JPH01202677A - Apparatus for testing semiconductor circuit - Google Patents

Abstract

PURPOSE:To easily confirm the contact state of a probe needle with a microwave semiconductor circuit, by connecting the first and second earthing lines of the probe needle to a resistance measuring device. CONSTITUTION:Resistance measuring devices 12a, 12b are respectively connected to the first and second earthing lines 8a, 8b of a probe needle 10 and constituted by mounting a condenser 13 for earthing the lines 8a, 8b in a high frequency like manner, a power supply 14, a voltmeter 15 and an ammeter 16. After the probe needle 10 is brought into contact with a microwave semiconductor circuit 1, the power supply 14 is closed to read the values of both of the voltmeter 15 and the ammeter 16. By this method, the contact resistance values of the lines 8a, 8b and the first and second earthing electrodes 4a, 4b are indivisually measured to be compared with a reference value. When both resistance values are within a predetermined range, it is judged that the contact of the lines 7, 8a, 8b of the probe needle 10 with the electrodes 3, 4a, 4b of the semiconductor circuit 1 is well.

Description

[Detailed Description of the Invention] <Industrial Application Field> The present invention provides a signal electrode on a semiconductor substrate and an eleventh electrode on both sides of the signal electrode.
The present invention relates to a test device for examining the characteristics of a microwave semiconductor circuit in which a coplanar line provided with a second grounding electrode is formed.

<Prior Art> As shown in FIG. 3, the microwave semiconductor circuit I has a coplanar structure in which a signal electrode 3 is provided on a semiconductor substrate 2, and first and second grounding electrodes 4a and 4b are provided on both sides of the signal electrode 3. Some have a track 5 formed thereon. Note that the first and second grounding electrodes 4a
, 4b are connected to a grounding electrode formed on the back surface of the semiconductor substrate 2 through a via hole or the like.

When investigating the characteristics of such a microwave semiconductor circuit 1, the signal electrode 3, the eleventh second grounding electrode 4a,
A test device is used that includes a probe needle 10 in which a signal line 7 and eleventh and second grounding lines 8a and 8b are formed corresponding to the ground lines 4b and 4b, respectively.

During the test, the signal line 7 of the probe needle IO, the eleventh and second grounding lines 8a and 8b are connected to the signal electrode 3 of the microwave semiconductor circuit l and the first and second grounding electrodes 4as, respectively.
4b, a high frequency signal in the microwave band is introduced into the microwave semiconductor circuit from the signal line 7 of the test device to perform various tests.By the way, when testing a microwave semiconductor circuit, the signal electrode 3 and The signal line 7, the eleventh second grounding electrodes 4a, 4b, and the eleventh second grounding line 8a.

If the contacts 8b are not properly contacted, it will not be possible to accurately measure the high frequency signal in the microwave band.

Therefore, during the test, it is necessary to confirm in advance whether the probe needle IO is in good contact with the microwave semiconductor circuit l.

Conventionally, to check the contact status of a probe needle, the contact area was magnified using a microscope and a person had to directly observe it, which hindered automation and labor-saving measurements.

The present invention has been made in view of the above circumstances, and it is possible to easily confirm whether or not the probe needle is properly contacting the microwave semiconductor circuit, thereby improving automation,
In order to achieve the above-mentioned object, the present invention provides a signal line corresponding to the signal electrode and the first and second grounding electrodes of a microwave semiconductor circuit in which a coplanar line is formed. The present invention is characterized in that it includes a probe needle on which an eleventh second grounding line is formed, and a resistance measuring device is connected to the eleventh second grounding line of the probe needle.

<Function> In the above configuration, during a test, after the probe needle is brought into contact with the microwave semiconductor circuit, the first and second
The contact resistance values between the grounding line and the first and second grounding electrodes on the circuit side are individually measured, and these values are compared with a reference value.

If both resistance values are within a predetermined appropriate range, it can be determined that the contact between each line of the probe needle and each electrode of the microwave semiconductor circuit is good.

<Embodiment> FIG. 1 is a block diagram showing the main parts of a microwave semiconductor circuit and its testing apparatus, and parts corresponding to the conventional example shown in FIG. 3 are given the same reference numerals. In Figure 1,
l is a microwave semiconductor circuit, 2 is a semiconductor substrate, 3.4a
, 4b are first and second grounding electrodes provided above the signal electrode and on both sides thereof, and the signal electrode 3 and the first and second grounding electrodes 4a.

4b forms a coplanar line 5. IO is a probe needle provided in the semiconductor circuit testing apparatus, and the signal electrode 3 of the microwave semiconductor circuit 1 and the first and second grounding electrodes 4a are attached to this probe needle 10'.

A signal line 7 and eleventh and second ground lines 8a and 8b are formed corresponding to the ground lines 4b, respectively.

