JP7409178B2 - Inspection equipment and inspection method for electronic devices - Google Patents

Description

The present invention relates to an inspection apparatus and inspection method for electronic devices.

A common method for inspecting the joints of semiconductor chips in BGA (Ball Grid Array) etc. using flip-chip mounting technology is to join a semiconductor chip for testing, then remove the semiconductor chip and visually inspect the joints. It has been implemented.

In addition, in recent years, the semiconductor chip to be inspected is irradiated with X-rays, infrared rays, ultrasonic waves, etc., and defects are detected using the characteristics of the transmitted image formed by the differences in the transmission characteristics of the semiconductor's silicon, wiring parts, and joint parts. A means of detecting the presence or absence is being considered. BACKGROUND ART Inspection methods or inspection apparatuses for joints of electronic elements in electronic devices are disclosed in, for example, Patent Documents 1 to 4.

In the method for inspecting a joint of an electronic component described in Patent Document 1, an electronic component including a component body made of a material that transmits infrared rays is used. Then, while transmitting infrared rays through the component body, the quality of the joint is determined by evaluating the state of intermetallic compound formation based on the infrared rays reflected at the interface between the component body and the pad electrode.

In the surface mount component soldering appearance inspection method described in Patent Document 2, an optical system including a halogen illumination, a camera, and a fiber scope integrally attached is used as a means for capturing an image. Then, halogen illumination is emitted from the tip of the fiberscope onto the object to be visually inspected, and the reflected light is captured by a camera from the tip of the fiberscope, and the quality is determined by image processing.

In the semiconductor device inspection method described in Patent Document 3, when a BGA package is mounted on a substrate, a light beam is irradiated to a gap between a joint portion of a solder ball of the BGA package that is connected to an electrode of the substrate. The method includes a step of receiving the light beam by the light receiving element, and a step of determining a short circuit or positional deviation of the joint portion of the solder ball by receiving the light beam by the light receiving element.

The object shape inspection apparatus described in Patent Document 4 has a movable stage, sequentially sets bumps on a wafer at predetermined positions, and performs bump determination by image processing a video signal obtained by imaging the bumps from the top surface. Inspect the shape. This object shape inspection device has a plurality of illumination means that are arranged so that the irradiation angles on the object to be inspected are different, and are switched on and off according to the required inspection items, and images the bumps illuminated by the illumination means to produce a video signal. and an imaging means for outputting. The image processing means also has an image processing judgment means, which compares data obtained by digitizing the input video signal with reference data stored in advance, processes and judges each of the required test items stored, and obtains the test results. Output data.

Japanese Patent Application Publication No. 2001-060605 Japanese Patent Application Publication No. 06-094429 Japanese Patent Application Publication No. 2006-041167 Japanese Patent Application Publication No. 2000-131037

The following analysis is given in terms of the present invention.

In an inspection method in which test semiconductor chips are bonded and then removed, even if no defects are found during inspection, there is no guarantee that defects will not occur during the actual manufacturing process. Furthermore, this method involves a destructive means of peeling off the bonded semiconductor chips, so it does not meet the recent demands for 100% inspection.

In an inspection method using X-rays or infrared rays, the X-rays or infrared rays hardly pass through metal, so this inspection method is difficult to apply to bond inspections of recent semiconductor chips with high wiring density. Further, in the method for inspecting the joint portion of an electronic component described in Patent Document 1, there is a restriction that a material that transmits infrared rays must be used for the component body. Inspection methods using ultrasonic waves require that the object to be inspected be submerged in water, and the inspection time is approximately one to several minutes, so there is a problem in that it is difficult to perform a complete inspection.

Patent Document 2 discloses a technique for an imaging means for a joint, but does not disclose a technique for a determination method. In addition, in the surface mount component soldering appearance inspection method described in Patent Document 2, the number of joints that can be inspected in one imaging is only a few considering the field of view of the fiberscope, and the illumination is coaxial epi-illumination. The problem is that the effect is uncertain because it is limited to lighting.

In the semiconductor device testing method described in Patent Document 3, the light receiving element is placed on the opposite side of the light source across the BGA package to be tested. Therefore, if a plurality of solder balls are present on the optical path, there is a problem in that it is not possible to determine the quality of each individual bond.

The object shape inspection apparatus described in Patent Document 4 inspects bumps on a wafer before being bonded to a substrate, and cannot inspect the shape of a bonded portion after being bonded to a substrate. In particular, the object shape inspection device described in Patent Document 4 determines the quality of the bump based on an image from the top surface of the bump, and cannot determine the quality of the bonded portion with the substrate.

SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic device testing device and testing method that facilitates quality testing of electronic device joints.

An inspection apparatus for an electronic device includes an imaging mechanism that captures an image of a joint between an electronic element and a substrate, and an oblique illumination that illuminates the joint from an oblique direction with respect to the optical axis direction of the imaging mechanism. The apparatus also includes an image processing mechanism that determines the quality of the joint based on an oblique illumination image captured using oblique illumination. The image processing mechanism identifies reflective areas in the obliquely illuminated image. Then, based on the reflection area, it is determined whether there is a constriction in the joint, and whether the joint is good or bad is determined based on the presence or absence of the constriction.

An advantage of the present invention is that it is possible to provide an electronic device testing device and testing method that facilitates quality testing of electronic device joints.

1 is a block diagram of an inspection apparatus for an electronic device according to a first embodiment of the present invention. FIG. 2 is a schematic configuration diagram of an electronic device inspection apparatus according to a second embodiment of the present invention. FIG. 3 is a schematic three-view diagram showing the front, top, and side views of the oblique lighting. FIG. 4 is a schematic trihedral view showing the front, top, and side views of an oblique illumination having a different form from that shown in FIG. 3; 7 is a flowchart for explaining the operation of the electronic device inspection apparatus according to the second embodiment of the present invention. FIG. 2 is a schematic partial plan view of an electronic device showing an example of a viewing area of an imaging mechanism. FIG. 3 is a schematic plan view of a joint showing a good shape of the joint. FIG. 3 is a schematic plan view of a joint showing a good joint reflection area in an obliquely illuminated image. FIG. 2 is a schematic plan view of a joint showing the shape of a defective joint (unmelted or poorly creeping up); FIG. 3 is a schematic plan view of a joint showing a reflection area of a defective joint (unmelted or poorly creeping up) in an oblique illumination image. FIG. 3 is a schematic plan view of a joint showing the shape of a defective joint (poor suction). FIG. 3 is a schematic plan view of a joint showing a reflection area of a defective joint (poor wicking) in an oblique illumination image. 7 is a flowchart for explaining one embodiment of the operation of the electronic device inspection apparatus according to the second embodiment of the present invention. FIG. 7 is a schematic plan view of an electronic device inspection apparatus according to a third embodiment of the present invention.

Embodiments of the present invention will be described in detail below with reference to the drawings. However, although the embodiments described below include technically preferable limitations for implementing the present invention, the scope of the invention is not limited to the following. Note that similar components in each drawing may be designated by the same numbers and their descriptions may be omitted.

(First embodiment)
FIG. 1 is a block diagram showing the configuration of an electronic device inspection apparatus 10000 according to the first embodiment. An inspection apparatus 10000 for an electronic device includes an imaging mechanism 1000, an oblique illumination 2000, and an image processing mechanism 3000.

The imaging mechanism 1000 captures an image of a joint between an electronic element and a substrate. The oblique illumination 2000 illuminates the joint from an oblique direction with respect to the optical axis direction of the imaging mechanism 1000.

The image processing mechanism 3000 determines the quality of the joint based on the oblique illumination image captured using the oblique illumination 2000. Image processing mechanism 3000 identifies reflective areas in the oblique illumination image. The presence or absence of a constriction in the joint is determined based on the reflection area, and the quality of the joint is determined based on the presence or absence of a constriction.

According to the electronic device inspection apparatus of the present embodiment described above, by using oblique illumination, it is possible to capture an image with a clear outline of the joint. Therefore, the constriction of the electronic element joint can be easily detected. Then, it is possible to easily inspect the quality of the electronic element joint based on the presence or absence of constrictions.

(Second embodiment)
An inspection apparatus for electronic devices according to a second embodiment of the present invention will be described. FIG. 2 shows a schematic configuration diagram of an electronic device inspection apparatus according to the first embodiment of the present invention. The inspection apparatus 1 for electronic devices includes a stage section 10 , an illumination section 11 , an imaging section 12 , and a determination section 13 .

