JP7138979B1 - Simplified capacitance pen refill module and assembly method thereof - Google Patents

Abstract

A simplified capacitance pen refill module is provided. A refill module uses a PCB board 1 as a main body, and the PCB board covers an FPC board as pins. A hollow screw seat 5 is installed in the strip portion of the PCB board and electrically connected and fixed to the root step of the strip portion. The hollow metal cylinder 4 and the hollow tapered portion 2 are in turn installed in relative positions of the strip portion of the PCB board, electrically connected to the pads of the PCB board from the hollow interior, and fixed in relative positions. A high-temperature-resistant insulating ring 3 is installed between the screw seat, the metal cylinder, and the tapered portion. [Selection drawing] Fig. 1

Description

The present invention relates to the technical field of electronic capacitance pens, and more particularly to a simplified refill module and its assembly method.

Capacitance touch is the dominant input technology for touch panels and is widely used in mobile communication devices, tablet computers, or any device that uses a touch screen. The user can choose to perform input operations with a finger and a capacitance pen. However, the refill structure of the existing dedicated capacitance pen on the market is too complicated, the production efficiency is low, and the cost is high. Also, prior art refill structures require connection and bonding of multiple parts. Various defects are likely to occur in industrial production, and labor costs and materials are often wasted, which is disadvantageous for mass production.

In the prior art, in the simplified spontaneous capacitance pen module (CN210402293U), the refill component wraps the refill component with structures such as tapered nib, screw part, plastic sleeve, nib cover and so on. The refill component consists of a receiving head, a refill cylinder, a refill holder, a lead wire, and a spring, and is connected to the circuit board. significantly reduced.

Prior art KR1020160022369A also disclosed an electronic pen. Among them, the circuit carrier cylinder 208 is installed on the object 210, the writing pad 203 is connected to the piezoelectric power generation component 204, the piezoelectric engine 205, the digital controller 217, etc. are jointed and connected, so the pen structure is complicated.

The present invention proposed a refill module for a capacitance pen. After realizing the refill function of the prior art, it is fitted and welded to the PCB board through the ring assembly and integrated to form the refill of the capacitance pen, greatly simplifying the refill structure. It not only satisfies the needs of users for detailed and multi-functional writing, drawing and other input operations on the touch panel, but also reduces the failure rate of capacitance pens and reduces industrial production assembly costs.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a simplified capacitance pen refill module to overcome the deficiencies and deficiencies of the prior art. The present invention uses the PCB board as the refill body to directly replace a large number of complicated structures, and uses the inner hole welding method, which greatly reduces the process and processing time, and greatly reduces the defect rate. The appearance is smooth and clean.

To achieve the above objectives, the present invention provides the following technical solutions:
A simplified capacitance pen refill module includes a refill body consisting of a PCB board and a ring assembly mounted on the PCB board, characterized by the following. The above PCB board is a three-layer circuit, respectively a primary transmission circuit, a secondary transmission circuit and a ground circuit. A pin is connected to the rear end of the PCB board, and the pin is electrically connected to the three-layer circuit of the PCB board.

Preferably, the PCB board covers the FPC board as pins, and the three-layer circuit is electrically connected to the FPC board to turn on the corresponding pins respectively.

Preferably, said ring assembly includes a hollow taper, a hollow metal cylinder and a hollow screw seat. The hollow tapered part, the hollow metal cylinder and the hollow screw seat are installed in turn on the PCB board, and each is equipped with a high temperature resistant insulating ring fitted on the PCB board. A high-temperature-resistant insulating ring separates the hollow taper, the hollow metal cylinder and the hollow screw seat from each other to reduce the electrical influence between them and improve the writing accuracy of the capacitance pen. It is also used for insulation and spacing between parts, fills the gaps between parts, and makes the appearance beautiful.

Preferably, a socket portion is installed on the PCB, and the socket portion is used to connect the ring assembly and the insulating ring. A step portion is connected to the rear end of the socket portion, and the step portion and the hollow screw seat form a stop. There is an extension part behind the step part, and the extension part is composed of the FPC board.

Preferably, the PCB board is provided with a plurality of pads, and the pads are respectively welded and fixed to the tapered part, the metal cylinder, and the hollow interior of the screw seat to be electrically connected. Wherein, the metal cylinder is electrically connected to the secondary transmission circuit, the screw seat, and the tapered part is electrically connected to the ground circuit.