The feature of this embodiment is that a resistance measuring device 12a is connected to each of the eleventh and second grounding lines 8a and 8b of the probe needle lO.
, 12b are connected. Each resistance measuring device 12a, 12b has first and second grounding lines 8a, 8b.
Capacitor 13 added to ground at high frequency
, a power source 14, a voltmeter 15, and an ammeter 16.

In the above configuration, during testing, after bringing the probe needle 10 into contact with the microwave semiconductor circuit 1, each resistance measuring device 12a
Turn on the power supply 14 of 112b and check the voltmeter 15 and ammeter 16.
By reading the value of the first and second grounding lines 8
The contact resistance values between a and 8b and the eleventh second grounding electrode 4a14b are individually measured, and these values are compared with a reference value.

If both resistance values are within a predetermined appropriate range, it is determined that the contact between each line 7.8a, 8b of the probe needle IO and each electrode 3.4a, 4b of the microwave semiconductor circuit 1 is good. . That is, as shown in FIG. 2(a), if the lines 7.8a and 8b of the probe needle 10 are in good contact with the electrodes 3.4a and 4b on the circuit side, no measurement is possible. Both resistance values are within the appropriate range. On the contrary,
If the probe needle is tilted as shown in Figure (b) or Figure (C), either resistance measuring device 1
Since the contact resistance value obtained in 2a or 12 becomes large, it can be determined that the probe needle is not in proper contact. Although the contact resistance value between the signal line 7 of the probe needle 10 and the signal electrode 3 on the circuit side was not measured,
If the grounding lines 8a and 8b on both sides of the signal line 7 are in good contact, the signal line 7 will inevitably be in good contact, so the contact state can be determined without particularly measuring the contact resistance value. There is no problem when determining the quality of the product.

<Effects of the Invention> According to the present invention, the quality of the contact between the probe needle and the microwave semiconductor circuit can be determined by checking the contact state between the probe needle's first and second grounding lines and the first and second grounding electrodes on the circuit side. Since the contact resistance value is determined by individually measuring it with a resistance measuring device, it is much easier to check whether the contact condition is good or bad than before, and automation of measurement and labor savings are achieved. Excellent effects such as making it possible to do this are achieved.

[Brief explanation of the drawing]

Figure 1 is a configuration diagram showing the main parts of a microwave semiconductor circuit and its testing equipment, Figure 2 is an explanatory diagram showing the contact state between each line of the probe needle and each electrode of the microwave semiconductor circuit, and Figure 3 is an explanatory diagram showing the contact state between each line of the probe needle and each electrode of the microwave semiconductor circuit. FIG. 1 is a configuration diagram showing an example of a conventional test device. l...Microwave semiconductor circuit, 2...Semiconductor substrate,
3...Signal electrode, 4a, 4b...Grounding electrode, 7.
...Signal lines, 8a, 8b...Grounding lines, 10...
- Probe needles, 12a, 12b...resistance measuring device. Figure 3 Procedural Amendment (Voluntary) July 7, 1999 2. Name of invention Semiconductor circuit testing equipment: 3. Ministry of HLI City. Relationship to the case Patent applicant zip code +00 Address 2-2-3-4 Marunouchi, Chiyoda-ku, Tokyo Agent zip code 100 Address Mitsubishi Electric Corporation, 2-2-3 Marunouchi, Chiyoda-ku, Tokyo Name (7375) Masuo Oiwa, Patent Attorney (External 2)
Name) (Contact 03 (213) 3421 Patent Department) 5,? 1
1) Date of positive order Voluntary 1ili positive 6, hli i
Number of inventions increased by f- None 7, hli
Positive subject 8, content of amendment (1) The "Claims" column of the specification is amended as shown in the attached sheet. (2) The column "Detailed explanation of one invention" in the specification is amended as follows. Page 1, lines 17 to 18 of the specification, 2nd page of the specification
Delete the word "coplanar" in three places: the fourth line of the page and the third line of the fifth page of the specification. Claims (1) after the above amendment: A signal electrode on a semiconductor substrate and a first electrode on both sides thereof.
; A test device for testing the characteristics of a microwave semiconductor circuit in which a second grounding electrode is provided to form a narrow path, the test device being provided with a second grounding electrode corresponding to the signal electrode and the first and second grounding electrodes, respectively. 1. A semiconductor circuit testing device comprising: a probe needle having a signal line and first and second grounding lines formed thereon; and a resistance measuring device connected to the first and second grounding lines of the probe needle.

Claims (1)

[Claims] (1) A test device for examining the characteristics of a microwave semiconductor circuit in which a coplanar line is formed on a semiconductor substrate and includes a signal electrode and first and second grounding electrodes on both sides thereof, the signal electrode and a probe needle in which a signal line and first and second grounding lines are formed corresponding to the first and second grounding electrodes, respectively, and resistance measurement is performed on the first and second grounding lines of the probe needle. A semiconductor circuit testing device characterized in that a device is connected to the device.