JPH01132766A - Substrate attaching/detaching device - Google Patents

Substrate attaching/detaching device

Info

Publication number
JPH01132766A
JPH01132766A JP29084087A JP29084087A JPH01132766A JP H01132766 A JPH01132766 A JP H01132766A JP 29084087 A JP29084087 A JP 29084087A JP 29084087 A JP29084087 A JP 29084087A JP H01132766 A JPH01132766 A JP H01132766A
Authority
JP
Japan
Prior art keywords
substrate
cap
opening
hand
finger
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP29084087A
Other languages
Japanese (ja)
Other versions
JPH0557352B2 (en
Inventor
Shinichi Yamabe
真一 山辺
Shiro Takigawa
滝川 志朗
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinmaywa Industries Ltd
Original Assignee
Shin Meiva Industry Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Meiva Industry Ltd filed Critical Shin Meiva Industry Ltd
Priority to JP29084087A priority Critical patent/JPH01132766A/en
Publication of JPH01132766A publication Critical patent/JPH01132766A/en
Publication of JPH0557352B2 publication Critical patent/JPH0557352B2/ja
Granted legal-status Critical Current

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Abstract

PURPOSE:To mount a substrate by robot handling to a substrate holder by inserting the finger parts provided to hand parts into the notches formed to the circumferential edges of caps and expanding the finger parts, thereby holding the substrate from the inside. CONSTITUTION:A cap 10 in a cap housing body 7 is sucked by means of a vacuum chuck 35 of a 1st robot 15. The finger parts 36-38 are inserted into the notches 22-24 formed to the circumferential edge of the cap 10. Arms 31-33 and the hand parts 34 are turned to the position G and the cap 10 is fitted to the aperture of the substrate 2a in an untreated substrate housing body 1 while the cap 10 is kept sucked and held. The substrate 2a is held from the inside by expanding the finger parts 36-38 and while the substrate 2a and the cap 10 are kept held, the arms 31-33 and the hand parts 34 are turned to the position H, where the substrate 2a is mounted on the substrate holder 6 on a conveyor 5. The holding of the substrate 2a is released by closing the finger parts 36-38 and the holding of the cap 10 is released by removing the vacuum chuck 35.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は基板着脱装置に関し、中央に開口部を有する基
板と、この基板の開口部を閉塞するキャップと、前記基
板を装着して真空槽内に搬入する基板ホルダとがそれぞ
れ製造ラインの所定位置に配置されたスパッタリングの
処理工程において利用される。
DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a substrate attachment/detachment device, which includes a substrate having an opening in the center, a cap for closing the opening of the substrate, and a vacuum chamber in which the substrate is attached. The substrate holders carried into the chamber are respectively placed at predetermined positions on the manufacturing line and used in the sputtering process.

(従来の技術) 一般的なスパッタリングの様子を第5図に示す。(Conventional technology) FIG. 5 shows a typical sputtering process.

同図において、aは基板、bは基板ホルダ、C5dは基
板aを介して対向配置されたターゲット、eは基板aを
紙面に垂直方向に移動させるための搬送コンベアである
In the figure, a is a substrate, b is a substrate holder, C5d is a target disposed opposite to each other with the substrate a in between, and e is a conveyor for moving the substrate a in a direction perpendicular to the plane of the paper.

このように、基板aを真空槽内で2つの独立したターゲ
ラ)c、dにより両面同時にスパッタリングする場合、
各ターゲットc、dからのスパンタプラズマが互いに影
響を与えないように、基板aの全周に基板ホルダbを配
して間仕切る形をとる。
In this way, when sputtering both sides of substrate a simultaneously using two independent targeters (c and d) in a vacuum chamber,
A substrate holder b is arranged around the entire circumference of the substrate a to partition the substrate a so that the spanner plasmas from the targets c and d do not affect each other.

