JPH01221881A - High-frequency heating device - Google Patents
High-frequency heating deviceInfo
- Publication number
- JPH01221881A JPH01221881A JP4624488A JP4624488A JPH01221881A JP H01221881 A JPH01221881 A JP H01221881A JP 4624488 A JP4624488 A JP 4624488A JP 4624488 A JP4624488 A JP 4624488A JP H01221881 A JPH01221881 A JP H01221881A
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- air
- magnetron
- heating device
- frequency heating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 34
- 238000001816 cooling Methods 0.000 claims abstract description 51
- 230000010355 oscillation Effects 0.000 abstract description 2
- 239000007921 spray Substances 0.000 abstract 2
- 238000007664 blowing Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 1
Landscapes
- Constitution Of High-Frequency Heating (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、高周波加熱装置の冷却構造に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a cooling structure for a high frequency heating device.
従来の技術
従来の例えば第3図に示す、高周波加熱装置の冷却構造
を示す右側面部分断面の構造図では、冷却ファンモータ
1の回転により外郭2の後面に設けられた吸気孔3及び
外郭2の右側面後部に設けられた吸気孔(図示せず)よ
り外気が矢印の様に外郭2の内部に入り、高圧トランス
4を冷却し、外郭2の底面部の排気孔7より外へ排気さ
れる。2. Description of the Related Art In the conventional structure diagram, for example, shown in FIG. 3, which is a partial cross-sectional view of the right side showing the cooling structure of a high-frequency heating device, the rotation of the cooling fan motor 1 causes the air intake hole 3 provided on the rear surface of the outer shell 2 and the outer shell 2 to Outside air enters the enclosure 2 as shown by the arrow through an intake hole (not shown) provided at the rear of the right side of the housing, cools the high-voltage transformer 4, and is exhausted to the outside through an exhaust hole 7 at the bottom of the enclosure 2. Ru.
又、高圧トランス4を冷却した冷却風の一部は高周波加
熱装置の動作を制御する電子回路8を冷却し、外郭2の
底面部の排気孔7より外へ排気される、又、冷却ファン
モータ1の回転により外郭2の後面に設けられ吸気孔3
及び外郭2の右側面後部に設けられた吸気孔(図示せず
)より外気が矢印の様に外郭2の内部に入り、マグネト
ロン6を冷却した後、エアーガイド6を通過し、加熱室
9内部に入り、加熱室9の左後面(図示せず)より外郭
2の外へ排気される。又、従来の例えば第4図に示す、
高周波加熱装置の冷却構造を示す右側面部分断面の構造
図では、冷却ファンモータ10の回転によ抄高圧トラン
ス11の周囲の外郭12に吸気孔13から外気を吸い込
む時の空気の流れ(矢印)により高圧トランス11が冷
却された後、冷却風はマグネトロン14を冷却し、エア
ーガイド16を通過し、加熱室16内部に入り、加熱室
16の左後面(図示せず)から外郭12の外へ排気され
る。又、高圧トランス11を冷却した冷却風の一部はマ
グネトロン14を冷却せずに電子回路18を冷却し外郭
12の底部の排気孔17より排気される。A part of the cooling air that has cooled the high-voltage transformer 4 cools the electronic circuit 8 that controls the operation of the high-frequency heating device, and is exhausted to the outside through the exhaust hole 7 on the bottom of the outer shell 2. 1, the intake hole 3 is provided on the rear surface of the outer shell 2.
Outside air enters the inside of the housing 2 as shown by the arrow from an intake hole (not shown) provided at the rear right side of the housing 2, cools the magnetron 6, passes through the air guide 6, and enters the inside of the heating chamber 9. The air enters the heating chamber 9 and is exhausted to the outside of the outer shell 2 from the left rear surface (not shown) of the heating chamber 9. In addition, the conventional method shown in FIG. 4, for example,
In the structural diagram of the right side partial cross-section showing the cooling structure of the high-frequency heating device, air flow (arrow) occurs when outside air is sucked into the outer shell 12 around the high-voltage transformer 11 from the intake hole 13 by the rotation of the cooling fan motor 10. After the high voltage transformer 11 is cooled, the cooling air cools the magnetron 14, passes through the air guide 16, enters the heating chamber 16, and exits the outer shell 12 from the left rear surface (not shown) of the heating chamber 16. Exhausted. Further, a part of the cooling air that has cooled the high voltage transformer 11 cools the electronic circuit 18 without cooling the magnetron 14, and is exhausted from the exhaust hole 17 at the bottom of the outer shell 12.
