JPH01145888A - Printed wiring substrate - Google Patents

Abstract

PURPOSE:To supply power without voltage drop to an electronic component placed on a printed wiring substrate and to reduce the number of layers of the substrates by employing a superconducting material as all or part of the conductor section of the substrate. CONSTITUTION:All of a conductor 2 or a conductor 2a for a power source and a conductor 2c for a ground are composed of a superconducting material, and a whole printed wiring substrate 1 is held at the critical temperature or lower of the superconducting material. Since a voltage drop at the material is zero, a conductor having a wide area is not required as a conductor 2b for supplying power and the conductor 2c for the ground, and the pattern for supplying power and a ground pattern can be formed on the same layer as a signal pattern. Leads 8 for supplying power are connected to the conductor 2b, leads 9 are connected to the conductor 2c, thereby supplying power without voltage drop the an electronic component 6.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a printed wiring board on which electronic components are mounted.

[Prior Art] Fig. 3 is a cross-sectional view showing a conventional printed wiring board, in which (1) is a printed wiring board, (2a) is a signal conductor forming a signal pattern, and (3) is a signal conductor forming a signal pattern. Electrical conductor for power supply, (4
) is a grounding conductor, and (5a), (5b), and (5c) are insulating layers. Note that the conductors (2a), (3), and (4) are made of normal conductors.

FIG. 4 is a perspective view showing a state in which electronic components are mounted on a conventional printed wiring board, and a portion thereof is shown in a partially cutaway view. In FIG. 4, the same symbols as in FIG. 3 indicate the same or corresponding parts, and (
6) is an electronic component, (7) is a signal lead, (8) is a power supply lead, and (k) is a grounding lead.

The electronic components (6) mounted on the printed wiring board (1) are
The number leads (7) are connected to each other by a signal conductor (2a) forming a signal pattern to form a predetermined electronic circuit. On the other hand, in order to reduce the voltage drop caused by the power supply conductor (3) when supplying power to the electronic component (6), the power supply conductor is placed on one side of a layer different from the pattern of the signal conductor (2a). (3), and this power supply conductor 3
) is connected to the power supply lead (8) of the electronic component. Regarding grounding, similarly, the grounding conductor (4) spread on the inner layer of the printed wiring board (1) and the grounding lead (9) of the electronic component (6) are connected.

[Problems to be solved by the invention] Since the conventional printed wiring board is configured as described above,
A problem arises in that a dedicated conductor layer is required for power supply and grounding, and the number of layers of the printed wiring board must be increased for this purpose. Further, even if the voltage drop is reduced in this way, the voltage drop cannot be reduced to zero, so there is a problem that there is a possibility that harmful coupling or the like may occur due to the power supply circuit.

This invention was made in order to solve the above-mentioned problems in the conventional ones, and its purpose is to obtain a printed wiring board that can supply power and ground to electronic components without providing a dedicated layer. There is.

[Means for Solving the Problems] In the present invention, all the conductors on the printed wiring board, or the power supply conductor and the grounding conductor, are made of a superconducting material, and the printed wiring board is made of superconducting material. I tried to keep it below temperature.

[Operation: Since it is a superconducting material, there is no voltage drop. Furthermore, if a superconducting material whose critical temperature is above room temperature is used, a cooling device can be omitted.

[Examples] Examples of the present invention will be described below with reference to the drawings. 1st
The figure is a sectional view showing an embodiment of the present invention, and Fig. 2 is a perspective view showing an embodiment of the invention.
The same symbols as in Fig. 4 indicate the same or corresponding parts, (2)
represents a conductor in general, (2b) is a power supply conductor forming a power supply pattern, and (2c) is a grounding conductor forming a grounding pattern.

The entire conductor (2), or the power supply conductor (2a) and the ground conductor (2C) are made of a superconducting material, and the entire printed wiring board (1) is kept below the critical temperature of this superconducting material. Since the voltage drop in superconducting materials is zero, there is no need for conductors with large areas as the power supply conductor (2b) and the grounding conductor (2c), and therefore the power supply pattern and the grounding pattern can also be used for signals. It can be formed on the same layer as the pattern.

Connect the power supply lead (8) to the power supply conductor (2b) and connect the grounding lead (9) to the grounding conductor (2C) to provide a voltage drop-free power source to the electronic component (6). can be supplied.

In the above embodiment, the case where there are two signal layers has been described, but it goes without saying that the present invention can be applied to a case where there are more layers. Further, the signal conductor (2a) may be made of a superconducting material or a normal conducting material.

[Effects of the Invention] As described above, according to the present invention, all or part of the conductive portion of the printed wiring board is constructed using a superconducting material, so that
It is possible to supply power without voltage drop to electronic components mounted on a printed wiring board, and it is also possible to reduce the number of printed wiring boards.

[Brief explanation of the drawing]

Fig. 1 is a sectional view showing an embodiment of the present invention, Fig. 2 is a perspective view showing an embodiment of the invention, Fig. 3 is a sectional view showing a conventional printed wiring board, and Fig. 4 is a sectional view showing a conventional printed wiring board. FIG. 2 is a perspective view showing a state in which electronic components are mounted on a printed wiring board. (1) is a printed wiring board, (2) is a conductor, (2a) is a signal conductor, (2b) is a power supply conductor, (2c) is a grounding conductor, and (5) is an insulating layer. , (6) is an electronic component, (
, 7) is a signal lead, (8) is a power supply lead, (
9) is the grounding lead. Note that the same reference numerals in the figures indicate the same or corresponding parts.

Claims (1)

[Claims] In a printed wiring board on which electronic components are mounted, all or part of the conductor portion of the printed wiring board is constructed using a superconducting material, and the temperature of the printed wiring board is maintained below the critical temperature of the superconducting material. Characteristic printed wiring board.