JPH01216815A - Transfer resin encapsulation molding of component to be encapsulated, resin encapsulation mold assembly used therefor and film carrier - Google Patents

Abstract

PURPOSE:To obtain a high quality and highly reliable resin encapsulation-molded item by a method wherein resin material, which is melted by heating, is poured under pressure through a passage for its transfer under pressure in a cavity so as to encapsulation-mold, with resin, a component ot be encapsulated on a film carrier, which is fittingly set in the cavity. CONSTITUTION:When a film carrier 1 is fittingly installed at the predetermined position of a fitting groove part 15, which is provided on the mold surface of a bottom force 12, under the condition that both forces 11 and 12 are opened, a component to be encapsulated in the film carrier is fittingly set in the cavity 13 of the bottom force. In addition, the bottom surface of a semiconductor chip 4 within the resin encapsulating range 6 of the film carrier 1 is so constituted as to come into direct contact with the bottom surface of the cavity of the bottom force 12. Accordingly, the component to be encapsulated, which is fittingly installed in the cavity of the bottom force, can be surely supported as a whole through the semiconductor chip 4. After both the forces 11 and 12 are clamped, resin material, which is charged in a pot, is melted by heating and poured and filled by being pressed with a plunger through a passage 14 for transfer in both the upper and lower cavities 13.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a resin encapsulation molding technique for encapsulating parts to be encapsulated with a resin material, and particularly relates to a resin encapsulation molding technique for encapsulating parts on a film carrier (or tape carrier). The present invention relates to a method for sealing and molding a mounted component such as a semiconductor device with a transfer resin.

[Conventional technology]

2. Description of the Related Art A transfer resin encapsulation method has conventionally been employed as a technique for encapsulating a component to be encapsulated, such as a semiconductor device mounted on a metal lead frame, with a resin material.

A mold device for resin sealing molding employing this method includes, for example, a fixed upper mold A and a movable lower mold B disposed opposite to the upper mold A, as shown in FIGS. 8 and 9. and P of both types,
A required number of cavities C having the same shape are provided facing each other on the L (parting line) surface. Further, a required number of resin material supply pots and plungers are disposed on either side of the two molds, and between this pot and the cavity C, the resin material is heated and melted in the pot. A passage for pressurized transfer of resin material is provided.

Resin sealing molding using this mold device begins with both molds A-B.
The mold is opened as shown in FIG. 8, and then the lead frame F is fitted into the fitting groove E provided on the mold surface of the lower mold B, and the part to be sealed G is mounted on the lead frame. Set it at the position of cavity C. Next, both molds A-B are clamped in the above-described state as shown in FIG. 9, and then the resin material supplied into the pot is heated and melted, and at the same time, it is pressurized with a plunger. The molten resin material is injected and filled into the upper and lower cavities C of both molds through the passage, and the part to be sealed G fitted and set in the cavities C is sealed with the resin.

Furthermore, as a technique for sealing and molding parts to be sealed such as semiconductor devices mounted on a film carrier (see Figures 1 and 2) with a resin material, a botting resin molding method has conventionally been adopted. .

In this method, a liquid resin material is dropped onto a desired resin-sealed area of a film carrier, and the resin material is heated and cured.

[Problem that the invention seeks to solve]

By the way, when adopting the above-mentioned botting resin encapsulation molding method, it is generally difficult to handle using a liquid resin material, a long molding time is required, and the process is complicated and production is slow. Problems such as extremely low efficiency have been pointed out.

It is also known that when a transfer resin encapsulation molding method is employed, the above-mentioned disadvantages generally do not occur.

However, when using a film carrier, the transfer resin sealing molding method cannot be adopted, mainly because of the following disadvantages.

That is, the thickness of the film carrier itself is extremely thin compared to the metal lead frame, and the thickness of its outer leads and inner leads are even thinner. When the conventional transfer resin encapsulation mold device shown in FIG. Due to the flow in the cavity C due to the speed and speed, the film carrier itself is swayed, resulting in a serious problem that uniform resin sealing cannot be performed. Furthermore, the above-mentioned flow effect of the molten resin material within the cavity disturbs the state of electrode connection between the inner leads of the film carrier, the semiconductor chip, and the bumps (connection electrodes) interposed between the two, thereby preventing electrical connection. This can lead to fatal problems with this type of product, such as poor connection.

Therefore, when molding a component to be sealed in a film carrier with resin, the actual situation is that the conventional transfer resin molding method and apparatus cannot be immediately applied.

The present invention improves the conventional transfer resin encapsulation molding method as described above, and provides resin encapsulation that allows parts to be encapsulated in a film carrier to be resin encapsulated using the transfer resin encapsulation molding method. The purpose of this invention is to provide a molding method.

