JPH01154527A - Marking apparatus - Google Patents

Abstract

PURPOSE:To enable superior marking, by pressing an ink ribbon to which ink is attached, to a wafer surface by using a head, and transferring the ink to the wafer surface to perform marking. CONSTITUTION:The title marking equipment 1 has an ink ribbon 2 moved by a feeding mechanism, and the ink ribbon is arranged close to a wafer 11 surface so as to face it. In the rear of the ink ribbon, a pinlike thermal head 3 is arranged, which is moved laterally by a driving mechanism 4, and constituted in such a manner as to protrude against the ink ribbon. At the time of marking, the thermal head is electromagnetically protruded in the direction of wafer. As a result, the ink ribbon is locally pressed on the chip surface, which is locally heated. Thereby thermosensitive ink is thermally transferred on the chip, and marking is performed, so that constant marking is stably enabled.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an apparatus for marking electrically defective chips in a wafer sorting process for semiconductor integrated circuits.

[Conventional technology]

Generally, in the wafer sorting process for semiconductor integrated circuits, markings are made on the surfaces of electrically defective chips to serve as marks in subsequent processes. Conventionally, this type of marking method uses a scratch method in which the chip surface is scratched with a needle, and an ink method in which marking is performed by dropping ink onto the chip surface.

[Problem that the invention seeks to solve]

Among the conventional marking methods mentioned above, the former scratch method scratches the surface of the chip with a needle, which causes the following problems: ■ Scratch dust is likely to come out; ■ Scratches are inconsistent, making subsequent recognition difficult; ■ Poor adjustment. There is a problem that the wafer may crack. Furthermore, since the latter one-type ink ink drips ink from a narrow nozzle, there are problems such as (1) ink dries at the mouth of the nozzle and no ink comes out, and (2) liquid scatters and causes stains.

An object of the present invention is to provide a marking device that solves all of the above-mentioned problems and enables suitable marking.

[Means for solving problems]

The marking device of the present invention includes an ink ribbon placed opposite to a wafer to be marked and to which ink to be marked is attached, and a needle-like head that presses the ink ribbon against the wafer surface to transfer the ink to the wafer surface. It is equipped with

Here, the head may be a thermal head that thermally transfers the ink or a head that transfers the ink using pressing force.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

The figure is a schematic configuration diagram of an embodiment of the present invention. In the figure, 11 is a wafer to be marked, and markings are applied to the surfaces of chips that have become electrically defective in the sorting process. Further, 1 is a marking device, and only the main part thereof, that is, the marking part is shown here.

The marking device 1 has an ink ribbon 2 that is moved in the length direction by a feeding mechanism (not shown), and the ink ribbon 2 is arranged close to the surface of the wafer 11 so as to face it. This ink ribbon 2 has a thickness of, for example, 0.5 mm.
A so-called heat-sensitive ink, in which dyed toner is wrapped in resin, is adhered to a plastic film with a width of 1 mm.

Further, a needle-shaped thermal head 3 is disposed at the rear of the ink ribbon 2, and its drive mechanism 4 electromagnetically moves the thermal head 3 in the lateral direction in the drawing, and directs it towards the ink ribbon 2. It is configured so that it sticks out. Here, the thermal head is made of a 1 mm iron needle.

Further, the thermal head 3 is electrically heated.

According to this marking device, when marking a defective chip on a wafer 11, the thermal head 3 is electromagnetically protruded toward the wafer to locally press the ink ribbon 2 onto the chip surface, and the ink ribbon 2 is Localized heating. As a result, the toner of the ink ribbon 2 is thermally transferred to the defective chip/tube, and marking is performed.

Note that the ink ribbon is wound on a reel (not shown), and a new part is moved to a position facing the thermal head 3 to form the next marking part. Therefore, with this marking device, it is not possible to always perform constant marking stably. , it is possible to accurately recognize defective chips in subsequent processes. In addition, the marking method using this device does not require scratching the wafer surface and does not use liquid ink.
Unlike conventional scratching methods, there is no generation of dust, unrecognizability due to uneven scratches, or cracking of the wafer, etc.
Also, unlike the ink method, clogging due to ink does not cause stains or the like.

Here, as the ink ribbon 2, a plastic film base coated with a mixture of adhesive and black dye may be used, and as the thermal head 3, a head having a simple needle structure may be used. good. In this configuration, by pressing the head against the defective chip and press-fitting the ink ribbon, the adhesive dyed black is transferred from the base to the defective chip, and can also be used as a marking.

[Effects of the Invention] As explained above, the present invention is configured to press an ink ribbon to which ink is adhered to the wafer surface using a head, and to transfer the ink to the wafer surface to perform marking. Therefore, all the problems caused by the conventional scratch method and ink method can be solved, and there is an effect that suitable marking can be performed.

[Brief explanation of the drawing]

The figure is a schematic configuration diagram of a marking device of the present invention. 1... Marking device, 2... Ink ribbon, 3...
... Thermal head, 4... Drive mechanism.

Claims (1)

[Claims] (1) An ink ribbon placed opposite the wafer to be marked and to which ink to be marked is attached, and a needle-shaped head that presses the ink ribbon against the wafer surface to transfer the ink to the wafer surface. A marking device characterized by: