JP7102798B2 - Method for forming a loading body of a packaging box with an IC chip and a packaging box with an IC chip - Google Patents
Method for forming a loading body of a packaging box with an IC chip and a packaging box with an IC chip Download PDFInfo
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Description
本発明は、ＩＣチップ付包装箱およびＩＣチップ付包装箱の積載体形成方法に関する。 The present invention relates to a packaging box with an IC chip and a method for forming a loading body of a packaging box with an IC chip.
特許文献１には、物流管理システムにおいて、ＲＦＩＤ（Radio Frequency Identification）ラベルを用い、ラベル等が汚れて文字の判読が不能になるような事態が生じた場合でも確実な荷物配送を可能にする方法が記載されている
物流システムにおいて、商品の管理のためにＲＦＩＤチップを内臓したラベルが使用されている。ＲＦＩＤラベルは商品を内包した包装箱の外表面に貼付され、商品の移動時に管理者が携帯式リーダ．／ライタでＲＦＩＤ情報を確認する、或いは、ベルトコンベアで搬送する際に固定式リーダ．／ライタがＲＦＩＤ情報を確認するといった作業が行われている。
Patent Document 1 describes a method in which an RFID (Radio Frequency Identification) label is used in a physical distribution management system to enable reliable baggage delivery even when a situation occurs in which the label or the like becomes dirty and the characters cannot be read. Labels with built-in RFID chips are used for product management in the distribution systems described in. The RFID label is affixed to the outer surface of the packaging box containing the product, and the administrator can use a portable reader when the product is moved. / Fixed reader when checking RFID information with a writer or transporting with a belt conveyor. / The writer is checking the RFID information.
上述した作業では、ＲＦＩＤはリーダ．／ライタにより読取可能な包装箱表面に配置することが容易である。しかし、商品が倉庫に保管される場合、包装箱は、倉庫内で最小の占有体積となるように、包装箱同士を密接して積載されることが通常である。
このように積載された積載体の、奥に位置する包装葉箱に貼付されたＲＦＩＤラベルとリーダ．／ライタとの送受信エラーが発生するというトラブルが発生した。
包装箱の内包物がビン詰や缶詰等の様に山積みにされたＲＦＩＤの電波を吸収または遮蔽する物品である場合、送受信が全くできないトラブルが頻発した。
本発明は、ＲＦＩＤ付包装箱において、該包装箱同士が密接して積載された場合でも、積載された包装箱に貼付されたすべてのＲＦＩＤとリーダ．／ライタとの良好な送受信が可能となるＲＦＩＤ付包装箱を提供することを目的とする。
In the above work, RFID is the reader. / Easy to place on the surface of the packaging box readable by the writer. However, when goods are stored in a warehouse, the packaging boxes are usually loaded in close contact with each other so as to have the smallest occupied volume in the warehouse.
The RFID label and reader attached to the packaging leaf box located at the back of the loaded body loaded in this way. / There was a problem that a transmission / reception error with the writer occurred.
When the inclusions in the packaging box are articles such as bottles and cans that absorb or shield the piled up RFID radio waves, troubles that transmission and reception cannot be performed frequently occur.
In the present invention, in a packaging box with RFID, all RFIDs and readers attached to the loaded packaging box even when the packaging boxes are closely loaded with each other. / It is an object of the present invention to provide a packaging box with RFID capable of good transmission / reception with a writer.
