JP7157331B2 - light emitting device - Google Patents

Description

The present invention relates to light emitting devices.

Conventionally, in an LED array panel, when LED elements of the same structure are arranged regularly, if there is a certain pattern in the intensity distribution of the light emitted from the LED elements mounted on the panel, when the light is condensed Certain patterns may be superimposed in the same state, resulting in uneven illuminance, and further, an image with uneven illuminance may be projected onto the screen.
On the other hand, in order to make the light intensity distribution uniform on the light irradiation surface, the light emitting elements are arranged at different angles of 90° around the optical axis, and the intensity of the constant pattern output from each light emitting element is obtained. A method of superimposing and averaging light beams having distributions has been proposed (for example, Patent Document 1).

Japanese Patent Application Laid-Open No. 2002-374004

On the other hand, in the direct type backlight source, since a large number of light emitting elements are arranged in a matrix at equal pitches, if luminance unevenness occurs around one light emitting element, it continues in rows or columns. Therefore, the luminance unevenness is sometimes visually recognized on the light exit surface of the backlight light source. The luminance unevenness visually recognized on the light emitting surface of the backlight source tends to be carried over to the light irradiation surface such as the liquid crystal panel.
The present invention provides a light-emitting device in which light-emitting elements having a specific three-dimensional shape and specific light distribution characteristics are arranged in a plurality of rows and columns at equal pitches, in which continuous unevenness in brightness is not or is hardly visible. intended to provide

The present application includes the following inventions.
a wiring board having wiring and having light reflectivity;
a sapphire substrate having a pair of first side surfaces inclined with respect to a lower surface and a pair of second side surfaces perpendicular to the lower surface; and a semiconductor laminate provided on the lower surface of the sapphire substrate, a plurality of light emitting elements mounted in a matrix on the upper surface of the wiring board;
a light reflecting film disposed on the upper surface of the light emitting element;
a light diffusing member arranged above the plurality of light emitting elements,
Among the plurality of light emitting elements, the plurality of light emitting elements arranged within a predetermined region have the first side surface and the second side surface of the light emitting elements that are adjacent to each other in at least one of the row direction and the column direction. Light-emitting devices arranged facing each other.

According to the light-emitting device of the present invention, regardless of the electrode pattern of the light-emitting element, the light-emitting device in which light-emitting elements having a specific three-dimensional shape and specific light distribution characteristics are arranged in a plurality of rows and columns at equal pitches can be continuously arranged. Visibility of luminance unevenness can be effectively prevented.

1 is a schematic plan view showing a light emitting device of one embodiment; FIG. 4 is a schematic plan view for explaining the arrangement of light emitting elements in region M of the light emitting device of one embodiment; FIG. 1B is a schematic cross-sectional view of a light-emitting element at a position corresponding to line AA' in FIG. 1B of the light-emitting device of one embodiment; FIG. 4 is a graph showing light transmission characteristics of a light reflecting film; 1C is a graph showing light distribution characteristics of the light emitting element 12T in the X direction of FIG. 1B; 1B is a graph showing light distribution characteristics of the light emitting element 12T in a direction orthogonal to the X direction of FIG. 1B; FIG. 10 is a schematic plan view for explaining the arrangement of light emitting elements in a region M of a light emitting device according to another embodiment; FIG. 11 is a schematic plan view for explaining the arrangement of light emitting elements in a region M of a light emitting device according to still another embodiment; FIG. 11 is a schematic plan view for explaining the arrangement of light emitting elements in a region M of a light emitting device according to still another embodiment;

The embodiments shown below are examples for embodying the technical idea of the present invention, and are not intended to limit the present invention. Also, the sizes and positional relationships of members shown in each drawing may be exaggerated for clarity of explanation. Furthermore, the same names and reference numerals basically indicate the same or homogeneous members, and overlapping descriptions will be omitted as appropriate.

