JP7275616B2 - Light emitting device, optical device and information processing device - Google Patents

Description

The present invention relates to a light emitting device, an optical device and an information processing device.

Patent Document 1 discloses a surface-emitting laser array having a light-emitting region having a plurality of light-emitting portions each formed of a surface-emitting laser element including a lower reflector, a resonator region including an active layer, and an upper reflector, and a wall formed so as to surround the electrode pad and electrically insulated from the electrode pad. A laser array is disclosed.

JP 2017-084899 A

An object of the present invention is to provide a structure in which a light-emitting element array and circuit elements are arranged on the surface of a base material mounted on a wiring board, and the light-emitting element array and the circuit elements face the light-emitting element array along the direction in which they are arranged. Compared to the configuration in which the conductive pattern connected to the upper surface electrode of the light emitting element array and the penetrating member of the base material is arranged only at the position, the inductance between the light emitting element array and the wiring board on which the base material is mounted is reduced. An object of the present invention is to provide a light-emitting device, an optical device, and an information processing device that are configured to be easily reduced.

A light-emitting device according to a first aspect includes a substrate mounted on a wiring substrate, a light-emitting element array provided on the substrate, and connected to the light-emitting element array, along the side surface of the light-emitting element array. a first conductive pattern provided on the surface of the base material and having a facing region facing the light emitting element array and an extension region extending beyond the facing region; and a plurality of penetrating members connected to the extension region and penetrating to the rear surface side of the base material.

A light-emitting device according to a second aspect is the light-emitting device according to the first aspect, further comprising: a circuit element provided in parallel with the light-emitting element array along the direction in which the first conductive pattern extends; is extended to at least a position facing a portion of the circuit element.

A light-emitting device according to a third aspect is the light-emitting device according to the second aspect, provided on the surface of the substrate opposite to the first conductive pattern with the light-emitting element array interposed therebetween, and facing the light-emitting element array. and an extension region extending beyond the opposing region toward the circuit element, wherein at least part of the circuit element It is provided between the extension region of one conductive pattern and the extension region of the second conductive pattern.

A light-emitting device according to a fourth aspect is the light-emitting device according to the second aspect or the third aspect, wherein the circuit element is a photoelectric conversion element that receives light emitted from the light-emitting element array.

A light-emitting device according to a fifth aspect is the light-emitting device according to the fourth aspect, wherein a light diffusion member for diffusing light emitted from the light-emitting element array to the outside is provided above the light-emitting element array and the photoelectric conversion elements. It is provided.

A light-emitting device according to a sixth aspect is the light-emitting device according to any one of the second to fifth aspects, wherein the circuit element is a capacitor that supplies current to the light-emitting element array.

A light-emitting device according to a seventh aspect is the light-emitting device according to any one of the first to sixth aspects, wherein a rear-side conductive pattern is provided on the rear surface of the base material, and the penetrating member 1 and the conductive pattern on the back side.

A light-emitting device according to an eighth aspect is the light-emitting device according to any one of the first to seventh aspects, further comprising a plurality of wiring members for connecting the light-emitting element array and the first conductive pattern, A plurality of wiring members are connected to the facing area and the extension area.

A light-emitting device according to a ninth aspect is the light-emitting device according to the eighth aspect, wherein the plurality of wiring members are connected in a row on the first conductive pattern, and the plurality of penetrating members are arranged in the row-shaped region. It is provided so as to overlap with the

A light-emitting device according to a tenth aspect is the light-emitting device according to the eighth aspect or the ninth aspect, wherein: a connection point between the penetrating member and the first conductive pattern; It overlaps with the connection point.

A light emitting device according to an eleventh aspect is the light emitting device according to any one of the eighth aspect to the tenth aspect, wherein the number of the penetrating members is greater than the number of the wiring members.

A light-emitting device according to a twelfth aspect is the light-emitting device according to any one of the eighth aspect to the eleventh aspect, wherein the total cross-sectional area of the plurality of penetrating members is the total cross-sectional area of the plurality of wiring members. is greater than the value

A light-emitting device according to a thirteenth aspect is the light-emitting device according to any one of the first to twelfth aspects, wherein the light-emitting element array has a plurality of light-emitting elements, and the plurality of light-emitting elements in the light-emitting element array The shape of the region in which the elements are arranged is such that the length in the direction crossing the first conductive pattern is longer than the length in the direction along the first conductive pattern.

A light-emitting device according to a fourteenth aspect is the light-emitting device according to the thirteenth aspect, wherein the plurality of light-emitting elements are connected in parallel.

A light-emitting device according to a fifteenth aspect is the light-emitting device according to any one of the first to fourteenth aspects, wherein the substrate is made of ceramic.

A light-emitting device according to a sixteenth aspect is the light-emitting device according to the first aspect, further comprising an identification display region provided in parallel with the light-emitting element array along the direction in which the first conductive pattern extends; The region extends at least to a position facing a portion of the identification display region.

