JPH01218015A - Semiconductor manufacturing apparatus - Google Patents

Abstract

PURPOSE:To reduce the amount of dust particles or the like adhering to a semiconductor substrate by a method wherein an opening is formed in a substrate retention part and a peripheral edge part of the semiconductor substrate is supported by a support part installed at a peripheral part of the opening in order to reduce a contact area between the semiconductor substrate and the substrate retention part. CONSTITUTION:An opening 3 whose diameter is smaller than the diameter of a semiconductor substrate 2 is formed at the top surface of a substrate retention part 1. A peripheral edge part on the rear side of the substrate 2 is supported by a support part 4 installed at a peripheral part of the opening 3. While a gas whose temperature has been adjusted by a temperature regulator 8 is circulated on the surface of the rear of the substrate 2 by using a pump 7, the substrate is heat-treated. Then, the substrate 2 comes into contact with the retention part 1 only at its peripheral edge part which does not affect a device region. By this setup, the amount of dust particles or the like adhering to the rear side of the substrate 2 can be reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor manufacturing apparatus for holding a semiconductor substrate and performing heat treatment on the semiconductor substrate.

[Prior Art] Generally, in the manufacturing process of a semiconductor device, a so-called heat treatment is performed to heat a semiconductor substrate in order to diffuse impurities, for example.

Conventionally, an apparatus as shown in FIG. 2 has been used for such a heat treatment process. In the figure, 11 is a substrate holding section. A flat surface 11a is formed on the upper surface of this substrate holding portion 11, and a semiconductor substrate 12 is placed on this flat surface 11a.
At the same time, the semiconductor substrate 12 is prevented from falling by a fall prevention wall 11b protruding from the periphery of the flat surface 11a. Further, the mounted semiconductor substrate 12 is heated from the back side of the semiconductor substrate 12- through the substrate holder 11 by a heating coil 13 provided inside the substrate holder 11.

[Problems to be Solved by the Invention] However, this conventional device has a structure in which the semiconductor substrate 12 is placed on the flat part 11a of the substrate holding part 11, so that the back side of the semiconductor substrate 12 is completely placed on the flat surface 11a. They were in close contact. For this reason, the semiconductor substrate 1
During the heat treatment, countless pieces of dust, etc. on the flat surface 11a adhere to the back surface of the semiconductor substrate 1.
2 may re-adhere to the surface of the semiconductor substrate during transportation or processing in a liquid. This re-adhesion was a major factor in reducing product yield.

The present invention has been made in view of such problems, and includes:
An object of the present invention is to provide a semiconductor manufacturing apparatus that can reduce the amount of dust and the like that adheres to a semiconductor substrate from a substrate holding part during a heat treatment process, and can improve product yield.

[Means for Solving the Problems] A semiconductor manufacturing apparatus according to the present invention holds a semiconductor substrate,
In a semiconductor manufacturing apparatus that performs heat treatment on the semiconductor substrate,
A substrate holding part that has an opening and holds the semiconductor substrate by a support part provided around the opening, and a heating means that heats the semiconductor substrate through a region facing the opening. shall be.

[Function] In the semiconductor manufacturing apparatus of the present invention having the above configuration, only the peripheral portion of the semiconductor substrate contacts the supporting portion of the substrate holding portion, and therefore, the contact area between the semiconductor substrate and the substrate holding portion is reduced.
Therefore, the amount of dust and the like that adheres from the substrate holder side to the semiconductor substrate side is reduced.

[Example] Hereinafter, an example of the present invention will be specifically described with reference to the accompanying drawings.

FIG. 1 shows a cross-sectional structure of a semiconductor manufacturing apparatus according to an embodiment of the present invention. In the figure, reference numeral 1 denotes a substrate holder for holding the semiconductor substrate 2 horizontally by suction. This substrate holder 1 is provided with an opening 3 having a diameter smaller than the diameter of the semiconductor substrate 2 on the upper surface, and a supporting portion 4 provided around the periphery of this opening 3 supports the periphery of the back side of the semiconductor substrate 2. At the same time,
A fall prevention wall 4a protruding around the support portion 4 prevents the semiconductor substrate 2 from falling. Further, the support section 4 is provided with a suction groove 5 that communicates with a vacuum suction pump (not shown), and the semiconductor substrate 2 is suctioned and held on the support section 4 through the suction groove 5. There is.

A gas exhaust port 6 and a gas supply port 9 are provided at the bottom of the substrate holder 1.
is the provision. A pump 7 for circulating gas as a heat medium and a temperature controller 8 for adjusting the temperature of this gas to an appropriate temperature are connected by piping 10 between the gas exhaust port 6 and the gas supply port 9. .

That is, in the semiconductor manufacturing apparatus having the above configuration, the semiconductor substrate 2 is placed on the support part 4 provided around the opening 3 in the substrate holding part 1, and is also placed on the vacuum suction pump ( (not shown). and,
A heat treatment is performed on the rear surface of the held semiconductor substrate 2 by circulating a gas whose temperature is controlled by a temperature controller 8 by a pump 7.

In this manner, in the semiconductor manufacturing apparatus of this embodiment, the peripheral edge of the semiconductor substrate 2 is supported by the supporting portion 4 provided around the opening 3. Therefore, the semiconductor substrate 2 comes into contact with the substrate holder 1 only at the peripheral portion thereof that does not affect the element region, and the contact area is significantly reduced compared to conventional manufacturing equipment. Therefore, the amount of dust and the like attached to the back side of the semiconductor substrate 2 is significantly reduced.

In the above embodiment, gas was circulated within the opening 3 of the substrate holder 1 in order to heat the semiconductor substrate 2, but the present invention is not limited to this, and liquid may be used instead of gas. Of course, you may use it as a heat medium. Further, the heating means may be other heating coils or the like.

[Effects of the Invention] As described above, according to the semiconductor manufacturing apparatus of the present invention, the opening is provided in the substrate holder, and the peripheral edge of the semiconductor substrate is supported by the supporting portion provided around the opening. , the contact area of the semiconductor substrate with the substrate holder is significantly reduced, which greatly reduces the amount of dust, etc. that adheres to the semiconductor substrate side from the substrate holder, and also reduces the amount of dust, etc. that re-adheres to the substrate surface side. amount is significantly reduced, and product yield is significantly improved.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of a semiconductor manufacturing apparatus according to an embodiment of the present invention, and FIG. 2 is a sectional view of a conventional semiconductor manufacturing apparatus. 1.11. Substrate holding part, 2, 12. Semiconductor substrate, 3; opening, 4; support portion, 5; adsorption groove, 6; gas exhaust port, 7; pump, 8; temperature controller, 9; gas supply port, 10; piping,
11a: flat part, 13; heating coil

Claims (1)

[Claims] (1) In a semiconductor manufacturing apparatus that holds a semiconductor substrate and performs heat treatment on the semiconductor substrate, a substrate holding section that has an opening and holds the semiconductor substrate by a support section provided around the opening; A semiconductor manufacturing apparatus comprising: heating means for heating the semiconductor substrate through a facing region.