JPH01256775A - Pod cooling device - Google Patents
Pod cooling deviceInfo
- Publication number
- JPH01256775A JPH01256775A JP8266988A JP8266988A JPH01256775A JP H01256775 A JPH01256775 A JP H01256775A JP 8266988 A JP8266988 A JP 8266988A JP 8266988 A JP8266988 A JP 8266988A JP H01256775 A JPH01256775 A JP H01256775A
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- refrigerant
- heat exchanger
- cold plates
- evaporation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 55
- 239000003507 refrigerant Substances 0.000 claims abstract description 33
- 238000009835 boiling Methods 0.000 claims abstract description 24
- 239000007788 liquid Substances 0.000 claims abstract description 10
- 238000001704 evaporation Methods 0.000 abstract 5
- 230000008020 evaporation Effects 0.000 abstract 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 230000007423 decrease Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、航空機の胴下あるいは翼下に搭載されるボ
ッド内の電子機器の温度をコントロールするための冷却
装置にきシするものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention is directed to a cooling device for controlling the temperature of electronic equipment in a pod mounted under the fuselage or under the wings of an aircraft.
第５図、第６図は従来のポッド冷却装置を示す断面図で
あり、図において（１）は電子機器（０を搭載するコー
ルドプレート、（２）は冷媒（→を循環させる循環ポン
プ、（３は循環冷媒（−の温度を下げるための外板熱交
換器、（４）は沸騰冷却用熱交換器、（０は気化した冷
媒を排気するレリーフバルブ、（７）は冷媒（−を外板
熱交換器（■あるいは沸騰冷却用熱交換器（４に送るた
めのバイパスバルブ、（印はバイパスバルブ（７）の中
にある冷媒（〜の温度を検出する温度センサ、（ｇｌは
沸騰冷却で使用する水の入った水タンク、（１０）はチ
エツクバルブ、（１１）はボッＦ胴体である。Figures 5 and 6 are cross-sectional views showing conventional pod cooling devices. 3 is an outer plate heat exchanger to lower the temperature of the circulating refrigerant (-), (4) is a boiling cooling heat exchanger, (0 is a relief valve to exhaust the vaporized refrigerant, (7) is a refrigerant (- is removed) Bypass valve to send to plate heat exchanger (■ or evaporative cooling heat exchanger (10) is the check valve, and (11) is the Bok F fuselage.
次に動作について説明する。外板熱交換器（′５はラム
エア（１））を使用して熱交換を行なうため、その能力
は航空機の飛行条件により興なってくる。まず、温度セ
ンサ（匂により循環冷媒（ａ）の温度を検出する。循環
冷媒（−の温度が低い時には外板熱交換器（３による液
冷方式により行ない、そして冷媒（、）の温度が高くな
ると冷却能力の高い沸騰冷却方式により行なう。液冷方
式では、第５図中実線矢印で示すように冷媒（荀は循環
ポンプ（２により送られ、電子機器（６）が搭載されて
いるコールドプレート（１）を通り熱をうばう。温度が
上昇した冷媒（→は外板熱交換器（３１に送られてラム
エア（ｂ）により冷却され、再びコールドプレート（１
）に送られる。外板熱交換器（■の能力が落ちて、冷媒
（→の温度が上昇してくると、バイパスバルブ（７）か
ら冷媒（〜は第５図中点線矢印で示すように沸騰冷却用
熱交換器（７ｇに送られる。Next, the operation will be explained. Since heat exchange is performed using a skin heat exchanger ('5 is ram air (1)), its performance depends on the flight conditions of the aircraft. First, the temperature of the circulating refrigerant (a) is detected by the temperature sensor (smell). In this case, the boiling cooling method with high cooling capacity is used.In the liquid cooling method, as shown by the solid line arrow in Fig. The refrigerant whose temperature has increased (→ is sent to the outer plate heat exchanger (31) and cooled by ram air (b), and is again cooled by the cold plate (1).
) will be sent to. When the capacity of the outer plate heat exchanger (■ decreases and the temperature of the refrigerant (→) rises, the refrigerant (~ is indicated by the dotted line arrow in Figure 5) from the bypass valve (7) to the boiling cooling heat exchanger. Container (7g).
ここで、冷媒（〜は水タンク（９）内の水を蒸発させて
熱交換を行ない、冷却されてチエツクバルブ（１０）を
通り、再びコールドプレート（１）に送られる。蒸発し
た水はレリーフパルプ（０を通り排気される。したがっ
て、冷却時間は水の量に依存する。Here, the refrigerant (~) evaporates the water in the water tank (9) to perform heat exchange, is cooled, passes through the check valve (10), and is sent to the cold plate (1) again.The evaporated water is The pulp (passes through 0 and is evacuated. Therefore, the cooling time depends on the amount of water.