A light-emitting device according to a seventeenth aspect is the light-emitting device according to the sixteenth aspect, wherein the identification display area is an area including at least one of letters, numbers, and symbols for identifying the self-device and other devices. be.

An optical device according to an eighteenth aspect comprises the light emitting device according to any one of the first to seventeenth aspects, and receives reflected light emitted from the light emitting element array included in the light emitting device and reflected by an object to be measured. and a three-dimensional sensor that outputs a signal corresponding to the time from when the light is emitted from the light-emitting element array to when the light is received by the three-dimensional sensor.

An information processing apparatus according to a nineteenth aspect includes the optical device according to the eighteenth aspect, and light emitted from the light emitting element array included in the optical device, reflected by the object to be measured, and received by a three-dimensional sensor included in the optical device. a shape specifying unit that specifies the three-dimensional shape of the object to be measured based on the reflected light.

An information processing apparatus according to a twentieth aspect is the information processing apparatus according to the nineteenth aspect, further comprising an authentication processing section that performs authentication processing regarding use of the own apparatus based on the identification result of the shape identification section.

According to the first aspect and the sixteenth to nineteenth aspects, in the configuration in which the light emitting element array and the circuit elements are arranged on the surface of the base material mounted on the wiring board, the arrangement of the light emitting element array and the circuit elements Compared to the configuration in which the conductive pattern connected to the upper surface electrode of the light emitting element array and the penetrating member of the base material is arranged only at the position facing the light emitting element array along the direction, the light emitting element array and the base material are mounted. It is possible to provide a light-emitting device having a configuration that facilitates reducing the inductance between the wiring board and the substrate.

According to the second aspect, there is an effect that the space for connecting the penetrating member is increased compared to the case where the penetrating member is not extended to the position facing the part of the circuit element.

According to the third aspect, compared to the case where the first and second conductive patterns are not extended to cover part of the circuit element, the space for connecting the penetrating member is increased.

According to the fourth aspect, there is an effect that the light emitted from the light emitting element array is received when the light diffusion member or the like is provided above the light emitting element array.

According to the fifth aspect, the light from the light emitting element array is diffused and irradiated, and the light reflected downward by the light diffusion member is photoelectrically converted compared to the case where there is no light diffusion member above the photoelectric conversion element. The effect is that the light is easily received by the element.

According to the sixth aspect, there is an effect that the light emitting element array and the capacitor are arranged close to each other.

According to the seventh aspect, when the light emitting device is mounted on the wiring board, there is an effect that it is not necessary to connect the first conductive pattern and the wiring board with a bonding wire.

According to the eighth aspect, there is an effect that the inductance is reduced as compared with the case of connecting only to the opposing region.

According to the ninth aspect, there is an effect that the inductance is reduced as compared with the case where they do not overlap.

According to the tenth aspect, there is an effect that the inductance is reduced as compared with the case where they do not overlap.

According to the eleventh aspect, compared with the case where the number of penetrating members is smaller than the number of wiring members, it is possible to easily reduce the inductance without increasing the size of the light emitting element array.

According to the twelfth aspect, compared with the case where the total value of the cross-sectional areas of the penetrating members is smaller than the total value of the cross-sectional areas of the wiring members, it is possible to reduce the inductance.

According to the thirteenth aspect, the shape of the region in which the plurality of light emitting elements are arranged sets the current loop of the drive circuit shorter than when the length in the direction along the first conductive pattern is longer. It has the effect of making it easier to

According to the 14th aspect, compared with the configuration in which the light emitting elements are driven individually, there is an effect that the light of high intensity is emitted simultaneously.

According to the fifteenth aspect, there is an effect that heat is easily dissipated compared to the case of using a member having a thermal conductivity lower than that of ceramics.

According to the twentieth aspect, there is an effect that authentication is performed more stably than when the authentication processing section is not used.

1A is a diagram showing an example of the appearance of an information processing apparatus according to an embodiment, and FIG. 1B is a block diagram showing an example of an electrical configuration; FIG. 1A is a plan view of a light emitting element array, FIG. 1B is a circuit diagram of a light emitting device, and FIG. 1A and 1B are a side cross-sectional view and a plan view of a light emitting device according to an embodiment; 1A is a plan view and a cross-sectional side view of a light-emitting module according to an embodiment, FIG. 1B is a back view, and FIG. (a) is a plan view of a first modification, (b) is a plan view of a second modification, and (c) is a plan view of a third modification. 2A and 2B are a plan view and a side cross-sectional view of a light-emitting module according to a comparative example; FIG.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the drawings.

A light-emitting device, an optical device, and an information processing device according to the present embodiment will be described with reference to FIGS. 1 to 4. FIG. In the following embodiments, as an example of an information processing device, a portable information processing device represented by a smart phone will be described.

FIG. 1(a) shows the appearance of an information processing apparatus 10 according to this embodiment. The information processing apparatus 10 includes an optical device 24 and a UI (User Interface) section 20 . The UI unit 20 is configured, for example, by integrating a display device for displaying information to a user and an input device for inputting an instruction for information processing by a user's operation. A display device is, for example, a liquid crystal display or an organic EL display, and an input device is, for example, a touch panel.

