JPH01123493A - Semiconductor laser device - Google Patents

Abstract

PURPOSE:To unnecessitate insulating material, glass and the like which are necessary in conventional arts, and reduce the assembling cost, by inclining a part of peripheral wall of a sealed insulator, and providing the inclination part with a half mirror which transmits laser beam outside and reflects it toward the photo detector side. CONSTITUTION:On a circuit board 2, is arranged a laser parts protecting package 11 which seals a semiconductor laser element 5 and a photo detector 7. On a part of peripheral wall of the package 11, an inclination part 12 is arranged which has a gradient rising from the front part to the rear part. The inclination part 12 is provided with a half mirror 13 which transmits a laser beam (a) outside, and reflects a part of it toward the side of a photo detector. A part of the laser beam (a) is reflected by the half mirror 13, and received by the photo detector 7. The output of the laser beam (a) is controlled by a monitor current. Thereby unnecessitating insulating material, glass and the like which are necessary in conventional arts, and reducing the assembling cost.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor laser device incorporating a semiconductor element for output and a light receiving element for monitoring.

[Conventional technology]

Conventionally, this type of semiconductor laser device was disclosed in Japanese Patent Application Laid-Open No. 105-1983.
Disclosed in Japanese Patent No. 316, FIGS. 3 and 4(a),
(It is configured as shown in bl. This will be explained based on the same figure. In the same figure, the part indicated by reference numeral 1 is provided on the circuit board 2, and the glass window 3 for the output beam and the glass window 3 for the monitor beam are provided on the circuit board 2. a cap having a reflective surface 4; 5 is a semiconductor laser element housed inside the cap 1 and mounted above the circuit board 2 via a support base (heat sink) 6 and emitting a laser beam a (output beam);
Reference numeral 7 denotes a light-receiving element that is provided near the semiconductor laser element 5 and connected to the circuit board 2 to receive the monitor beam b; 8 represents the light-receiving element 7, the electrode circuit 2a on the circuit board 2, and the semiconductor laser element. 5 and the electrode circuit 2b on the circuit board 2. Note that the camp 1 and the circuit board 2 are electrically insulated by an insulating material (not shown). Further, although the wire 8 shown in FIG. 4(b) does not originally appear, it is described for ease of understanding, and the same description will be made below.

In the semiconductor laser device configured in this way, a laser beam a and a monitor beam b are emitted from the semiconductor laser element 5.
The monitor beam b is incident on the reflecting surface 4 and is received by the light receiving element 7. Further, the laser beam a passes through the glass window 3 and is irradiated to the outside.

[Problem that the invention seeks to solve]

Incidentally, in this type of semiconductor laser device, an insulating material (not shown) is interposed between the cap 1 and the circuit board 2, and not only a reflective surface 4 but also a glass window 3 is required. Therefore, there was a problem that the assembly work was complicated and the cost increased.

The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide a semiconductor laser device that can simplify assembly work and thereby reduce costs.

[Means for solving problems]

In the semiconductor laser device according to the present invention, a semiconductor laser element and a light receiving element are sealed with an insulator made of transparent molded resin, a part of the peripheral wall of this insulator is inclined, and a laser beam is transmitted to the outside through this inclined part. In addition, a half mirror for reflection is provided on the side of the light receiving element.

[For production]

In the present invention, the insulator made of transparent molded resin eliminates the need for structural parts such as glass windows.

〔Example〕

EMBODIMENT OF THE INVENTION Hereinafter, the structure etc. of this invention will be explained in detail by the Example shown in the figure. FIG. 1 is an exploded perspective view showing a semiconductor laser device according to the present invention, and FIGS. 2(a) and 2(b) are a perspective plan view and a sectional view showing the semiconductor laser device. The same members as in FIG. 4 are given the same reference numerals, and detailed explanations are omitted. In the figure, what is indicated by the reference numeral 11 is a laser component protection package that seals the semiconductor laser element 5 and the light receiving element 7, and is provided on the circuit board 2, and is made of an insulator made of transparent molded resin. It is made up of. A part of the peripheral wall of this package 11 is provided with an inclined part 12 having a slope rising from the front to the rear, and this inclined part 12 transmits the laser beam a to the outside and directs a part of it toward the light receiving element. A half mirror 13 is provided to reflect the light.

In the semiconductor laser device configured in this way, when the laser beam a is emitted from the semiconductor laser element 5,
The light passes through the package 11 and the half mirror 13 and is irradiated to the outside. At this time, a part of the laser beam a is reflected by the half mirror 13 and is received by the light receiving element 7 as a monitor beam b, and the monitor current changes the laser beam a.
output is controlled.

Therefore, in the present invention, components such as an insulating material (not shown) and a glass window 3 that were conventionally required are not required, and the assembly work of the semiconductor laser device can be easily performed.

In this embodiment, the entire package 11 is installed on the circuit board 2, but the present invention is not limited to this, and the package (not shown) is installed on the back side of the circuit board 2. There is no problem in installing it so that it goes around.

Further, in this embodiment, a case has been shown in which the semiconductor laser element 5 is directly installed on the support base 6, but the present invention may also use a submount for relieving thermal stress.

In addition, in the present invention, it is desirable to provide a noise prevention circuit or the like within the package 11.

〔Effect of the invention〕

As explained above, according to the present invention, a semiconductor laser element and a light receiving element are sealed with an insulator made of transparent molded resin, the peripheral wall of this insulator is inclined, and a laser beam is directed to the outside through this inclined part. Since a half mirror is provided that transmits light and reflects the light toward the light receiving element, components such as insulating materials and glass windows that are conventionally required can be eliminated. Therefore, since the work of assembling the semiconductor laser device can be easily performed, it is possible to reliably reduce the assembly cost.

[Brief explanation of the drawing]

FIG. 1 is an exploded perspective view showing a semiconductor laser device according to the present invention, FIGS. 2(a) and (b) are a perspective plan view and a sectional view also showing the semiconductor laser device, and FIG. 3 is a conventional semiconductor laser device. FIG. 4 (al and b) is a perspective plan view and a sectional view taken along line bb. 2...Circuit board, 5...Semiconductor laser element, 7
... Light receiving element, 11 ... Buff cage, 12 ...
... Inclined part, 13 ... half (two, a ... laser beam, b ... monitor beam. Agent Masuo Oiwa Figure 1 7: Ukemaru So) 11: Ha 0 Tsupu: /1゜12; II Tortoise part 13: Herr 7 mirror 0: Racer゛°symbol b: (=Tame Figure 2)

Claims (1)

[Claims] A semiconductor laser element mounted on a circuit board and emitting a laser beam, and a light receiving element provided near the semiconductor laser element and connected to the circuit board to receive a monitor beam, the light receiving element and the semiconductor laser The element is sealed with an insulator made of transparent mold resin,
A semiconductor laser device characterized in that a part of the peripheral wall of the insulator is inclined, and a half mirror is provided on the inclined part to transmit a laser beam to the outside and reflect it toward a light receiving element.