従来のポッド冷却装置は以上のように構成されているの
で、冷媒（姉の温度により冷却方法を換えるためのバイ
パスバルブ（力が必要で、装置が大きく複雑になるなど
の問題点があった。Conventional pod cooling systems are configured as described above, but they have had problems such as the refrigerant (a bypass valve to change the cooling method depending on the temperature of the refrigerant), which requires force, making the system large and complicated.
この発明は上記のような問題点を解消するためになされ
たもので、軽量コンパクトなポッド冷却装置を得ること
を目的とする。This invention was made to solve the above-mentioned problems, and aims to provide a lightweight and compact pod cooling device.
この発明に係るポッド冷却装置は、液冷と沸騰冷却のそ
れぞれの冷却装置を独立にし、沸騰冷却では循環冷媒を
冷却し、コールドプレートを冷却するのではなく、直接
コールドプレートを冷却するものである。The pod cooling device according to the present invention has independent liquid cooling and boiling cooling devices, and the boiling cooling cools the circulating refrigerant and directly cools the cold plate instead of cooling the cold plate. .
この発明におけるポッド冷却装置は、液冷装置と沸騰冷
却装置を独立にすることにより、バイパスバルブが不要
となり、沸騰冷却時に循環ポンプを作動する必要がなく
なり、ポンプ発熱を零にする。By making the liquid cooling device and the boiling cooling device independent, the pod cooling device according to the present invention eliminates the need for a bypass valve, eliminates the need to operate the circulation pump during boiling cooling, and reduces pump heat generation to zero.
以下、この発明の一実施例を第１図、第２図について説
明する。第１図は縦断側面図、第２図は縦断正面図であ
り、前記従来装置と同一または相当部分には同一符号を
付して説明を省略する。図において、（ＩＡ）は電子機
器（０を搭ａするコールドプレートで、上下二列状に並
設されている。（４Ａ）はコールドプレート（ＩＡ）１
（ＩＡ）間に配置した沸騰冷却用熱交換器である０
次に上記実施例の動作を説明する。液冷方式では、循環
ポンプ（２から送り出された循環冷媒（→はコールドプ
レート（ＩＡ）、（ＩＡ）を通る際、熱交換を行ない電
子機器（６）を冷却する。An embodiment of the present invention will be described below with reference to FIGS. 1 and 2. FIG. 1 is a longitudinal sectional side view, and FIG. 2 is a longitudinal sectional front view. Parts that are the same or corresponding to those of the conventional device are designated by the same reference numerals, and their explanation will be omitted. In the figure, (IA) is a cold plate equipped with electronic devices (0a), which are arranged in two rows, one above the other. (4A) is a cold plate (IA) 1.
(IA) The boiling cooling heat exchanger disposed between 0 and 0. Next, the operation of the above embodiment will be explained. In the liquid cooling system, the circulating refrigerant sent out from the circulation pump (2) performs heat exchange when passing through the cold plates (IA), (IA) to cool the electronic equipment (6).
温度が上昇した循環冷媒（→は外板熱交換器（３）でラ
ムエア（ｂ）と熱交換を行ない冷却され、再びコールド
プレート（ＩＡ）、（ＩＡ）に送られる。The circulating refrigerant (→) whose temperature has increased exchanges heat with the ram air (b) in the outer plate heat exchanger (3), is cooled, and is sent to the cold plates (IA) and (IA) again.
外板熱交換器（■の能力が落ちて電子機器（６）の温度
が上昇し、ある設定温度を越えると、循環ポンプ（２が
停止し、沸騰冷却用熱交換器（４Ａ）内の冷媒が沸騰す
るその気化熱によりコールドプレート（ＩＡ）、（ＩＡ
）を直接冷却する。When the capacity of the outer heat exchanger (■ decreases and the temperature of the electronic equipment (6) rises and exceeds a certain set temperature, the circulation pump (2) stops and the refrigerant in the boiling cooling heat exchanger (4A) The heat of vaporization causes the cold plate (IA) to boil, (IA
) directly cooled.
沸騰した冷媒はレリーフパルプ（＄から排気される。し
たがって、冷却時間は沸騰冷却用熱交換器（４Ａ）内の
冷媒の量に依存する。The boiling refrigerant is exhausted from the relief pulp. Therefore, the cooling time depends on the amount of refrigerant in the boiling cooling heat exchanger (4A).
このようにレリーフパルプ（９を設けておくと、このレ
リーフパルプ（５）を使用することにより沸騰冷却用冷
媒の圧力を変え冷媒の沸点を自由に調整できるものであ
る。By providing the relief pulp (9) in this way, the pressure of the boiling cooling refrigerant can be changed and the boiling point of the refrigerant can be freely adjusted by using the relief pulp (5).