ところで、基板aそのものに穴fが開いている場合には
、第6図に示すように、この穴fにセンターマスクgを
付ける。このセンターマスクgは、円盤の周縁の1ケ所
を中心まで切り込み、この切り込み部の両側部分を同一
方向に曲げ起こしてつまみ片り、iを形成したもので、
このつまみ片り。
By the way, if the substrate a itself has a hole f, a center mask g is attached to the hole f, as shown in FIG. This center mask g is made by cutting one place on the periphery of a disk to the center, and bending both sides of this cut in the same direction to form a knob piece i.
This knob piece.

iを手でつまんで基板aの穴rに挿入し、該穴f内で手
を離すことによってセンターマスクgを穴fの周縁に当
接させ、穴fを閉塞するものである。
The center mask g is brought into contact with the periphery of the hole f by inserting it into the hole r of the substrate a by grasping it with the hand and releasing the hand within the hole f, thereby closing the hole f.

(発明が解決しようとする問題点) ところが、基板aを基板ホルダbに装着するために、ロ
ボットでハンドリングする場合、通常、基板aを六fの
内側から掴む場合が多く、このとき、センターマスクg
が邪魔になってロボットハンドリングが行えないといっ
た問題があった。
(Problem to be Solved by the Invention) However, when the substrate a is handled by a robot in order to be mounted on the substrate holder b, the substrate a is usually grasped from the inside of the 6F, and at this time, the center mask g
There was a problem that robot handling could not be performed because the robot was in the way.

(問題点を解決するための手段) 本発明の基板着脱装置は、中央に開口部を有する基板と
、この基板の開口部を閉塞するキャンプと、前記基板を
装着して真空槽内に搬入する基板ホルダとがそれぞれ製
造ラインの所定位置に配置されたスパッタリングの処理
工程において、前記キャップを保持して前記基板の開口
部に嵌め合わせ、この状態で前記基板と前記キャンプと
を保持して前記基板ホルダに前記基板を装着するハンド
部が設けられ、前記キャップはその周縁部に複数個の切
欠部が形成されるとともに、周縁下部に前記基板の開口
部周縁に嵌合する凹溝部が形成され、一方、前記ハンド
部は、その先端部に、前記キャップを吸着して保持する
吸着部が設けられるとともに、前記キャンプの周縁部に
形成された切欠部に挿通されるフィンガー部が該切欠部
に対応する数だけ設けられ、かつ、該フィンガー部は外
方に拡開されることにより前記基板の開口部周縁を内側
から保持するようになされたものである。
(Means for Solving the Problems) A substrate attachment/detachment device of the present invention includes a substrate having an opening in the center, a camp for closing the opening of the substrate, and a device for loading the substrate and transporting the substrate into a vacuum chamber. In a sputtering process in which a substrate holder is placed at a predetermined position on a production line, the cap is held and fitted into the opening of the substrate, and in this state, the substrate and the camp are held and the substrate is removed. The holder is provided with a hand portion for mounting the substrate, and the cap has a plurality of notches formed at its peripheral edge, and a groove portion that fits into the opening peripheral edge of the substrate at the lower peripheral edge, On the other hand, the hand part is provided with a suction part on the tip thereof to attract and hold the cap, and a finger part inserted into a notch formed in the peripheral edge of the camp corresponds to the notch. The finger portions are provided in such number as to hold the periphery of the opening of the substrate from the inside by expanding outward.

(作用) ハンド部に設けられた吸着部によってキャップのほぼ中
央部を吸着保持する。このとき、ハンド部に設けられた
フィンガー部がキャップの周縁部に形成された切欠部に
挿通される。この状態で、ハンド部を移動してキャップ
を基板の開口部に対峙させ、かつ該開口部に遊嵌した状
態に嵌め合わせる。そして、フィンガー部を外方に拡開
することによって基板を開口部の内側から保持し、この
ように基板とキャンプとを保持した状態でハンド部を移
動して、基板ホルダに基板を装着する。次に、拡開して
いたフィンガー部を閉じて開口部とフィンガー部との接
触を解除し、さらに吸着部の吸着動作を解除してキャッ
プの凹溝部を基板の開口部の周縁下部に嵌合し、開口部
をキャップで閉塞する。
(Function) The suction part provided in the hand part holds the cap almost in the center by suction. At this time, the finger portion provided on the hand portion is inserted into the notch formed in the peripheral portion of the cap. In this state, the hand portion is moved so that the cap faces the opening of the substrate, and is loosely fitted into the opening. Then, by expanding the finger portion outward, the substrate is held from inside the opening, and with the substrate and camp held in this manner, the hand portion is moved to mount the substrate on the substrate holder. Next, close the expanded finger section to release the contact between the opening and the finger section, and then release the suction operation of the suction section to fit the concave groove of the cap to the lower periphery of the opening on the board. and close the opening with a cap.