The optical device 24 has a light emitting device 23 and a three-dimensional sensor 13 . The light emitting device 23 is a part that emits light toward the object to be measured in order to obtain a three-dimensional image. In this embodiment, a human face will be described as an example of the object to be measured. The three-dimensional sensor 13 receives reflected light that is returned after the light emitted by the light emitting device 23 is reflected by the face. The three-dimensional sensor 13 according to this embodiment has a function of acquiring, for example, a three-dimensional image of a human face based on the so-called TOF (Time of Flight) method.

An electrical configuration of the information processing apparatus 10 will be described with reference to FIG. As shown in FIG. 1B, the information processing apparatus 10 includes a system control section 16, a ROM 18, a RAM 19, a UI section 20, an optical device 24, a speaker 21 and a two-dimensional camera 22. FIG. Of course, this configuration is just an example, and some configurations may be deleted or other configurations may be added depending on the purpose, application, and the like.

The system control unit 16 is, for example, a CPU, and the information processing apparatus 10 is configured as a computer including the system control unit 16, a ROM 18, a RAM 19, and the like. The system control unit 16 controls the entire information processing apparatus 10 as a system and includes an authentication processing unit 17 . Note that the ROM 18 includes a non-volatile rewritable memory such as a flash memory. Programs and constants stored in the ROM 18 are developed in the RAM 19, and the system control unit 16 executes the programs to operate the information processing apparatus 10 and perform various types of information processing. The speaker 21 is a part that emits sound to the user, and the two-dimensional camera 22 is a normal camera used for photographing by the user. ROM 18 , RAM 19 , UI section 20 , speaker 21 and two-dimensional camera 22 are each connected to system control section 16 via bus 25 .

As shown in FIG. 1B, the optical device 24 includes the light emitting device 23, the three-dimensional sensor 13, and the optical device controller 14 described above. The optical device control section 14 is connected to the system control section 16 and controls the optical device 24 as a whole. The optical device control section 14 also includes a shape identification section 15 . Each of the light emitting device 23 and the three-dimensional sensor 13 is connected to the optical device control section 14 .

As shown in FIG. 1B, the light emitting device 23 includes a light emitting element array 11 and driving elements 12 . The light emitting element array 11 is a semiconductor light emitting element in which a plurality of light emitting elements are arranged. The drive element 12 is a driver IC that drives the light emitting element array 11 . The light emitting element array 11 is driven by the driving element 12 so as to emit pulsed light (emission light pulse) of several tens of MHz to several hundreds of MHz, for example. The light-emitting device 23 is configured such that the three-dimensional sensor 13 receives the reflected light of the light emitted from the light-emitting element array 11 toward the object to be measured and reflected by the object to be measured.

Next, the relationship between the three-dimensional sensor 13 and TOF will be described. The three-dimensional sensor 13 according to this embodiment has a plurality of light receiving areas (pixels). The three-dimensional sensor 13 receives the reflected light (light receiving pulse) from the object to be measured in response to the light pulse emitted from the light emitting element array 11, and accumulates charges corresponding to the time until the light is received in each light receiving area. As an example, the three-dimensional sensor 13 is configured as a CMOS structure device in which each light receiving region includes two gates and charge storage portions corresponding to the two gates. By alternately applying pulses to the two gates, the generated photoelectrons are transferred at high speed to one of the two charge storage units, and charges corresponding to the phase difference (i.e., time difference) between the emitted light pulse and the received light pulse are accumulated. configured to accumulate. A signal corresponding to the accumulated charge is output from the three-dimensional sensor 13 via an AD (Analog Digital) converter as a digital signal corresponding to the charge corresponding to the phase difference between the emitted light pulse and the received light pulse for each light receiving area. . That is, the three-dimensional sensor 13 outputs a signal corresponding to the time from when the light is emitted from the light emitting element array 11 until when the light is received by the three-dimensional sensor 13 . In addition, the three-dimensional sensor 13 may be provided with a lens for collecting light.

A shape identification unit 15 included in the optical device control unit 14 acquires a digital value generated for each light receiving area of the three-dimensional sensor 13, calculates the distance to the object to be measured for each light receiving area, and determines the distance to the object to be measured. Identify the three-dimensional shape of

On the other hand, the authentication processing unit 17 included in the system control unit 16 detects information when the three-dimensional shape (specification result) of the object to be measured specified by the shape specifying unit 15 matches the three-dimensional shape stored in advance in the ROM 18 or the like. An authentication process for using the processing device 10 is performed. Note that the authentication process regarding the use of the information processing device 10 is, for example, a process of whether or not to permit use of the own device (the information processing device 10). For example, when the three-dimensional shape of the face, which is the object to be measured, matches the face shape stored in the storage means such as the ROM 18, the information processing apparatus 10 including various applications provided by the information processing apparatus 10 can be used. Allowed.

