JP7275699B2 - LAMINATED PRODUCT AND METHOD FOR MANUFACTURING LAMINATED BODY - Google Patents

Description

TECHNICAL FIELD The present invention relates to a laminate and a method for manufacturing the laminate.

A heat exchanger body formed by stacking heat transfer plates with flow paths formed in the heat exchanger, and a control board that processes output signals from temperature sensors, etc. attached to the heat exchanger body. and a printed circuit board (see, for example, Patent Document 1).

In such a heat exchanger, a laminate is used as a heat exchanger main body, in which a plurality of heat transfer plates are laminated and solid-phase bonded to each other. When solid-phase bonding multiple heat transfer plates, a pressure jig is generally used to apply pressure to the heat transfer plates in the stacking direction in a high-temperature vacuum or inert gas atmosphere. be done.

After the plurality of heat transfer plates are solid-phase bonded to form a laminate, the laminate is removed from the pressure jig. At this time, a mold release agent may be interposed between the heat transfer plate and the pressure jig that are in contact with the pressure jig for the laminate to facilitate removal of the heat transfer plate from the pressure jig.

JP 2017-053542 A

However, during solid phase bonding, the release agent is also pressed against the laminate by the pressing jig. For this reason, the component of the mold release agent may remain on the contact surface of the laminate that comes into contact with the pressurizing jig and adhere firmly. If the release agent layer remains on the contact surface in this way, when a metal part such as a pipe is joined to the contact surface by brazing, a bonding material (brazing material) for connecting the laminate and the metal part is used. material) may be repelled by the release agent, reducing the reliability of joining metal parts. Further, if surface treatment such as polishing is performed in order to completely remove such remaining release agent from the contact surface, a large manufacturing cost is required.

SUMMARY OF THE INVENTION In view of the circumstances as described above, an object of the present invention is to provide a laminate and a method for producing the laminate that improve the reliability of joining metal parts by brazing and suppress an increase in production cost.

In order to achieve the above object, a laminate according to one aspect of the present invention is a laminate formed by stacking n heat transfer plates and joining them by solid phase bonding.
In the laminate, a through-hole penetrating in the stacking direction is provided in each of the m heat transfer plates from the uppermost heat transfer plate to the mth (m<n) heat transfer plate.
A hole into which a metal component is inserted is formed by connecting the through holes formed in each of the m heat transfer plates in the stacking direction.
The inner diameter of the through hole formed in the heat transfer plate of the uppermost layer is larger than the inner diameter of the through hole formed in the heat transfer plates other than the heat transfer plate of the uppermost layer.

In the laminate, the through-hole formed in the heat transfer plate of the uppermost layer has a first hole and a second hole communicating with the first hole. The part is located between the first hole and the through hole formed in the second heat transfer plate counted from the uppermost heat transfer plate, and the inner diameter of the first hole is It may be formed below the inner diameter of the second hole.

In the above laminate, the through-holes formed from the second heat transfer plate counted from the uppermost heat transfer plate to the mth heat transfer plate counted from the uppermost heat transfer plate are: The inner diameter of the through-hole having the same inner diameter and formed in the (m+1)-th heat transfer plate counted from the heat transfer plate of the uppermost layer may be smaller than the same inner diameter.

In the laminate, the metal part is inserted into the hole, and the metal part and the second heat transfer plate extend from the side surface of the metal part to the surface of the second heat transfer plate counted from the uppermost heat transfer plate. A fillet may be formed by a bonding material that bonds the second heat transfer plate.

