JPH01500235A - Parallel airflow device for cooling electronic equipment - Google Patents

Parallel airflow device for cooling electronic equipment

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Publication number
JPH01500235A
JPH01500235A JP62503796A JP50379687A JPH01500235A JP H01500235 A JPH01500235 A JP H01500235A JP 62503796 A JP62503796 A JP 62503796A JP 50379687 A JP50379687 A JP 50379687A JP H01500235 A JPH01500235 A JP H01500235A
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Japan
Prior art keywords
card
duct
parallel
airflow system
cooling air
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Granted
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JP62503796A
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Japanese (ja)
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JPH0760955B2 (en
Inventor
スミス，グラント・メリル
ロウメイニャ，サミュエル・リチャード
ギブズ，ロナルド・トマス
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ユニシス・コーポレーション
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Publication of JPH01500235A publication Critical patent/JPH01500235A/en
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20554—Forced ventilation of a gaseous coolant
    • H05K7/20572—Forced ventilation of a gaseous coolant within cabinets for removing heat from sub-racks, e.g. plenum
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S165/00—Heat exchange
    • Y10S165/908—Fluid jets

Abstract

(57)【要約】本公報は電子出願前の出願データであるため要約のデータは記録されません。 (57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 大型コンピュータシステムのような電子機器に対する熱設計上の考慮すべきこと は、性能、コスト、信頼性および低価格保守に対する主要な関心を含む。実際に 、一方における性能要件が他方における残余の関心事と比較検討される。簡略化 を特徴としながら、電子機器の適当な冷却を提供する能力を有するシステムは熱 問題に対する最良の解決を意味する。空気冷却は一般に最も簡単で信頼できるシ ステムとみなされている。しかしながら、コンピュータカードにおける出力密度 が絶えず増加するにつれて、空気で冷却することはますます困難になっている。[Detailed description of the invention] Thermal design considerations for electronic equipment such as large computer systems includes primary concerns for performance, cost, reliability and affordable maintenance. actually , performance requirements on one side are weighed against residual concerns on the other side. Simplification The system has the ability to provide adequate cooling for electronic equipment while means the best solution to a problem. Air cooling is generally the simplest and most reliable system. It is considered a stem. However, the power density in computer cards cooling with air is becoming more and more difficult as

典型的な強制空冷機構では、コンピュータカードにわたってカードの平坦な表面 に平行な方向に空気が吹込まれる。In a typical forced air cooling scheme, the flat surface of the card is Air is blown in a direction parallel to.

空気がカードを渡って移動すると、それはその上に装設された集積回路パッケー ジから連続する態様で熱を拾い上げ、空気は温度が高まる。カードの出力レベル の上昇に伴って、空気の温度上昇が容認できるレベルを超えないようにするため に大量の空気が必要とされる。As air moves across the card, it blows away the integrated circuit package mounted on top of it. The air picks up heat in a continuous manner from the air, increasing its temperature. Card output level To ensure that the temperature rise of the air does not exceed an acceptable level with the rise of requires a large amount of air.

集積回路パッケージの出力および寸法の増加により、冷却問題はさらに悪化され ている。すぐ前に言及された装置の高出力レベルは平均的な局所温度の上昇より も高くなる。Cooling problems are further exacerbated by the increasing power and size of integrated circuit packages. ing. The high power levels of the devices just mentioned are greater than the average local temperature rise. It also becomes more expensive.