上記実施例ではコールドプレー）（ＩＡ）。Coldplay) (IA) in the above examples.
（ＩＡ）間に沸騰冷却用熱交換器（４Ａ）がはさまれた
ものを示したが、第３図に示すように一列状のコールド
プレー）（１Ｂ）に液冷方式による循環冷媒が通る流路
（１ａ）と沸騰冷却用熱交換器（４Ｂ）とを設けてもよ
い。また、第４図に示すように第１図、第２図のコール
ドプレー）（ＩＡ）、（ＩＡ）内に循環冷媒が通る流路
（１ａ）を設けず、沸騰冷却用熱交換器（４０）内に液
冷用熱交換器（１２）を通すようにしてもよい。The boiling cooling heat exchanger (4A) is shown sandwiched between (IA), but as shown in Figure 3, a circulating refrigerant using a liquid cooling system passes through a row of cold plays (1B). A flow path (1a) and a boiling cooling heat exchanger (4B) may be provided. In addition, as shown in Fig. 4, the flow path (1a) through which the circulating refrigerant passes is not provided in the cold play (IA), (IA) of Figs. 1 and 2, and the boiling cooling heat exchanger (40 ) A liquid cooling heat exchanger (12) may be passed through the inside.
さらに、特別に沸騰冷却用熱交換器を設けず、液冷方式
で使用するコールドプレートを冷却する循環冷媒が通る
流路を沸騰冷却時にも使用し、循環冷媒を沸騰させても
よい。Furthermore, without providing a special heat exchanger for boiling cooling, the flow path through which the circulating refrigerant that cools the cold plate used in the liquid cooling method is used also during boiling cooling, and the circulating refrigerant may be boiled.
以上のように、この発明によれば沸騰冷却の時は直接コ
ールドプレートを冷却するように構成したので、装置が
小型化でき、構造が簡単なものが得られる効果がある。As described above, according to the present invention, since the cold plate is directly cooled during boiling cooling, the apparatus can be miniaturized and the structure can be simple.
第１図はこの発明の一実施例によるボッド冷却装置を示
す縦断側面図、第２図はその縦断正面図、第３図および
第４図はこの発明のそれぞれ異なる実施例を示す縦断正
面図、第５図は従来のポンド冷却装置を示す縦断側面図
、第６図はその縦断正面図である。
図において、（ＩＡ）はコールドプレート、（２は循環
ポンプ、（■は外板熱交換器、（４Ａ）は沸騰冷却用熱
交換器、（５）はレリーフパルプ、（■は電子機器であ
る。
なお、各図中同一符号は同一または相当部分を示す。FIG. 1 is a longitudinal sectional side view showing a body cooling device according to an embodiment of the invention, FIG. 2 is a longitudinal sectional front view thereof, and FIGS. 3 and 4 are longitudinal sectional front views showing different embodiments of the invention. FIG. 5 is a longitudinal sectional side view showing a conventional pound cooling device, and FIG. 6 is a longitudinal sectional front view thereof. In the figure, (IA) is a cold plate, (2 is a circulation pump, (■ is an outer plate heat exchanger, (4A) is a boiling cooling heat exchanger, (5) is a relief pulp, (■ is an electronic device. Note that the same reference numerals in each figure indicate the same or equivalent parts.
