JPH0195010A - Cleaning method for molding die - Google Patents
Cleaning method for molding dieInfo
- Publication number
- JPH0195010A JPH0195010A JP25294387A JP25294387A JPH0195010A JP H0195010 A JPH0195010 A JP H0195010A JP 25294387 A JP25294387 A JP 25294387A JP 25294387 A JP25294387 A JP 25294387A JP H0195010 A JPH0195010 A JP H0195010A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- cleaning
- cavity
- mold
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 41
- 238000000034 method Methods 0.000 title claims description 13
- 238000000465 moulding Methods 0.000 title claims description 9
- 229920005989 resin Polymers 0.000 claims abstract description 43
- 239000011347 resin Substances 0.000 claims abstract description 43
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000003063 flame retardant Substances 0.000 claims abstract description 7
- 239000012778 molding material Substances 0.000 claims abstract 2
- 239000000758 substrate Substances 0.000 claims description 20
- 238000007789 sealing Methods 0.000 abstract description 5
- 229920000877 Melamine resin Polymers 0.000 abstract description 4
- 239000004640 Melamine resin Substances 0.000 abstract description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/70—Maintenance
- B29C33/72—Cleaning
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は樹脂等を成形する成形金型のクリーニング方法
に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method for cleaning a mold for molding resin or the like.
従来の技術
樹脂成形金型においては、何度か成形作業を繰り返すう
ちに金型のキャビティ内に樹脂かす等の汚れが付着し、
キャビティ内のエアー抜けが悪くなってボイド（気泡）
、未充填等の不良が発生したり、パッケージ表面に汚れ
が付着する等の問題が起こる。このため定期的にクリー
ニングし、キャビティ内の汚れを除去する必要がある。Conventional technology In resin molding molds, dirt such as resin scum builds up inside the mold cavity as the molding process is repeated several times.
Voids (bubbles) due to poor air release inside the cavity
Problems such as defects such as non-filling and dirt adhering to the surface of the package occur. Therefore, it is necessary to periodically clean the cavity to remove dirt inside the cavity.
第３図、第４図は従来の半導体樹脂封止用金型のクリー
ニング方法を示すものであり、１は下金型、２は上金型
、３は上下金型１，２間に形成されるキャビティ、４は
上下金型１，２間に配置された銅などの金属で構成され
たリードフレーム、５はメラミン樹脂等のクリーニング
用樹脂である。クリーニング用樹脂５は、いわゆるトラ
ンスファーモールドと呼ばれる方法で成形され、ランナ
一部５ａと、ランナ一部５ａから分岐してゲート口へ流
れ込んだゲート部５ｂと、キャビティ３内に流れ込んだ
封止部５Ｃとが一体となって成形される。メラミン樹脂
等のクリーニング用樹脂５を上下金型１，２間で成形固
化すると、金型表面に付着した樹脂かす等の汚れがクリ
ーニング用樹脂５の表面゛に付着する。このため、第４
図に示すようにリードフレーム４とクリーニング用樹脂
５とを一体として上下金型１．２から離型すれば、キャ
ビティ３内等に残った汚れを自動的に除去することがで
き、その後の通常の樹脂成形の品質を高めることができ
る。Figures 3 and 4 show a conventional cleaning method for semiconductor resin encapsulation molds, in which 1 is the lower mold, 2 is the upper mold, and 3 is the cleaning method formed between the upper and lower molds 1 and 2. 4 is a lead frame made of metal such as copper and placed between the upper and lower molds 1 and 2; 5 is a cleaning resin such as melamine resin. The cleaning resin 5 is molded by a method called transfer molding, and is formed into a runner part 5a, a gate part 5b which branches from the runner part 5a and flows into the gate opening, and a sealing part 5C which flows into the cavity 3. are integrally formed. When the cleaning resin 5 such as melamine resin is molded and solidified between the upper and lower molds 1 and 2, dirt such as resin scum adhering to the mold surface adheres to the surface of the cleaning resin 5. For this reason, the fourth
As shown in the figure, if the lead frame 4 and the cleaning resin 5 are integrally released from the upper and lower molds 1.2, dirt remaining in the cavity 3 etc. can be automatically removed, and the subsequent normal The quality of resin molding can be improved.