高温の空気の各ボケ！トは空気流により次のパッケージへと向けられる。また、 装置が物理的に大きくなるにつれて、それらは下流方向のパッケージから冷却空 気の流れを遮る傾向にある。先はど言及された熱効果のせいで、すべてのパッケ ージが高温で低速度の空気の下流方向の後流を形成する。今日の電子機器の高密 度パッケージングに伴って、下流方向のパッケージがこの後流に直接式ることは 明白である。さらに、これら熱効果は、集積回路パッケージの物理的寸法および 出力散逸の増加に比例して制御するのがより困難になっている。結果的に、新規 なコンピュータ設計の用途では、パッケージおよびカードの出力レベルは、上で 説明された連続的に方向づけられる空気流により与えられることが当然期待され る冷却を圧倒し得る。そのような場合、そのようなシステムの複雑さおよびコス トの増加および信頼性の低下にもかかわらず、水によるアプローチを採用するも ののような、あまり普通でない冷却システムが考慮され得る。Every blur of hot air! The airflow directs the waste to the next package. Also, As devices become physically larger, they require cooling air from downstream packages. It tends to block the flow of air. Due to the thermal effects mentioned earlier, all packages The surge creates a downstream wake of hot, low velocity air. The high density of today's electronic devices Due to the degree of packaging, downstream packages are not directly attached to this wake. It's obvious. Additionally, these thermal effects are related to the physical dimensions and As power dissipation increases, it becomes proportionally more difficult to control. As a result, new In typical computer design applications, package and card power levels should be would naturally be expected to be provided by the continuously directed airflow described. cooling can be overwhelmed. In such cases, the complexity and cost of such systems Adopting a water approach despite increasing costs and decreasing reliability Less conventional cooling systems may be considered, such as.

望ましいのは、冷却媒体として空気を使用するが、今日の高密度電子機器で容認 できる温度レベルを維持するというその能力において従来のアプローチとは異な る冷却システムである。この発明の平列空気流システムはそのような要求を満た す。Using air as the cooling medium is preferable but acceptable in today's high-density electronic equipment. differs from traditional approaches in its ability to maintain temperature levels that can It is a cooling system that The parallel airflow system of this invention satisfies such requirements. vinegar.

発明の概要 この発明に従って、個々の放出口から複数個のそれぞれの集積回路パッケージへ と同時に冷却空気を向けるための配置が提供される。後者のパッケージは冷却効 果を高めるために、一般にその上に配置されるヒートシンク部材を利用する。Summary of the invention In accordance with the present invention, from an individual outlet to a plurality of respective integrated circuit packages. At the same time an arrangement is provided for directing the cooling air. The latter package has a cooling effect. To enhance the performance, a heat sink member is commonly disposed thereon.

先に述べられた配置は、平行で、間隔を隔てた関係で配置されるプリント回路基 板すなわちカードと通風構造の必須のアセンブリを含む。より具体的に言うと、 カードは、その上にヒートシンクが装設され、かつ平行で間隔を隔てた列状に配 置された複数個の集積回路パッケージを含む。The previously described arrangement includes printed circuit boards arranged in a parallel, spaced relationship. Includes the required assembly of plates or cards and ventilation structures. More specifically, The cards have heat sinks mounted on them and are arranged in parallel, spaced rows. The integrated circuit package includes a plurality of integrated circuit packages located in the same place.

通風構造は、集積回路パッケージの列と一致するように配置される、複数個の指 状のダクトへと通じるカード・ブレナムを含む。ダクトの各々は複数個の放出口 、すなわちそこに形成されるアパーチャを有し、これらアパーチャはパッケージ に関して一致して位置決めされる。The ventilation structure consists of a plurality of fingers arranged to coincide with the rows of the integrated circuit package. Contains a card blennium leading to a shaped duct. Each duct has multiple outlets , i.e. has apertures formed therein, and these apertures are are positioned coincidentally with respect to each other.

実際の動作環境では、この発明のカード−ダクトアンセンブリを保持するための ラックを有するキャビネットが設けられる。キャビネットの底部に設置される送 風機スクロールは、中央キャビネット・ブレナムに送られる、高速の大量冷却空 気流の源を備えている。それぞれのカード−ダクトアセンブリの個々のカード会 ブレナムは気密にされる態様で中央ブレナムと界面を作る。このように、送風機 スクロールからの空気は指状のダクトへと移動し、そこのアパーチャを出て、個 々のヒートシンク部材のそれぞれの表面に向けられる。In an actual operating environment, the card-duct assembly of the present invention may be A cabinet having a rack is provided. The feeder installed at the bottom of the cabinet. The wind scrolls provide high-velocity, high-volume cooling air to the central cabinet blenheim. It has a source of airflow. Individual card association for each card-duct assembly The blennium interfaces with the central blennium in an airtight manner. In this way, the blower Air from the scroll moves into the finger-like ducts, exits through apertures there, and enters the individual each heat sink member.