上記課題を解決するため本発明の包装箱は、以下の特徴を有する。
（１）情報を送信および／または受信可能なＩＣチップが貼付された包装箱であって、前記包装箱を水平方向に縦方向３列以上、横方向３列以上を１層として、前記１層の占有面積が最小となるように前記包装箱同士を密接して配置して、前記１層を複数層積み上げたとき、前記１層を縦方向または横方向に貫通する開口部、若しくは、前記複数層を貫通する開口部が形成されることを特徴とする包装箱。
（２）前記ＩＣチップは前記開口部に接する前記包装箱の構成部分に貼付され（１）に記載の包装箱。
（３）前記開口部はＲＦＩＤの電波が通過可能である開口面積を有する（１）または（２）に記載の包装箱。
（３）前記包装箱はＲＦＩＤの電波を吸収または遮蔽する物品を内包するためのものである（１）～（３）のいずれかに記載の包装箱。
（４）前記包装箱の少なくとも１つの側面または天面からの投影形状は、矩形の一部が切り取られた形状である（１）～（４）のいずれかに記載の包装箱。
In order to solve the above problems, the packaging box of the present invention has the following features.
(1) A packaging box to which an IC chip capable of transmitting and / or receiving information is attached, wherein the packaging box has three or more rows in the vertical direction and three or more rows in the horizontal direction as one layer. When the packaging boxes are closely arranged so as to occupy the minimum area and the one layer is stacked, the opening that penetrates the one layer in the vertical or horizontal direction, or the plurality of the packaging boxes. A packaging box characterized in that an opening is formed through the layer.
(2) The packaging box according to (1), wherein the IC chip is attached to a constituent portion of the packaging box in contact with the opening.
(3) The packaging box according to (1) or (2), wherein the opening has an opening area through which RFID radio waves can pass.
(3) The packaging box according to any one of (1) to (3), wherein the packaging box contains an article that absorbs or shields RFID radio waves.
(4) The packaging box according to any one of (1) to (4), wherein the projected shape from at least one side surface or top surface of the packaging box is a shape in which a part of a rectangle is cut off.
また、上記課題を解決するため、本発明の包装箱の積載体の形成方法は、以下の特徴を有する。
情報を送信および／または受信可能なＩＣチップが貼付された包装箱を水平方向に縦方向３列以上、横方向３列以上を１層として、前記１層の占有面積が最小となるように前記包装箱同士を密接して配置して、前記１層を複数層積み上げる包装箱の積載体形成方法であって、
前記包装箱の少なくとも１つの側面または天面からの投影形状は、矩形の一部が切り取られた形状であることにより、前記１層を縦方向または横方向に貫通する開口部、若しくは、前記複数層を貫通する開口部が形成され、
前記ＩＣチップは前記開口部に接する部分に位置する前記包装箱の部位に貼付され
いずれの方向も他の包装箱と接している包装箱に貼付されたＩＣチップの情報が積載体の外側から読取可能であることを特徴とする積載体形成方法。
Further, in order to solve the above problems, the method for forming a loading body of a packaging box of the present invention has the following features.
The packaging box to which the IC chip capable of transmitting and / or receiving information is attached is composed of three or more rows in the vertical direction and three or more rows in the horizontal direction as one layer so that the occupied area of the one layer is minimized. It is a method of forming a loading body of a packaging box in which packaging boxes are closely arranged and the one layer is stacked in a plurality of layers.
The projected shape from at least one side surface or top surface of the packaging box is a shape in which a part of the rectangle is cut off, so that the opening that penetrates the one layer in the vertical or horizontal direction, or the plurality of. An opening is formed through the layer,
The IC chip is attached to the portion of the packaging box located at the portion in contact with the opening, and the information of the IC chip attached to the packaging box in contact with the other packaging box is read from the outside of the load. A method of forming a load body, which is characterized by being possible.
上記構成によれば、包装箱の積載体を平面視縦方向または横方向に貫通する開口部、若しくは、高さ方向に貫通する開口部が形成されていることによって、積載体内のすべてのＩＣチップとリーダ．／ライタとの送受信が可能となる。 According to the above configuration, all IC chips in the loading body are formed by forming an opening that penetrates the loading body of the packaging box in the vertical or horizontal direction in a plan view or an opening that penetrates in the height direction. And the leader. / Sending and receiving with the writer is possible.