発明が解決しようとする課題
ところが、このような高周波加熱装置の冷却においては
、第3図に示す冷却構造の場合、高圧トランス4、マグ
ネトロン6、電子回路8を冷却するための吸気孔3を多
く設けることができるが、冷却風は高圧トランス4と、
マグネトロン6を冷却するために大きく風量が2分割さ
れた状態となり冷却ファンモータ1の能力は半減されて
しまうため冷却ファンモータの回転数を高くしたり、フ
ァンを大きくしなければならない。又、第4図に示す冷
却構造では、冷却ファンモータ10の吸い込みによる風
で高圧トランス11を冷却した後、冷却ファンモータ1
oでほとんどの冷却風はマグネトロン14を吹き付けて
冷却することができるが、高圧トランス11は吸い込み
による冷却のため、高圧トランス11の周囲に吸気孔1
3がないと高圧トランス11は冷却されにくく、吸気孔
13は高圧トランス11の周囲に限られてしまい少ない
ため冷却性能を向上させるのが困難であるという問題が
あった。Problem to be Solved by the Invention However, in cooling such a high-frequency heating device, in the case of the cooling structure shown in FIG. However, the cooling air is supplied by the high voltage transformer 4,
In order to cool the magnetron 6, the air volume is largely divided into two, and the capacity of the cooling fan motor 1 is halved, so the rotation speed of the cooling fan motor must be increased or the fan must be made larger. Further, in the cooling structure shown in FIG. 4, after the high voltage transformer 11 is cooled by the air drawn in by the cooling fan motor 10
Most of the cooling air can be cooled by blowing the magnetron 14 at o, but the high voltage transformer 11 is cooled by suction, so there are intake holes 1 around the high voltage transformer 11.
3, the high voltage transformer 11 would be difficult to cool, and the number of intake holes 13 would be limited to the area around the high voltage transformer 11, making it difficult to improve the cooling performance.
本発明はこのような従来の問題点を解消するものであり
、簡単な構成で、高周波発生装置の冷却能力を向上させ
ることを目的とする。The present invention solves these conventional problems, and aims to improve the cooling capacity of a high-frequency generator with a simple configuration.
課題を解決するための手段
上記目的を達するため、本発明の高周波加熱装置は加熱
室に高周波を供給するマグネトロン、マグネトロンに電
力を供給する高圧トランス、高周波加熱装置の動作を制
御する電子回路の冷却は、クロスフローファンによる吹
き付は冷却で冷却風を分流させない構成である。Means for Solving the Problems In order to achieve the above object, the high-frequency heating device of the present invention includes a magnetron that supplies high-frequency waves to a heating chamber, a high-voltage transformer that supplies power to the magnetron, and cooling of an electronic circuit that controls the operation of the high-frequency heating device. is a configuration in which the cross-flow fan blows cooling air and does not separate the cooling air.
作用
本発明の高周波加熱装置は冷却をクロスフローファンモ
ータで行ない、高圧トランス、マクネトロン、高周波加
熱装置の電子回路の冷却を冷却風の吹き付けによる冷却
で行ない、冷却風を分流させないため、高圧トランス、
マグネトロンを電子回路に吹き付けられる冷却風の風量
が落ちないため、冷却性能が従来に比べ向上するという
効果を有するものである。Function The high-frequency heating device of the present invention performs cooling with a cross-flow fan motor, and cools the high-voltage transformer, Macnetron, and electronic circuit of the high-frequency heating device by blowing cooling air.Since the cooling air is not divided, the high-voltage transformer,
Since the amount of cooling air blown by the magnetron onto the electronic circuit does not decrease, the cooling performance is improved compared to the conventional method.
実施例
以下、本発明の一実施例について図面に基づき説明する
。EXAMPLE Hereinafter, an example of the present invention will be described based on the drawings.