The shape identification unit 15 and the authentication processing unit 17 described above are configured by a program as an example. Alternatively, it may be configured by an integrated circuit such as ASIC or FPGA. Furthermore, it may be composed of software such as a program and an integrated circuit.

The light emitting element array 11 emits light for specifying the three-dimensional shape of the object to be measured as described above, and irradiates the object to be measured. That is, the light emitting element array 11 irradiates a predetermined measurement range with light having a predetermined density. The form of the plurality of light emitting elements included in the light emitting element array 11 is not particularly limited, and VCSELs (Vertical Cavity Surface Emitting Lasers), LEDs (Light Emitting Diodes), etc. are used. ing. Preferably, it is composed of a multi-mode VCSEL which is more likely to have a higher output than a single-mode VCSEL.

A plurality of VCSELs (light emitting elements) are electrically connected in parallel with each other. The optical output per VCSEL is set to 4 mW to 8 mW as an example, and the number of VCSELs included in the light emitting element array 11 is 100 to 1000 as an example. FIG. 2A shows a plan view of the light emitting element array 11. FIG. As shown in FIG. 2(a), the surface of the light emitting element array 11 is covered with a solid anode pattern 50 (electrode wiring) formed in a region excluding the light exit port 52 of each VCSEL. At the end along each side, there is a connection area by the bonding wire of the anode pattern 50 . A semiconductor substrate of the light emitting element array 11 is, for example, an n-type GaAs substrate, and a cathode electrode is arranged on the back side of the substrate.

A drive circuit for the light emitting element array 11 will be described with reference to FIG. FIG. 2B shows a circuit diagram of the light emitting device 23. As shown in FIG. As shown in FIG. 2B, the light-emitting device 23 includes a light-emitting element array 11, a driving element 12, a light-receiving element 30 for light quantity monitoring, a resistor 38, a capacitor 35, and a power supply .

As described above, the light emitting element array 11 is configured by connecting a plurality of VCSELs 26 in parallel. A current source included in the driving element 12 is connected to the VCSELs 26 connected in parallel, and a driving current id is supplied from the current source.

The light intensity monitoring light receiving element 30 has a function of monitoring the light intensity of the light emitting element array 11 . That is, the output signal from the light intensity monitoring light receiving element 30 is used to control the light emitting element array 11 to emit light while maintaining a predetermined light intensity. The light intensity monitoring light receiving element 30 is, for example, a photodiode (PD) made of silicon or the like that outputs an electric signal corresponding to the amount of light received. That is, the light intensity monitoring light-receiving element 30 receives part of the light emitted from the light-emitting element array 11 and outputs a monitor current im corresponding to the amount of received light. The monitor current im is converted into a voltage by a resistor 38 and output as a monitor voltage Vpd. The monitor voltage Vpd is sent to a light amount monitoring circuit (not shown) provided inside the driving element 12, and the light amount monitoring circuit monitors the amount of light emitted from the light emitting element array 11 based on the monitor voltage Vpd. do. The light intensity monitoring light-receiving element 30 is an example of the "circuit element" according to the present invention.

On the other hand, the power supply 36 is a power supply for operating the light emitting element array 11 and the light intensity monitoring light receiving element 30, and the capacitor 35 functions as a current source as will be described later. The power supply 36 is composed of, for example, a power supply layer and a ground layer provided inside the wiring board 27 .

Next, with reference to FIG. 3, the configuration of the light emitting device 23 according to this embodiment will be described. FIG. 3 <1> is a side sectional view of the light emitting device 23, and <2> is a plan view. As shown in FIG. 3, the light-emitting device 23 includes a light-emitting module 40 mounted on the wiring board 27, a light diffusion plate 33, a spacer 32, and the drive element 12. As shown in FIG. The wiring board 27 is composed of, for example, a glass epoxy board on which wirings for connecting elements are formed. The light diffusing plate 33 is an example of the "light diffusing member" according to the present invention.

The light emitting module 40 includes a base material 31, a light emitting element array 11 mounted on the base material 31, and a light receiving element 30 for light quantity monitoring. The base material 31 is made of ceramic, for example, and mainly has a function of efficiently dissipating heat generated in the light emitting element array 11 .
This is because the output of the light-emitting element array 11 is as large as several watts, and heat dissipation becomes a problem. More specifically, the base material 31 is made of aluminum oxide, aluminum nitride, or the like. Note that the base material 31 may be configured using a material commonly used as a wiring board, such as glass epoxy. In this case, the light-emitting element array 11 and the light-receiving element 30 for monitoring the amount of light can be configured as a single module package, although the heat radiation efficiency is lower than that of the ceramic base material. , distribution and handling become easier.