Preferably, a primary transmission end face is installed on the end face remote from the step of the socket portion of the PCB board, and the primary transmission end face and the primary transmission circuit are electrically connected. A hollow screw seat is installed in the strip portion of the PCB board and electrically connected and fixed to the root step of the strip portion. This screw seat is electrically connected to the ground circuit.

A refill module assembly method includes a refill body composed of a PCB board and a ring assembly mounted on the PCB board. The above PCB board is a three-layer circuit, respectively a primary transmission circuit, a secondary transmission circuit and a ground circuit. An FPC board is covered as pins on the PCB board, and the three-layer circuit is electrically connected to the FPC board to turn on the corresponding pins respectively. and characterized by: Solder paste is applied to multiple pads on the PCB board. The hollow tapered part, the hollow metal cylinder and the hollow screw seat, and the insulating ring attached to each other are fitted on the PCB board in order. After completing the assembly of the hollow ring assembly, solder paste is filled inside each component. The solder paste then melts when the refill module is heated via the heating element. The inner surface of each component is electrically connected to a pad on the PCB board, and when the solder paste cools it becomes solid metallic tin, securing the hollow ring assembly and the PCB board. Complete assembly of the refill module. Each circuit of the refill module is tested through the inspection parts to confirm assembly pass/fail.

In summary, the present invention has the following beneficial effects compared with the prior art.
(1) The present invention is rational in design, uses the PCB board as the refill body, optimizes the structure of the PCB board, and allows the PCB board to fit with the hollow ring assembly. The hollow components of different parts are connected to the primary transmission circuit, the secondary transmission circuit and the ground line, respectively, which simplifies the structure and directly replaces a large number of complicated structural parts.

(2) The PCB board uses a 3-layer circuit structure, and through the design of the multilayer circuit, the strength of the PCB board used as the refill body has been improved. In addition, the multi-layer circuit design, in line with the pad arrangement, further improves the welding stability and strength of the PCB board and hollow components, avoiding failures caused by collisions and drops in the use of capacitance pens. In addition, the inner hole welding method is used during assembly, which greatly reduces labor and material costs, and the appearance of the refill is smooth and clean.

(3) The FPC board is installed as a pin on the rear end of the PCB board to improve the electrical connection performance through the connection between the FPC and the main control board of the capacitance pen. Specifically, since the FPC is a flexible connection, it avoids the impact of dropping the capacitance pen, avoids the breakdown due to disconnection of the electrical connection point, and further improves the drop prevention performance of the capacitance pen.

(4) With the improved refill module, after the refill module assembly is completed, its body PCB board is completely wrapped and connected by the ring assembly. Avoiding damage when the PCB board circuit is rubbed and hit by foreign objects, further improving the stability of the refill component.

In order to describe the embodiments of the present invention or the technical solutions in the prior art more clearly, the following briefly introduces the accompanying drawings used in the description of the embodiments or the prior art. Obviously, the attached drawings below are only some examples of the present utility model. For the general engineer in the field, these attachments can be used to obtain other attachments if they do not do creative work.

1 is a schematic diagram of the structure of an embodiment of the present invention; FIG. 1 is a schematic diagram of a circuit according to an embodiment of the present invention; FIG. 1 is a schematic diagram of a circuit pad according to an embodiment of the present invention; FIG.

The following further describes the technical solutions of the present invention based on the accompanying drawings and specific embodiments.
(Example 1)
As shown in Figures 1 to 3, the simplified refill module consists of a PCB board and a ring assembly installed on the PCB, which constitutes the refill body, and the PCB board is composed of a socket part and a step part, and the ring assembly fits into the socket portion, and the ring assembly includes a hollow taper portion 2, a hollow metal cylinder 4 and a hollow screw seat 5; the step portion and the hollow screw seat 5 form a stop. The fitting is strip-shaped. The hollow tapered part 2, the hollow metal cylinder 4 and the hollow screw seat 5 are successively mounted on the PCB board, and each is provided with a high temperature resistant insulating ring 3 fitted on the PCB board. There is an extension part behind the step part, and the extension part is composed of the FPC board.

The FPC board is covered as pins on the PCB board (1). Among them, the PCB board (1) is divided into three-layer circuits, each of which is a ground circuit (C), a primary transmission circuit (B), and a secondary transmission circuit (A), and the three circuits are electrically connected to the FPC and turn on the corresponding pin. Said primary transmitting end face (B1) is on the end face of the strip portion of the PCB board (1).