In order to achieve the above object, in a method for manufacturing a laminate according to one aspect of the present invention, n heat transfer plates are laminated and joined by solid phase bonding, and counting from the uppermost heat transfer plate, Holes into which metal parts are inserted are formed in m heat transfer plates up to the mth (m<n) heat transfer plate.
A plurality of first heat transfer plates having first through holes with the same inner diameter are stacked such that the first through holes are concentrically positioned.
A second heat transfer plate having a bottom portion and a recess having an inner diameter larger than the inner diameter of the first through hole is formed in the second heat transfer plate, the recess facing the first through hole, and the recess and the first through hole. The second heat transfer plate is stacked on the plurality of first heat transfer plates such that the heat transfer plates are concentrically positioned.
Each of the plurality of first heat transfer plates and the second heat transfer plate are laminated and solid phase bonded.
A second through hole is formed through the second heat transfer plate in the stacking direction by cutting the bottom portion to form an opening, and the second through hole and the first through hole are aligned in the stacking direction. The holes are formed in the laminate by communicating with each other.

In the method for manufacturing the laminate, when forming the opening by cutting the bottom, the inner diameter is larger than the inner diameter of the first through hole, is equal to or less than the inner diameter of the recess, and is concentric with the first through hole. A portion of the bottom area of interest may be removed.

In the method for manufacturing the laminate, when the laminate is formed by solid-phase bonding, a pressurizing jig is prepared for pressing each of the n heat transfer plates in the stacking direction, and the pressurizing jig is prepared. Between the jig and the heat transfer plate in contact with the pressure jig, a release agent is interposed for removing the laminate from the pressure jig after the solid phase bonding, and the bottom is cut to form an opening. The release agent adhering to the region may be removed by forming.

INDUSTRIAL APPLICABILITY As described above, according to the present invention, there is provided a laminate and a method for producing the laminate that improve the reliability of joining metal parts by brazing and suppress an increase in production cost.

FIG. (a) is a schematic perspective view showing a part of the laminate of the present embodiment. FIG. (b) is a schematic cross-sectional view showing a cross section along A1-A2 in FIG. (a). FIG. 4 is a schematic cross-sectional view showing how a pipe is joined to the laminate of the present embodiment. It is a typical sectional view showing a manufacturing process by which the layered product of this embodiment is formed. It is a typical sectional view showing a manufacturing process by which the layered product of this embodiment is formed. It is a schematic perspective view showing an application example of the laminate of the present embodiment. It is a schematic perspective view showing an application example of the laminate of the present embodiment.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. XYZ axis coordinates may be introduced in each drawing. Also, the same members or members having the same function may be denoted by the same reference numerals, and the description may be omitted as appropriate after describing the members.

[Laminate]

FIG. 1(a) is a schematic perspective view showing a part of the laminate of this embodiment. FIG. 1(b) is a schematic cross-sectional view showing a cross section along A1-A2 in FIG. 1(a). That is, the cross section of FIG. 1B shows the cross section of the laminate 200 viewed from a direction perpendicular to the Z-axis direction.

A laminate 200 shown in FIG. 1A is a laminate formed by stacking n heat transfer plates 202 and joining them by solid phase bonding. FIG. 1( a ) illustrates corners of the laminate 200 . The laminate 200 has a rectangular parallelepiped shape, and has an upper surface 201u, a lower surface 201d, and side surfaces 201w connecting the upper surface 201u and the lower surface 201d. A hole 51 having a predetermined depth is provided in the laminate 200 from the upper surface 201u toward the lower surface 201d. When the laminated body 200 is viewed from above in the lamination direction Z, the outer shape of the hole 51 is, for example, circular.

Each of the n heat transfer plates 202 is a metal plate with high thermal conductivity. Each of the n heat transfer plates 202 is made of the same kind of metal. In the present embodiment, the material of the heat transfer plate 202 is described as the same kind of metal, but different kinds of metals may be used in combination. These metals are, for example, stainless steel, aluminum, copper, and the like.

As shown in FIG. 1(b), a through hole 510 penetrating in the stacking direction Z is formed in the heat transfer plate 202a arranged in the uppermost layer of the laminate 200. As shown in FIG. A through hole 511 penetrating in the stacking direction Z is formed in each of the plurality of heat transfer plates 202b positioned below the uppermost heat transfer plate 202a. A plurality of heat transfer plates 202c located below the plurality of heat transfer plates 202b are formed with through holes 512 penetrating in the stacking direction Z. As shown in FIG.

Through-holes 520 penetrating in the stacking direction Z are formed in a plurality of heat transfer plates 202d positioned below the heat transfer plate 202c. A plurality of heat transfer plates 202e located below the plurality of heat transfer plates 202d do not have through holes formed directly below the holes 51 .

Here, if the heat transfer plates 202a to 202e are collectively referred to as the heat transfer plate 202, and the through holes 510 to 512 are collectively referred to as the through hole 500, the laminate 200 includes m heat transfer plates counted from the heat transfer plate 202 of the uppermost layer. The through holes 500 communicating in the stacking direction Z are provided in each of the m heat transfer plates 202 up to the heat transfer plate 202 of the order (m<n).

That is, the through-holes 500 formed in each of the m heat transfer plates 202 communicate with each other in the stacking direction, so that the laminate 200 is formed with holes 51 into which pipes (described later), which are metal parts, are inserted. ing.

In the laminate 200, the inner diameters (inner diameters R1 and R2) of the through holes 510 formed in the heat transfer plate 202a of the uppermost layer are equal to those of the through holes 510 formed in the heat transfer plates 202b and 202c other than the heat transfer plate 202a of the uppermost layer. It is formed larger than the inner diameters (inner diameters R3, R4) of the holes 511, 512.

In the laminate 200, a step is formed on the inner wall of the uppermost heat transfer plate 202a. For example, the through hole 510 formed in the heat transfer plate 202a has a first hole portion 510a and a second hole portion 510b. The first hole portion 510a and the second hole portion 510b communicate with each other in the stacking direction Z. The second hole 510b is located between the first hole 510a and the second heat transfer plate 202b in the stacking direction Z. As shown in FIG. The inner diameter R2 of the first hole portion 510a is less than or equal to the inner diameter R1 of the second hole portion 510b.

In the laminate 200, from the second heat transfer plate 202b counting from the uppermost heat transfer plate 202a to the mth heat transfer plate 202b counting from the uppermost heat transfer plate 202a have the same inner diameter R3. The inner diameter R4 of the through-hole 512 formed in the (m+1)-th heat transfer plate 202c counted from the uppermost heat transfer plate 202a is formed smaller than the inner diameter R3.

The hole 51 communicates with the channel 20 provided inside the laminate 200 . The flow path 20 is formed, for example, by connecting through holes 520 formed in a plurality of heat transfer plates 202d in the stacking direction Z. As shown in FIG.

FIG. 2 is a schematic cross-sectional view showing how pipes are attached to the laminate of the present embodiment. The cross section shown in FIG. 2 is drawn from the same direction as the cross section shown in FIG. 1(b) (A1-A2 cross section).

Pipe 5 is inserted into hole 51 of laminate 200 . A fillet 6f is formed from the side surface 5w of the pipe 5 to the surface 202s of the second heat transfer plate 202b by the joining material (brazing material) 6 that joins the pipe 5 and the heat transfer plate 202b. The surface of the fillet 6f is formed in the shape of a slope, and wets and spreads from the side surface 5w of the pipe 5 to the surface 202s of the heat transfer plate 202b. The bonding material 6 is, for example, a nickel brazing material.

An outer diameter R5 of the pipe 5 is formed smaller than an inner diameter R3. Therefore, a gap is formed between the pipe 5 and the hole 51, and the bonding material 6 flows into this gap by capillary action. The pipe 5 and the through hole 511 may have a dimensional relationship of so-called "tight fit", in which case the outer diameter R5 may be equal to or larger than the inner diameter R3.

[Laminate production method]

3(a) to 4(b) are schematic cross-sectional views showing manufacturing processes for forming the laminate of the present embodiment. The cross sections shown in FIGS. 3(a) to 4(b) are drawn from the same direction as the cross section shown in FIG. 1(b) (A1-A2 cross section).