これまでに言及された従来の直列空気冷却機構と比べて、この並列システムは大 いに重要な利点を提供しており、その主要なものは、高出力カードが空気で冷却 され得るということである。またこのシステム：；、カードラック中のすべての 集積回路パッケージが送風機の注入口の空気温度で冷却空気を受取ると同時に、 パッケージ間の温度差が最小にされることを確実にする。このシステムはまた散 逸された出力の１ワツトあたり、より低量の空気流しか必要とせず、さらに平均 的な装置温度は直列空気システムで達成され得るものよりも低い。Compared to the conventional series air cooling mechanisms mentioned so far, this parallel system The main advantage is that high-power cards can be cooled with air. This means that it can be done. Also this system:;, all the cards in the card rack As the integrated circuit package receives cooling air at the blower inlet air temperature, Ensure that temperature differences between packages are minimized. This system also Requires less air flow per watt of power dissipated, and average equipment temperatures are lower than can be achieved with series air systems.

この発明の重要な特徴は、カードの各々にそのアセンブリの必須部分としてそれ 自体の冷却システムが設けられることである。各カード−ダクトアセンブリは形 がコンパクトで、そのため多数のそのようなアセンブリが互い緊密にバックされ た関係でキャビネット内に装設され得る。カードラックからのカード−ダクトア センブリの取付けおよび除去は、残余のアセンブリを掻き乱さずに容易に達成さ れる。この発明の他の特徴および利点は後に続くこの発明の詳細な説明から明ら かとなるであろう。An important feature of this invention is that each of the cards has a It is to be provided with its own cooling system. Each card-duct assembly is shaped like is compact, so many such assemblies can be closely backed together. It can be installed in the cabinet in a similar manner. Cards from card rack - duct door Installation and removal of the assembly is easily accomplished without disturbing the remaining assembly. It will be done. Other features and advantages of the invention will be apparent from the detailed description of the invention that follows. It will be.

図面の簡単な説明 第１図はこの発明の並列空冷システムを例示する図である。Brief description of the drawing FIG. 1 is a diagram illustrating a parallel air cooling system of the present invention.

第２図は第１図のシステムのカード−ダクトアセンブリの部分的側面図である。2 is a partial side view of the card-duct assembly of the system of FIG. 1; FIG.

ｊｆ！３図は、集積回路パッケージに隣接して配置される空気放出口を有するダ クトの表面を例示する、第２図の線３−３に沿って破断された断面図である。jf! Figure 3 shows a semiconductor device having an air outlet located adjacent to an integrated circuit package. 3 is a cross-sectional view taken along line 3-3 of FIG. 2 illustrating the surface of the duct; FIG.

第４図は集積回路パッケージをその付随のヒートシンク部材とともに描いた分解 図である。Figure 4 shows an exploded view of the integrated circuit package with its associated heat sink components. It is a diagram.

好ましい実施例の詳細な説明 第１図はこの発明の並列冷却システムの実際の動作環境を描いている。キャビネ ット１０は複数個のカード−ダクトアセンブリ１４を含むカードラック１２を例 示するためにその外壁が部分的に切取られて示されている。モータ１８により駆 動され、キャビネット１０の底部に設置される１対の送風機スクロール１６は周 囲の空気をルーバ２０を介してキャビネット内に引込む。このように、大量の動 きの速い空気流がスクロールにより中央ブレナム２２に届けられる。DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS FIG. 1 depicts an actual operating environment for the parallel cooling system of the present invention. cabinet 10 is an example of a card rack 12 that includes a plurality of card-duct assemblies 14. Its outer wall is shown partially cut away for illustrative purposes. Driven by motor 18 A pair of blower scrolls 16 installed at the bottom of the cabinet 10 are Ambient air is drawn into the cabinet through the louver 20. In this way, large amounts of movement A fast air stream is delivered to the central blenheim 22 by the scroll.

