JPH01199436A - Semiconductor device - Google Patents

Abstract

PURPOSE:To prevent the flow of a brazing metal to other component mounting parts at the time of mounting of a semiconductor chip and to contrive the improvement of the reliability of a semiconductor device by a method wherein protrusion parts are respectively provided at parts, which come into contact to the other component mounting parts, of a chip mounting part. CONSTITUTION:In a semiconductor device provided with a case 3 comprising a chip mounting part 1 for mounting a semiconductor chip and other component mounting parts 2 for mounting other components other than the semiconductor chip, protrusion parts 4 are respectively provided at parts, which come into contact to the mounting parts 2, of the mounting part 1. For example, in a field-effect transistor provided with the case 3 comprising the mounting part 1 for mounting a transistor chip, which is used as the semiconductor chip, and the mounting parts 2 for mounting other components other than the transistor chip, such as a dielectric substrate provided with strip lines for an internal matching circuit and a chip capacitor, the protrusion parts 4 are respectively provided at parts, which come into contact to the mounting parts 2 and are located in the input/output direotions, of the mounting part 1.

Description

[Detailed description of the invention] [Industrial application field] The present invention is utilized in the field of semiconductor devices.

The present invention relates to a semiconductor device, and more particularly to a field effect transistor with an improved case and a high output internal matching circuit.

〔overview〕

The present invention provides a semiconductor device having a case including a chip mount section for mounting a semiconductor chip, and an other component mount section for mounting a component other than the semiconductor chip, wherein the chip mount section is in contact with the other component mount section. By providing protrusions on the parts, it is possible to prevent brazing material from flowing to other component mounting parts when mounting a semiconductor chip, thereby improving reliability.

[Conventional technology]

Conventionally, in the case of field-effect transistors using internal matching circuit materials, the chip mount part that mounts the transistor chip is used as a component mount part that mounts other components other than the transistor chip, such as a dielectric substrate forming a strip line or a chip capacitor. The chip mount part was either flat or had a raised chip mount part.

FIGS. 2(a) and 2(a) are diagrams showing the structure of such a conventional example; FIG. 2(a) is a top view, and FIG.
FIG. The case 3 includes a chip mount section 1 and an other component mount section 2, and the chip mount section 1 is higher than the other component mount section 2.

[Problem that the invention seeks to solve]

In the semiconductor device having the conventional case shape mentioned above, the chip mount part is either flat with the other component mount parts or the entire chip mount part is raised, so when mounting the transistor chip, the chip mount The brazing material flows to the mounting area of other components, which deteriorates the mounting condition of the transistor chip and further causes short circuits to other components, resulting in a reduction in reliability.

SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor device in which the reliability is improved by eliminating the above-mentioned drawbacks so that the brazing material does not flow to other component mounting parts when mounting a semiconductor chip.

[Means for solving problems]

The present invention provides a semiconductor device having a case including a chip mount section for mounting a semiconductor chip and an other component mount section for mounting a component other than the semiconductor chip, in which the other component mount section of the chip mount section has A feature is that a protrusion is provided at the contacting part.

[Effect]

Since the protrusion is provided at the part of the chip mount part that contacts the other component mount part, it prevents the brazing material from flowing when the semiconductor chip is mounted.

Therefore, the semiconductor chip is firmly fixed, and short circuits do not occur to other components, making it possible to improve reliability.

〔Example〕

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1(a) is a top view showing essential parts of an embodiment of the present invention;
FIG. 1(b) is a sectional view taken along the line AA', showing the case of a field effect transistor for an internal matching circuit.

This embodiment includes a chip mount part 1 for mounting a transistor chip (not shown) as a semiconductor chip, and other components other than the transistor chip, such as a dielectric substrate provided with a strip line for an internal matching circuit and a chip capacitor. In a field effect transistor having a case 3 including a component mount section 2 for mounting the chip mount section 1, a protrusion 4 is provided at a portion of the chip mount section l in the input/output direction that is in contact with the component mount section 2.

The feature of the present invention is that in FIGS. 1(a) and (b),
This is because the protrusion 4 is provided.

According to this embodiment, the flow of brazing material that occurs when a transistor chip is mounted on the chip mount portion 1 is blocked by the protrusion portion 4, and flow to other component mount portions is completely prevented.

〔Effect of the invention〕

As explained above, the present invention prevents low-phase flow when mounting a semiconductor chip and makes the chip mount stable and reliable by providing a protrusion on the part of the chip mount that contacts the other component mount. Moreover, short circuits do not occur in other parts, and the reliability of the semiconductor device is improved.

[Brief explanation of the drawing]

FIG. 1(a) is a top view showing essential parts of an embodiment of the present invention;
Figure 1 (company) is the AA' cross section. Fig. 2 (a) is a top view showing the main parts of the conventional example, Fig. 2 et al.)
is a sectional view taken along line AA'. DESCRIPTION OF SYMBOLS 1...Chip mount part, 2...Other component mount part, 3...Case, 4...Protrusion part. Patent applicant: NEC Corporation7. − Agent Patent Attorney Nao Takashi Ide ゛1: +-Noah Mount Ya 3: Case 2: Ground Parts Mount s 4
: A-Kr side view of Yuki part (b) Structural shoulder of Issei example 1 Figure 1: +-, mount part 3: Case 2: Ali parts mount part (a) A-A'Fr side view (b) Figure 2 of the conventional example

Claims (1)

[Claims] 1. A chip mount section (1) for mounting a semiconductor chip;
) and a case (3) including an other component mount part (2) for mounting a component other than the semiconductor chip, the semiconductor device having a protrusion in a part of the chip mount part that comes into contact with the other component mount part. A semiconductor device characterized by providing (4).