The stage section 10 includes a mounting stage 101 on which an electronic device 20, which is an object to be inspected, is mounted, and a rotation mechanism 102 that rotates the mounting stage 101 at a predetermined angle. It also includes a moving mechanism 103 that moves the mounting stage 101 in a plane direction so as to adjust the position and distance with respect to the imaging unit 12, and a mechanism control unit 100 that controls the rotating mechanism 102 and the moving mechanism 103. The stage section 10 adjusts the position of the electronic device 20 with respect to the imaging section 12 for focusing and setting of an imaging region.

The illumination unit 11 includes an oblique illumination 111, an epi-illumination 112, and an illumination control unit 110 that controls the oblique illumination 111 and the epi-illumination 112. For the electronic device 20 that is the object to be inspected, the oblique illumination 111 serves as oblique illumination light with respect to the optical axis of the imaging unit 12 , and the epi-illumination 112 serves as coaxial illumination light with respect to the optical axis of the imaging unit 12 .

FIG. 3 shows a schematic three-view diagram showing the front, top, and side views of the oblique illumination. The oblique illumination 111 has an opening 111b in the center and has a hemispherical shell shape. Further, the oblique illumination 111 includes a dome 111a whose concave surface (inner surface of a hemisphere) faces the object to be inspected, and at least one first light source 111c arranged on the concave surface of the dome 111a. The dome 111a and the first light source 111c constitute dome lighting that illuminates the joint portion of the electronic device 20. This dome illumination is oblique illumination with respect to the optical axis of the imaging mechanism 122 and the optical system 121 in order to extract the outline of the joint portion of the electronic device 20. As the dome lighting, direct dome lighting can be used in which a plurality of small light emitters (for example, LEDs) are arranged (for example, in a grid pattern) on the concave surface (inside the hemispherical shell) of the dome 111a as the first light source 111c. Alternatively, paint that reflects or diffuses light is applied to the concave surface of the dome 111a, and the first light source (for example, an LED) 111c is directed toward the concave surface of the dome 111a, so that the light reflected by the concave surface of the dome 111a indirectly generates electrons. There may also be diffuse dome lighting illuminating the device 20. The first light source 111c may be arranged so as to illuminate the joint portion of the electronic device 20. For example, in direct dome lighting, the first light source 111c is arranged in an arc shape along the concave surface of the dome 111a, and the electronic device 20 It is preferable to arrange it so that it emits light with the direction of the light. The oblique illumination 111 allows illumination from the side of the joint with respect to the optical axis of the imaging section 12. As a result, the outline of the joint becomes clear, and the external shape and presence or absence of a constriction can be determined.

FIG. 4 is a schematic three-view diagram showing the front, top, and side views of an oblique illumination device different from that shown in FIG. 3. In the embodiment shown in FIG. 3, the first light source is disposed on the entire concave surface of the dome, but the first light source may not be disposed at any position that does not affect the illumination of the joint portion of the electronic device 20. For example, in direct dome lighting, the first light source 211c may not be arranged in the upper and lower parts of the dome 111a shown in FIG. 3, which do not affect the illumination of the joint of the electronic device. That is, as shown in FIG. 4, a configuration in which the first light source 211c is arranged in a shape like a dome 211a without concave surfaces at the upper and lower portions may be used.

The epi-illumination 112 has a second light source (not shown) and is arranged so that the joint portion of the electronic device 20 can be illuminated from the opening 111b of the dome 111a. For example, the epi-illumination 112 is arranged so that the optical axis of the imaging unit 12 and the optical axis of the epi-illumination 112 are aligned. The epi-illumination 112 makes it easy to align the optical axis of the imaging unit 12 with the front of the joint, so positioning for imaging can be easily performed.

The lighting control unit 110 controls ON/OFF of the oblique lighting 111 and epi-illumination 112, the output (illuminance) of each lighting, and the like.

The imaging unit 12 is capable of capturing an image of the joint portion of the electronic device 20 through the aperture 111b of the oblique illumination 111. To this end, it includes an optical system 121 and an imaging mechanism 122, a camera control unit 120 that controls the optical system 121 and the imaging mechanism 122, and an image storage unit 123 that stores images captured by the imaging mechanism 122. The optical system 121 and the imaging mechanism 122 are connected. The epi-illumination 112 is connected to the optical system 121 so that the optical axis of the imaging mechanism 122 and the optical axis of the epi-illumination 112 coincide.