引き続き第１図を概略しさらに第２図および第３図をより具体的に参照すると、 カードラック１２に装設されるカード−ダクトアセンブリ１４の各々は、カード ・ブレナム２６ａと開いてそこに入り込む複数個の指状のダクト２６ｂとを有す る通風構造２６に堅固に固定されるプリント回路基板すなわちカード２４からな る。特に第２図で見られるように、各カード２４およびその関連する通風構造２ ６は近接し、平行で、間隔を隔てられた関係で実質的にＵ字形部材２８により保 持されている。さらに、部材２８の各々の一方の脚は延長されて、ラック支持チ ャネル３０の各々で溝に係合する。各カード−ダクトアセンブリ１４は中央ブレ ナム２２の外部表面上に装設されるチャネル３４の各々でその溝に係合するため の突起３２をさらに含む。各カードの電気接続はそれぞれカード−ダクトアセン ブリ１４およびキャビネットの背面３８上に装設されるコネクタ特に第１図およ び第２図に見られるように、カード２４の各々はそれぞれのヒートシンク部材４ ２が取付けられた複数個の集積回路パッケージ４０がその上に装設されている。Continuing to refer generally to FIG. 1 and more specifically to FIGS. 2 and 3, Each of the card-duct assemblies 14 installed in the card rack 12 includes a card - It has a blemish 26a and a plurality of finger-like ducts 26b that open and enter there. A printed circuit board or card 24 is rigidly secured to a ventilation structure 26. Ru. As seen in particular in FIG. 2, each card 24 and its associated ventilation structure 2 6 are held in close, parallel, spaced relationship by substantially U-shaped members 28. held. Additionally, one leg of each member 28 is extended to provide a rack support base. A groove is engaged in each of the channels 30. Each card-duct assembly 14 has a central block. for engaging a groove in each of the channels 34 disposed on the external surface of the numer 22; It further includes a protrusion 32 . Electrical connections for each card are made in separate card-duct assemblies. The connectors installed on the bridge 14 and the rear surface 38 of the cabinet, especially those shown in FIG. 2, each of the cards 24 has a respective heat sink member 4. A plurality of integrated circuit packages 40 with 2 mounted thereon are mounted thereon.

パッケージ４０は一般に、隣接する指状ダクト２６ｂの配置と一致する列で配置 される。第３図に見られるように、後者のダクトの各々は複数個のアパーチャ４ ４がそこに形成され、これらアパーチャ４４はヒートシンク部材４２に関して一 致して配置される。Packages 40 are generally arranged in rows that match the arrangement of adjacent duct fingers 26b. be done. As seen in FIG. 3, each of the latter ducts has a plurality of apertures 4 4 are formed therein, and these apertures 44 are aligned with respect to the heat sink member 42. It will be placed accordingly.

動作において、スクロール１６（第１図）は中央ブレナム２２に冷却空気を送る 。後者から、空気が中央ブレナム２２のスロット４６を介してカード・ブレナム ２６ａの開口へと押し込まれる。この空気が指状ダクト２６ｂの各々を通過する と、個々の空気流はアパーチャ４４（第３図）を介して集積回路パッケージ４０ のそれぞれのヒートシンク部材４２上に向けられる。次に熱せられた空気はキャ ビネット１０の上方部分の開口４８を介してそこを出る。In operation, the scroll 16 (FIG. 1) directs cooling air to the central brenum 22. . From the latter, air passes through slots 46 in the central blenheim 22 to the card blenheim. It is pushed into the opening of 26a. This air passes through each finger duct 26b. and individual airflows to integrated circuit package 40 through apertures 44 (FIG. 3). are directed onto their respective heat sink members 42 . Next, the heated air It exits the vignette 10 through an opening 48 in the upper part.

慣例通り、パッケージ４０で発生された熱をより良好に散逸させるためにヒート シンク部材４２が使用される。一般に、ヒートシンクの型式および形状はかなり 変わる。この発明が第４図に描かれたヒートシンク４２に限られると考えられる べきではないが、後者の構造はこのシステムに適している。したがって、ヒート シンク部材４２の各々は、開口５０により分離されかつフレーム５２内に支持さ れる１対の金属製波形セクション４２ａを含む。指状ダクト２６ｂのアパーチャ ４４を出る冷却空気はヒートシンク４２の開口５０に入る傾向があり、続いてセ クション４２ａによりヒートシンクを渡って反対方向に搬送され、その際それは 後者を出る。As is customary, heat is used to better dissipate the heat generated in the package 40. A sink member 42 is used. In general, the type and shape of the heat sink is quite change. It is believed that the invention is limited to the heat sink 42 depicted in FIG. Although it should not, the latter structure is suitable for this system. Therefore, heat Each of the sink members 42 is separated by an opening 50 and supported within a frame 52. It includes a pair of corrugated metal sections 42a. Aperture of finger duct 26b Cooling air exiting 44 tends to enter opening 50 in heat sink 42 and then into the is transported in the opposite direction across the heat sink by means of a section 42a, whereupon it Exit the latter.

