JPH01308038A - Feeding of solder - Google Patents
Feeding of solderInfo
- Publication number
- JPH01308038A JPH01308038A JP13911488A JP13911488A JPH01308038A JP H01308038 A JPH01308038 A JP H01308038A JP 13911488 A JP13911488 A JP 13911488A JP 13911488 A JP13911488 A JP 13911488A JP H01308038 A JPH01308038 A JP H01308038A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- plate
- sheet
- input
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 104
- 238000000034 method Methods 0.000 claims abstract description 38
- 239000004065 semiconductor Substances 0.000 claims abstract description 21
- 238000010438 heat treatment Methods 0.000 claims abstract description 10
- 239000000758 substrate Substances 0.000 claims description 4
- 238000007493 shaping process Methods 0.000 claims 1
- 238000005476 soldering Methods 0.000 abstract description 11
- 230000006835 compression Effects 0.000 abstract description 7
- 238000007906 compression Methods 0.000 abstract description 7
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 4
- 238000005553 drilling Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】 〈産業上の利用分野〉 本発明は半導体装に於ける、半田供給方法に関する。[Detailed description of the invention] <Industrial application field> The present invention relates to a method for supplying solder in semiconductor devices.
〈従来の技術〉
一般に半導体素子（チップ）部品を基板に実装する際、
その接続方法の主流は半田付である。 この半田付方法
には予備半田方法、半田溶融接続方法があり、この両者
を１回で兼用して行うフロー半田付方法がある。<Conventional technology> Generally, when mounting semiconductor element (chip) parts on a board,
The mainstream connection method is soldering. This soldering method includes a preliminary soldering method and a solder fusion connection method, and there is a flow soldering method that combines both of these methods at one time.
このフロー半田付方法は、まず予備半田として■半田浸
漬、■噴流半田付け、■半田ペースト、■半田めっぎ、
■半田蒸着、■成形半田（シート、ボール状）等を行な
い、
接続方法として、全面加熱、局部加熱等があり、被接着
体の材質、物性、接続部の大きさ等に応じ、各々の方法
が用いられている。This flow soldering method begins with preliminary soldering: ■ solder dipping, ■ jet soldering, ■ solder paste, ■ solder plating, and
■Solder vapor deposition, ■molded solder (sheet, ball shape), etc. are performed, and connection methods include whole surface heating, local heating, etc., and each method is selected depending on the material and physical properties of the object to be bonded, the size of the connection part, etc. is used.
〈発明が解決しようとする課題〉
従来、前記接続において、特に集積度の高いものは、一
つ一つ、１ケ所毎に半田を供給する方法が採られている
。<Problems to be Solved by the Invention> Conventionally, in the above-mentioned connections, especially those with a high degree of integration, a method has been adopted in which solder is supplied to each location one by one.
しかし、この方法では時間と手間が掛り、ましてや単位
面積あたりの半導体素子数が多くなればなるほど大変な
作業となる。However, this method requires time and effort, and the work becomes more difficult as the number of semiconductor elements per unit area increases.
例えば１０〜２０ｍｍ四方の半導体集積回路（ＩＣ）パ
ッケージで入出力端子部の数が４００〜５００以上とい
うのも多々あり、高速の自動機械であっても相当時間が
かかる。 また半田自体極めて小さく、その配設間隔も
極めて小さく自動機械としても高速かつ高精度のハンド
リングが可能なものが要求され、何よりも多大な費用が
掛る。For example, a semiconductor integrated circuit (IC) package measuring 10 to 20 mm square often has 400 to 500 or more input/output terminals, and it takes a considerable amount of time even for high-speed automatic machines. Furthermore, the solder itself is extremely small, and the spacing between the solders is also extremely small, requiring an automatic machine that can handle at high speed and with high precision, and most of all, it costs a lot of money.
そこで、本発明は半導体素子を基板に実装する際、自動
機械を使用しなくても作業性が容易でかつ費用があまり
かからない、半田供給方法を提供することを目的とする
。SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a solder supply method that is easy to work with and does not require much cost without using an automatic machine when mounting a semiconductor element on a substrate.