The determination unit 13 includes an image processing unit 130 that extracts the bonded portion of the electronic device 20 from the image captured by the imaging mechanism 122 and determines whether the bonded portion is good or bad. The image processing unit 130 determines the quality of the joint based on the reflective area of the joint as described below. For example, the image processing unit 130 can determine the presence or absence of a constriction in the joint based on whether the reflective region is divided into the substrate side and the electronic element side, and can determine the quality of the joint based on the presence or absence of the constriction. Furthermore, the image processing unit 130 can determine the presence or absence of a bridge between joints.

Next, an embodiment of the operation of the electronic device inspection apparatus according to the first embodiment of the present invention shown in FIG. 2 will be described. FIG. 5 shows a flowchart for explaining one embodiment of the operation of the electronic device inspection apparatus according to the first embodiment of the present invention. The object to be inspected is, for example, an electronic device 20 in which an electronic element 202 (for example, a bare chip) is flip-chip mounted on a substrate 201, and the portion to be inspected is a joint between the electronic element 202 and the substrate 201 in the electronic device 20. In the following description, it is assumed that in the electronic device 20, the substrate 201 is on the lower side and the electronic element 202 is on the upper side.

First, the electronic device 20, which is an object to be inspected, is placed on the mounting stage 101 (S1). When the stage section 10 detects that the electronic device 20 is mounted (S2), the mechanism control section 100 operates the moving mechanism to move the mounting stage 101 to move the electronic device 20 to the first electronic device 20 to be inspected. It is moved to the side inspection position (S3). Next, the electronic device 20 is moved to the inspection position of the joint portion to be inspected first in this area (S4). Next, this joint portion is inspected (S5). In this flowchart, the contents of the inspection are treated as predefined processing, and details will be described later. When the inspection of the joint to be inspected is completed, it is determined whether the position of the inspection target has reached the edge of the side (S6). If the end of the side has not been reached, that is, there is still a joint to be inspected on that side (S6_No), the electronic device 20 is moved to the inspection position of the adjacent joint (S7) S5 Return to the site and perform an inspection. On the other hand, if the joint portion that has been inspected has reached the end of its side (S6_Yes), it is determined whether there is an uninspected side (S8). If there is an uninspected side (S8_Yes), the stage is rotated, for example, by 90 degrees (S9), and the electronic device 20 is placed at a position where the next side can be inspected. Then, the process returns to S4 and the joints on that side are inspected. On the other hand, if there are no uninspected edges, that is, if all edges have been inspected (S8_No), the process ends. After finishing, for example, the mounting stage 101 may be returned to the initial position.

Next, inspection of the joint will be explained. In the inspection, first, the position of the stage 101 is adjusted so that the joint to be inspected is within the field of view of the imaging mechanism 122. FIG. 6 is a schematic partial plan view showing an example in which the left end 202a of one side of the electronic element 202 is imaged. When the position adjustment of the imaging mechanism 122 is completed, the imaging mechanism is focused on the joint portion 203. Focus adjustment can be performed using either or both of moving the stage 101 and adjusting the focus of the imaging mechanism 122.

Next, the illumination control unit 110 turns on the oblique illumination 111 and sets it to a predetermined brightness. Next, by illuminating only the oblique illumination 111 (without using the epi-illumination 112), an image (hereinafter referred to as "oblique illumination image") including the joint part 203 of the electronic device 20 is generated by the camera control unit 120 and the imaging mechanism 122. Take an image with When the oblique illumination image is captured, the illumination by the oblique illumination 111 also ends. Note that a plurality of oblique illumination images may be captured by changing conditions such as the brightness of the oblique illumination 111. The oblique illumination image is stored in the image storage unit 123.

Next, an inspection area is set for the oblique illumination image. The inspection area 205 is set, for example, based on packaging design information of the electronic device 20 so that at least one joint portion is included therein. In the example of FIG. 6, at least one region of a predetermined size including the joint portion 203 (particularly a portion corresponding to the bump of the electronic element 202) is extracted based on the vertical center line 204 of the joint portion 203, This extraction area is defined as an inspection area 205.

When inspecting the presence or absence of a bridge between the joints 203, the area between the joints 203 is set as an inspection region 205. When one imaging region (oblique image) includes a plurality of joints 203 and regions between joints 203, it is preferable to extract as many joints 203 or regions between joints 203 as possible as inspection regions 205.