発明が解決しようとする問題点
ところが、従来の方法では、クリーニング時にも通常の
半導体の製造に用いるリードフレーム４をそのまま利用
し、チップを載せない状態でのリードフレーム４にクリ
ーニング用樹脂５を成形固化して汚れを除去するため、
クリーニングに要するコストが高くなるという問題があ
る。Problems to be Solved by the Invention However, in the conventional method, the lead frame 4 used in normal semiconductor manufacturing is used as is even during cleaning, and the cleaning resin 5 is molded onto the lead frame 4 without a chip mounted thereon. To harden and remove dirt,
There is a problem that the cost required for cleaning increases.
本発明はこのような従来の問題を解決する成形金型のク
リーニング方法を提供するものである。The present invention provides a mold cleaning method that solves these conventional problems.
問題点を解決するための手段
本発明は上下金型間に難燃性の紙または樹脂からなる基
板を配置し、この状態でクリーニング用樹脂を注入固化
して上記基板とクリーニング用樹脂とを一体化させ、そ
の後上記基板とクリーニング用樹脂とを上下金型から離
型するものである。Means for Solving the Problems The present invention places a substrate made of flame-retardant paper or resin between the upper and lower molds, injects and solidifies the cleaning resin in this state, and integrates the substrate and the cleaning resin. After that, the substrate and the cleaning resin are released from the upper and lower molds.
作用
このようにすれば、従来の高価なリードフレームに代え
て、安価な紙または樹脂からなる基板を利用して金型を
クリーニングすることができる。Function: By doing so, the mold can be cleaned using an inexpensive substrate made of paper or resin instead of the conventional expensive lead frame.
このためクリーニングに要する費用を大幅に低減するこ
とができる。Therefore, the cost required for cleaning can be significantly reduced.
実施例
第１図、第２図は本発明の一実施例を示すものであり、
第３図、第４図と同一機能の部分には同一符号を付して
説明を省略する。６は紙で構成された基板であり、第１
図に示すように、キャビティ３の水平方向の形状とほぼ
同形状の孔６ａがキャビティ３と同一間隔で形成されて
いる。なお基板６を構成する紙としては、樹脂の成形温
度（通常１８０℃程度）より発火点の高い、いわゆる難
燃性の紙を用いる必要があるが、厚手の模造紙などはこ
の目的に十分適する。そしてその厚みは、通常の半導体
の製造に用いられるリードフレームとほぼ同じ厚さに設
定する。次にクリーニング方法を説明する。Embodiment FIGS. 1 and 2 show an embodiment of the present invention.
Components having the same functions as those in FIGS. 3 and 4 are given the same reference numerals, and explanations thereof will be omitted. 6 is a substrate made of paper;
As shown in the figure, holes 6a having substantially the same shape as the cavity 3 in the horizontal direction are formed at the same intervals as the cavity 3. Note that it is necessary to use so-called flame-retardant paper, which has a higher ignition point than the molding temperature of the resin (usually about 180° C.), as the paper forming the substrate 6, but thick imitation paper is well suited for this purpose. . The thickness is set to be approximately the same as that of a lead frame used in normal semiconductor manufacturing. Next, a cleaning method will be explained.
難燃性の紙で構成した基板６を上下金型１．２間に配置
する。このとき、キャビティ３と基板６の孔６ａとを一
致させる。そして従来と同じトランスファーモールド法
によりメラミン樹脂等のクリーニング用樹脂５を注入し
、固化させると、クリーニング用樹脂５の表面に金型表
面の汚れが付着する。このとき、基板６は上下金型１，
２間に隙間なく挟持される。このためキャビティ３内に
流入したクリーニング用樹脂５がキャビティ３外へ流出
することはな（、基板６の孔６ａ内に内接する形で封止
部５ｃが成形され、基板６とクリーニング用樹脂５が一
体化される。クリーニング用樹脂５が固化した後、上下
金型１，２を分離し、一体化された基板６とクリーニン
グ用樹脂５を金型から分離すると、それにともなって、
キャビティ３の表面から離れ、クリーニング用樹脂５の
封止部５ｃの表面に付着した汚れが自動的に除去される
。このとき、ランナ一部５ａやゲート部５ｂを構成する
キャビティ内の汚れはそれぞれランナ一部５ａ、ゲート
部５ｂの表面に付着して除去される。A substrate 6 made of flame-retardant paper is placed between the upper and lower molds 1.2. At this time, the cavity 3 and the hole 6a of the substrate 6 are aligned. Then, when a cleaning resin 5 such as melamine resin is injected and solidified by the conventional transfer molding method, dirt from the mold surface adheres to the surface of the cleaning resin 5. At this time, the substrate 6 is the upper and lower molds 1,
It is sandwiched between the two without a gap. Therefore, the cleaning resin 5 that has flowed into the cavity 3 does not flow out of the cavity 3 (the sealing portion 5c is molded to be inscribed in the hole 6a of the substrate 6, and the cleaning resin 5 between the substrate 6 and the cleaning resin 5 is After the cleaning resin 5 is solidified, the upper and lower molds 1 and 2 are separated, and the integrated substrate 6 and cleaning resin 5 are separated from the mold.