指状ダクト２６ｂの設計に関して、第１図を参照するとダクトの断面が一定であ るよりはむしろ段差をつけられていることが明らかになる。すなわち、ダクト２ ６ｂの断面はカード・ブレナム２６ａに隣接するその最端部で最大であり、ダク トのほぼ中点まで段階的に減少する。ダクト２６ｂは後者の点からその反対の最 端部まで最小の断面を有する。指状ダクトに段差がつｊすられている理由は、こ の形状が最小ブレナム圧力でかつダクトに沿って成るアパーチャ４４から別なも のまで最小の変化で最高合計空気流量をもたらすことである。逆に言えば、一定 の断面のダクトは高いブレナム圧力を必要とし、さらに個々の空気流でかなりの 変化が現われる。たとえば、均一な断面のダクトのカード・ブレナム２６ａに近 いアパーチャ４４からは低い流量しか出ず、そのような低流量はそれに関連する 集積回路パッケージ４０に不適当な冷却をもたらす。要約すると、このシステム では段差のついた断面のダクト２６ｂが好ましく、その理由は、すべてのアパー チャ４４にわたって均一な圧力差を維持するにはそれが一定の断面よりも勝れて いるからである。Regarding the design of the finger-shaped duct 26b, referring to FIG. 1, the cross section of the duct is constant. It becomes clear that they are being stepped up rather than moved. That is, duct 2 The cross-section of 6b is greatest at its extreme end adjacent to card blennium 26a, and the duct gradually decreases to approximately the midpoint of the peak. The duct 26b runs from the latter point to its opposite end. Has the smallest cross section to the ends. The reason why there is a step in the finger duct is this. The shape of the aperture 44 is different from that at the minimum Blenheim pressure and along the duct. The goal is to provide the highest total air flow rate with the least amount of change. Conversely, constant ducts with a cross section require high Blenheim pressures and even significant Change appears. For example, near a card brenum 26a of a duct with a uniform cross section. Only a low flow rate exits from the small aperture 44, and such low flow rate is associated with This results in inadequate cooling of the integrated circuit package 40. In summary, this system Therefore, the duct 26b with a stepped cross section is preferable, and the reason is that all the apartments To maintain a uniform pressure difference across the chamber 44, it is better than a constant cross section. Because there is.

この発明の別な重要な特徴は、アパーチャ４４によりもたらされる個々の量の冷 却空気がそれぞれの集積回路パッケージ４０の出力散逸に従って選択され得るこ とである。Another important feature of the invention is that the discrete amount of cooling provided by aperture 44 is The cooling air may be selected according to the power dissipation of each integrated circuit package 40. That is.

したがって、第２図および第３図で見られるように、パッケージ４０ａは他のパ ッケージよりも高い出力型であると推測される。したがって、アパーチャ４４ａ は他より大きく、パッケージ４０ａに収納されたチップを他のパッケージ内のチ ップと実質的に同じ温度まで冷却するのに必要とされる量の空気を提供する。Therefore, as seen in FIGS. 2 and 3, package 40a is It is assumed that the output type is higher than that of the package. Therefore, the aperture 44a is larger than the others, and the chip housed in the package 40a is Provide the amount of air required to cool the cup to substantially the same temperature as the cup.