(実施例) 以下、本発明の一実施例を図面を参照して説明する。(Example) Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

第1図は、本発明の基板着脱装置を備えたスパッタリン
グの処理工程の一部を示している。なお、工程全体の図
示は省略しているが、本例はインライン型のスパッタリ
ング装置に適用した例を示している。
FIG. 1 shows a part of the sputtering process using the substrate attachment/detachment apparatus of the present invention. Although illustration of the entire process is omitted, this example shows an example applied to an in-line sputtering apparatus.

同図において、1.1・・・はスパッタ処理前の基板2
a、2a・・・を多数枚収納した未処理基板収納体、3
,3・・・はスパッタ処理済の基板2b、2b・・・を
順次収納していく処理済基板収納体、4は空の未処理基
板収納体1.1・・・を搬送するベルトコンベア、5は
基板ホルダ6.6・・・が一定間隔を存して縦一列(図
面上では横一列)に配置されたベルトコンベア、7は基
板2aの開口部12(第3図参照)を閉塞するキャップ
10.10が多数枚収納されたキャップ収納体、8は基
板ホルダ6に装着した基板2aをスパッタ槽(真空槽:
図示省略)内に供給するための供給トラバーサ、9はス
パッタ処理がなされた基板2bを回収する回収トラバー
サ1.15は処理前の基板2aを基板ホルダ6に装着す
るための基板着脱装置(以下、第10ボツトという)、
16は処理済の基板2bを基板ホルダ6から回収するた
めの基板着脱装置(以下、第20ボツトという)である
。すなわち、本例では2基のロボットを用いて基板の着
脱を行っている。
In the same figure, 1.1... is the substrate 2 before sputtering treatment.
Unprocessed substrate storage body containing a large number of a, 2a..., 3
, 3... are treated substrate storage bodies that sequentially store sputtered substrates 2b, 2b...; 4 is a belt conveyor that conveys empty unprocessed substrate storage bodies 1.1...; Reference numeral 5 denotes a belt conveyor in which substrate holders 6, 6, . A cap storage body 8 stores a large number of caps 10 and 10, and a cap storage body 8 stores a substrate 2a attached to a substrate holder 6 in a sputtering tank (vacuum tank:
9 is a supply traverser for supplying the substrate 2b that has been subjected to the sputtering process, and a recovery traverser 1.15 is a substrate attachment/detachment device (hereinafter referred to as (referred to as the 10th bot),
Reference numeral 16 denotes a substrate attachment/detachment device (hereinafter referred to as the 20th bot) for recovering the processed substrate 2b from the substrate holder 6. That is, in this example, two robots are used to attach and detach the substrate.

前記未処理基板収納体1. 1・・・は、上面が開口さ
れた箱状体に形成され、前後両側面に、上端縁から半円
弧状に切欠いた挿通口1a、laが形成されている。こ
の挿通口1aは、基板2aを収納した状態で、該基板2
aの開口部12(第3図参照)が露出するように設けら
れたものである。この未処理基板収納体1.1・・・は
、図面上を矢符P1方向に順次搬送され、次に矢符P2
方向に搬送されて、ベルトコンヘア4上に1個の未処理
基板収納体1が搬出される。搬出された未処理基板収納
体1は、収納されている基板2aが第10ボツト15に
よって全部取り出されるまでこの位置Aに止まり、空に
なった状態でベルトコンベア4上を矢符P3方向へ搬送
されるようになされている。
The unprocessed substrate storage body 1. 1... is formed into a box-like body with an open top surface, and insertion openings 1a and 1a, which are cut out in semicircular arc shapes from the top edge, are formed on both front and rear sides. This insertion hole 1a is inserted into the board 2a when the board 2a is housed therein.
It is provided so that the opening 12 (see FIG. 3) of a is exposed. These unprocessed substrate storage bodies 1.1... are sequentially conveyed in the direction of arrow P1 on the drawing, and then are conveyed in the direction of arrow P2.
direction, and one unprocessed substrate storage body 1 is carried out onto the belt conveyor 4. The carried-out unprocessed substrate storage body 1 remains at this position A until all the stored substrates 2a are taken out by the 10th bot 15, and is conveyed in the empty state on the belt conveyor 4 in the direction of arrow P3. It is made to be done.