Dirt that has separated from the surface of the cavity 3 and adhered to the surface of the sealing portion 5c of the cleaning resin 5 is automatically removed. At this time, dirt in the cavity constituting the runner part 5a and the gate part 5b adheres to the surfaces of the runner part 5a and the gate part 5b, respectively, and is removed.
なお、上記実施例では基板６を紙で構成したが、難燃性
の樹脂で構成してもよい。Although the substrate 6 is made of paper in the above embodiment, it may be made of flame-retardant resin.
また、以上の説明では半導体パッケージ用金型を例とし
て挙げたが、この他の成形金型にも応用できる。Further, although the above explanation has been given as an example of a semiconductor package mold, the present invention can also be applied to other molding molds.
発明の効果
本発明はクリーニング用樹脂を注入する際の基板を難燃
性の紙または樹脂で構成したものであるから、通常のリ
ードフレームを基板として用いる従来の方法に比べて大
幅なコストダウンを図ることができる。Effects of the Invention Since the present invention uses a flame-retardant paper or resin as the substrate for injecting the cleaning resin, the cost can be significantly reduced compared to the conventional method using an ordinary lead frame as the substrate. can be achieved.
第１図は本発明の一実施例における成形金型のクリーニ
ング方法を示す断面図、第２図は上記実施例の離型後の
基板とクリーニング用樹脂を示す要部破断斜視図、第３
図は従来の金型のクリーニング方法を示す断面図、第４
図は上記従来例の離型抜の基板とクリーニング用樹脂を
示す要部破断斜視図である。
１・・・・・・上金型、２・・・・・・下金型、３・・
・・・・キャビティ、５・・・・・・クリーニング用樹
脂、５ａ・・・・・・ランナ一部、５ｂ・・・・・・ゲ
ート部、５Ｃ・・・・・・封止部、６・・・・・・基板
。
代理人の氏名 弁理士 中尾敏男 ほか１名／−−−下
金型
６α−−一充FIG. 1 is a sectional view showing a method of cleaning a molding die in an embodiment of the present invention, FIG.
The figure is a cross-sectional view showing the conventional mold cleaning method.
The figure is a cutaway perspective view of essential parts showing the mold release substrate and cleaning resin of the above-mentioned conventional example. 1...Top mold, 2...Bottom mold, 3...
...Cavity, 5...Cleaning resin, 5a...Part of runner, 5b...Gate part, 5C...Sealing part, 6 ······substrate. Name of agent: Patent attorney Toshio Nakao and 1 other person/---Lower mold 6α---Kazumitsu
Claims (1)
キャビティとほぼ同形状の孔を有する難燃性の紙または
樹脂からなる基板とを備え、上記上下金型間に上記キャ
ビティと上記孔とを一致させた状態で上記基板を配置し
、上記キャビティ内にクリーニング用樹脂を注入固化し
て上記クリーニング用樹脂の表面に上記キャビティ内に
ある成形材料かす等の汚れを付着させ、その後上記基板
と上記固化したクリーニング用樹脂とを上記上下金型か
ら離型することを特徴とする成形金型のクリーニング方
法。The method comprises upper and lower molds forming a cavity of a predetermined shape, and a substrate made of flame-retardant paper or resin having a hole approximately the same shape as the cavity, and the cavity and the hole are formed between the upper and lower molds. The substrates are placed in a matched state, and a cleaning resin is injected into the cavity and solidified to cause dirt such as molding material residue in the cavity to adhere to the surface of the cleaning resin, and then the substrate and the A method for cleaning a molding die, comprising releasing the solidified cleaning resin from the upper and lower molds.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25294387A JPH0195010A (en) | 1987-10-07 | 1987-10-07 | Cleaning method for molding die |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25294387A JPH0195010A (en) | 1987-10-07 | 1987-10-07 | Cleaning method for molding die |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0195010A true JPH0195010A (en) | 1989-04-13 |
Family
ID=17244317
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25294387A Pending JPH0195010A (en) | 1987-10-07 | 1987-10-07 | Cleaning method for molding die |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0195010A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03202327A (en) * | 1989-12-28 | 1991-09-04 | Toowa Kk | Cleaning process of mold face for molding resin, sheet member for cleaning used in same process and continuous automatic resin-molding process |