く課題を解決するための手段〉
本発明者は、前記目的を解決すべく、半導体素子の基板
への実装に用いられる半田を前記半導体素子の入出力端
子部分へ供給するに際し、予め、前記入出力端子部分に
対応する位置に所定の形状の孔部を有する半田供給板に
、所定量の半田シートを前記孔部に搭載し、前記半田シ
ートを加熱によりボール状に成形した後、前記半田供給
板を前記半導体素子の入出力端子部分に加熱接合させ、
前記入出力端子部分に前記半田を凸状に転写することを
特徴とする半田供給方法を提供する。Means for Solving the Problem> In order to solve the above object, the present inventor has provided the above-mentioned information in advance when supplying solder used for mounting a semiconductor element onto a substrate to an input/output terminal portion of the semiconductor element. A predetermined amount of solder sheet is mounted on a solder supply plate having a predetermined-shaped hole at a position corresponding to the output terminal portion, and after forming the solder sheet into a ball shape by heating, the solder is supplied. heating and bonding the plate to the input/output terminal portion of the semiconductor element;
A solder supply method is provided, characterized in that the solder is transferred to the input/output terminal portion in a convex shape.
以下、本発明の半田供給方法を添付の図面に示す好適実
施例に基づいて、具体的に説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS The solder supply method of the present invention will be specifically described below based on preferred embodiments shown in the accompanying drawings.
第１図は本発明に係る半田供給方法を実施する半田供給
装置の一構成例を示す概略断面図である。FIG. 1 is a schematic cross-sectional view showing an example of the configuration of a solder supply device that implements a solder supply method according to the present invention.
同図に示すように、半田供給装置は受台４と、受台４上
に載置され、半田供給用孔部６を有する半田供給板３と
、半田供給板３に供給された半田シート２を孔部６に圧
入する圧縮板１と有している。As shown in the figure, the solder supply device includes a pedestal 4, a solder supply plate 3 placed on the pedestal 4 and having a solder supply hole 6, and a solder sheet 2 supplied to the solder supply plate 3. The compression plate 1 is press-fitted into the hole 6.
本発明に用いられる半田供給板３は半導体素子の入出力
端子部分すなわち電極に対応する位置に孔部６を有する
ものである。 孔部６は半導体素子の電極に対応してい
ればよく、その数および大きさは特に限定されない。The solder supply plate 3 used in the present invention has holes 6 at positions corresponding to input/output terminal portions, ie, electrodes, of a semiconductor element. The holes 6 only need to correspond to the electrodes of the semiconductor element, and their number and size are not particularly limited.
この半田供給板３は耐熱性に優れ、取り扱いが容易でま
た使用を重ねても孔部６に変形ゆがみなどが生じないも
のであればいかなるものを用いてもよいが、例えばステ
ンレス板（ＳＵＳ３０４）等を用いるのがよい。This solder supply plate 3 may be made of any material as long as it has excellent heat resistance, is easy to handle, and does not cause deformation or distortion in the holes 6 even after repeated use, such as a stainless steel plate (SUS304). It is better to use
次に半田供給板３に孔部６を開ける方法としては通常公
知の方法を用いればよく、機械的に開ける方法およびエ
ツチングによる方法、例えば機械的にボール盤、旋盤、
スライス盤等によ。Next, the holes 6 may be opened in the solder supply plate 3 by any known method, such as mechanical drilling, etching, mechanical drilling using a drilling machine, lathe, etc.
By slicing board etc.
り孔加工を行なえばよい。All you have to do is drill holes.
孔部６の形状は、半田シート２を好適に圧入でき、加熱
してボール状にした後、半導体素子の電極に好適に転写
できればいかなる形状でもよいが、第１図に示すように
先細の孔部、特にテーパ状円孔であるのが好ましい。The shape of the hole 6 may be any shape as long as the solder sheet 2 can be suitably press-fitted and that the solder sheet 2 can be suitably transferred to the electrode of the semiconductor element after being heated into a ball shape. Preferably, the hole is a tapered circular hole.
孔部６の大きさは半田供給の量によって適宜法められる
が、好ましくは５０〜２５０μｍ位が一般的な半導体素
子に適している。The size of the hole 6 is appropriately determined depending on the amount of solder supplied, but preferably about 50 to 250 μm is suitable for general semiconductor devices.
又、孔部の深さは１００〜３００μｍが適当であり、底
部はつぎ抜けていても、つき抜けていなくてもよいが、
好ましくはつき抜けた方がよい。 これは半田の充填率
を上げ、供給量の精度アップを図り、更には清掃を容易
にするためである。In addition, the appropriate depth of the hole is 100 to 300 μm, and the bottom may or may not be penetrated.
It is better to stick to it. This is to increase the filling rate of solder, improve the precision of the amount of solder supplied, and furthermore, to facilitate cleaning.