Here, in the TOF method, it is necessary to irradiate an irradiation surface (for example, several meters away) of an object to be measured with a uniform laser beam within a predetermined range. Therefore, the light diffusion plate 33 has a function of diffusing the emitted light L emitted from the light emitting element array 11 and enlarging the emission angle. That is, as shown in FIG. 2(c), the light diffusion plate 33 is provided with an uneven member 39, which enlarges the emission angle of the emission light L emitted from the light emitting element array 11 at the emission angle θ1 to θ2 (>θ1). . More specifically, the light diffusing plate 33 includes, for example, a concave-convex member 39 made of a resin layer having concaves and convexes for diffusing light on one surface of a glass base material whose both surfaces are parallel and flat. The unevenness further diffuses the emitted light L emitted from the light emitting element array 11 and irradiates it to the outside.

The spacer 32 is arranged between the wiring board 27 and the light diffusion plate 33, supports the light diffusion plate 33, and positions the light diffusion plate 33 so that the distance from the light emitting element array 11 is a predetermined distance. are doing. Further, in this embodiment, by sealing the light emitting element array 11 and the like with the light diffusing plate 33 and the spacer 32, dust prevention, moisture prevention, and the like are achieved. The spacer 32 is made of ceramic or resin material, for example.

The light diffusing plate 33 further has a function of guiding part of the light emitted from the light emitting element array 11 to the light receiving element 30 for monitoring the amount of light. That is, the light diffusing plate 33 is provided so as to cover the light emitting element array 11 and the light intensity monitoring light receiving elements 30 , and the light reflected by the back surface of the light diffusing plate 33 without passing through the light diffusing plate 33 reaches the light intensity monitoring light receiving elements 30 . is arranged to receive light at Since the amount of light received by the light intensity monitoring light receiving element 30 decreases as the distance from the light emitting element array 11 increases, the light emitting element array 11 and the light intensity monitoring light receiving element 30 are preferably arranged close to each other. The light intensity monitoring light-receiving element 30 is also used to detect that the light diffusing plate 33 is detached or damaged and the light emitted from the light-emitting element array 11 is directly irradiated to the outside.

By the way, a VCSEL array used for measuring TOF may be required to start up a large current of, for example, 2 A with a rise time of 1 ns or less, or to be driven at a high frequency of about 100 MHz. It is important to reduce the inductance component of the circuit. One possible way to reduce the inductance component is to increase the number of bonding wires as much as possible, but it is also assumed that this alone is not sufficient. Therefore, in the present embodiment, measures are taken to reduce the inductance component caused by the base material 31 . In order to reduce the inductance of the driving circuit, it is also important to shorten the current loop composed of the capacitor 35 serving as the current source, the light emitting element array 11 and the driving element 12 . FIG. 3 <2> illustrates a case where two capacitors 35-1 and 35-2 are arranged as the capacitor 35 to form two current loops L1 and L2.

Further, in the present embodiment, in order to efficiently dissipate heat from the light-emitting element array 11, the light-emitting element array 11 is not mounted directly on the wiring board 27 such as a printed board, but is mounted via the base material 31 for heat dissipation. It is mounted on the wiring board 27 . In addition, the circuit elements such as the light intensity monitoring light receiving element 30 for receiving the light emitted from the light emitting element array 11 are mounted together with the light emitting element array 11 on the base material 31 for heat dissipation in close proximity to the light emitting element array 11 . . In order to drive the light-emitting element array 11 at high speed in a configuration in which the light-emitting element array 11 and the light-receiving elements 30 (circuit elements) for monitoring the amount of light are arranged on the surface of the substrate 31, the anode pattern 50 (upper portion) of the light-emitting element array 11 is required. electrodes) and the wiring substrate 27 on which the substrate 31 is mounted is desired to be reduced. The light-emitting module 40 according to the present embodiment is designed in consideration of the above points.

The light-emitting module 40 according to the present embodiment will be described in more detail with reference to FIG.
As described above, the light emitting module 40 according to the present embodiment includes the base material 31, and the light emitting element array 11 and the light intensity monitoring light receiving element 30 mounted on the base material 31. FIG. In FIG. 4A, <1> shows a plan view of the light emitting module 40, <2> shows a side cross-sectional view along line AA' in <1>, and <3> shows BB'. Fig. 3 shows a side cross-sectional view along line;

As shown in FIG. 4A <1>, conductive patterns 42-1, 42-2, 41-1, and 41-2 are formed on the substrate 31. As shown in FIG. Each of the conductive patterns 42-1, 42-2, 41-1, and 41-2 is formed of, for example, a deposited film of gold or the like, silver paste, or the like. The conductive patterns 42-1 and 42-2 are patterns for relaying the connection between the light emitting element array 11 and the wiring board 27, and the conductive patterns 41-1 and 41-2 connect the light intensity monitoring light receiving element 30 and the wiring board 27. This is a pattern that relays connections with

As shown in FIG. 4A <1><3>, the light emitting element array 11 and each of the conductive patterns 42-1 and 42-2 are connected by bonding wires W. As shown in FIG. The back electrode of the light emitting element array 11 is connected to a conductive pattern (not shown) formed on the base material 31 by a conductive bonding member or the like, and the back electrode of the light emitting element array 11 is electrically connected. On the other hand, as shown in FIG. 4A <1> and <2>, the conductive patterns 42-1 and 42-2 are connected to the conductive patterns 47-1 and 47- on the back surface of the base material 31 via vias V, respectively. 2 is connected. Each of the conductive patterns 47-1 and 47-2 is connected to a wiring pattern formed on the wiring board 27, and the light emitting element array 11 is connected to other circuits or the like mounted on the wiring board 27. FIG. The "bonding wire W" is an example of the "wiring member" according to the present invention, and the "via V" is an example of the "penetrating member" according to the present invention.