結論として、高密度電子パッケージング用途の有効な空冷システムが説明されて きた。特定の状況に基づいて、ここで説明されたようなシステムの変更および修 正が必要とされ得ることは明らかである。そのような変更および修正は、それら がこの発明の真の範囲から逸脱しない限り、後に続く請求の範囲により包含され ることが意図されている。In conclusion, an effective air cooling system for high-density electronic packaging applications is described. came. Based on your specific situation, you may be required to make system changes and repairs such as those described here. It is clear that positive changes may be required. Such changes and modifications shall shall be encompassed by the following claims insofar as they do not depart from the true scope of this invention. It is intended that

国際調査報告 一１蘭−＾ｗｃＪｂ＃１ＩＩＬ　”Ｃ：！：ＡメＲ７１０１３３５international search report 11ran-^wcJb#1IIL”C:!:AmeR7101335

Claims (10)

【特許請求の範囲】[Claims] １．冷却空気の源を有するキャビネットに配置される並列空気流システムが プリント回路カードおよび関連する通風構造を含む少なくとも１個のカード−ダ クトアセンブリと、前記カードおよび前記通風構造を固定され、並列で、間隔を 隔てられた関係で保持するための手段とを含み、 前記カードは複数個の集積回路パッケージアセンブリが予め定められた間隔が隔 てられた列状の関係でその上に装設され、前記通風構造は前記パッケージアセン ブリの列状配置と空間的に対応して配置される複数個の指状ダクトを含み、前記 ダクトの各々は複数個のアパーチャが前記パッケージアセンブリに関して一致し て位置決めされ、さらに冷却空気の前記源を含んで前記ダクトへ入りかつ前記ア パーチャから出る空気流を引き起こすための手段を含み、それにより冷却空気の 個々の流れを同時にそれぞれのパッケージアセンブリに向ける、並列空気流シス テム。1. A parallel airflow system placed in a cabinet with a source of cooling air at least one card-adapter including a printed circuit card and associated ventilation structure; with the card and the ventilation structure fixed, parallel, and spaced apart. and means for holding in separated relationship; The card includes a plurality of integrated circuit package assemblies spaced apart at predetermined intervals. and the ventilation structure is mounted on the package assembly in a parallel row relationship. a plurality of finger-like ducts arranged spatially corresponding to the row-like arrangement of the yellowtails; Each of the ducts has a plurality of apertures aligned with respect to the package assembly. and further including said source of cooling air entering said duct and said source of cooling air. including means for inducing airflow exiting the percha, thereby causing cooling air to flow out of the percha; Parallel airflow system that directs individual flows to each package assembly simultaneously Tem. ２．前記集積回路パッケージアセンブリの各々が集積回路パッケージに取付けら れるヒートシンク部材を含む、請求の範囲第１項に記載の並列空気流システム。2. Each of the integrated circuit package assemblies is attached to an integrated circuit package. 2. A parallel air flow system as claimed in claim 1, including a heat sink member. ３．前記ダクト内への空気流を引き起こすための前記手段が中央プレナムを含ん でそれの前記源から冷却空気を受取り、前記中央プレナムが各カードーダクトア センブリのためにそこにスロット状の開口を有し、前記通風構造がカード・プレ ナムを含み、前記カード・プレナムが前記ダクトへ入るそれぞれの開口と前記中 央プレナムに後者の前記スロット状の閉口を介して入るさらなる開口を有する、 請求の範囲第２項に記載の並列空気流システム。3. the means for causing airflow into the duct includes a central plenum; The central plenum receives cooling air from the source at each card duct door. The ventilation structure has a slot-like opening there for the card assembly. the card plenum includes a respective opening into the duct and a respective opening into the duct; having a further opening entering the central plenum via said slot-like closure of the latter; Parallel airflow system according to claim 2. ４．前記指状ダクトの各々が段差のついた断面を示し、ダクトの断面が前記カー ドプレナムと隣接するその最端部で最大であり、かつその反対の最端部で最小で あり、ダクトのそれぞれのアパーチャでの空気の流量が実質的に等しいことをさ らに特徴とする、請求の範囲第３項に記載の並列空気流システム。4. Each of the finger-shaped ducts exhibits a stepped cross-section, and the cross-section of the duct is It is maximum at its extreme end adjacent to the doplenum and minimum at its opposite end. Yes, and ensure that the air flow rate at each aperture in the duct is substantially equal. 4. A parallel airflow system according to claim 3, further characterized in: ５．ラックをさらに含み、チャネル手段がそれぞれ前記ラックと前記中央プレナ ムの表面に互いに向かい合って配置され、前記カード−ダクトアセンブリが前記 チャネル手段に係合するための手段を含み、前記カード−ダクトアセンブリが前 記キャビネット内に摺動可能に取付けられ得る、請求の範囲第４項に記載の並列 空気流システム。