JPH01148871U - - Google Patents
Info
- Publication number
- JPH01148871U JPH01148871U JP4646788U JP4646788U JPH01148871U JP H01148871 U JPH01148871 U JP H01148871U JP 4646788 U JP4646788 U JP 4646788U JP 4646788 U JP4646788 U JP 4646788U JP H01148871 U JPH01148871 U JP H01148871U
- Authority
- JP
- Japan
- Prior art keywords
- inspection
- test
- wiring board
- printed wiring
- probe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007689 inspection Methods 0.000 claims description 11
- 239000000523 sample Substances 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Testing Electric Properties And Detecting Electric Faults (AREA)
Description
第１図は本考案の実施例のプリント配線板の布
線検査装置の正面図、第２図は第１図の検査制御
部のブロツク図である。
１……被検査プリント配線板、２……位置決め
用ピン、３……検査プローブ、４……ブロツク、
５……検査ヘツド部、６……コネクタ、７……Ｐ
−ＲＯＭボード、８……コネクタ、９……検査制
御部、１０……プロセツサ、１１……メモリ、１
２……入出力インターフエース、１３……プロー
ブインターフエース、１４……Ｐ−ＲＯＭインタ
ーフエース、１５……内部データバス、１６……
フロツピイデイスク。
FIG. 1 is a front view of a printed wiring board wiring inspection apparatus according to an embodiment of the present invention, and FIG. 2 is a block diagram of the inspection control section of FIG. 1. 1... Printed wiring board to be inspected, 2... Positioning pin, 3... Inspection probe, 4... Block,
5...Inspection head part, 6...Connector, 7...P
-ROM board, 8...Connector, 9...Test control unit, 10...Processor, 11...Memory, 1
2...I/O interface, 13...Probe interface, 14...P-ROM interface, 15...Internal data bus, 16...
Flotspie disc.
Claims (1)
導体位置に対応させて設けた検査ヘツド部と、情
報媒体より入力したプリント配線板上のＸＹ座標
値による検査点情報を前記検査プローブの番号に
変換し、該当するプローブからの電気特性を検査
する検査制御部とを備え、前記検査ヘツド部が前
記検査制御部より取り外すことが可能な着脱構造
であつて、前記ＸＹ座標値による検査点情報を前
記検査プローブの番号に変換するための交換テー
ブル情報を、前記検査ヘツド部に有していること
を特徴とするプリント配線板の布線検査装置。 A test head section is provided with a large number of test probes corresponding to the conductor positions of the printed wiring board to be tested, and the test point information based on the XY coordinate values on the printed wiring board inputted from the information medium is converted into the number of the test probe. and an inspection control section for inspecting the electrical characteristics from the corresponding probe, the inspection head section being detachable from the inspection control section, wherein the inspection point information based on the XY coordinate values is used for the inspection A wiring inspection device for a printed wiring board, characterized in that the inspection head section includes exchange table information for converting into a probe number.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4646788U JPH01148871U (en) | 1988-04-05 | 1988-04-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4646788U JPH01148871U (en) | 1988-04-05 | 1988-04-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01148871U true JPH01148871U (en) | 1989-10-16 |
Family
ID=31272735
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4646788U Pending JPH01148871U (en) | 1988-04-05 | 1988-04-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01148871U (en) |
-
1988
- 1988-04-05 JP JP4646788U patent/JPH01148871U/ja active Pending
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