The PCB board is divided into the front first layer, the middle layer and the back third layer. At a certain distance from the socket on the front first layer is the tapered ground pad C1. The step has a threaded ground pad C2 and the tapered ground pad C1 and the threaded ground pad C2 are in the same plane. There is a secondary transmit pad A1 on the back third layer and a screw ground pad C2 on the back third layer. Secondary transmit pad A1 is centered between tapered ground pad C1 and threaded ground pad C2.

As shown in FIG. 2, the tapered portion grounding pad C1, the threaded portion grounding pad C2, the grounding pin C3, and the lead wire connecting the three constitute a grounding circuit (C). The primary transmission end face B1, the primary transmission pin B2, and the lead wire connecting them constitute a primary transmission circuit (B). The secondary transmission pad A1, the secondary transmission pin A2, and the direct lead connecting the two form a secondary transmission circuit (A). The above three circuits are placed on different PCB layers. B1, B2, C2, C3, A2 pins or edge positions on different layers are overlapped and connected.

A hollow screw seat (5) is installed in the strip portion of the PCB board (1) and electrically connected and fixed to the root step of the strip portion. This screw seat (5) is electrically connected to the ground circuit (C2).
A hollow metal cylinder (4), a hollow tapered section (2) are in turn installed in relative positions of the strip section of the PCB board (1), and electrically connected from the hollow interior to the pads of the PCB board (1). connected and fixed in relative position. Among them, the metal cylinder (4) is electrically connected to the secondary transmission circuit (A1), and the taper part (2) is electrically connected to the ground circuit (C1).

A high-temperature-resistant insulating ring (3) is installed between the screw seat (5), the metal cylinder (4), and the tapered part (2), respectively, to ensure the insulation and spacing between each part, and Suppresses the electric effect between the electrodes and improves the accuracy of capacitance pen writing. It is also used for insulation and spacing between parts, fills the gaps between parts, and makes the appearance beautiful.
The primary transmission end face B1 is installed on the "end face away from the step part" of the socket part of the PCB board, and the primary transmission end face B1 and the primary transmission circuit are electrically connected.
As shown in Figure 2, the three pins of A2/B2/C3 are FPC flexible circuit boards, and the pins are electrically connected to the main board of the capacitance pen.

A refill module assembly method includes a refill body composed of a PCB board and a "ring assembly mounted on the PCB board". The above PCB board is a three-layer circuit, respectively a primary transmission circuit, a secondary transmission circuit and a ground circuit. An FPC board is covered as pins on the PCB board, and the three circuits are electrically connected to the FPC board to turn on the corresponding pins respectively. Solder paste is applied to multiple pads on the PCB board. The hollow tapered part, the hollow metal cylinder and the hollow screw seat, and the insulating ring attached to each other are fitted on the PCB board in turn. After completing the assembly of the hollow ring assembly, solder paste is filled inside each component. The solder paste then melts when the refill module is heated via the heating element. The inner surface of each component is electrically connected to a pad on the PCB board, and when the solder paste cools it becomes solid metallic tin, securing the hollow ring assembly and the PCB board. Complete assembly of the refill module. Each circuit of the refill module is tested through the inspection parts to confirm assembly pass/fail.

After completing the construction of the capacitance pen refill module, attach the refill module to the capacitance pen kit. Its primary transmitting end face B1 is mated and electrically connected to the capacitance nib component. The male thread of the hollow screw seat 5 and the female thread of the capacitance pen kit are fitted and connected, and the refill module is attached to the capacitance pen kit, and the rear end is connected to the main control board of the capacitance pen.

(Example 2)
The simplified refill module consists of a PCB board and a ring assembly mounted on the PCB forming the refill body, the PCB board consisting of a socket part and a step part, the ring assembly fitted into the socket part, and the ring assembly includes a hollow tapered portion 2, a hollow metal cylinder 4 and a hollow screw seat 5. The step portion and the hollow screw seat 5 form a stop. The fitting is strip-shaped. The hollow taper part 2, the hollow metal cylinder 4 and the hollow screw seat 5 are installed in turn on the PCB board, and there is a "high temperature resistant insulation ring 3 fitted on the PCB board". A pin is connected to the rear end of the PCB board, and the pin is electrically connected to the transmit and ground circuits of said PCB board. In this embodiment, the connection at the rear end of the PCB board adopts a rigid connection method. Specifically, wires such as copper wires and steel wires are used as pins on the PCB board. Electrically connect the wires to the main control board of the capacitance pen to complete the assembly of the capacitance pen.