本発明の半田供給方法の第１工程は、半田供給板３を受
台４に設置し、半田シートを半田供給板の、孔部６に供
給することである。The first step of the solder supply method of the present invention is to install the solder supply plate 3 on the pedestal 4 and supply the solder sheet to the hole 6 of the solder supply plate.
この半田シート２はその形状および寸法において特に限
定されないが、厚さは０．１〜１．０ｍｍのものが好ま
しい。 また半田シートの切断は、シャー等を使いあら
かじめ供給板に合致した巾のシートを必要長にあわせ切
断してもよいし、長尺もののシートを直接供給板にいれ
プレスすることで必要長さ分だけ切断させてもよい。This solder sheet 2 is not particularly limited in its shape and dimensions, but preferably has a thickness of 0.1 to 1.0 mm. To cut the solder sheet, you can use a shear or the like to cut a sheet with a width that matches the supply plate in advance to the required length, or you can cut a long sheet directly to the supply plate and press it to the required length. You may also disconnect only the
半田供給板３上に半田シート２を置き、圧縮板１を用い
て半田シートの上から０．５〜５０ｋ ｇ ／ ｃ ｍ
２の力で圧縮し半田シート２から孔部６に対応する部
分を切断し、孔部６に半田を圧入する。Place the solder sheet 2 on the solder supply plate 3, and use the compression plate 1 to apply 0.5 to 50 kg/cm from the top of the solder sheet.
The solder sheet 2 is compressed with a force of 2 to cut the portion corresponding to the hole 6, and the solder is press-fitted into the hole 6.
圧縮板１を除いた後、孔部に挿入されなかった半田部分
を除く。After removing the compression plate 1, remove the solder portion that was not inserted into the hole.
尚、受台４は頑丈で耐熱性のよいものであればどのよう
なものでもよい。Note that the pedestal 4 may be of any type as long as it is sturdy and has good heat resistance.
第２図に示すように上記方法により半田シートが圧入さ
れた半田供給板３を取り出す。As shown in FIG. 2, the solder supply plate 3 into which the solder sheet was press-fitted by the above method is taken out.
次に、第２工程として第３図に示すように前記半田供給
板３を加熱して半田をボール状にする。Next, in a second step, as shown in FIG. 3, the solder supply plate 3 is heated to form the solder into a ball shape.
これは、加熱により、半田が溶融し、表面張力による為
である。 加熱は均熱炉、連続炉等を用い、半田の融点
まで温度を上げればよし）。This is because the solder melts due to heating and is caused by surface tension. For heating, use a soaking furnace, continuous furnace, etc., and raise the temperature to the melting point of the solder).
この場合、ボール状に容易にする為、あらかじめ孔部表
面には離型性をもたせた離型剤を塗布しておくと半田供
給板３と半田との接着を防ぎ、金型な保護する助けをす
る。ｌ！１型剤としては、金型への付着性、潤滑性等の
要件を満たす炭素系、塩素系潤滑剤等が適している。In this case, in order to make it easier to form into a ball, it is recommended to apply a mold release agent with mold releasability to the surface of the hole in advance to prevent the solder from adhering to the solder supply plate 3 and to help protect the mold. do. l! As the type 1 agent, a carbon-based or chlorine-based lubricant that satisfies requirements such as adhesion to the mold and lubricity is suitable.
本発明最終の第３工程として上記のようにしてボール状
半田を形成した半田供給板３を、第４図に示すように半
導体素子の入出力端子部分（電極）などの被供給部５に
接合し、位置決め後、入出力端子部に加熱によりバンブ
状に転写し引き上げる。As the third and final step of the present invention, the solder supply plate 3 on which the ball-shaped solder has been formed as described above is bonded to the supplied part 5 such as the input/output terminal part (electrode) of the semiconductor element, as shown in FIG. After positioning, it is transferred to the input/output terminal area in a bump shape by heating and pulled up.
圧縮板１の圧縮面は第１図のように平坦であってもよい
し、第５図のように孔部にあわせた凸部となっていても
よいが、第５図に示した圧縮板の方が半田シートを切る
働きを兼ねるために、本発明方法においては好適である
。The compression surface of the compression plate 1 may be flat as shown in FIG. 1, or may have a convex portion matching the hole as shown in FIG. This is preferable in the method of the present invention because it also serves to cut the solder sheet.
この場合も孔部に挿入されなかった半田部分は除く。In this case as well, the solder portion that has not been inserted into the hole is excluded.