前記処理済基板収納体3.3・・・は、前記未処理基板
収納体1.1・・・と同形状に形成されている。
The processed substrate storage bodies 3.3 are formed to have the same shape as the unprocessed substrate storage bodies 1.1.

この処理済基板収納体3.3・・・は、ベルトコンベア
4に沿って二列に配置されている。そして、図面上では
上段の列を矢符Q、力方向ら順次搬送され、位置Bで上
段から下段に搬送方向が転換され、次に矢符Q2方向に
搬送されて位置Cに達し、この位置Cで、処理済の基板
2bが第20ボツト16によって満杯に収納されるまで
停止し、その後、再び矢符Q2方向に搬送されるように
なされている。
The processed substrate storage bodies 3, 3, . . . are arranged in two rows along the belt conveyor 4. Then, in the drawing, the upper row is conveyed sequentially from the direction of arrow Q and the force direction, and at position B, the conveyance direction is changed from the upper row to the lower row, and then it is transported in the direction of arrow Q2, reaching position C, and this position At point C, the processed substrates 2b are stopped until they are fully stored in the 20th bottle 16, and then they are conveyed again in the direction of arrow Q2.

前記ベルトコンベア5は、矢符R方向へ距M1移動して
一旦停止し、一定時間後再び矢符R方向へ距離l移動し
て一旦停止するという間欠的な動作を連続して繰り返す
。ここで、距離lとは、ベルトコンベア5上の一つの基
板ホルダ6から隣接する次の基板ホルダ6までの距離で
あり、また、基板ホルダ6の停止位置は、第10ボツト
15によって基板2aが基板ホルダ6に装着される位置
D、及び第20ボツト16によって基板2bが基板ホル
ダ6から構成される装置Eである。なお、これらの位置
り、  Eは、位置検出器9a、9bによってそれぞれ
検出される。ただし、ベルトコンベア5を一定速度で駆
動し、第10ボツト15及び第20ボツト16の方を、
これに追従する形で移動させながら基板2a、’lbの
着脱を行うようにしてもよい。
The belt conveyor 5 continuously repeats an intermittent operation in which it moves a distance M1 in the direction of arrow R, stops once, and after a certain period of time moves again a distance l in the direction of arrow R and stops once. Here, the distance l is the distance from one substrate holder 6 on the belt conveyor 5 to the next adjacent substrate holder 6, and the stopping position of the substrate holder 6 is the distance between the substrate holder 6 and the next substrate holder 6 on the belt conveyor 5. This is a device E in which the substrate 2b is configured from the substrate holder 6 by the position D where it is mounted on the substrate holder 6 and the 20th bot 16. Note that these positions E are detected by position detectors 9a and 9b, respectively. However, when the belt conveyor 5 is driven at a constant speed, the 10th bot 15 and the 20th bot 16 are
The substrates 2a and 'lb may be attached and detached while being moved to follow this.

前記基板ホルダ6は、第4図に示すように、スパッタ槽
内に対向配置されたターゲット(図示省略)間を仕切る
程度の大きさの板体に形成され、その中央部に基板2a
の外形状より若干径大の円形開口部40が設けられてい
る。この円形開口部40は、その開口部周縁の下半分に
基板2a(又は2b)の周縁部を嵌合保持するための三
ケ月状の凹溝部41が形成され、さらに、開口部周縁の
上半分には、−側寄り部に、基板2a(又は2b)の周
縁部を当接するための三ケ月状の当接片42が形成され
ている。
As shown in FIG. 4, the substrate holder 6 is formed into a plate large enough to partition targets (not shown) placed opposite each other in a sputtering tank, and has a substrate 2a in the center thereof.
A circular opening 40 having a diameter slightly larger than the outer shape is provided. This circular opening 40 has a crescent-shaped groove 41 for fitting and holding the peripheral edge of the substrate 2a (or 2b) formed in the lower half of the opening periphery, and further has a crescent-shaped groove 41 in the upper half of the opening periphery. A crescent-shaped abutment piece 42 for abutting the peripheral edge of the substrate 2a (or 2b) is formed on the negative side.