Next, the relationship between the captured image and the state of the joint will be explained. FIG. 7 is a schematic plan view showing the shape of a good joint 203. A bonding portion 203 is formed by bonding a spherical bump formed on the electronic element 202 and preliminary solder formed on the substrate 201. In this case, a good bonding portion 203 is formed by melting preliminary solder on the substrate 201 during the bonding process and creeping up onto the bumps of the electronic element 202. Therefore, a good shape of the joint portion 203 is a barrel shape or a cylindrical shape without constrictions.

The oblique illumination 111 irradiates the joint portion with light obliquely to the optical axis of the imaging mechanism 122 . FIG. 8 shows a schematic plan view of the joint showing the good joint reflection area in the oblique illumination image. In FIG. 8, reflective areas are shown in white and dark areas are shown in hatching.

If a reflective area is defined as an area with brightness higher than a predetermined value in an image, then in an oblique illumination image, the reflective area 203a will be inside the joint 203, and will be located around the outline of the joint 203, as shown in FIG. The portion 203b becomes a dark area. Therefore, in the oblique illumination image, if the reflective region 203a continuously exists over a wide range of the joint 203, the joint can be determined to be good.

FIG. 9 shows a schematic plan view of an example of the shape of the defective joint 207. Such defects are caused by unmelted preliminary solder (unmelted defect) or insufficient creep-up of preliminary solder (defect in creep-up). In the example of FIG. 9, the defective joint 207 has a constriction 207c. FIG. 10 shows a schematic plan view of the reflective region 207b of the defective joint 207 in the oblique illumination image. In FIG. 10, the reflection area 207a from each illumination is shown in white, and the dark area around the outline 207b is shown in hatching. In the oblique illumination image, as shown in FIG. 10, the reflective region 207a has a shape divided into upper and lower parts with the constriction 207c of the joint portion 207 as the boundary. That is, in the oblique illumination image, if there is a vertical division in the reflective region 207a, it can be determined that there is a constriction, and the joint can be determined to be defective. Note that the division of the reflective region 207a can be detected if, when the luminance distribution is graphed, the width of the region where the luminance is lower than the threshold value is equal to or larger than a predetermined position.

FIG. 11 shows a schematic plan view of a defective joint in a different manner from that shown in FIG. In the joint 208 in FIG. 11, a gap is created between the joint 208 and the board 201 without preliminary solder. Such defects occur, for example, when the viscosity of the preliminary solder on the board 201 is low or the amount thereof is small, and the melted preliminary solder is completely absorbed by the bump side of the electronic element 202 ( Poor suction). FIG. 12 shows the defective joint 208 and reflective area 208a in the oblique illumination image. In FIG. 12, the reflective area 208a is shown in white, and the peripheral portion 206 of the outline is shown in hatching. In this case, the defective joint 208 is in a state in which the lower end (end on the substrate 201 side) of the joint 208 is not in contact with the substrate 201 . At this time, the luminance center of gravity of the reflective region 208a is closer to the electronic element 202 than in a good joint. Therefore, this defect can be detected based on the fact that the luminance barycenter coordinates are outside a predetermined range. The predetermined range can be determined, for example, based on the center of the gap between the electronic element 202 and the substrate 201. Note that the barycentric coordinates of the reflective area can be obtained, for example, by dividing the reflective area into pixels and taking the total average of the coordinates of the pixels. If the coordinates of the luminance center of gravity are above a predetermined range, it can be determined that the preliminary solder has been sucked up by the bumps and is defective. Conversely, if the center of gravity coordinates are below the reference range, this means that the joint portion 208 has fallen off from the electronic element. Therefore, in this way, the standard for the center of gravity position is determined, and if the standard is not satisfied, it can be determined that there is an unconnected defect.

Bonding defects also include bridges where one bonding portion and an adjacent bonding portion are short-circuited by solder. Detection of a bridge can be performed, for example, by detecting whether a reflective region having a predetermined area or more exists between adjacent joint portions. If a reflective area exists, it may be determined that a bridge exists. Note that when inspecting the presence or absence of bridges between joints, the area between the joints may be set as the inspection area.

FIG. 13 is a flowchart showing the operation of the test described above. This process is the detailed operation of S5 "inspect joint" in the flowchart of FIG.

First, the joint is illuminated with oblique illumination, and an oblique illumination image is captured (S501). Next, an inspection area is extracted from each image (S502). Next, it is determined whether there is a vertical division in the reflection area of the image of the joint of the extracted inspection area (S503). If there is upper and lower separation (S503_Yes), it is determined that there is a constriction (S504), and it is determined that there is a poor connection (S510), and the process ends. On the other hand, if there is no division (S503_No), the process advances to S505.

In S505, it is determined whether the luminance center of gravity is within the standard. If it is not within the specifications (S505_No), it is determined that there is no connection (S506), and it is determined that there is a poor connection (S510), and the process ends. On the other hand, if the luminance gravity center position is within the standard (S505_Yes), the process advances to S507.

In S507, it is determined whether there is a reflective area between two adjacent joints in the extracted inspection area. Here, if there is a reflective area (S507_Yes), it is determined that there is a bridge (S508), and it is determined that there is a poor bonding (S510), and the process ends. On the other hand, if there is no reflective area between the bonded parts (S507_No), it is determined that the bonded product is good and the process ends (S509).

Through the above-described operation, the electronic device inspection apparatus according to the present embodiment can detect a bonding failure at a bonding portion. In the above flowchart, the determination of the presence or absence of division in the reflective area, the determination of whether the brightness center of gravity position satisfies the standard, and the determination of the presence or absence of the reflective area between joints were performed in the order described. The order may be in any order. Furthermore, although the description has been made as an operation in which the quality of the joint is determined following the capturing of an oblique illumination image and the capturing of an epi-illumination image, it is also possible to perform only the image capturing first and then inspect the images at the same time.

As described above, according to the present embodiment, by using both oblique illumination and coaxial illumination, it is possible to easily determine the quality of the joint. In addition, the accuracy of quality determination can be improved.

(Third embodiment)
Next, an electronic device inspection apparatus according to a third embodiment of the present invention will be described. In the second embodiment, the electronic device was rotated by a rotation mechanism, and the joint portion was inspected from each direction. In this embodiment, the inspection device does not have a rotation mechanism and inspects the electronic device from each direction when transferring it. FIG. 14 shows a schematic plan view of an electronic device inspection apparatus according to a third embodiment of the present invention.

The inspection apparatus 3 includes first to fourth stage units 301, 304, 307, and 310, and first to fourth imaging units 302, 305, 308, and 311 corresponding to each stage unit. It also includes first to third conveyors 303, 306, and 309 that transport electronic devices 20 between each stage unit. Furthermore, it has a first pusher (not shown) that places the electronic device 20 on the conveyor from the stage unit, and a second pusher (not shown) that puts the electronic device 20 on the stage unit from the conveyor.

The first to fourth stage units 301, 304, 307, and 310 each include the mounting stage described in the first embodiment, a movement mechanism, and a mechanism control section. In the first to fourth stage units 301, 304, 307, and 310, the line connecting the first stage unit 301 and the second stage unit 304 is perpendicular to the line connecting the second stage unit 304 and the third stage unit 307. It is arranged so that Further, the line connecting the first stage unit 301 and the second stage unit 304 and the line connecting the third stage unit 307 and the fourth stage unit 310 are arranged in parallel.

The first to fourth imaging units 302, 305, 308, and 311 each have the oblique illumination, the epi-illumination, the illumination control section, the optical system, the imaging mechanism, and the camera control described in the first embodiment. It has a section and a. The first to fourth imaging units 302, 305, 308, and 311 face different directions so that they can image each side (each side) of the electronic device 20 without rotating it.

The image processing section and the image storage section described in the second embodiment may be provided as one so that they can process the first to fourth imaging units 302, 305, 308, and 311 all at once, or each It may be provided in the unit.

The inspection apparatus 3 may also include a loader 300 that transfers the electronic device 20 before inspection to the first stage unit 301 and an unloader 312 that discharges the electronic device 20 that has been inspected.

Next, the operation and inspection method of the inspection device according to the third embodiment will be explained. In this embodiment, each of the first to fourth stage units 301, 304, 307, and 310 performs imaging and inspection of one side (one side) of the electronic device, and the conveyor 303, 306 and 309 are used to transport the electronic device 20. Therefore, except for whether the electronic device is rotated by a rotation mechanism or transported by a conveyor, the operation and inspection method of the inspection apparatus according to this embodiment are the same as those of the second embodiment. In other words, the difference is whether images are taken and inspected at one location, or whether images are taken and inspected at multiple locations.