As shown in FIG. 3A, n heat transfer plates 202 are stacked in the stacking direction Z in advance. For example, a plurality of heat transfer plates 202d are laminated on the plurality of heat transfer plates 202e, and a heat transfer plate 202c is laminated on the plurality of heat transfer plates 202d. Further, a plurality of heat transfer plates 202b are laminated on the heat transfer plates 202c, and a heat transfer plate 202a is laminated on the plurality of heat transfer plates 202b.

In this lamination, the heat transfer plate 202c and the heat transfer plate 202b (first heat transfer plate) are aligned so that the through hole 512 and the through hole 511 (first through hole) are concentrically positioned. . The plurality of heat transfer plates 202b are aligned so that the respective through holes 511 are concentrically positioned.

A concave portion 510b having an inner diameter R1 larger than the inner diameter R3 is formed in advance in the uppermost heat transfer plate 202a (second heat transfer plate). This concave portion 510b has a bottom portion 510ab, which will be described later. The outer diameter and depth of the recess 510b are the same as the outer diameter and depth of the second hole 510b. Therefore, in this embodiment, the recess and the second hole are denoted by reference numeral "510b". The concave portion 510b is formed by, for example, etching, laser processing, precision press processing, cutting, 3D printer processing, or the like.

When stacking the heat transfer plate 202a on the plurality of heat transfer plates 202b, the heat transfer plates are arranged such that the recess 510b faces the through hole 511 and the recess 510b and the through hole 511 are positioned concentrically. 202a and the heat transfer plate 202b are aligned.

Next, each of the n heat transfer plates 202 is solid phase bonded to each other in the lamination direction Z by pressurizing and heating the n heat transfer plates 202 in a vacuum or an inert gas atmosphere. Here, solid phase bonding means, for example, diffusion bonding. The method of solid phase bonding is not limited to diffusion bonding, and may be hot pressure welding, cold pressure welding, or the like.

When forming the laminate 200 by solid phase bonding, pressure jigs 601 and 602 are used to press each of the n heat transfer plates 202 in the stacking direction Z. As shown in FIG. For example, the pressure jigs 601 and 602 sandwich the n heat transfer plates 202 from above and below in the stacking direction Z, and the pressure jigs 601 and 602 press the n heat transfer plates 202 in the stacking direction Z. .

At this time, between the pressing jigs 601 and 602 and the heat transfer plates 202 (the outermost heat transfer plates 202 of the laminate 200) forming the upper surface 201u and the lower surface 201d of the laminate 200, respectively, A mold release agent 610 is interposed for facilitating removal of the laminated body 200 bonded after solid-phase bonding from the pressure jigs 601 and 602 . The presence of the release agent 610 makes it easier to remove the laminated body 200 joined after the solid-phase joining from the pressure jigs 601 and 602 compared to the case where the release agent 610 is not present.

FIG. 3B shows the state of the laminate 200 after solid phase bonding. As shown in FIG. 3B, each of the heat transfer plate 202a, each of the plurality of heat transfer plates 202b, each of the heat transfer plates 202c, each of the plurality of heat transfer plates 202d, and each of the plurality of heat transfer plates 202e are solid phase bonded in the stacking direction Z to form a rectangular parallelepiped stack 200 .

Here, in the stacking direction Z, the recess 510b, each of the plurality of through holes 511, the through hole 512, and each of the plurality of through holes 520 communicate with each other to form the holes 51 in the laminate 200. . However, at this stage, the hole 51 is closed by the bottom 510ab of the recess 510b.

Next, as shown in FIG. 4A, for example, using a cutting tool such as a hole cutter 620, the surface of the heat transfer plate 202a on the side opposite to the recess 510b, that is, from the top surface 201u of the laminate 200 to the bottom 510ab is cut to form an opening. The hole cutter 620 has a cylindrical blade 620a and a drill 620b arranged on the center axis of the blade 620a so as to protrude from the blade 620a. As the hole cutter 620, one having an outer diameter R5 of the blade 620a that is equal to or smaller than the inner diameter R1 of the recess 510b and an inner diameter R6 of the blade 620a that is larger than the inner diameter R3 of the through hole 511 is used.

Here, when the bottom portion 510ab is cut by the hole cutter 620, a region portion that is concentric with the through hole 511 and has an outer diameter larger than the inner diameter R3 of the through hole 511 and equal to or smaller than the inner diameter R1 is removed. After the bottom portion 510ab is cut by the hole cutter 620, the area portion 510ac that forms a part of the bottom portion 510ab drops as shown in FIG. 4(b).

As a result, a through-hole 510 (second through-hole) is formed through the heat transfer plate 202a in the stacking direction Z, and the through-hole 510 and the through-hole 511 communicate in the stacking direction Z. As a result, the laminate 200 having the holes 51 in the upper surface 201u shown in FIG. 1B is formed.

After that, as shown in FIG. 2 , the pipe 5 is inserted into the hole 51 and is joined to the laminate 200 by brazing using the joining material 6 . The opening may be formed by cutting the bottom portion 510ab by a technique such as press working or end milling instead of cutting by the hole cutter 620 .

[effect]

Although the release agent 610 is subjected to cleaning treatment after solid-phase bonding, the release agent 610 is also pressurized toward the upper surface 201u and the lower surface 201d of the laminate 200 during the solid-phase bonding. 610 may remain as a contaminant layer on the upper surface 201u or the lower surface 201d.

In the present embodiment, when the hole 51 is formed in the laminate 200 , the cutting jig 620 removes the region 510 ac from the laminate 200 to which the contaminated layer may be attached. For this reason, the joining material 6 that joins the pipe 5 to the laminate 200 is not repelled by the contaminated layer (mold release agent) and is directly applied to the metal surface (surface 202s) of the heat transfer plate 202b on which the contaminated layer is not formed. will come into contact.

As a result, the bonding material 6 spreads over the surface 202s of the heat transfer plate 202b in a slope-like manner from the side surface 5w of the pipe 5, and the fillet 6a is well formed. The bonding material 6 is in close contact with the side surface 5w of the pipe 5 and the surface 202s of the heat transfer plate 202b, and the pipe 5 and the laminate 200 are firmly bonded by the bonding material 6. FIG. This improves the reliability of pipe joints.

Furthermore, since the joining member 6 is not repelled by the contaminated layer (release agent), the joining member 6 can easily enter the gap between the pipe 5 and the hole 51 . Thereby, the pipe 5 and the laminate 200 are firmly joined.

In addition, in this embodiment, since the contaminated layer near the portion where the pipe 5 is joined is removed by a simple physical process using the hole cutter 620 or the like, the contaminated layer is completely removed from the upper surface 201u by polishing or chemical treatment. The laminate 200 having the pipes 5 formed thereon can be formed at a lower cost compared to surface treatment.

Also, in the present embodiment, the outer diameter of the region portion 510ac is determined by the size of the inner diameter R6 of the blade 620a of the hole cutter 620, so the outer diameter of the region portion 510ac is smaller than the inner diameter R2 of the first hole portion 510a. This makes it possible to easily remove the area portion 510ac from the hole 51 .

For example, after cutting the bottom portion 510ab to form an opening, the cut bottom portion 510ab fits into the region portion 510ac in the hole cutter 620 or is caught by the drill 620b of the hole cutter 620 . The area portion 510ac is easily removed from the hole 51 by pulling it out from the through hole 510 .

Further, in this embodiment, the outer diameter of the region portion 510ac is determined by the size of the inner diameter R6 of the blade 620a of the hole cutter 620, so the outer diameter of the region portion 510ac is larger than the inner diameter R3 of the through hole 511. As a result, the region portion 510ac does not drop downward from the top layer heat transfer plate 202b and stays on the top layer heat transfer plate 202b. As a result, the region portion 510ac, which is a chip, does not enter deeply into the flow path 20 formed in the laminate 200 .

[Application example of laminate]

5 and 6 are schematic perspective views showing application examples of the laminate of the present embodiment.

A laminate 200 to which a pipe 5 is attached is applied to a microchannel heat exchanger 1 as an example. In the microchannel heat exchanger 1, heat is exchanged between a low temperature fluid and a high temperature fluid.

As shown in FIG. 5, the microchannel heat exchanger 1 includes a heat exchanger body 2 in which grooves or the like for flowing fluid are formed, a high-temperature side outer shell plate 3A as a lower outer shell plate, and an upper A low-temperature side outer shell plate 3B, which is an outer shell plate, a high-temperature inlet pipe 5A into which the high-temperature fluid flows, a high-temperature outlet pipe 5B into which the high-temperature fluid flows out, a low-temperature inlet pipe 5C into which the low-temperature fluid flows, and a low-temperature fluid flows out. and a cold outlet pipe 5D. Furthermore, a control board (not shown) may be attached to the microchannel heat exchanger 1 .

The heat exchanger main body 2, the high-temperature side shell plate 3A, and the low-temperature side shell plate 3B each form a laminated body 200 that is integrated by solid phase bonding. FIG. 5 is an exploded perspective view of a state in which the high-temperature-side outer shell plate 3A and the low-temperature-side outer shell plate 3B are separated from the heat exchanger main body 2 in order to explain the internal structure of the microchannel heat exchanger 1. It is shown.

The heat exchanger main body 2 corresponds to a laminate in which a plurality of heat transfer plates 202d are laminated. The high-temperature side outer shell plate 3A corresponds to a laminate in which a plurality of heat transfer plates 202e are laminated. The low temperature side outer shell plate 3B corresponds to a laminate in which the heat transfer plates 202a to 202c are laminated. A hot inlet pipe 5A, a hot outlet pipe 5B, a cold inlet pipe 5C, and a cold outlet pipe 5D respectively correspond to the pipes 5 described above. Each of flow paths 20A, 20B, 20C, and 20D corresponds to flow path 20 described above.

The heat transfer plate 202d forming the heat exchanger body 2 is further divided into a high temperature heat transfer plate 202da and a low temperature heat transfer plate 202db. The heat exchanger main body 2 is formed by alternately stacking a plurality of high-temperature heat transfer plates 202da and low-temperature heat transfer plates 202db. In the example of FIG. 5, the low-temperature heat transfer plate 202db is located in the uppermost layer of the heat exchanger main body 2. In the example of FIG.

The heat exchanger body 2 includes a low temperature inlet channel 23 into which the low temperature fluid flows, a low temperature outlet channel 24 into which the low temperature fluid flows out, a high temperature inlet channel 21 into which the high temperature fluid flows, and a high temperature fluid out. A hot outlet channel 22 is formed. Each of the low temperature inlet channel 23, the low temperature outlet channel 24, the high temperature inlet channel 21, and the high temperature outlet channel 22 penetrates through the heat exchanger body 2 in the Z-axis direction.

The low-temperature heat transfer plate 202db is provided with grooves 23B, 24B, and 25B that form flow paths for the low-temperature fluid. The grooves 23B, 24B, 25B are formed only on one side of the low-temperature heat transfer plate 202db, for example, by half-etching. A plurality of grooves 25B are provided, and the low temperature inlet channel 23 and the low temperature outlet channel 24 communicate with each other through the plurality of grooves 25B.

The cold inlet channel 23 communicates with the cold inlet pipe 5C via the groove 23B and the channel 20C. An external pipe (not shown) for inflowing a low-temperature fluid is detachably connected to the low-temperature inlet pipe 5C. The cold outlet channel 24 communicates with the cold outlet pipe 5D via the groove 24B and the channel 20D. An external pipe (not shown) through which the low temperature fluid flows is detachably connected to the low temperature outlet pipe 5D.

As a result, the low-temperature fluid flowing from the low-temperature inlet pipe 5C flows in the order of the flow path 20C, the groove 23B, the low-temperature inlet flow path 23, the groove 25B, the low-temperature outlet flow path 24, the groove 24B, and the flow path 20D. flow out from

On the other hand, FIG. 6 shows the grooves and the like formed in the high temperature heat transfer plate 202da after removing the uppermost low temperature heat transfer plate 202db from the heat exchanger main body 2. As shown in FIG. FIG. 6 does not show the high temperature side shell plate 3A.

The high-temperature heat transfer plate 202da is provided with grooves 23A, 24A, 25A, 26A, and 27A that form flow paths for high-temperature fluid. The grooves 23A, 24A, 25A, 26A, 27A are formed only on one side of the high-temperature heat transfer plate 202da, for example, by half-etching. A plurality of grooves 25A are provided, and grooves 26A and grooves 27A communicate with each other through the plurality of grooves 25A. Groove 26A communicates with hot inlet channel 21 and groove 27A communicates with hot outlet channel 22 .

The hot inlet channel 21 communicates with the hot inlet pipe 5A via the groove 23A and the channel 20A. An external pipe (not shown) for inflowing a high temperature fluid is detachably connected to the high temperature inlet pipe 5A. The hot outlet channel 22 communicates with the hot outlet pipe 5B via the groove 24A and the channel 20B. An external pipe (not shown) through which a high temperature fluid flows is detachably connected to the high temperature outlet pipe 5B.

As a result, the high-temperature fluid flowing from the high-temperature inlet pipe 5A flows in the order of the flow path 20A, the groove 23A, the high-temperature inlet flow path 21, the groove 26A, the groove 25A, the groove 27A, the high-temperature outlet flow path 22, the groove 24A, and the flow path 20B. flow out of the hot outlet tube 5B. The micro-channel heat exchanger 1 described above is of a parallel flow type in which the low-temperature fluid and the high-temperature fluid flow in the same direction. It can be applied to various types of micro-channel heat exchangers, such as a counterflow type and a cross-flow type in which a low-temperature fluid and a high-temperature fluid flow orthogonally.

According to such a micro-channel heat exchanger 1, the joint material 6 spreads over the surface 202s of the heat transfer plate 202b in a slope-like manner from the side surface 5w of the pipe 5, and the fillet 6a is well formed. Defective joining (brazing) due to insufficient rotation of the joining material 6 is prevented, the joining material 6 adheres to the side surface 5w of the pipe 5 and the surface 202s of the heat transfer plate 202b, and the joining material 6 firmly joins the pipe 5. Since the laminated body 200 is realized, the reliability of each connection of the high temperature inlet pipe 5A, the high temperature outlet pipe 5B, the low temperature inlet pipe 5C, and the low temperature outlet pipe 5D is improved, and furthermore, the manufacturing of the microchannel heat exchanger 1 is improved. Minimize cost increases.

Although the embodiments of the present invention have been described above, it is needless to say that the present invention is not limited to the above-described embodiments and can be modified in various ways. Each embodiment is not limited to an independent form, and can be combined as much as technically possible.

DESCRIPTION OF SYMBOLS 1... Microchannel heat exchanger 2... Heat exchanger main body 3A... High temperature side shell plate 3B... Low temperature side shell plate 5... Pipe 5A... High temperature inlet pipe 5B... High temperature outlet pipe 5C... Low temperature inlet pipe 5D... Low temperature outlet Tube 5w Side 6 Joining member 6a Fillet 20, 20A, 20B, 20C, 20D Channel 21 High temperature inlet channel 22 High temperature outlet channel 23 Low temperature inlet channel 24 Low temperature outlet channel 23A, 24A , 25A, 26A, 27A, 23B, 24B, 25B Groove 51 Hole 200 Laminate 201d Lower surface 201u Upper surface 201w Side surface 202, 202a, 202b, 202c, 202d, 202e Heat transfer plate 202da High temperature heat transfer Plate 202db Low-temperature heat transfer plate 202s Surface 500, 510, 511, 512, 520 Through hole 510a First hole 510b Second hole (recess)
510ab... Bottom part 510ac... Region part 601... Pressure jig 610... Release agent 620... Hole cutter 620a... Blade 620b... Drill

Claims (6)

In a laminate formed by stacking n heat transfer plates and joining them by solid phase joining,
In the laminate, a through hole is provided through each of m heat transfer plates from the heat transfer plate of the uppermost layer to the m heat transfer plate (m<n) in the stacking direction,
A hole into which a metal component is inserted is formed by connecting the through holes formed in each of the m heat transfer plates in the stacking direction,
The inner diameter of the through hole formed in the heat transfer plate of the uppermost layer is larger than the inner diameter of the through hole formed in the heat transfer plate other than the heat transfer plate of the uppermost layer,
The through holes formed in the heat transfer plate of the uppermost layer are
a first hole;
a second hole communicating with the first hole;
has
The second hole is located between the first hole and the through hole formed in the second heat transfer plate counted from the uppermost heat transfer plate,
The inner diameter of the first hole is smaller than the inner diameter of the second hole. Laminated body. A laminate according to claim 1 ,
The through holes formed from the second heat transfer plate counted from the top heat transfer plate to the mth heat transfer plate counted from the top heat transfer plate have the same inner diameter,
The inner diameter of the through hole formed in the (m+1)-th heat transfer plate counted from the heat transfer plate of the uppermost layer is smaller than the same inner diameter. A laminate according to claim 1 or 2 ,
the metal part is inserted into the hole,
A fillet made of a bonding material for bonding the metal part and the second heat transfer plate is formed from the side surface of the metal part to the surface of the second heat transfer plate counted from the uppermost heat transfer plate. Laminate. n heat transfer plates are laminated and joined by solid phase bonding, and m heat transfer plates counted from the uppermost heat transfer plate to the mth heat transfer plate (m<n) In a method for manufacturing a laminate having a hole for inserting a metal part,
A plurality of first heat transfer plates having first through holes with the same inner diameter are stacked such that the first through holes are concentrically positioned;
A second heat transfer plate having a bottom portion and a recess having an inner diameter larger than the inner diameter of the first through hole is formed in the second heat transfer plate, the recess facing the first through hole, and the recess and the first through hole. Laminating the second heat transfer plate on the plurality of first heat transfer plates so that the and are concentrically positioned,
Each of the plurality of first heat transfer plates and the second heat transfer plate are laminated and solid phase bonded,
A second through hole penetrating in the stacking direction is formed in the second heat transfer plate by cutting the bottom portion to form an opening, and the second through hole and the first through hole are aligned in the stacking direction. A method for manufacturing a laminate, wherein the holes are formed in the laminate by communicating with each other. A method for manufacturing a laminate according to claim 4 ,
When cutting the bottom to form an opening, a region of the bottom that is larger than the inner diameter of the first through-hole and equal to or less than the inner diameter of the recess and concentric with the first through-hole is removed. body manufacturing method. A method for manufacturing a laminate according to claim 5 ,
When forming the laminate by solid phase bonding, prepare a pressurizing jig for pressurizing each of the n heat transfer plates in the stacking direction,
Between the pressure jig and the heat transfer plate in contact with the pressure jig, a release agent is interposed for easy removal of the laminate from the pressure jig after the solid phase bonding,
A method of manufacturing a laminate, wherein the release agent adhering to the region is removed by cutting the bottom to form an opening.

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