Furthermore, the present invention provides a resin sealing method that enables resin sealing of parts to be sealed in a film carrier using a transfer resin sealing method by improving the conventional transfer resin sealing mold apparatus. The object of the present invention is to provide a mold device for stop forming.

Another object of the present invention is to provide a film carrier for transfer resin encapsulation that can be resin encapsulated using the transfer resin encapsulation method described above.

[Means for solving problems]

The transfer resin sealing method for parts to be sealed according to the present invention includes a fixed mold (fixed upper mold 11) and a movable mold (movable lower mold 1).
2) Resin molding cavities (13) provided on both mold surfaces
) is formed into a shape in which substantially the entire surface of the required resin sealing range (6) in the film carrier (1) is sealed with a resin material having a substantially uniform thickness, and a resin that does not melt by heating is placed in the cavity. The material is transferred through its pressure transfer passage (
14), the parts to be sealed on the film carrier fitted and set in the cavity are resin-sealed and molded by injection under pressure.

Further, the mold device for molding transfer resin sealing of parts to be sealed according to the present invention includes a fixed mold (11), a movable mold (12) disposed opposite to the fixed mold, and both molds (11).・12)
- The required number of resin material supply pots and plungers arranged on the left side, and P and L of both types (11 and 12)
Transfer of sealed parts, comprising a required number of resin molding cavities (13) arranged opposite to each other on a surface, and a passageway (14) for transferring molten resin material that communicates between the pot and the cavities (13). In the resin molding mold device, the resin molding cavity (13) is molded by sealing almost the entire surface of the resin sealing range (6) in the film carrier (1) with a resin material having a substantially uniform thickness. The invention is characterized in that it is formed into a shape.

Further, the film carrier (1) for transfer resin sealing of a part to be sealed according to the present invention has an outer lead (2
) and the inner lead (3) and the inner lead (3)
A film carrier comprising a semiconductor chip (4) connected to the side thereof, and a shape-retaining support part ( 7), and the support portion (
7) is characterized in that a passage surface (8) for transferring molten resin material corresponding to the position of the passage (14) for transferring molten resin material in the mold device for transfer resin sealing molding is provided. It is something to do.

[Effect]

According to the method and apparatus of the present invention, when a part to be sealed on a film carrier is fitted and set in a cavity, substantially the entire surface of the resin sealing range on the film carrier is covered with a resin material having a substantially uniform thickness. It will fit into the construction space (both cavities) to be sealed.

Therefore, if the molten resin material is injected into the cavity under pressure in this state, the injected resin material will flow and be filled in the above-described specific configuration spaces (both cavities) in a stable state. It is possible to efficiently and reliably prevent swirling of the molten resin material within the cavity. Therefore, it is possible to reliably prevent the film carrier itself from shaking due to the flow of the molten resin material within the cavity.

Further, according to the film carrier of the present invention, the molten resin material transfer passage surface is placed in the shape-retaining support portion of the film carrier corresponding to the molten resin material transfer passage position in the mold device for transfer resin sealing molding. Since the molten resin material is arranged and configured, the transfer action of the molten resin material to the resin-sealed area of the film carrier is carried out efficiently and smoothly, and the molten resin material does not adhere to the passage surface of the film carrier after resin molding. The solidified resin can be easily removed.

〔Example〕

Next, the present invention will be explained based on the embodiment diagrams shown in FIGS. 1 to 6.

1 and 2 show the main parts of a film carrier 1 used for carrying out the method of the present invention, respectively.

The film carrier is usually made of polyimide film or the like and has a thin wall thickness (approximately 120 μm), and the outer leads 2 and inner leads 3 provided on the film carrier are thicker than this. It is formed with a thin wall thickness (approximately 30 μm).

Furthermore, the inner leads 3 of the film carrier 1 and the semiconductor chip 4 are electrically connected via bumps 5, respectively.

Further, the required resin sealing range 6 in the film carrier 1, that is, the range in which the parts to be sealed such as the inner leads 3 and the semiconductor chip 4 are sealed and molded with a resin material is the outer part provided on the film carrier. The area is arranged to be approximately equal to the area surrounded by the shape-retaining support portion 7 of the lead 2 and the inner lead 3.

In addition, the shape-retaining support part 7 is provided with a passage surface 8 for transferring molten resin material corresponding to a passage position (14) for transferring molten resin material in a transfer resin sealing mold device described later. ing.

Incidentally, one engagement hole 9 for automatic feeding of the film carrier is bored in both side portions of the film carrier 1. In addition, a through hole 10 called a window is formed in the portion surrounded by the shape-retaining support portion 7 described above.

FIGS. 3 and 4 show the main parts of a transfer resin sealing mold apparatus used for carrying out the method of the present invention.

The mold device is provided with a fixed upper mold 11, a movable lower mold 12 arranged opposite to the upper mold, and a required number of cavities 13 arranged opposite to the P and L surfaces of both molds. .

In addition, a required number of resin material supply pots and plungers (not shown) are arranged on the left side of either of the above-mentioned molds (11 and 12), and this pot and the above-mentioned cavity 13
There is a passage 14 for pressure transfer of molten resin material consisting of a runner and a gate or only a gate (see Fig. 1).
is provided.

Further, the resin molding cavity 13 is formed in a shape that allows substantially the entire surface of the resin sealing range 6 of the film carrier 1 to be sealed with a resin material having a substantially uniform thickness.

That is, as shown in FIGS. 3 and 4, a fitting groove 15 for fitting the film carrier 1 is formed in the mold surface of the lower mold 12, and a predetermined position of the fitting groove 15 is formed in the mold surface of the lower mold 12. When the film carrier 1 is fitted into the film carrier, a required resin sealing area 6 of the film carrier is provided so as to be fitted into the cavity of the lower mold 12.

Furthermore, a core portion 16 having a desired shape is provided in the cavity 13 of the upper mold 11, and the shape of the core portion 16 is as follows.
It is formed for the purpose of sealing and molding substantially the entire surface of the resin sealing range 6 described above with a resin material having a substantially uniform thickness.

Hereinafter, a case will be described in which the resin sealing molding of the component to be sealed is performed within the resin sealing range 6 of the film carrier using the film carrier 1 and the mold apparatus.

First, both molds (11 and 12) are opened as shown in FIG. The part to be sealed in the carrier is fitted into the lower mold cavity 13. Note that at this time, the bottom surface of the semiconductor chip 4 within the resin sealing range 6 of the film carrier 1 is configured to be directly bonded to the bottom surface of the cavity of the lower mold 12, so that Thus, the entire part to be sealed that is fitted into the lower mold cavity can be reliably supported.

Next, in this state, both molds (11 and 12) are clamped as shown in Fig. 4, and the resin material supplied into the pot is heated and melted and pressurized with a plunger to melt it. Both the upper and lower cavities 13 are passed through the transfer passage 14.
All you have to do is inject and fill it inside.

By the way, as mentioned above, the parts to be sealed on the film carrier fitted and set in both the upper and lower cavities 13 are
When both of the molds are clamped, substantially the entire surface of the resin sealing range 6 in the film carrier is fitted into the configuration space to be sealed and molded with a resin material having a substantially uniform thickness. .

Therefore, when the molten resin material is injected under pressure into both cavities 13 in this state, the injected resin material flows in a stable state and is filled in the above-mentioned specific configuration spaces, that is, the insides of both cavities 13. Therefore, swirling of the molten resin material in both cavities can be efficiently and reliably prevented. Therefore, it is possible to reliably prevent the film carrier itself from shaking due to the flow of the molten resin material in the cavity. Since it is solidified and formed after a while, both the upper and lower cavities 1
The part to be sealed that has been fitted and set within 3 is sealed and molded within a resin molded body 17 as shown in FIG.

Note that a recess 18 corresponding to the shape of the core portion 16 in the upper mold cavity is formed on the upper surface of the resin molded body 17, but this is because the recess 18 corresponds to the shape of the core portion 16 in the upper mold cavity. The same or different resin material is filled into the recess 18 by normal secondary molding so that the upper surface of the resin molded body 17 is formed as shown in FIG. It may be formed as a smooth surface as shown in FIG.

Further, the thickness of the resin molded body 17 in the vertical direction is slightly thicker due to the recess 18 formed on the upper surface of the film carrier 1, but the recess 18 is not always necessary. Therefore, at least by omitting the recess (18) formed above the upper surface of the film carrier, the resin molded body 17 can be formed to have a thinner upper and lower thickness. That is, in this case, as shown in FIG. 7, the mold surface (
By omitting the cavity (recess for resin molding) that is recessed from the P and L sides and configuring this omitted part to be flush with the surface 21, the resin molded body (17) is lower than the top surface of the film carrier 1. What is necessary is to set it so that it is not formed on the upper part.

Furthermore, in the above embodiment diagram, as described above, the bottom surface of the semiconductor chip 4 within the resin sealing area 6 is directly bonded to the bottom surface of the cavity of the lower mold 12, so the bottom surface of the semiconductor chip 4 is Therefore, the aspect of this embodiment is suitable, for example, when configuring a heat dissipation function on the bottom surface of the semiconductor chip 4. However, when there is no need to configure the heat dissipation function, the semiconductor By molding the chip 4 with resin while being fitted and supported at a predetermined height within the lower mold cavity, the bottom surface of the semiconductor chip 4 can also be molded with resin at the same time.