第1図に示すように、本発明の高周波加熱装置の冷却構
造を示す部分断面斜視図で、19はクロスフローファン
モータ、2oは外郭後面で、そこにはクロスフローファ
ンモータ19の吸気口21に対向する面に吸気孔22を
設ける。23はインバータトランス、24はインバータ
トランス23の制御回路、26はマグネトロン、26は
高圧コンデンサ、2了はエアーガイドで、高周波発振と
同時にクロス70−フ1ンモータ19が回転し外郭後面
2oの吸気孔22より外気を吸い込みインバータトラン
ス23及びインバータトランスの制御回路24を冷却し
た後、エアーガイド27で冷却風を集められマグネトロ
ン26に集中して冷却風が流れさらに加熱室上面の高周
波加熱装置の制御回路28を冷却し外郭後面20の排気
孔29より排気される。このように冷却風は吹き付は冷
却であり、分流がないためクロスフローファン19から
受ける風量は変わらないため、冷却性能が向上する。As shown in FIG. 1, it is a partial cross-sectional perspective view showing the cooling structure of the high-frequency heating device of the present invention, where 19 is a cross-flow fan motor, 2o is the rear surface of the outer shell, and there is an inlet 21 of the cross-flow fan motor 19. An intake hole 22 is provided on the surface facing the. 23 is an inverter transformer, 24 is a control circuit for the inverter transformer 23, 26 is a magnetron, 26 is a high-voltage capacitor, 2 is an air guide, and at the same time as high frequency oscillation, the cross 70-fan motor 19 rotates and the air intake hole on the rear surface 2o of the outer shell is generated. After drawing in outside air from 22 and cooling the inverter transformer 23 and the control circuit 24 for the inverter transformer, the air guide 27 collects the cooling air, and the cooling air is concentrated at the magnetron 26 and flows to the control circuit for the high-frequency heating device on the top surface of the heating chamber. 28 is cooled and exhausted from the exhaust hole 29 on the rear surface 20 of the outer shell. In this way, the cooling air is blown for cooling purposes, and since there is no branch flow, the amount of air received from the cross-flow fan 19 does not change, so the cooling performance is improved.
発明の効果
以上のように本発明の高周波加熱装置によれば次の効果
を得ることができる。Effects of the Invention As described above, the high frequency heating device of the present invention provides the following effects.
(1)冷却風は吹き付けによる冷却で高圧トランスを冷
却した冷却風をエアーガイドで全て集め、次にマグネト
ロンを冷却し、さらにマグネトロンを冷却した後、電子
回路を冷却することで無熱のない効率の良い高周波加熱
装置の冷却が行なえる。(1) Cooling air is sprayed to cool the high-voltage transformer, and then all the cooling air is collected by an air guide, then the magnetron is cooled, and after further cooling the magnetron, the electronic circuit is cooled to achieve efficiency without heat loss. It can cool high-frequency heating equipment with good performance.
(2)高周波加熱装置の冷却風の吸排気はクロスフロー
ファンモータで行なうことにより、高周波発生装置部の
ブロックの小型化がはかれ省スペース設計となり、外郭
後面吸排気により、外郭後面以外は設置場所のスペース
を取る必要がないため、主な設置場所である台所などの
壁に外郭後面以外は密着して設置できるため、台所等が
広く使える。(2) By using a cross-flow fan motor to take in and exhaust the cooling air of the high-frequency heating device, the block of the high-frequency generator unit can be made smaller, resulting in a space-saving design. Since there is no need to take up space, it can be installed in close contact with the wall of the main installation location, such as the kitchen, except for the rear surface of the outer shell, allowing the kitchen to be used more widely.
第1図は本発明の一実施例である高周波加熱装置の要部
断面斜視図、第2図は同高周波加熱装置後面外観斜視図
、第3図、第4図は従来例を示す高周波加熱装置の右側
面断面図である。
19・・・・・・クロスフロー7アンモータ、20・・
・・・・外郭後面、21・・川・クロスフローファンモ
ータの吸気口、22・・・・・・外郭後面の吸気孔、2
3・・・・・・インバータトランス、24・・・・・・
インバータトランス制御回路、26・・・・・・マグネ
トロン、26・・・・・・高圧コンデンサ、27・・川
・エアーガイド、28・・・・・・高周波加熱装置の制
御回路、29・・・・・・外郭後面排気孔。FIG. 1 is a cross-sectional perspective view of a main part of a high-frequency heating device that is an embodiment of the present invention, FIG. 2 is a rear external perspective view of the same high-frequency heating device, and FIGS. 3 and 4 are high-frequency heating devices showing conventional examples. FIG. 19...Cross flow 7 unmotor, 20...
...Rear surface of the outer shell, 21...Intake port of the river/cross flow fan motor, 22...Intake hole on the rear surface of the outer shell, 2
3... Inverter transformer, 24...