5. further comprising a rack, with channel means respectively connecting said rack and said central planar. the card-duct assemblies are disposed opposite each other on a surface of the system; means for engaging the channel means, the card-duct assembly being 4. The parallel arrangement according to claim 4, which can be slidably mounted within the cabinet. airflow system. ６．背面をさらに含み、少なくとも１個の電気コネクタが前記背面上に取付けら れ、前記カードは少なくとも１個の電気コネクタがその上に装設されて前記カー ド−ダクトアセンブリが前記キャビネット内に摺動可能に取付けられると前記背 面上の前記電気コネクタと係合する、請求の範囲第５項に記載の並列空気流シス テム。6. further comprising a back surface, and at least one electrical connector mounted on the back surface. and the card has at least one electrical connector mounted thereon to connect the card to the card. When the duct assembly is slidably mounted within the cabinet, the 6. A parallel air flow system according to claim 5 engaging said electrical connector on a surface. Tem. ７．前記ヒートシンク部材がフレームからなり、１対の金属製の波形セクション がそれらの間で開口が形成されるような間隔を隔てられた態様で前記フレームに 装設され、前記アパーチャから発出される冷却空気の前記流れの各々が実質的に 前記ヒートシンク部材のすぐ前に言及された開口の方に向けられる、請求の範囲 第６項に記載の並列空気流システム。7. The heat sink member comprises a frame, a pair of metal corrugated sections. to said frame in a spaced-apart manner such that an opening is formed between them. each of said streams of cooling air disposed and emanating from said aperture substantially Claims directed towards the mentioned opening immediately in front of said heat sink member Parallel airflow system according to clause 6. ８．前記カードおよび前記通風構造を固定され、並列で、間隔が隔てられた関係 で維持するための前記手段がＵ字形部材であることをさらに特徴とし、前記後者 の部材が前記ラック上の前記チャネル手段と係合するための長手の脚を有し、前 記カード−ダクトアセンブリが前記中央プレナムの表面上の前記チャネル手段に 係合するための突起を有する、請求の範囲第７項に記載の並列空気流システム。8. the card and the ventilation structure in a fixed, parallel, spaced relationship; further characterized in that said means for maintaining said latter is a U-shaped member; a member having elongate legs for engaging said channel means on said rack; A card-duct assembly is connected to the channel means on the surface of the central plenum. 8. A parallel airflow system according to claim 7, having projections for engagement. ９．前記ダクトの各々の断面が前記カード・プレナムに隣接するその最端部で最 大でありかつダクトのほぼ中点まで段階的に減少し、すぐ前に言及された点から その反対の最端部まで最小である、請求の範囲第８項に記載の並列空気流システ ム。9. The cross-section of each of said ducts terminates at its extreme end adjacent said card plenum. large and gradually decreasing to approximately the midpoint of the duct, from the point just mentioned A parallel airflow system according to claim 8, which is minimal to its opposite extreme. Mu. １０．指状ダクトの段差のついた断面が矩形である、請求の範囲第９項に記載の 並列空気流システム。10. Claim 9, wherein the stepped cross-section of the finger-like duct is rectangular. Parallel airflow system.
JP62503796A 1986-07-03 1987-06-08 Parallel airflow device for cooling electronics Expired - Fee Related JPH0760955B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US881,725 1986-07-03
US06/881,725 US4674004A (en) 1986-07-03 1986-07-03 Parallel-flow air system for cooling electronic equipment
PCT/US1987/001335 WO1988000429A1 (en) 1986-07-03 1987-06-08 Parallel-flow air system for cooling electronic equipment

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JPH01500235A true JPH01500235A (en) 1989-01-26
JPH0760955B2 JPH0760955B2 (en) 1995-06-28

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JP (1) JPH0760955B2 (en)
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WO (1) WO1988000429A1 (en)

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EP0274486A1 (en) 1988-07-20
US4674004A (en) 1987-06-16
DE3788715T2 (en) 1994-04-28
DE3788715D1 (en) 1994-02-17
WO1988000429A1 (en) 1988-01-14
EP0274486B1 (en) 1994-01-05
JPH0760955B2 (en) 1995-06-28

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