The back electrode of the light intensity monitoring light receiving element 30 and the conductive pattern 41-1 are connected by a conductive bonding member, and the back electrode of the light intensity monitoring light receiving element 30 is electrically connected. A bonding wire W is used to connect the other electrode of the light-receiving element 30 for monitoring the amount of light and the conductive pattern 41-2. Further, as shown in FIG. 4 <1><2>, the conductive patterns 41-1 and 41-2 are connected to the conductive patterns 48-1 and 48-2 (see FIG. 4 is hidden by the conductive pattern 48-1 and is connected to the part (see FIG. 4(b)). Each of the conductive patterns 48-1 and 48-2 is connected to a wiring pattern formed on the wiring board 27, and a light quantity monitoring circuit inside the driving element 12 in which the light quantity monitoring light receiving element 30 is mounted on the wiring board 27. connected to

FIG. 4(b) shows the back surface of the substrate 31. FIG. As shown in FIG. 4B, the conductive patterns 47-1, 47-2, 48-1, and 48-2 are formed on the rear surface of the base material 31. As shown in FIG. Furthermore, a conductive pattern 53 is formed on the back surface of the base material 31 at a position corresponding to the light emitting element array 11 , and the conductive pattern 53 is connected to the back surface of the light emitting element array 11 through vias V.

Next, a method for reducing the inductance component in the light emitting module 40 according to this embodiment will be described. As shown in FIG. 4A, the conductive patterns 42-1 and 42-2 according to this embodiment have a conductive area OA and an extended conductive area EA. The conductive area OA has a length along one side of the light emitting element array 11, and the extended conductive area EA extends beyond the one side of the conductive area OA in the direction of the light receiving element 30 for monitoring the amount of light. A via V is formed from the conductive area OA to the extended conductive area EA. In this way, the light intensity monitoring light receiving element 30 is arranged on the center side in the width direction of the base material 31, and the extended conductive area EA is extended to a position facing a part of the light intensity monitoring light receiving element 30 (circuit element). It is preferable that As a result, the space for connecting the penetrating member increases compared to the case where it is not extended to a position facing a portion of the light-receiving element 30 for monitoring the amount of light. The extended conductive area EA is an example of the "extended area" according to the present invention.

FIG. 6 shows a light emitting module 80 according to a comparative example shown for comparison with the light emitting module 40 . FIG. 6 <1> is a plan view of the light emitting module 80, and FIG. 6 <2> is a side cross-sectional view taken along the line C-C' shown in <1>. In FIG. 6, the same reference numerals are assigned to the same configurations as those of the light emitting module 40, and detailed description thereof will be omitted.

As shown in FIG. 6, in light emitting module 80, conductive patterns 46-1 and 46-2 corresponding to conductive patterns 42-1 and 42-2 in light emitting module 40 do not have extended conductive regions. That is, each of the conductive patterns 46 - 1 and 46 - 2 has a length along only one side of the light emitting element array 11 . Therefore, the number of vias V connected to each of the conductive patterns 46-1 and 46-2 (the case of nine in FIG. 6 <2> is illustrated) is the same as that of the conductive patterns 42-1 and 42-2. It is smaller than the number of vias V connected to each (FIG. 4A <2> illustrates a case of 14).

That is, since the light-emitting module 40 according to the present embodiment has the vias V not only in the conductive region OA but also in the extended conductive region EA, the number of inductance components caused by the vias V connected in parallel increases. As a result, the inductance component from the light emitting element array 11 to the wiring board 27 is smaller than that of the light emitting module 80 according to the comparative example.

Here, the mutual relationship among the bonding wires W, the vias V, and the conductive patterns 42-1 and 42-2 according to the present embodiment for further reducing the inductance component will be described. By adopting the following configuration, the inductance component from the light emitting element array 11 to the wiring board 27 is further reduced.

A plurality of bonding wires W are connected in a row on the conductive patterns 42-1 and 42-2, and connection points between the vias V and the conductive patterns 42-1 and 42-2, bonding wires W and the conductive pattern 42-1 are connected. , 42-2 may be arranged so as to overlap each other as shown in FIG. 4(c). That is, at least part of the cross section of the bonding wire W and at least part of the cross section of the via V may be arranged so as to overlap each other in plan view. The configuration for connecting the plurality of bonding wires W in a row on the conductive patterns 42-1 and 42-2 is not limited to the configuration shown in FIG. -2 and the connection points between the bonding wires W and the conductive patterns 42-1 and 42-2 may be alternately arranged in a row. In this case, at least a portion of the connection points between the vias V and the conductive patterns 42-1 and 42-2 and the connection points between the bonding wires W and the conductive patterns 42-1 and 42-2 may overlap. and may not overlap.

