pont De Nemours And Company | Thermosetting electroconductive paste for electroconductive bump use |
| JP2005248061A (en) * | 2004-03-05 | 2005-09-15 | Toyo Ink Mfg Co Ltd | Conductive ink and non-contact medium using the same |
| WO2006101127A1 (en) * | 2005-03-23 | 2006-09-28 | Matsushita Electric Industrial Co., Ltd. | Electroconductive joining material and electric or electronic device using the same |
| JP2008235030A (en) * | 2007-03-20 | 2008-10-02 | Toshiba Corp | Packed batteries and battery pack |
| JP2018009112A (en) * | 2016-07-14 | 2018-01-18 | タツタ電線株式会社 | Conductive coating material and method for producing shield package using the same |
-
1987
- 1987-10-09 JP JP62255719A patent/JPH0198674A/en active Pending
Cited By (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0536307A (en) * | 1991-07-31 | 1993-02-12 | Fukuda Metal Foil & Powder Co Ltd | Conductive adhesive |
| EP0820217A1 (en) * | 1996-07-18 | 1998-01-21 | E.I. Du Pont De Nemours And Company | Composition and process for filling vias |
| WO2001022789A1 (en) * | 1999-09-22 | 2001-03-29 | Telefonaktiebolaget Lm Ericsson (Publ) | An electrically conductive ink |
| WO2001048762A1 (en) * | 1999-12-24 | 2001-07-05 | Ngk Insulators, Ltd. | Ceramic capacitor electrode-forming paste |
| JP2001184942A (en) * | 1999-12-24 | 2001-07-06 | Ngk Insulators Ltd | Paste for forming ceramic capacitor electrode |
| US6565774B2 (en) | 1999-12-24 | 2003-05-20 | Ngk Insulators, Ltd. | Paste for formation of ceramic capacitor electrode |
| US6322620B1 (en) | 2000-11-16 | 2001-11-27 | National Starch And Chemical Investment Holding Corporation | Conductive ink composition |
| WO2003019998A1 (en) * | 2001-08-24 | 2003-03-06 | E. I. Du Pont De Nemours And Company | Thermosetting electroconductive paste for electroconductive bump use |
| US6800223B2 (en) | 2001-08-24 | 2004-10-05 | E. I. Du Pont De Nemours And Company | Thermosetting electroconductive paste for electroconductive bump use |
| CN1322794C (en) * | 2001-08-24 | 2007-06-20 | 纳幕尔杜邦公司 | Thermosetting electroconductive paste for electroconductive bump use |
| JP4595353B2 (en) * | 2004-03-05 | 2010-12-08 | 東洋インキ製造株式会社 | Conductive ink and non-contact type medium using the same |
| JP2005248061A (en) * | 2004-03-05 | 2005-09-15 | Toyo Ink Mfg Co Ltd | Conductive ink and non-contact medium using the same |
| WO2006101127A1 (en) * | 2005-03-23 | 2006-09-28 | Matsushita Electric Industrial Co., Ltd. | Electroconductive joining material and electric or electronic device using the same |
| US8012379B2 (en) | 2005-03-23 | 2011-09-06 | Panasonic Corporation | Electroconductive bonding material and electric/electronic device using the same |
| JP5005530B2 (en) * | 2005-03-23 | 2012-08-22 | パナソニック株式会社 | Method for forming electric / electronic circuit and electric / electronic equipment using the same |
| JP2008235030A (en) * | 2007-03-20 | 2008-10-02 | Toshiba Corp | Packed batteries and battery pack |
| US9257727B2 (en) | 2007-03-20 | 2016-02-09 | Kabushiki Kaisha Toshiba | Assembled battery and battery pack |
| JP2018009112A (en) * | 2016-07-14 | 2018-01-18 | タツタ電線株式会社 | Conductive coating material and method for producing shield package using the same |
| WO2018012017A1 (en) * | 2016-07-14 | 2018-01-18 | タツタ電線株式会社 | Electroconductive coating material and process for producing shielded packages using same |
| US20190292381A1 (en) * | 2016-07-14 | 2019-09-26 | Tatsuta Electric Wire & Cable Co., Ltd. | Conductive coating material and production method for shielded package using conductive coating material |
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