There are certain advantages and disadvantages in practical operation compared to technical solutions that use FPC boards as pins. The technical solution of electrical connection with wires has a firm connection, but high rigidity, a hard touch when writing, and the welding point may burst and crack when subjected to external force impact. There are many manual welding points during processing welding, which is difficult to operate.

The technical solution of using FPC board (flexible lead wire) as a pin can solve the "hard connection point" problem. More space inside the capacitance pen is needed to accommodate flexible leads and improve impact resistance.

In summary, the present invention is rational in design, uses PCB board as the refill body, directly replaces a large number of complex structures, uses inner hole welding method, and greatly reduces labor and material costs. , the appearance is smooth and clean, and the defect rate is greatly reduced.

In addition to ensuring the reliability and stability of electrical connections, there are no welding marks on the outer surface, avoiding "external welding points protruding and interfering with the assembly of other parts", realizing the integrity of the appearance and achieved the aesthetic effect.

The technical principle of the present invention has been described above based on specific embodiments. This is only a preferred embodiment of the invention. The scope of protection of the invention is not limited to the above embodiments. The technical solutions based on the present invention shall fall within the protection scope of the present invention. A person skilled in the art can conceive of other specific embodiments of this utility model without creative labor. All these methods shall fall within the protection scope of the present invention.

1-PCB+FPC board, 2-taper part, 3-insulation ring, 4-metal cylinder, 5-screw seat, A1-secondary transmission pad, A2-secondary transmission pin, B1-primary transmission end face, B2-primary Transmit pin, C1-tapered ground pad, C2-threaded ground pad, C3-grounded pin.

Claims (7)

A capacitance pen refill module, the simplified refill module includes a refill body composed of a PCB board and a ring assembly mounted on the PCB board, said PCB board being a three-layer circuit, each of A capacitance pen characterized by a primary transmission circuit, a secondary transmission circuit and a ground circuit, wherein a pin is connected to the rear end of the PCB board, and the pin is electrically connected to the three-layer circuit of the PCB board. refill module. The pin is composed of an FPC board, the PCB board covers the FPC board as a pin, and the three-layer circuit is electrically connected to the FPC board to turn on the corresponding pin. Item 2. A capacitance pen refill module according to item 1. The ring assembly includes a hollow tapered portion, a hollow metal cylinder and a hollow screw seat, and the hollow taper portion, the hollow metal cylinder and the hollow screw seat are sequentially mounted on the PCB board and fitted together into the PCB board. 2. The capacitance pen refill module as claimed in claim 1, further comprising a high temperature resistant insulation ring attached to the capacitance pen refill module. The PCB board is composed of a socket part and a step part, the socket part is used to connect the ring assembly and the insulating ring, a step part is connected to the rear end of the socket part, and the step part and the hollow 4. The capacitance pen refill module as claimed in claim 3 , wherein the screw seat forms a stop, there is an extension behind the step, and the extension is composed of FPC board. A plurality of pads are installed on the PCB board, and the pads are respectively welded and fixed to the taper part, the metal cylinder, and the hollow interior of the screw seat to be electrically connected, wherein the metal cylinder is a secondary transmission. 4. The capacitance pen refill module of claim 3 , wherein a circuit is electrically connected to said screw seat and said tapered portion is electrically connected to a ground circuit. 5. The capacitance pen according to claim 4 , wherein a primary transmitting end face is installed on an end face of the socket portion of the PCB board remote from the stepped portion , and the primary transmitting end face and the primary transmitting circuit are electrically connected. refill module. Solder paste is applied to multiple pads on the PCB board, and the hollow tapered part, the hollow metal cylinder and the hollow screw seat, and the insulating ring attached to each other are sequentially fitted to the PCB board to form a hollow ring After the assembly is completed, the solder paste is filled inside each component, and then when the refill module is heated through the heating component, the solder paste melts and the inner surface of each component is attached to the pad of the PCB board. , the solder paste cools down to become solid metallic tin, and the hollow ring assembly and PCB board are fixed, completing the assembly of the refill module, and subsequently connecting each circuit of the refill module through the inspection parts. 2. The method of assembling a refill module for a capacitance pen according to claim 1, wherein the assembly is tested to confirm whether the assembly is acceptable.

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