According to this embodiment, all sides (sides) can be inspected in-line without rotating the electronic device 20, which is the object to be inspected, and the line structure can be simplified.

In the second and third embodiments, the electronic device 20, which is the object to be inspected, is moved or rotated, but the imaging unit may be moved or rotated.

The scope of the present invention also includes a program that causes a computer to execute the processes of the first to third embodiments described above, and a recording medium that stores the program. As the recording medium, for example, a magnetic disk, magnetic tape, optical disk, magneto-optical disk, semiconductor memory, etc. can be used.

The present invention has been described above using the first to third embodiments as exemplary examples. However, the present invention is not limited to the above embodiments. That is, the present invention can apply various aspects that can be understood by those skilled in the art within the scope of the present invention.

Part or all of the above embodiments may be described as in the following additional notes, but are not limited to the following.
(Additional note 1)
an imaging mechanism that captures an image of a joint between the electronic element and the substrate;
oblique illumination that illuminates the joint from an oblique direction with respect to the optical axis direction of the imaging mechanism;
In the oblique illumination image taken by the imaging mechanism using the oblique illumination, a reflective area whose brightness is equal to or higher than a predetermined value is identified, and based on the reflective area, the presence or absence of a constriction in the joint is determined. an image processing mechanism for determining;
An inspection device for an electronic device, comprising:
(Additional note 2)
Supplementary Note 1, wherein the image processing mechanism determines the presence or absence of the constriction based on whether or not there is a division in the reflective region at the joint in a direction connecting the electronic element and the substrate. Inspection equipment for electronic devices.
(Additional note 3)
3. The electronic device inspection apparatus according to appendix 1 or 2, wherein the image processing mechanism determines the quality of the joint based on the presence or absence of the constriction.
(Additional note 4)
The inspection device for an electronic device according to any one of appendix 3, wherein the image processing mechanism determines the quality of the joint portion based further on the luminance barycentric coordinates of the reflective area in the joint portion.
(Appendix 5)
The image processing mechanism includes:
The electronic device according to any one of appendices 1 to 4, wherein the presence or absence of a bridge between the joint parts is determined based on reflection between the adjacent joint parts in the oblique illumination image. Inspection equipment.
(Appendix 6)
further comprising a dome having an opening and having a concave surface facing the joint,
The oblique lighting is arranged to illuminate the joint from a concave surface of the dome,
6. The inspection apparatus for an electronic device according to any one of Supplementary Notes 1 to 5, wherein the imaging mechanism is arranged to image the joint portion from the opening.
(Appendix 7)
The inspection apparatus for an electronic device according to any one of Supplementary Notes 1 to 6, further comprising a rotation mechanism that rotates the electronic device about a direction perpendicular to a bonding surface on which the bonding portion is arranged. .
(Appendix 8)
8. The inspection device for an electronic device according to any one of Supplementary Notes 1 to 7, wherein the image processing device determines an inspection area from the epi-illumination image based on design information of the electronic device.
(Appendix 9)
four imaging units including the imaging mechanism and the oblique illumination;
9. The electronic device inspection apparatus according to any one of appendices 1 to 8, wherein the four imaging units face different directions.
(Appendix 10)
illuminating the joint between the electronic element and the substrate with oblique illumination that illuminates the joint between the electronic element and the substrate obliquely with respect to the optical axis direction of the imaging mechanism to capture an oblique illumination image;
identifying a reflective area whose brightness is equal to or higher than a predetermined value in the obliquely illuminated image;
determining the presence or absence of a constriction in the joint based on the reflective area;
A method for inspecting an electronic device, characterized in that:
(Appendix 11)
The method for inspecting an electronic device according to appendix 10, wherein the presence or absence of the constriction is determined based on whether or not the reflective region is divided.
(Appendix 12)
The method for inspecting an electronic device according to appendix 10 or 11, characterized in that the quality of the joint is determined based on the presence or absence of the constriction.
(Appendix 13)
13. The method for inspecting an electronic device according to appendix 12, wherein the quality of the joint is determined further based on the luminance barycentric coordinates of the reflective area in the joint.
(Appendix 14)
The electronic device according to any one of appendices 10 to 13, wherein the presence or absence of a bridge between the joint parts is determined based on the reflection between the adjacent joint parts in the oblique illumination image. Inspection method.
(Appendix 15)
15. The method for inspecting an electronic device according to any one of appendices 10 to 14, characterized in that an inspection area in the oblique illumination image is determined based on design information of the electronic device.
(Appendix 16)
The oblique illumination and the imaging are performed so that the joint portion is illuminated with oblique illumination that illuminates the joint portion between the electronic element and the substrate obliquely with respect to the optical axis direction of the imaging mechanism, and an oblique illumination image is captured. a step of controlling the mechanism;
identifying a reflective area whose brightness is equal to or higher than a predetermined value in the obliquely illuminated image;
determining whether there is a constriction in the joint based on the reflective area;
1. A control program for an electronic device inspection device, characterized in that the control program causes the electronic device inspection device to execute the following.