[Light emitting device]
A light-emitting device 10 according to an embodiment of the present application is configured by arranging a plurality of light-emitting elements 12 in a matrix on the upper surface of a wiring substrate 11, as shown in FIG. 1A. In this light emitting device 10, as shown in FIGS. 1B and 1C, the wiring substrate 11 has wiring 11a on the substrate 11b and has light reflectivity. A light reflecting film 13 is arranged on the upper surface of the light emitting elements 12 , and a light diffusion member 14 is arranged above the plurality of light emitting elements 12 . The light emitting element 12 has a sapphire substrate 21 and a semiconductor laminate 22. The sapphire substrate 21 has a pair of first side surfaces 21a inclined with respect to the bottom surface 21c and a pair of second side surfaces 21a perpendicular to the bottom surface 21c. 2 sides 21b. The plurality of light emitting elements 12 arranged in a predetermined region, for example, the region M in FIG. The first side surface 21a and the second side surface 21b of the sapphire substrate 21 are arranged to face each other. Here, facing each other may be a state in which the side surfaces are substantially parallel to each other, or one side surface may be inclined and opposed to the other side surface (for example, see FIG. 4, etc.). Including.
With such a configuration, the direction of the light emitted from the light emitting elements, which is affected by the pair of inclined first side surfaces caused by the cleaved surfaces of the sapphire substrate, differs between the light emitting elements adjacent in the row or column direction. can let As a result, it is possible to effectively avoid a continuous bright or dark pattern on the light emitting surface of the light emitting device that appears when a plurality of light emitting elements having relatively bright or dark sides when viewed from above are regularly arranged. can. As a result, in the light-emitting device, the light intensity distribution on the light exit surface can be made uniform, and luminance unevenness can be eliminated. Such an effect is particularly useful in applications where a large number of light-emitting elements, which hardly transmit light in a direction perpendicular to the upper surface of the light-emitting elements, are arranged by having a light reflecting film on the upper surface of the light-emitting element, particularly in a direct type backlight source. It is remarkable when used as

(Wiring board 11)
The wiring board 11 has wiring 11a on at least one surface (for example, the upper surface). The wiring 11a includes a plurality of pairs of patterns corresponding to the positive and negative electrodes of the light emitting element. The patterns corresponding to these positive and negative electrodes are electrically connected on one surface, inside and/or the other surface (for example, the lower surface) opposite to the one surface of the wiring board 11, respectively, so that current (power) from the outside can be applied. ) can be supplied.

(Wiring 11a)
The wiring 11a can be appropriately selected depending on the material used for the substrate 11b, its manufacturing method, and the like. For example, when ceramics is used as the material of the substrate 11b, the wiring 11a is preferably made of a material having a high melting point that can withstand the firing temperature of the ceramic sheet, such as metals with a high melting point such as tungsten and molybdenum. Also, it may be coated with other metal material such as nickel, gold, silver, etc. by plating, sputtering, vapor deposition, or the like.

When a resin such as a glass epoxy resin is used as the material of the substrate 11b, it is preferable that the wiring 11a is made of a material that is easy to process. The wiring 11a can be formed on one surface or both surfaces of the substrate by a method such as vapor deposition, sputtering, or plating. A metal foil may be attached by pressing, or masking may be performed using a printing method, photolithography, or the like, and patterning may be performed in a predetermined shape by an etching process. Examples thereof include metals such as copper, silver, gold and nickel, and alloys thereof.

(Substrate 11b)
The substrate 11b can be made of resin such as ceramics, glass epoxy resin, phenol resin, epoxy resin, polyimide resin, BT resin, polyphthalamide (PPA), polyethylene terephthalate (PET), or metal.
The thickness of the substrate 11b can be selected appropriately.

Ceramics include, for example, alumina, mullite, forsterite, glass ceramics, nitrides (eg, AlN), carbides (eg, SiC), LTCC, and the like.
When resin is used, inorganic fillers such as glass fiber, SiO ₂ , TiO ₂ , and Al ₂ O ₃ are mixed with the resin to improve mechanical strength, reduce thermal expansion coefficient, and improve light reflectance. can also
Metals include copper, iron, nickel, chromium, aluminum, silver, gold, titanium, and alloys thereof.