Claims (1)
ルドプレートを冷却する循環冷媒を送る循環ポンプ、ラ
ムエアにより前記循環冷媒を冷却する外板熱交換器、前
記循環冷媒による液冷によつて前記コールドプレートを
冷却できなくなつた時に沸騰冷却方式により前記コール
ドプレートを冷却するための沸騰冷却用熱交換器、およ
び気化した沸騰冷却用冷媒を排気、圧力調整をするレリ
ーフバルブを備えたことを特徴とするポッド冷却装置。(1) A cold plate that cools electronic equipment, a circulation pump that sends a circulating refrigerant that cools the cold plate, an outer plate heat exchanger that cools the circulating refrigerant with ram air, and a cold plate that cools the cold plate by liquid cooling with the circulating refrigerant. A boiling cooling heat exchanger for cooling the cold plate by a boiling cooling method when the cold plate can no longer be cooled, and a relief valve for exhausting vaporized boiling cooling refrigerant and adjusting the pressure. Pod cooling device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8266988A JPH01256775A (en) | 1988-04-04 | 1988-04-04 | Pod cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8266988A JPH01256775A (en) | 1988-04-04 | 1988-04-04 | Pod cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01256775A true JPH01256775A (en) | 1989-10-13 |
Family
ID=13780836
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8266988A Pending JPH01256775A (en) | 1988-04-04 | 1988-04-04 | Pod cooling device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01256775A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6205803B1 (en) * | 1996-04-26 | 2001-03-27 | Mainstream Engineering Corporation | Compact avionics-pod-cooling unit thermal control method and apparatus |
| WO2004083742A2 (en) * | 2003-03-17 | 2004-09-30 | Cooligy, Inc. | Boiling temperature design in pumped microchannel cooling loops |
| US6826923B2 (en) * | 2002-04-25 | 2004-12-07 | Matsushita Electric Industrial Co., Ltd. | Cooling device for semiconductor elements |
| US6988535B2 (en) | 2002-11-01 | 2006-01-24 | Cooligy, Inc. | Channeled flat plate fin heat exchange system, device and method |
| US7019972B2 (en) | 2002-02-07 | 2006-03-28 | Cooligy, Inc. | Apparatus for conditioning power and managing thermal energy in an electronic device |
| JP2010006151A (en) * | 2008-06-25 | 2010-01-14 | Mitsubishi Electric Corp | Cooling method of radio wave transceiver |
| JP2011522408A (en) * | 2008-05-30 | 2011-07-28 | エアバス オペラツィオンス ゲゼルシャフト ミット ベシュレンクテル ハフツング | Cooling of electronic equipment in an aircraft, optionally with single-layer or double-layer cooling |
| JP2011529418A (en) * | 2008-07-31 | 2011-12-08 | エアバス オペラツィオンス ゲゼルシャフト ミット ベシュレンクテル ハフツング | Heat transfer equipment for aircraft hull |
| JP2012030776A (en) * | 2010-07-30 | 2012-02-16 | Res Inst Of Natl Defence | Cooling device for fluid, flight vehicle having the same, and cooling method for fluid |
| WO2016024521A1 (en) * | 2014-08-13 | 2016-02-18 | 株式会社Ihi | Cooling apparatus for cooling electronic device in aircraft |
-
1988
- 1988-04-04 JP JP8266988A patent/JPH01256775A/en active Pending
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6205803B1 (en) * | 1996-04-26 | 2001-03-27 | Mainstream Engineering Corporation | Compact avionics-pod-cooling unit thermal control method and apparatus |
| US7019972B2 (en) | 2002-02-07 | 2006-03-28 | Cooligy, Inc. | Apparatus for conditioning power and managing thermal energy in an electronic device |
| US6826923B2 (en) * | 2002-04-25 | 2004-12-07 | Matsushita Electric Industrial Co., Ltd. | Cooling device for semiconductor elements |
| US6988535B2 (en) | 2002-11-01 | 2006-01-24 | Cooligy, Inc. | Channeled flat plate fin heat exchange system, device and method |
| WO2004083742A2 (en) * | 2003-03-17 | 2004-09-30 | Cooligy, Inc. | Boiling temperature design in pumped microchannel cooling loops |
| WO2004083742A3 (en) * | 2003-03-17 | 2005-11-24 | Cooligy Inc | Boiling temperature design in pumped microchannel cooling loops |
| JP2011522408A (en) * | 2008-05-30 | 2011-07-28 | エアバス オペラツィオンス ゲゼルシャフト ミット ベシュレンクテル ハフツング | Cooling of electronic equipment in an aircraft, optionally with single-layer or double-layer cooling |
| JP2010006151A (en) * | 2008-06-25 | 2010-01-14 | Mitsubishi Electric Corp | Cooling method of radio wave transceiver |
| JP2011529418A (en) * | 2008-07-31 | 2011-12-08 | エアバス オペラツィオンス ゲゼルシャフト ミット ベシュレンクテル ハフツング | Heat transfer equipment for aircraft hull |
| US9309000B2 (en) | 2008-07-31 | 2016-04-12 | Airbus Operations Gmbh | Heat exchanger for the outer skin of an aircraft |
| JP2012030776A (en) * | 2010-07-30 | 2012-02-16 | Res Inst Of Natl Defence | Cooling device for fluid, flight vehicle having the same, and cooling method for fluid |
| WO2016024521A1 (en) * | 2014-08-13 | 2016-02-18 | 株式会社Ihi | Cooling apparatus for cooling electronic device in aircraft |
| JPWO2016024521A1 (en) * | 2014-08-13 | 2017-04-27 | 株式会社Ihi | Cooling device for cooling aircraft electronic equipment |
| EP3130543A4 (en) * | 2014-08-13 | 2017-12-20 | IHI Corporation | Cooling apparatus for cooling electronic device in aircraft |
| US9999164B2 (en) | 2014-08-13 | 2018-06-12 | Ihi Corporation | Cooling apparatus for cooling electronic device in aircraft |
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