前記キャップ10は、第2図に示すように、キャンプ本
体21が基板2a(又は2b)の開口部12にほぼ適合
する円盤状に形成され、その周縁部の3ケ所に半円弧状
の切欠部22.23.24が形成されている。また、周
縁部の下半分には前記基板2aの開口部12の周縁部に
嵌合する三ケ月状の凹溝部26が前記切欠部23,24
の部分を除いて形成され、さらに、周縁部の上半分には
、−例寄り部に三ケ月状の当接片27が前記切欠部22
の部分を除いて形成されている。なお、このようなキャ
ップ10を収納するキャップ収納体7も、前記未処理基
板収納体lと同様な形状に形成されている。
As shown in FIG. 2, the cap 10 has a camp main body 21 formed in a disc shape that almost fits into the opening 12 of the substrate 2a (or 2b), and has semicircular arc-shaped notches at three locations on the periphery thereof. 22, 23, and 24 are formed. Further, in the lower half of the peripheral portion, a crescent-shaped recessed groove portion 26 that fits into the peripheral portion of the opening 12 of the substrate 2a is provided in the notches 23, 24.
Furthermore, in the upper half of the peripheral portion, a crescent-shaped abutment piece 27 is provided on the side of the notch 22.
It is formed except for the part. Note that the cap storage body 7 that stores such a cap 10 is also formed in the same shape as the unprocessed substrate storage body l.

前記第1ロボツ)15及び前記第20ボツト16は、ロ
ボット本体30を中心として水平方向に回動可能及び上
下方向に昇降動可能に設けられた第1アーム31と、第
1アーム31の先端部に取付けられ該先端部を中心とし
て水平方向に回動可能に設けられた第2アーム32と、
第2アーム32の先端部に取付けられ該先端部を中心と
して同じく水平方向に回動可能に設けられた第3アーム
33と、第37−ム33の先端に横向きに取付けられか
つ横向きの軸芯0(第2図を併せて参照)を中心として
旋回可能に設けられたハンド部34とで構成され、この
ハンド部34の先端面には、その中央部にキャップ10
を吸着するための真空チャック35が設けられるととも
に、該真空チャック35を囲むようにして3本のフィン
ガー部36゜37.38が設けられている。これらフィ
ンガー部36,37.38は、ハンド部34の軸芯Oか
ら離れる方向に拡開可能に設けられている。
The first robot 15 and the twentieth robot 16 each include a first arm 31 that is rotatable in the horizontal direction and movable up and down in the vertical direction about the robot main body 30, and a distal end portion of the first arm 31. a second arm 32 that is attached to and is rotatable in the horizontal direction about the tip;
A third arm 33 is attached to the tip of the second arm 32 and is also rotatable in the horizontal direction about the tip, and a third arm 33 is attached laterally to the tip of the third arm 33 and has a horizontal axis. 0 (also refer to FIG. 2), and a hand portion 34 that is rotatably provided around 0 (also refer to FIG.
A vacuum chuck 35 for suctioning is provided, and three finger portions 36°, 37, and 38 are provided surrounding the vacuum chuck 35. These finger parts 36, 37, 38 are provided so as to be expandable in a direction away from the axis O of the hand part 34.

次に、上記構成の基板着脱装置を用いた製造ラインの各
工程を順次説明する。
Next, each process of a manufacturing line using the substrate attachment/detachment device having the above configuration will be sequentially explained.

1つの未処理基板収納体lがベルトコンベア4上の位i
Aにおいて停止している。本例では、この未処理基板収
納体1に、最後の1枚の基板2aが収納されている状態
を示している。この状態において、まず、第10ボツト
15の各アーム31゜32.33及びハンド部34は1
点鎖線で示す位IFにあり、真空チャック35によって
キャップ収納体7内の最前列のキャップlαを吸着する
One unprocessed substrate storage body l is placed at a position i on the belt conveyor 4.
It is stopped at A. In this example, a state is shown in which the last substrate 2a is stored in the unprocessed substrate storage body 1. In this state, first, each arm 31, 32, 33 and hand portion 34 of the tenth bot 15 are
It is located at IF as indicated by the dotted chain line, and the cap lα in the front row in the cap storage body 7 is sucked by the vacuum chuck 35.

このとき、各フィンガー部36,37.38は、第2図
に示すように、キャンプlOの周縁部に形成された各切
欠部22,23.24にそれぞれ挿通された形となる。
At this time, the finger parts 36, 37, 38 are inserted into the respective notches 22, 23, 24 formed at the peripheral edge of the camp 10, as shown in FIG.

このキャップ10を吸着保持した状態で、各アーム31
,32.33及びハンド部34を二点鎖線で示す位置G
まで水平方向に回動し、未処理基板収納体l内に収納さ
れている基板2aの開口部12にキャップ10を嵌め合
わせる。このときの状態を第3図に示す。すなわち、キ
ャップ10の凹溝部26を基板2aの開口部12の周縁
部に対向させ、当接片27を基板2aの一側面に当接さ
せる。
While holding this cap 10 by suction, each arm 31
, 32, 33 and the hand portion 34 are indicated by two-dot chain lines.
The cap 10 is fitted into the opening 12 of the substrate 2a stored in the unprocessed substrate storage body l. The state at this time is shown in FIG. That is, the concave groove 26 of the cap 10 is opposed to the peripheral edge of the opening 12 of the substrate 2a, and the contact piece 27 is brought into contact with one side of the substrate 2a.

この状態で各フィンガー部36,37.38を拡開して
開口部12の周縁部に当接させ、基板2aを保持する。
In this state, each finger portion 36, 37, 38 is expanded and brought into contact with the peripheral edge of the opening 12, thereby holding the substrate 2a.

次に、基板2aとキヤ・7プIOを保持した状態で、各
アーム31,32.33及びハンド部34を実線で示す
位置Hまで水平方向に回動し、保持した基板2aをベル
トコンベア5上の位置りにある基板ホルダ6に装着する
。この装着を完了した状態を第4図に示す。すなわち、
基板2aの周縁下部を円形開口部40に形成された凹溝
部41に対向させるとともに、基板2aの周縁上部を円
形開口部40に形成された当接片42に当接させ、この
状態で基板2a及びキャンプ10を若干下方に降下させ
、基板2aの周縁下部を凹溝部41に嵌合して、基板2
aの装着を完了する。
Next, while holding the board 2a and the cap IO, each arm 31, 32, 33 and hand part 34 are horizontally rotated to position H shown by a solid line, and the held board 2a is moved to the belt conveyor 5. It is attached to the board holder 6 located at the upper position. FIG. 4 shows a state in which this installation is completed. That is,
The lower part of the periphery of the substrate 2a is opposed to the groove 41 formed in the circular opening 40, and the upper part of the periphery of the substrate 2a is brought into contact with the contact piece 42 formed in the circular opening 40, and in this state, the substrate 2a Then, lower the camp 10 slightly downward, fit the lower peripheral edge of the substrate 2a into the groove 41, and remove the substrate 2.
Complete the installation of a.

この後、拡開していた3本のフィンガー部36゜37.
38を閉じて基板2aの保持を解除し、次に真空チャッ
ク35を外してキャップ10の保持を解除し、各アーム
31.32.33を操作してハンド部34を後退させ、
フィンガー部36,37゜38をキャンプ10の切欠部
22,23.24から抜き取る。これによって、キャッ
プ10の凹溝部26が基板2aの開口部12の周縁下部
と係合し、当接片27が開口部12の周縁上部に当接す
る。
After this, the three finger parts that had expanded 36°37.
38 to release the holding of the substrate 2a, then remove the vacuum chuck 35 to release the holding of the cap 10, operate each arm 31, 32, 33 to retreat the hand part 34,
Remove the fingers 36, 37° 38 from the cutouts 22, 23, 24 of the camp 10. As a result, the groove portion 26 of the cap 10 engages with the lower peripheral edge of the opening 12 of the substrate 2a, and the contact piece 27 contacts the upper peripheral edge of the opening 12.

この後、基板ホルダ6に装着された基板2aは供給トラ
バーサ8まで搬送され、スパッタ槽に送り込まれてスパ
ッタ処理が施される。
Thereafter, the substrate 2a mounted on the substrate holder 6 is conveyed to the supply traverser 8, fed into a sputtering bath, and subjected to sputtering treatment.

一方、スパッタ処理が施された基板2bは、回収トラバ
ーサ9によってスパッタ槽内から回収され、ベルトコン
ベア5上の回収位置Eまで搬送される。そして、第20
ボツト16によって前記した装着動作と逆の動作を行い
、処理済の基板2bを回収する。すなわち、第20ボツ
ト16の各アーム31,32.33及びハンド部34を
実線で示す位置J(すなわち、基板2bの回収位置E)
まで回動し、真空チャック35でキャップ10を吸着し
、フィンガー部36,37.38を拡開して基板2bの
開口部12を内側から保持する。そして、この状態で、
各アーム31,32.33及びハンド部34を二点鎖線
で示す位置Kまで回動し、基板2bを処理済基板収納体
3内に収納した後、フィンガー部36,37.38を閉
じて基板2bとの保合を解除し、キャップ10のみを基
板2bから取り外す。この後、各アーム31,32゜3
3及びハンド部34を一点鎖線で示す位置りまで回動し
、キャップ収納体7内の最後部にキヤ・7プ10を収納
して、基板2bの回収動作を終了する。
On the other hand, the sputtered substrate 2b is recovered from the sputtering tank by the recovery traverser 9 and conveyed to a recovery position E on the belt conveyor 5. And the 20th
The bot 16 performs an operation opposite to the above-described mounting operation to collect the processed substrate 2b. In other words, each arm 31, 32, 33 and hand part 34 of the 20th bot 16 are shown by solid lines at position J (i.e., recovery position E of the board 2b).
The vacuum chuck 35 attracts the cap 10, and the finger portions 36, 37, 38 are expanded to hold the opening 12 of the substrate 2b from the inside. And in this state,
After rotating each arm 31, 32, 33 and hand part 34 to position K shown by the two-dot chain line and storing the substrate 2b in the processed substrate storage body 3, the finger parts 36, 37, 38 are closed and the substrate 2b, and remove only the cap 10 from the substrate 2b. After this, each arm 31, 32゜3
3 and the hand part 34 are rotated to the position shown by the dashed line, and the cap 7 is stored in the rearmost part of the cap storage body 7, thereby completing the recovery operation of the substrate 2b.

(発明の効果) 以上説明したように、本発明の基板着脱装置によれば、
基板の開口部にキャップを嵌め合わせる動作、及びキャ
ンプを嵌め合わせた状態で基板を基板ホルダに装着する
動作をロボットハンドリングによって行うことができる
(Effects of the Invention) As explained above, according to the substrate attachment/detachment device of the present invention,
The operation of fitting the cap into the opening of the substrate and the operation of mounting the substrate on the substrate holder with the cap fitted can be performed by robot handling.

【図面の簡単な説明】 第1図ないし第4図は本発明の一実施例を示し、第1図
は本発明の基板着脱装置を備えたスパッタリングの処理
工程の一部を示す平面図、第2図はキャップとハンド部
との関係を示す斜視図、第3図は処理前の基板にハンド
部によってキャップを嵌め合わせた状態を示す断面図、
第4図はキャップを嵌め合わせた基板を基板ホルダに装
着した状態を示す断面図、第5図はスパッタ処理の一例
を示す断面図、第6図は従来のキャップの一例を示す斜
視図である。 1・・・未処理基板収納体 2a、2b・・・基板 3・・・処理済基板収納体 4.5・・・ベルトコンベア 6・・・基板ホルダ 7・・・キャップ収納体 12・・・開口部 15.16・・・基板着脱装置 22.23.24・・・切欠部 26・・・凹溝部 30・・・ロボット本体 34・・・ハンド部 36.37.38・・・フィンガー部
[BRIEF DESCRIPTION OF THE DRAWINGS] FIGS. 1 to 4 show an embodiment of the present invention, and FIG. Figure 2 is a perspective view showing the relationship between the cap and the hand part, Figure 3 is a cross-sectional view showing the state in which the hand part fits the cap onto the substrate before processing;
FIG. 4 is a sectional view showing a state in which a substrate fitted with a cap is attached to a substrate holder, FIG. 5 is a sectional view showing an example of sputtering processing, and FIG. 6 is a perspective view showing an example of a conventional cap. . 1... Unprocessed substrate storage bodies 2a, 2b... Substrate 3... Processed substrate storage bodies 4.5... Belt conveyor 6... Substrate holder 7... Cap storage body 12... Opening portion 15.16... Board attachment/detachment device 22.23.24... Notch portion 26... Concave groove portion 30... Robot body 34... Hand portion 36.37.38... Finger portion

Claims (1)

【特許請求の範囲】 1)中央に開口部を有する基板と、この基板の開口部を
閉塞するキャップと、前記基板を装着して真空槽内に搬
入する基板ホルダとがそれぞれ製造ラインの所定位置に
配置されたスパッタリングの処理工程において、 前記キャップを保持して前記基板の開口部に嵌め合わせ
、この状態で前記基板と前記キャップとを保持して前記
基板ホルダに前記基板を装着するハンド部が設けられ、 前記キャップはその周縁部に複数個の切欠部が形成され
るとともに、周縁下部に前記基板の開口部周縁に嵌合す
る凹溝部が形成され、一方、前記ハンド部は、その先端
部に、前記キャップを吸着して保持する吸着部が設けら
れるとともに、前記キャップの周縁部に形成された切欠
部に挿通されるフィンガー部が該切欠部に対応する数だ
け設けられ、かつ、該フィンガー部は外方に拡開される
ことにより前記基板の開口部周縁を内側から保持するよ
うになされたことを特徴とする基板着脱装置。
[Claims] 1) A substrate having an opening in the center, a cap for closing the opening of the substrate, and a substrate holder to which the substrate is mounted and carried into a vacuum chamber are each placed at a predetermined position on a production line. In the sputtering process disposed in The cap has a plurality of notches formed at its peripheral edge, and a grooved groove that fits around the opening of the substrate at its lower peripheral edge, while the hand part has a distal end thereof. is provided with a suction portion that suctions and holds the cap, and is provided with a number of finger portions that are inserted into notches formed in a peripheral portion of the cap, the number of which corresponds to the number of the notches; 1. A substrate attachment/detachment device, characterized in that the portion is expanded outward to hold the periphery of the opening of the substrate from the inside.
JP29084087A 1987-11-18 1987-11-18 Substrate attaching/detaching device Granted JPH01132766A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP29084087A JPH01132766A (en) 1987-11-18 1987-11-18 Substrate attaching/detaching device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29084087A JPH01132766A (en) 1987-11-18 1987-11-18 Substrate attaching/detaching device

Publications (2)

Publication Number Publication Date
JPH01132766A true JPH01132766A (en) 1989-05-25
JPH0557352B2 JPH0557352B2 (en) 1993-08-23

Family

ID=17761166

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29084087A Granted JPH01132766A (en) 1987-11-18 1987-11-18 Substrate attaching/detaching device

Country Status (1)

Country Link
JP (1) JPH01132766A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5486964A (en) * 1990-12-19 1996-01-23 Integral Peripherals, Inc. Miniature disk drive with dynamic head loading with skewed lifting tab
US6562184B2 (en) * 2000-02-29 2003-05-13 Applied Materials, Inc. Planarization system with multiple polishing pads

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5486964A (en) * 1990-12-19 1996-01-23 Integral Peripherals, Inc. Miniature disk drive with dynamic head loading with skewed lifting tab
US6562184B2 (en) * 2000-02-29 2003-05-13 Applied Materials, Inc. Planarization system with multiple polishing pads

Also Published As

Publication number Publication date
JPH0557352B2 (en) 1993-08-23

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