(Coating layer 11c)
The wiring substrate 11 has light reflectivity, but this light reflectivity may be imparted by the wiring 11a formed on the wiring substrate 11, or the material constituting the substrate 11b itself may have light reflectivity. or a region on the upper surface of the wiring board 11 other than the wiring electrically connected to the light emitting element may be covered with the light-reflective covering layer 11c. Among them, the one coated with the light-reflective coating layer 11c is preferable.

As the material of the coating layer 11c that covers the wiring board 11, it is preferable to use the above resin containing a light reflecting material, an insulating resist, or the like. Light reflecting materials include titanium oxide, zinc oxide, magnesium oxide, magnesium carbonate, magnesium hydroxide, calcium carbonate, calcium hydroxide, calcium silicate, magnesium silicate, barium titanate, barium sulfate, aluminum hydroxide, aluminum oxide, and oxide. White pigments such as zirconium can be mentioned. These can be used individually by 1 type or in combination of 2 or more types. The content of the light reflecting material in the resin is preferably 10 to 70 wt%, more preferably 30 to 60 wt%, from the viewpoint of light reflectivity and viscosity in a fluid state.

(Light emitting element 12 and light reflecting film 13)
As shown in FIG. 1C, the light emitting device 12 has a sapphire substrate 21 and a semiconductor laminate 22 laminated on its lower surface 21c. A pair of positive and negative electrodes 23 and 24 are formed on the lower surface of the semiconductor laminate 22 . A light reflecting film 13 is arranged on the surface of the sapphire substrate 21 opposite to the lower surface 21c.
The light-emitting element 12 may have a shape that approximates a quadrangle such as a quadrangle or a quadrangle with rounded corners in plan view, but may have other various planar shapes.

(Sapphire substrate 21)
The sapphire substrate 21 has a pair of first side surfaces 21a inclined with respect to the lower surface 21c and a pair of second side surfaces 21b perpendicular to the lower surface 21c. That is, in a cross section passing through the lower surface 21a and the pair of first side surfaces 21a, one of the pair of first side surfaces 21a forms an acute angle with the lower surface 21a, and the other forms an obtuse angle with the lower surface 21a. As long as it has these side surfaces, for example, a substrate made of hexagonal Al ₂ O ₃ , that is, any one of the C plane, A plane, R plane, M plane, or a plane having an off angle of ±5° from these planes can be used. For example, the lower surface 21c may be the C plane (0001) or a plane having an off angle of ±5° with respect to the C plane. Although sapphire is not completely hexagonal, it is understood to be approximately hexagonal (hexagonal system).

When the lower surface 21c is the C plane (0001), the first side surface 21a can be, for example, the (1-100) plane, the (01-10) plane, the (−1010) plane, etc., and the [0001] direction When viewed from the C plane side of , those inclined in the [−1100] direction, the [−1100] direction, and the [0-110] direction, respectively. The inclination of the first side surface 21a is, for example, 1 to 20°, preferably 2 to 10°. In FIG. 1C, the first side surface 21a is inclined, for example, by 90±7° with respect to the lower surface 21c, and the pair of first side surfaces 21a are substantially parallel to each other. That is, one first side surface 21a intersects with the lower surface 21c at an acute angle (eg, 83°), and the other first side surface 21a intersects with the lower surface 21c at an obtuse angle (eg, 97°).

(Semiconductor laminate 22)
Any wavelength can be selected for the semiconductor laminate 22 . For example, nitride-based semiconductors ( _{InxAlyGa1 -xyN ,} 0≤X, 0≤Y, X+Y≤1) can be used as blue and green light emitting elements. The size and number of light-emitting elements to be used can be appropriately selected according to the purpose.

A pair of electrodes 23 and 24 correspond to an anode and a cathode, and each may be one or more. In FIG. 1B, one light emitting element 12 has one electrode 23 and one electrode 24 corresponding to an anode and a cathode.
The electrodes 23, 24 can be formed in any shape from a conductive material.
The pair of electrodes 23 and 24 are connected to the wiring 11a on the upper surface of the wiring substrate 11 via a joint member, as shown in FIG. 1C. In other words, the light emitting element 12 is flip-chip mounted across the pair of wirings 11a.
Bumps of gold, silver, copper, etc., metal pastes containing these metal powders and resin binders, tin-bismuth-based or tin-copper-based solders, brazing materials such as low-melting-point metals, etc., may be used as bonding members. can be done.

(Light reflecting film 13)
The light reflecting film 13 is formed on the upper surface of the sapphire substrate 21 opposite to the lower surface 21 c of the light emitting element 12 . The light reflecting film 13 is preferably a film whose light transmittance with respect to the light emitted from the light emitting element 12 depends on the incident angle. As shown in FIG. 2A, the incident angle dependency of the light transmittance of the light reflecting film 13 is such that almost no light passes through the upper surface of the light emitting element 12 in the direction perpendicular to it, but light tilted from the direction perpendicular to the upper surface of the light emitting element 12 Its transmittance increases. For example, the transmittance is about 10% when the incident angle of light is in the range of -30° to 30°, while the transmittance gradually increases when the incident angle of light is smaller than -30°. When the angle is smaller than −50°, the transmittance increases sharply. Similarly, the transmittance gradually increases when the incident angle of light exceeds 30°, and increases rapidly when the incident angle exceeds 50°. That is, the light transmittance of the light reflecting film 13 for the light from the light emitting element 12 increases as the absolute value of the incident angle increases. Therefore, in a direction substantially parallel to the second side surface 21b of the sapphire substrate 21 of the light emitting element 12 provided with the light reflecting film 13 (a direction substantially parallel to the paper surface of the light emitting element 12T in FIG. 1C), as shown in FIG. It has batwing light distribution characteristics as shown in FIG. It has optical properties.

In FIG. 2B , an asymmetrical light distribution characteristic is obtained on the left and right of the viewing angle of 0° due to the inclination of the first side surface 21a of the sapphire substrate 21 . On the other hand, in FIG. 2C, since the second side surface 21b of the sapphire substrate 21 is vertical, symmetrical light distribution characteristics are obtained on the left and right sides of the viewing angle of 0°.
In addition, the batwing light distribution characteristic has a first peak with an intensity higher than the intensity when the light distribution angle is 90° in the first region where the light distribution angle is 90° or less, and the light distribution angle is 90° or more. In the second region of , the light distribution characteristic has a second peak with an intensity higher than that at a light distribution angle of 90°.
By adopting light having such a batwing light distribution characteristic, it is possible to increase the pitch of the light-emitting elements in the light-emitting device in the matrix direction and reduce the number of light-emitting elements to be used.

The light reflecting film 13 may be made of any material that reflects at least the light emitted from the light emitting element 12, and may be formed of, for example, a metal, a white filler-containing resin, a dielectric multilayer film, or the like.
When a dielectric multilayer film is used, a reflective film with low absorption can be obtained, and it becomes easy to arbitrarily adjust the reflectance by designing the film. In addition, the reflectance can be accurately controlled by the incident angle of light. In particular, by increasing the reflectance in the direction perpendicular to the light extraction surface (also referred to as the optical axis direction) and decreasing the reflectance where the angle with respect to the optical axis increases, that is, by increasing the transmittance, the above-described batwing light distribution The characteristics can be well controlled.

The light emitting element 12 in this embodiment has the first side surface 21a and the second side surface 21b on the sapphire substrate 21 as described above. In other words, the light distribution characteristics of the emitted light are affected by the pair of inclined first side surfaces 21a resulting from the cleaved surface of the sapphire substrate 21, thereby having relatively bright sides and dark sides when viewed from above. becomes.
As shown in FIG. 1A, such light-emitting elements 12 are mounted on the upper surface of the wiring substrate 11 in a plurality of rows and/or columns. In the plurality of light emitting elements 12 arranged in the region M), the first side surface 21a and the second side surface 21b of the sapphire substrate 21 of the light emitting elements 12 that are adjacent to each other in at least one of the row direction and the column direction face each other. are placed. In particular, it is preferable that the first side surface 21a and the second side surface 21b of the sapphire substrates of the light emitting elements that are adjacent to each other in both the row direction and the column direction are arranged to face each other.

For example, as shown in FIGS. 1B and 1C, a plurality of light emitting elements 12 are regularly arranged in a matrix direction, and within a predetermined region M of them, for example, the first side surface of the sapphire substrate 21 of the light emitting element 12T 21a is arranged to face the second side surface 21b of the sapphire substrate 21 of the light emitting element 12Q adjacent thereto in the row direction (X direction in FIG. 1B). The second side surface 21b of the sapphire substrate 21 of the light emitting element 12Q is arranged to face the first side surface 21a of the sapphire substrate 21 of the light emitting element 12W adjacent thereto in the row direction. However, in the light emitting element 12T and the light emitting element 12W, the pair of first side surfaces 21a of the sapphire substrate 21 are not inclined in the same direction, but in opposite directions (see FIG. 1C). In other words, the light-emitting elements 12 adjacent in the row direction are arranged so as to rotate clockwise by 90°, for example, when focusing on one of the pair of first side surfaces 21a.

Similarly, the first side surface 21a of the sapphire substrate 21 of the light emitting element 12P faces the second side surface 21b of the sapphire substrate 21 of the light emitting element 12R adjacent thereto in the column direction. The second side surface 21b of the sapphire substrate 21 of the light emitting element 12R is arranged to face the first side surface 21a of the sapphire substrate of the light emitting element 12S adjacent thereto in the column direction. The first side surface 21a of the sapphire substrate 21 of the light emitting element 12S is arranged to face the second side surface 21b of the sapphire substrate 21 of the light emitting element 12T adjacent thereto in the column direction. However, the first side surfaces 21a of the sapphire substrates of the light emitting elements 12P and 12S are not inclined in the same direction, but in opposite directions. In other words, the light-emitting elements 12 adjacent in the column direction are arranged so as to rotate counterclockwise by 90°, for example, when focusing on one of the pair of first side surfaces 21a.

With such an arrangement, a continuous bright or dark pattern appears on the light emitting surface of the light emitting device when a plurality of light emitting elements having relatively bright sides and dark sides when viewed from above are regularly arranged as described above. can be effectively avoided. As a result, the intensity distribution of light on the light exit surface can be made uniform, and the visibility of luminance unevenness can be eliminated.
In particular, by arranging not only the light-emitting elements in a specific area but also the light-emitting elements in the entire area on the wiring board 11 as described above, the light intensity distribution on the light exit surface can be made more remarkably uniform. It is possible to eliminate visual recognition of luminance unevenness.

Note that the plurality of light emitting elements 12 are arranged such that, as shown in FIG. 3, the light emitting elements 12 adjacent in the row direction are rotated counterclockwise by 90°, for example, when focusing on one of the first side surfaces 21a. The light-emitting elements 12 arranged and adjacent in the column direction may be arranged so as to rotate clockwise by 90°, for example, when focusing on one side of the first side surface 21a.

Also, as shown in FIG. 4, the arrangement of the plurality of light emitting elements 12 is such that the light emitting elements 12 adjacent to each other in the row direction are rotated 45 degrees clockwise when one side of the pair of first side surfaces 21a is focused, for example. The light emitting elements 12 arranged so as to rotate by 45 degrees counterclockwise, for example, when focusing on one of the pair of first side surfaces 21a, the light emitting elements 12 adjacent to each other in the column direction may be arranged so as to rotate counterclockwise by 45 degrees. good. Similarly, the column direction may be clockwise and the row direction may be counterclockwise.

Furthermore, as shown in FIG. 5, the arrangement of the plurality of light emitting elements 12 is such that, when focusing on one of the pair of first side surfaces 21a, the light emitting elements 12 adjacent in the row direction are rotated 45 degrees clockwise, for example. The light-emitting elements 12 arranged so as to rotate one by one and adjacent to each other in the column direction are arranged so as to rotate counterclockwise or clockwise by 180°, for example, when focusing on one of the pair of first side surfaces 21a. may be In this case, the first side surface 21a and the second side surface 21b of adjacent light emitting elements are arranged to face each other only in the row direction.

Although not shown in FIGS. 4 and 5, the wiring 11a in the wiring board 11 may be arbitrarily arranged on the upper surface, inside and/or the lower surface of the wiring board according to the arrangement of the light emitting elements 12. FIG.
Further, the light-emitting elements may be rotated by any angle and arranged regularly or randomly, instead of rotating the light-emitting elements by 45°, 90°, 180°, or the like.

With these arrangements, continuous bright or dark patterns can be effectively avoided, the light intensity distribution on the light exit surface can be made uniform, and luminance unevenness can be eliminated.

(Underfill material 15)
An underfill material 15 is preferably formed around the light emitting element 12 mounted on the upper surface of the wiring board 11 and/or between the light emitting element 12 and the wiring board 11 . The underfill material 15 has a coefficient of thermal expansion close to that of the light emitting element, prevents the light from the light emitting element 12 from being scattered and reflected by the wiring board 11 , and directs the light from the light emitting element 12 to the wiring board 11 . A filler, a pigment, a light-reflecting material, or the like may be contained for the purpose of efficiently extracting to the side.
The underfill material 15 may be any material as long as it is less deteriorated by the light from the light emitting element. For example, epoxy resin, silicone resin, modified silicone resin, urethane resin, oxetane resin, acrylic resin, polycarbonate resin, polyimide resin, etc. can be used. If the filler and the pigment absorb the light of the emission wavelength, the light is less likely to be reflected and the scattering of the light can be prevented. In order to prevent deterioration due to light, it is preferable to use an inorganic compound as the light absorbing material.

(sealing member 16)
The light emitting element 12 mounted on the upper surface of the wiring board 11 is preferably sealed with a sealing member 16 .
The sealing member 16 can be formed using, for example, a translucent material such as epoxy resin, silicone resin or a resin obtained by mixing them, or glass. Among them, it is preferable to use a silicone resin in consideration of light resistance and ease of molding.

The shape of the sealing member 16 may be a dome shape, a bowl shape, or the like. In these shapes, the central portion of the light emitting element 12 may be recessed. It may be in the shape of a lens having so-called batwing orientation characteristics. Also, the shape on the wiring substrate 11 may be circular, hexagonal, octagonal, or the like.
The sealing member 16 can be formed by compression molding, injection molding, or the like so as to cover the light emitting element 12 . Also, by optimizing the viscosity of the material of the sealing member 16 and dropping or drawing the material on the light emitting element 12, the shape can be controlled by the surface tension of the material itself.

(Light diffusion member 14)
A light diffusion member 14 is arranged above the plurality of light emitting elements 12 . For example, a plurality of light diffusing members 14 may be arranged for each group of light emitting elements 12, or only one light diffusing member 14 may be arranged above all the light emitting elements 12 constituting the light emitting device. The light diffusing member 14 is preferably arranged substantially parallel to the upper surface of the light emitting element 12 . With such a light diffusing member, the light emitted from the plurality of light emitting elements 12 can be transmitted while being further diffused, and uneven brightness can be reduced.
In particular, when the light emitting element 12 including the sapphire substrate having the first side surface 21a described above is used, the use of the light diffusing member 14 makes the light emitting element relatively brighter and darker when viewed from above. Although the contrast tends to be emphasized, in this embodiment, the matrix-shaped light emitting elements are arranged such that the first side surface 21a and the second side surface 21b of the adjacent light emitting elements face each other, A continuous bright or dark pattern on the light exit surface of the light emitting device can be uniform and effectively avoided.
The light diffusing member 14 may be made of a material that absorbs less visible light, such as polycarbonate resin, polystyrene resin, acrylic resin, or polyethylene resin. As a method of diffusing light, a method of including materials with different refractive indexes in the light diffusing member 14, a method of processing the shape of the surface to scatter light, or the like can be adopted.

In the light emitting device of this embodiment, a wavelength converting member may be arranged in front of or behind the light diffusing member 14 with respect to the light emitted from the light emitting element 12 . The wavelength conversion member may be made of, for example, translucent resin containing any known phosphor, or may be made of sintered phosphor.

In this way, light emitting elements having a pair of first side surfaces 21a inclined with respect to the lower surface 21c of the sapphire substrate 21 and a pair of perpendicular second side surfaces 21b are arranged in rows and columns on a substrate having light reflectivity. However, even when the reflective film 13 and the light diffusing member 14 are used in combination, the continuous bright or dark pattern to be emphasized can generally be enhanced by a simple method of changing the arrangement of the light emitting elements in the matrix direction. can be effectively avoided. As a result, the intensity distribution of light on the light exit surface can be made uniform, and the visibility of luminance unevenness can be eliminated.

The light-emitting device of the present invention can be used for various display devices, lighting fixtures, displays, backlight sources for liquid crystal displays, image reading devices such as copiers and scanners, projector devices, laser displays, endoscopes, and vehicle headlights. , bar code scanners, etc.

10 light emitting device 11 wiring substrate 11a wiring 11b substrate 11c coating layers 12, 12P, 12Q, 12R, 12S, 12T, 12W, 12V light emitting element 13 light reflection film 14 light diffusion member 15 underfill material 16 sealing member 21 sapphire substrate 21a first side surface 21b second side surface 21c lower surface 22 semiconductor laminates 23, 24 electrode M region

Claims (7)

a wiring board having wiring and having light reflectivity;
a sapphire substrate having a pair of first side surfaces inclined with respect to a lower surface and a pair of second side surfaces perpendicular to the lower surface; and a semiconductor laminate provided on the lower surface of the sapphire substrate, a plurality of light emitting elements mounted in a matrix on the upper surface of the wiring board;
a light reflecting film disposed on the upper surface of the light emitting element;
a light diffusing member arranged above the plurality of light emitting elements,
Among the plurality of light emitting elements, the plurality of light emitting elements arranged in a predetermined region have the first side surface and the second side surface of the light emitting elements adjacent to each other in at least one of the row direction and the column direction. Focusing on one of the pair of first side surfaces, the light emitting elements that are arranged to face each other and are adjacent to each other when viewed from the upper surface side of the light emitting elements are arranged in at least one of the row direction and the column direction, A light-emitting device arranged to rotate clockwise or counterclockwise by 45° or 90° . 2. The light-emitting device according to claim 1, wherein the first side surface and the second side surface of the light-emitting elements adjacent to each other in the row direction and the column direction are arranged to face each other. In a cross section passing through the lower surface of the sapphire substrate and the pair of first side surfaces, one of the pair of first side surfaces forms an acute angle with the lower surface, and the other of the pair of first side surfaces forms an obtuse angle with the lower surface. The light-emitting device according to claim 1 or 2. The light emitting device according to any one of claims 1 to 3, wherein the predetermined area is an area including all of the plurality of light emitting elements. The light emitting device according to any one of claims 1 to 4, wherein each of the light emitting elements having the light reflecting film on the upper surface has a batwing light distribution characteristic. The light emitting device according to any one of claims 1 to 5, wherein the light emitting element has positive and negative electrodes on the lower surface side of the semiconductor laminate, and is flip-chip mounted on the wiring substrate. The light emitting device according to any one of claims 1 to 5, which is used for a direct type backlight light source.

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