尚、本発明は基本的には以上のように構成され、主とし
て精密な半田付、しかも小さな面の数多くの部分に同時
に正確に供給することを目的としているが、本発明はこ
れに限定されるわけではなく、例えばバッチタイプなど
の変形例、フープ材として連続的供給を行なう連続化可
能な応用例など、本発明の要旨を逸脱しない範囲におい
て種々の改良ならびに設計の変更が可能なことは勿論で
ある。The present invention is basically constructed as described above, and its main purpose is to perform precise soldering, and moreover, to accurately supply soldering to many parts of a small surface at the same time, but the present invention is limited to this. Of course, various improvements and changes in design are possible without departing from the gist of the present invention, such as modifications such as a batch type, and applications that can be continuously supplied as a hoop material. It is.
前述の半田供給板３に孔部６をあける方法の別の具体例
を以下に示す。Another specific example of the method for making the holes 6 in the solder supply plate 3 described above will be shown below.
半田供給板３の基板はシリコンウェーへの表面に５ｉｎ
２あるいは５ｔｓＮ４等の膜をＣＶＤで蒸着するとよい
。The substrate of the solder supply plate 3 is 5 inches on the surface of the silicon wafer.
A film such as 2 or 5tsN4 may be deposited by CVD.
この時シリコンウェー八とＳ ｉ ＯｘあるいはＳｉ３
Ｎ４の間にＩＴＯ液を塗布してもよい。At this time, silicon wafer 8 and SiOx or Si3
ITO liquid may be applied between N4.
５ｉ０２．Ｓｉｓ Ｎａ、ＩＴＯ等を用いるのは後にハ
ンダをボール状にして被供給部５に接合して引上げる時
、型離れが良いためである。5i02. The reason why Sis Na, ITO, etc. are used is that when the solder is later formed into a ball shape and joined to the supplied portion 5 and pulled up, it is easy to release the solder from the mold.
この他半田供給板３に半田供給のための孔部６を開ける
方法の一例としては、前述した基板にレジストで基板を
被覆保護しながら（ＣＦ＋Ｈ２）でドライエツチングを
行なう方法などもある。Another example of a method for opening the holes 6 in the solder supply plate 3 for supplying solder is to perform dry etching with (CF+H2) while covering and protecting the board with resist as described above.
こうして形成した孔部６に半田をつめ半田ボールを作る
こともできる。It is also possible to fill the hole 6 thus formed with solder to form a solder ball.
〈発明の効果〉
本発明の半田供給方法によれば従来の半導体素子（チッ
プ）部品を基板に実装する時の接続方法において、工程
が省略でき、効率化力く図れるので大幅なコスト低減が
可能である。<Effects of the Invention> According to the solder supply method of the present invention, steps can be omitted in the conventional connection method for mounting semiconductor element (chip) components on a board, and efficiency can be improved, resulting in a significant cost reduction. It is.
つまり、本発明方法のように半田供給板を用いて半田を
供給、接合する方法は、短時間でしかも簡単な工程で、
同時に数多くの独立した箇所への半田付は作業ができる
方法である。In other words, the method of supplying and bonding solder using a solder supply plate as in the method of the present invention is a short and simple process.
Soldering to many independent points at the same time is a method that allows you to work.
この方法は半導体素子の入出力端子の数ｈ（多くなれば
なるほど、すなわち集積度が増すに従い、その効果を発
揮する。This method becomes more effective as the number (h) of input/output terminals of the semiconductor device increases, that is, as the degree of integration increases.
また、本発明方法を、より可能にするために、半田供給
板の孔部は、あらかじめ被供給板である半導体素子など
の電極と同じパターンの孔として、加工しておけば、さ
らに微細化が可能であり、より大きな効果が期待出来る
。Furthermore, in order to make the method of the present invention even more possible, the holes in the solder supply plate may be processed in advance to have the same pattern as the electrodes of the semiconductor element, which is the plate to be supplied, to further miniaturize the solder. It is possible and a greater effect can be expected.
そしてくり返し使用可能な為、経済的である。It is also economical because it can be used repeatedly.