Furthermore, since the resin sealing range 6 in the film carrier 1 described above is set arbitrarily for each type of film carrier, the molten resin material transfer passage surface 8 in the film carrier 1 shown in the example drawings is Setting position and passage 1 for transferring molten resin material in mold device
The setting position of No. 4 may be selected relatively in accordance with this.

□ In addition, the shape of the core part 16 provided in the cavity 13 of the upper mold 11 is
) When the mold is clamped, the upper surface (flat) side of the part to be sealed is protruded downward from the inside of the upper mold cavity where the upper surface (flat) side is molded with resin.
Further, although the case is shown in which the film carrier 1 is formed in a shape that is fitted into the through hole 10 in the film carrier 1, this shape can be set as appropriate depending on the shape of the part to be sealed.

〔Effect of the invention〕

According to the present invention, it is possible to reliably prevent the film carrier itself from shaking due to the flow effect of the molten resin material pressurized and injected into the cavity, and to perform stable resin molding at all times.

Therefore, even if the parts to be sealed in the film carrier are resin encapsulated using the transfer resin encapsulation molding method and apparatus, a uniform resin encapsulation molding effect can be obtained, which eliminates the conventional problems described above. This has excellent practical effects such as being able to reliably solve the problem and obtain a resin-sealed molded product with high quality and high reliability.

In addition, it becomes possible to use a transfer resin encapsulation molding method and apparatus for resin encapsulation of parts to be encapsulated in a film carrier, and low-pressure molding resin materials such as epoxy resin can be used. For example, ■It is possible to improve the quality of molded products.

■The use of resin tablets makes it easier to handle the resin material, and also shortens the curing time without limiting the pot life, improving production efficiency.

■Production costs can be reduced.

It has excellent practical advantages such as:

Furthermore, since the present invention can provide a film carrier that can be used in the above-described transfer resin encapsulation molding method and apparatus, by using this together, it will contribute to the improvement of this type of resin encapsulation molding technology. There is an effect that can be done.

[Brief explanation of the drawing]

FIG. 1 is a partially cutaway plan view showing essential parts of a film carrier for transfer resin sealing molding according to the present invention. FIG. 2 is an enlarged longitudinal sectional front view taken along the line ■-■ in FIG. 1. FIG. 3 is a longitudinal sectional front view showing the main parts of the mold device for transfer resin sealing molding according to the present invention, showing both molds in an open state. FIG. 4 is a longitudinal sectional front view corresponding to FIG. 3, showing both molds in a clamped state. FIG. 5 is a partially cutaway longitudinal sectional front view showing the main parts of the resin-sealed molded product. FIG. 6 is a partially cutaway longitudinal sectional front view showing the main part of another example of a resin-sealed molded product. FIG. 7 is a longitudinal sectional front view showing the main parts of another example of the mold device;
Only the upper mold part is shown. FIG. 8 is a longitudinal sectional front view showing the main parts of a conventional mold device for sealing with a transfer resin using a lead frame, and shows both molds in an open state. FIG. 9 is a longitudinal sectional front view corresponding to FIG. 8, showing both molds in a clamped state. [Explanation of symbols] 1... Film carrier 2... Outer lead 3... Inner lead 4... Semiconductor chip 5... Bump 6... Resin sealing range 7... Support part 8. ...Transfer passage surface 11...Fixed upper die 12...Movable lower die 13...Cavity 14...Transfer passage 15...Fitting groove 16...Core part 17...Resin Molded object

Claims (3)

[Claims] (1) The resin molding cavities provided on both the fixed mold surface and the movable mold surface are configured so that substantially the entire surface of the required resin sealing range in the film carrier is sealed with a resin material of approximately uniform thickness. At the same time, by pressurizing and injecting a heated and melted resin material into the cavity through the pressurized transfer passage, the part to be sealed on the film carrier fitted and set in the cavity is resin-sealed and molded. A transfer resin encapsulation molding method for a part to be encapsulated, characterized in that: (2) a fixed mold, a movable mold disposed opposite to the fixed mold, a required number of resin material supply pots and plungers disposed on either side of both molds, P of both molds; A mold device for transfer resin encapsulation molding of parts to be sealed, comprising a required number of resin molding cavities arranged opposite to each other on the L side, and a passageway for transferring molten resin material that communicates between the pot and the cavity. The resin molding cavity is formed in a shape in which substantially the entire surface of the resin-sealed area of the film carrier is sealed with a resin material having a substantially uniform thickness. Mold equipment for transfer resin sealing molding. (3) A film carrier equipped with an outer lead, an inner lead, and a semiconductor chip connected to the inner lead side, for shape preservation that surrounds the required resin sealing area of the film carrier. A support part is provided, and the support part is provided with a molten resin material transfer passage surface corresponding to the molten resin material transfer passage position in the transfer resin sealing mold device. Features: Film carrier for transfer resin sealing of parts to be sealed.