Also, the number of vias V may be greater than the number of bonding wires W. FIG. If an attempt is made to reduce the inductance of the driving circuit by increasing the number of bonding wires W, the size of the light emitting element array 11 must be increased in accordance with the number of bonding wires W. FIG. On the other hand, if the inductance of the drive circuit is reduced by increasing the number of vias V, it is not necessary to increase the size of the light emitting element array 11 .

Also, the total value of the cross-sectional areas of the plurality of vias V may be larger than the total value of the cross-sectional areas of the plurality of bonding wires W. FIG.

The shape of a region (light emitting region) in which a plurality of VCSELs 26 (light emitting elements) are arranged within the outer shape of the light emitting element array 11 is larger than the length in the direction along the conductive pattern 42-1 or 42-2. The length in the direction crossing 42-1 or 42-2 may be longer. If the light-emitting region has the same area, the shorter the length in the direction along the conductive pattern 42 - 1 or 42 - 2 , the less the bonding wire W needs to be arranged farther from the drive element 12 . This makes it easy to set the two current loops L1 and L2 in FIG. 3 short.

<Modification>
A modification of the light-emitting module 40 according to the present embodiment will be described with reference to FIG.
In the following description, the same components as those of the light emitting module 40 are denoted by the same reference numerals, and detailed description thereof will be omitted.

FIG. 5(a) shows a light emitting module 40A according to a first modified example. The difference between the light emitting module 40A and the light emitting module 40 is that the bonding wire W is connected not only to the conductive area OA but also to the extended conductive area EA in the light emitting module 40A. Since this increases the number of bonding wires W connected in parallel, the inductance component can be further reduced.

FIG. 5(b) shows a light emitting module 40B according to a second modification. The difference between the light-emitting module 40B and the light-emitting module 40 is that the light-emitting module 40B has an identification display area 70 instead of the light-receiving element 30 for monitoring the amount of light. The identification display area 70 is formed of, for example, a conductive pattern on the base material 31, and is an area including at least one of characters, numbers, and symbols for distinguishing the device from other devices. As described above, the “circuit element” according to the present invention is not limited to electrical components such as the light intensity monitoring light receiving element 30 , but may be a non-electrical configuration mounted or formed on the substrate 31 . According to the second modification, even if the circuit element is the identification display area 70, the inductance component is further reduced.

FIG. 5(c) shows a light emitting module 40C according to a third modified example. A difference between the light-emitting module 40C and the light-emitting module 40 is that the light-emitting module 40C has a capacitor 72 instead of the light-receiving element 30 for monitoring the amount of light. In light-emitting module 40C, conductive patterns 43-1 and 43-2 to which bonding wires W from light-emitting element array 11 are connected are connected by conductive pattern 44, and capacitor 72 is placed between conductive patterns 44 and 45. It is connected. Capacitor 72 functions as a current source like capacitors 35-1 and 35-2. According to the third modification, even if the circuit element is the capacitor 72, the inductance component is further reduced.

In each of the above-described embodiments, two conductive patterns are used as the conductive patterns connected to the light emitting element array by the bonding wires W. However, the present invention is not limited to this, and either one of the conductive patterns is used. It may be in the form

10 Information Processing Device 11 Light Emitting Element Array 12 Driving Element 13 Three-Dimensional Sensor 14 Optical Device Control Section 15 Shape Identification Section 16 System Control Section 17 Authentication Processing Section 18 ROM
19 RAM
20 UI unit 21 speaker 22 two-dimensional camera 23 light emitting device 24 optical device 25 bus 26 VCSEL
27 Wiring board 30 Light intensity monitoring light receiving element 31 Base material 32 Spacer 33 Light diffusion plate 35, 35-1, 35-2 Capacitor 36 Power source 38 Resistor 39 Concave and convex member 40, 40A, 40B, 40C Light emitting module 41-1, 41- 2, 42-1, 42-2, 43-1, 43-2, 44, 45, 46-1, 46-2, 47-1, 47-2, 48-1, 48-2 conductive pattern 50 anode pattern 52 Light exit 53 Conductive pattern 70 Identification display area 72 Capacitor 80 Light emitting module id Drive current im Monitor current L Emitted light L1, L2 Current loop V Via Vpd Monitor voltage EA Extended conductive area OA Conductive area W Bonding wires θ1, θ2 Output angle

Claims (20)

a base material mounted on a wiring board;
a light-emitting element array provided on the substrate;
a counter region connected to the light emitting element array and provided on the surface of the base along the side surface of the light emitting element array and facing the light emitting element array; a first conductive pattern having an extension region;
The substrate is provided so as to connect the facing region and the extension region to a second conductive pattern, which is a conductive pattern provided on the back surface of the base material and is connected to the wiring pattern of the wiring board. a plurality of penetrating members penetrating from the surface side of the material to the back side of the base material;
a drive element provided on the wiring substrate on the side opposite to the direction in which the extension region extends;
A light-emitting device with a base material mounted on a wiring board;
a light-emitting element array provided on the substrate;
a counter region connected to the light emitting element array and provided on the surface of the base along the side surface of the light emitting element array and facing the light emitting element array; a first conductive pattern having an extension region;
The substrate is provided so as to connect the facing region and the extension region to a second conductive pattern, which is a conductive pattern provided on the back surface of the base material and is connected to the wiring pattern of the wiring board. a plurality of penetrating members penetrating from the surface side of the material to the back side of the base material;
a circuit element provided in parallel with the light emitting element array along the direction in which the first conductive pattern extends;
The light-emitting device, wherein the extension region extends to at least a position facing a portion of the circuit element. a circuit element provided in parallel with the light emitting element array along the direction in which the first conductive pattern extends;
The light emitting device according to claim 1, wherein the extension region extends to at least a position facing a part of the circuit element. a facing region provided on the surface of the base material opposite to the first conductive pattern with the light emitting device array interposed therebetween and facing the light emitting device array; further comprising a third conductive pattern having an extension region that is a region extended to the circuit element side;
4. The light-emitting device according to claim 2, wherein at least part of the circuit element is provided between the extended region of the first conductive pattern and the extended region of the third conductive pattern. The light emitting device according to any one of claims 2 to 4, wherein the circuit element is a photoelectric conversion element that receives light emitted from the light emitting element array. 6. The light emitting device according to claim 5, further comprising a light diffusing member arranged above the light emitting element array and the photoelectric conversion element for diffusing light emitted from the light emitting element array to the outside. The light emitting device according to any one of claims 2 to 6, wherein the circuit element is a capacitor that supplies current to the light emitting element array. further comprising a plurality of wiring members connecting the light emitting element array and the first conductive pattern;
The light emitting device according to any one of claims 1 to 7, wherein the plurality of wiring members are connected to the facing area and the extension area. The light emitting device according to claim 8, wherein the plurality of wiring members are connected in a row on the first conductive pattern, and the plurality of penetrating members are provided so as to overlap the row-shaped region. 10. The light emitting device according to claim 8, wherein a connection point between the penetrating member and the first conductive pattern overlaps with a connection point between the wiring member and the first conductive pattern. The light emitting device according to any one of claims 8 to 10, wherein the number of said penetrating members is greater than the number of said wiring members. The light emitting device according to any one of claims 8 to 11, wherein a total value of cross-sectional areas of the plurality of penetrating members is larger than a total value of cross-sectional areas of the plurality of wiring members. The light emitting element array has a plurality of light emitting elements,
The shape of the region in which the plurality of light emitting elements are arranged in the light emitting element array is longer in the direction intersecting the first conductive pattern than in the direction along the first conductive pattern. 13. The light emitting device according to any one of claims 1 to 12, wherein the length is longer. The light emitting device according to claim 13, wherein the plurality of light emitting elements are connected in parallel with each other. The light emitting device according to any one of claims 1 to 14, wherein the base material is made of ceramic. a base material mounted on a wiring board;
a light-emitting element array provided on the substrate;
a counter region connected to the light emitting element array and provided on the surface of the base along the side surface of the light emitting element array and facing the light emitting element array; a first conductive pattern having an extension region;
The substrate is provided so as to connect the facing region and the extension region to a second conductive pattern, which is a conductive pattern provided on the back surface of the base material and is connected to the wiring pattern of the wiring board. a plurality of penetrating members penetrating from the surface side of the material to the back side of the base material;
an identification display area provided in parallel with the light emitting element array along the direction in which the first conductive pattern extends;
The light-emitting device, wherein the extension region extends to at least a position facing a portion of the identification display region. 17. The light-emitting device according to claim 16, wherein the identification display area is an area including at least one of letters, numbers, and symbols that distinguish the device from other devices. a light emitting device according to any one of claims 1 to 17;
a three-dimensional sensor that receives reflected light emitted from the light-emitting element array included in the light-emitting device and reflected by an object to be measured;
The optical device, wherein the three-dimensional sensor outputs a signal corresponding to the time from when the light is emitted from the light-emitting element array to when the light is received by the three-dimensional sensor. an optical device according to claim 18;
A shape identifying unit that identifies the three-dimensional shape of the object to be measured based on reflected light emitted from the light-emitting element array of the optical device, reflected by the object, and received by a three-dimensional sensor of the optical device. and,
Information processing device. 20. The information processing apparatus according to claim 19, further comprising an authentication processing section that performs authentication processing regarding use of the apparatus based on the result of identification by the shape identification section.

Images