第１図は本発明の半田供給方法を実施する装置の一構成
例を示す概略断面図である。
第２図は本発明方法により作られた半田シートを詰めた
半田供給板の断面図である。
第３図は、本発明方法において、加熱により、半田をボ
ール状に成形した半田供給板の断面図である。
第４図は第３図により形成された半田供給板を被供給部
に転写、引上げた断面図である。
第５図は第１図同様本発明の半田供給方法を実施する装
置の一構成例を示す概略断面図である。
符号の説明
１・・・圧縮板、
２・・・半田シート、
３・・・半田供給板、
４・・・受台、
５・・・被供給部、
６・・・孔部FIG. 1 is a schematic sectional view showing an example of the configuration of an apparatus for carrying out the solder supply method of the present invention. FIG. 2 is a cross-sectional view of a solder supply plate filled with solder sheets made by the method of the present invention. FIG. 3 is a sectional view of a solder supply plate on which solder is formed into a ball shape by heating in the method of the present invention. FIG. 4 is a cross-sectional view of the solder supply plate formed as shown in FIG. 3 transferred to a supplied portion and pulled up. Like FIG. 1, FIG. 5 is a schematic sectional view showing an example of the configuration of an apparatus for carrying out the solder supply method of the present invention. Explanation of symbols 1... Compression plate, 2... Solder sheet, 3... Solder supply plate, 4... Holder, 5... Part to be supplied, 6... Hole part
Claims (1)
記半導体素子の入出力端子部分へ供給するに際し、 予め、前記入出力端子部分に対応する位置に所定の形状
の孔部を有する半田供給板とシート状半田と重ね合せた
後、前記シート状半田を前記孔部に圧入し、前記シート
状半田の残部を除いた後、前記シート状半田を加熱によ
りボール状に成形した後、 前記半田供給板を前記半導体素子の入出力端子部分に加
熱接合させ、前記入出力端子部分に前記半田を凸状に転
写することを特徴とする半田供給方法。(1) When supplying solder used for mounting a semiconductor element onto a substrate to an input/output terminal portion of the semiconductor element, a solder supply having a hole of a predetermined shape in advance at a position corresponding to the input/output terminal portion. After overlapping the plate with the sheet-like solder, press-fitting the sheet-like solder into the hole, removing the remaining part of the sheet-like solder, and shaping the sheet-like solder into a ball shape by heating, A solder supply method comprising: heat-bonding a supply plate to an input/output terminal portion of the semiconductor element, and transferring the solder in a convex shape to the input/output terminal portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13911488A JPH01308038A (en) | 1988-06-06 | 1988-06-06 | Feeding of solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13911488A JPH01308038A (en) | 1988-06-06 | 1988-06-06 | Feeding of solder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01308038A true JPH01308038A (en) | 1989-12-12 |
Family
ID=15237819
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13911488A Pending JPH01308038A (en) | 1988-06-06 | 1988-06-06 | Feeding of solder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01308038A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0241796A (en) * | 1988-08-03 | 1990-02-09 | Hitachi Ltd | Manufacture of solder ball carrier and its apparatus |
| JPH05258986A (en) * | 1992-03-13 | 1993-10-08 | Hitachi Ltd | Electronic component provided with solder chip, device and method of providing solder chip to component lead |
| US5275970A (en) * | 1990-10-17 | 1994-01-04 | Nec Corporation | Method of forming bonding bumps by punching a metal ribbon |
| US6855623B2 (en) * | 1999-02-24 | 2005-02-15 | Micron Technology Inc. | Recessed tape and method for forming a BGA assembly |
| JP2006179782A (en) * | 2004-12-24 | 2006-07-06 | Shinko Electric Ind Co Ltd | Method of manufacturing semiconductor substrate |
-
1988
- 1988-06-06 JP JP13911488A patent/JPH01308038A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0241796A (en) * | 1988-08-03 | 1990-02-09 | Hitachi Ltd | Manufacture of solder ball carrier and its apparatus |
| US5275970A (en) * | 1990-10-17 | 1994-01-04 | Nec Corporation | Method of forming bonding bumps by punching a metal ribbon |
| JPH05258986A (en) * | 1992-03-13 | 1993-10-08 | Hitachi Ltd | Electronic component provided with solder chip, device and method of providing solder chip to component lead |
| US6855623B2 (en) * | 1999-02-24 | 2005-02-15 | Micron Technology Inc. | Recessed tape and method for forming a BGA assembly |
| JP2006179782A (en) * | 2004-12-24 | 2006-07-06 | Shinko Electric Ind Co Ltd | Method of manufacturing semiconductor substrate |
| JP4508859B2 (en) * | 2004-12-24 | 2010-07-21 | 新光電気工業株式会社 | Manufacturing method of semiconductor substrate |
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