| WO2002011966A1 (en) * | 2000-08-04 | 2002-02-14 | Hitachi, Ltd. | Mold cleaning sheet and method of producing semiconductor devices using the same |
| US6565419B1 (en) | 1999-02-05 | 2003-05-20 | Advantest Corporation | Method of removing particles from stage and cleaning plate |
| KR100403132B1 (en) * | 2001-12-28 | 2003-10-30 | 동부전자 주식회사 | mold cavity bar for manufacturing a semiconductor package |
| KR100518745B1 (en) * | 1998-06-30 | 2005-12-02 | 삼성전자주식회사 | Leadframe for cleaning mold press |
| US7429342B2 (en) * | 2001-08-15 | 2008-09-30 | Advanced Semiconductor Engineering, Inc. | Method for cleaning and regenerating a mold |
| JP2009010084A (en) * | 2007-06-27 | 2009-01-15 | Sumitomo Heavy Ind Ltd | Resin sealing device |
| US7537967B2 (en) | 2001-05-18 | 2009-05-26 | Renesas Technology Corp. | Mold cleaning sheet and manufacturing method of a semiconductor device using the same |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55137914A (en) * | 1979-04-13 | 1980-10-28 | Mitsubishi Electric Corp | Cleaning method for semiconductor producing device |
-
1987
- 1987-10-07 JP JP25294387A patent/JPH0195010A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55137914A (en) * | 1979-04-13 | 1980-10-28 | Mitsubishi Electric Corp | Cleaning method for semiconductor producing device |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03202327A (en) * | 1989-12-28 | 1991-09-04 | Toowa Kk | Cleaning process of mold face for molding resin, sheet member for cleaning used in same process and continuous automatic resin-molding process |
| KR100518745B1 (en) * | 1998-06-30 | 2005-12-02 | 삼성전자주식회사 | Leadframe for cleaning mold press |
| US6565419B1 (en) | 1999-02-05 | 2003-05-20 | Advantest Corporation | Method of removing particles from stage and cleaning plate |
| KR100855048B1 (en) * | 2000-08-04 | 2008-08-29 | 가부시키가이샤 히타치세이사쿠쇼 | Mold cleaning sheet and method of producing semiconductor devices using the same |
| KR100788769B1 (en) * | 2000-08-04 | 2007-12-31 | 가부시키가이샤 히타치세이사쿠쇼 | Mold cleaning sheet and method of producing semiconductor devices using the same |
| US7384582B2 (en) | 2000-08-04 | 2008-06-10 | Renesas Technology Corp. | Mold cleaning sheet and method for producing semiconductor devices using the same |
| KR100847320B1 (en) * | 2000-08-04 | 2008-07-21 | 가부시키가이샤 히타치세이사쿠쇼 | Mold cleaning sheet and method of producing semiconductor devices using the same |
| WO2002011966A1 (en) * | 2000-08-04 | 2002-02-14 | Hitachi, Ltd. | Mold cleaning sheet and method of producing semiconductor devices using the same |
| US7572398B2 (en) | 2000-08-04 | 2009-08-11 | Renesas Technology Corp. | Mold cleaning sheet and method of producing semiconductor devices using the same |
| US7837908B2 (en) | 2000-08-04 | 2010-11-23 | Renesas Electronics Corporation | Mold cleaning sheet and method of producing semiconductor devices using the same |
| US8070992B2 (en) | 2000-08-04 | 2011-12-06 | Renesas Electronics Corporation | Mold cleaning sheet and method of producing semiconductor devices using the same |
| US7537967B2 (en) | 2001-05-18 | 2009-05-26 | Renesas Technology Corp. | Mold cleaning sheet and manufacturing method of a semiconductor device using the same |
| US7943432B2 (en) | 2001-05-18 | 2011-05-17 | Renesas Electronics Corporation | Mold cleaning sheet and manufacturing method of a semiconductor device using the same |
| US7429342B2 (en) * | 2001-08-15 | 2008-09-30 | Advanced Semiconductor Engineering, Inc. | Method for cleaning and regenerating a mold |
| KR100403132B1 (en) * | 2001-12-28 | 2003-10-30 | 동부전자 주식회사 | mold cavity bar for manufacturing a semiconductor package |
| JP2009010084A (en) * | 2007-06-27 | 2009-01-15 | Sumitomo Heavy Ind Ltd | Resin sealing device |
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