Inverter transformer control circuit, 26...Magnetron, 26...High voltage capacitor, 27...River/air guide, 28...Control circuit for high frequency heating device, 29... ...Outer shell rear exhaust hole.
Claims (2)
周波を供給するマグネトロンと、前記マグネトロンに電
力を供給する高圧トランスと、前記高圧トランスの動作
を制御する電子回路と、前記マグネトロン、高圧トラン
スおよび電子回路を冷却する冷却ファンモータと、エア
ーガイドとを備え、そのエアーガイドは前記冷却ファン
モータによる冷却風の吹き付けによる分流を起させない
ことを特徴とする高周波加熱装置。(1) a heating chamber that stores an object to be heated, a magnetron that supplies high frequency waves into the heating chamber, a high-voltage transformer that supplies power to the magnetron, an electronic circuit that controls the operation of the high-voltage transformer, and the magnetron; 1. A high-frequency heating device comprising a cooling fan motor for cooling a high-voltage transformer and an electronic circuit, and an air guide, the air guide being characterized in that the air guide does not cause shunting due to cooling air blown by the cooling fan motor.
ーファンモータで構成した請求項1記載の高周波加熱装
置。(2) The high-frequency heating device according to claim 1, wherein the cooling fan motor of the high-frequency heating device is a cross-flow fan motor.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4624488A JPH01221881A (en) | 1988-02-29 | 1988-02-29 | High-frequency heating device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4624488A JPH01221881A (en) | 1988-02-29 | 1988-02-29 | High-frequency heating device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01221881A true JPH01221881A (en) | 1989-09-05 |
Family
ID=12741732
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4624488A Pending JPH01221881A (en) | 1988-02-29 | 1988-02-29 | High-frequency heating device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01221881A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100437382B1 (en) * | 2000-12-30 | 2004-06-25 | 주식회사 엘지이아이 | The structure of microwave oven |
US6849840B2 (en) * | 2002-07-26 | 2005-02-01 | Lg Electronics Inc. | Microwave oven with inverter and cooling assembly |
WO2008032902A1 (en) | 2006-09-12 | 2008-03-20 | Lg Electronics, Inc. | Cooking apparatus |
-
1988
- 1988-02-29 JP JP4624488A patent/JPH01221881A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100437382B1 (en) * | 2000-12-30 | 2004-06-25 | 주식회사 엘지이아이 | The structure of microwave oven |
US6849840B2 (en) * | 2002-07-26 | 2005-02-01 | Lg Electronics Inc. | Microwave oven with inverter and cooling assembly |
WO2008032902A1 (en) | 2006-09-12 | 2008-03-20 | Lg Electronics, Inc. | Cooking apparatus |
EP2061996B1 (en) * | 2006-09-12 | 2018-04-04 | LG Electronics Inc. -1- | Cooking apparatus |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR870003916Y1 (en) | High frequency heeting apparatus | |
US5951907A (en) | Exhaust structure for ventilation-hooded microwave ovens | |
JPH01221881A (en) | High-frequency heating device | |
JP3771363B2 (en) | Cooling structure for hood combined microwave oven | |
JPH0969595A (en) | Electronic equipment unit | |
JPS5479849A (en) | Heating apparatus | |
JPH0254887A (en) | Heating device | |
JPH0141194Y2 (en) | ||
KR100437382B1 (en) | The structure of microwave oven | |
CN217903780U (en) | Heat dissipation distribution control equipment | |
JPH0135439Y2 (en) | ||
JP2538620B2 (en) | Cooling structure for electrical components of high-frequency heating device | |
CN216554287U (en) | Cooling device and oxygenerator | |
CN213485511U (en) | High-frequency power supply control cabinet with cooling device | |
KR20040059039A (en) | Ventilation hooded microwave oven | |
CN212303606U (en) | Etching device for semiconductor processing | |
KR20000015474U (en) | Air guide for food and microwave | |
JPH0632406B2 (en) | Electronic device rack structure | |
JPS6252328A (en) | Complex heating cooking apparatus | |
JPH05106852A (en) | Rf heating apparatus | |
JPS58102548A (en) | Air cooling semiconductor converter | |
JPS63314793A (en) | High frequency heating device | |
JPH04198625A (en) | Microwave oven | |
JPS61188881A (en) | High frequency heater | |
JP2000125571A (en) | Power-conversion |