1, 10000 Inspection device for electronic devices 10 Stage section 11 Illumination section 12 Imaging section 13 Judgment section 20 Electronic device 100 Mechanism control section 101 Mounting stage 102 Rotation mechanism 103 Movement mechanism 110 Lighting control section 111 Oblique illumination 112 Epi-illumination 120 Camera control Part 121 Optical system 122 Imaging mechanism 123 Image storage unit 130 Image processing unit 201 Substrate 202 Electronic element 203 Joint 205 Inspection area 207, 208 Defective joint 207c Waist 1000 Imaging mechanism 2000 Oblique illumination

Claims (10)

an imaging mechanism that captures an image of a joint between the electronic element and the substrate;
oblique illumination that illuminates the joint from an oblique direction with respect to the optical axis direction of the imaging mechanism;
In the oblique illumination image taken by the imaging mechanism using the oblique illumination, a reflective area whose brightness is equal to or higher than a predetermined value is identified, and based on the reflective area, the presence or absence of a constriction in the joint is determined. an image processing mechanism for determining;
An inspection device for electronic devices characterized by: 2. The image processing mechanism determines the presence or absence of the constriction based on whether or not there is a division in the reflective region at the joint in a direction connecting the electronic element and the substrate. An inspection device for the electronic device described above. The inspection device for an electronic device according to claim 1 or 2, wherein the image processing mechanism determines the quality of the joint based on the presence or absence of the constriction. 4. The inspection apparatus for an electronic device according to claim 3, wherein the image processing mechanism determines the quality of the joint part based further on the luminance barycentric coordinates of the reflective area in the joint part. The image processing mechanism includes:
The electronic device according to any one of claims 1 to 4, wherein the presence or absence of a bridge between the joint portions is determined based on reflection between the adjacent joint portions in the oblique illumination image. inspection equipment. further comprising a dome having an opening and having a concave surface facing the joint,
The oblique lighting is arranged to illuminate the joint from a concave surface of the dome,
5. The inspection apparatus for an electronic device according to claim 1, wherein the imaging mechanism is arranged to take an image of the joint portion from the opening. Inspection of an electronic device according to any one of claims 1 to 6, further comprising a rotation mechanism that rotates the electronic device about a direction perpendicular to a bonding surface on which the bonding portion is arranged. Device. illuminating the joint between the electronic element and the substrate with oblique illumination that illuminates the joint between the electronic element and the substrate obliquely with respect to the optical axis direction of the imaging mechanism to capture an oblique illumination image;
identifying a reflective area whose brightness is equal to or higher than a predetermined value in the obliquely illuminated image;
A method for inspecting an electronic device, characterized in that the presence or absence of a constriction in the joint portion is determined based on the reflective area. Inspection of an electronic device according to claim 8, wherein the presence or absence of the constriction is determined based on whether or not there is a division in the reflective region in the joint portion in a direction connecting the electronic element and the substrate. Method. The oblique illumination and the imaging are performed so that the joint portion is illuminated with oblique illumination that illuminates the joint portion between the electronic element and the substrate obliquely with respect to the optical axis direction of the imaging mechanism, and an oblique illumination image is captured. a step of controlling the mechanism;
identifying a reflective area whose brightness is equal to or higher than a predetermined value in the obliquely illuminated image;
determining whether there is a constriction in the joint based on the reflective area;
1. A control program for an electronic device inspection device, characterized in that the control program causes the electronic device inspection device to execute the following.

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