以下、本発明の包装箱の一実施形態について説明する。
この実施形態では包装箱は、図１に示したように直方体の１つの角が傾斜面あるいは、丸められた面形状を有している。そして、ＩＣチップは丸められた角の表面に貼付されている。
図２はこの包装箱を縦３列、横４列、上下３段に積み上げた積載体を示している。
この実施形態では包装箱の１つの側面からの投影形状が図３のような形状となるように形成されているため、図２の積載体において横方向に貫通する開口部が形成されるように積載体を形成することができる。
そして、積載体を構成する包装箱に貼付されたすべてのＩＣチップが開口部に接しているため、包装箱または包装箱の内容物によって電波の一部または全部が、遮蔽または吸収されてしまう場合であっても、積載体のすべてのＩＣチップとリーダ．／ライタとの送受信が良好に行うことができる。
Hereinafter, an embodiment of the packaging box of the present invention will be described.
In this embodiment, the packaging box has a surface shape in which one corner of a rectangular cuboid is an inclined surface or a rounded surface as shown in FIG. The IC chip is attached to the surface of the rounded corner.
FIG. 2 shows a loading body in which the packaging boxes are stacked in three vertical rows, four horizontal rows, and three upper and lower rows.
In this embodiment, since the projected shape from one side surface of the packaging box is formed as shown in FIG. 3, an opening penetrating in the lateral direction is formed in the loading body of FIG. A loading body can be formed.
Then, since all the IC chips attached to the packaging boxes constituting the loading body are in contact with the openings, a part or all of the radio waves may be shielded or absorbed by the packaging box or the contents of the packaging box. Even so, all IC chips and readers on the load. / Transmission and reception with the writer can be performed well.
図４のように直方体の１つの辺に沿って包装箱の一部を三角柱状に切り取った形状とすることにより、開口部形成することができる。
直方体の１つの辺に沿って包装箱の一部を三角柱状または四角柱状に切り取った形状とする場合、包装箱を形成するシート材料の一部を直線的に折り曲げ又は切断する加工によって開口部を簡便に形成することができる。
更に、直方体の１つの辺の周辺に開口部を設けることによって、包装箱を形成するシート材料を節約し、収容できる物品の寸法を大きくすることができる。
An opening can be formed by cutting a part of the packaging box into a triangular columnar shape along one side of the rectangular cuboid as shown in FIG.
When a part of the packaging box is cut into a triangular columnar shape or a square columnar shape along one side of a rectangular cuboid, the opening is formed by linearly bending or cutting a part of the sheet material forming the packaging box. It can be easily formed.
Further, by providing an opening around one side of the rectangular cuboid, the sheet material forming the packaging box can be saved and the size of the article that can be accommodated can be increased.
本発明の包装箱は、図５のように包装箱の１つの面から対向する面に向かって筒状に貫通する開口部を有し、貫通する開口部の内壁にＩＣチップが配置されている態様も含む。
この態様によれば、筒状に貫通する開口部によって、搬送時のラベルの損傷を防ぐことができる。
As shown in FIG. 5, the packaging box of the present invention has an opening that penetrates in a cylindrical shape from one surface of the packaging box toward the opposite surface, and an IC chip is arranged on the inner wall of the penetrating opening. Also includes aspects.
According to this aspect, the cylindrically penetrating opening can prevent damage to the label during transport.
包装箱の構成材料は、厚紙、ダンボール紙などの紙、発泡スチロール、硬質プラスチック、軟質プラスチック等の樹脂、アルミニウムなどの金属の板または箔、およびこれらの複合体が使用できる。
包装箱の構成材料は、ＲＦＩＤの電波を透過しやすい材料であることが好ましい。
しかしながら、内包物の保護などの目的により、ＲＦＩＤの電波を透過し難い材料を用いる場合には、包装箱においてＲＦＩＤの電波を透過し難い材料の外側にＲＦＩＤを配置すればよい。
ＲＦＩＤの電波を透過し難い材料としては、金属板、金属箔、金属メッシュ、金属メッキ、金属粒子を含む塗工層または印刷層などが挙げられる。
As the constituent material of the packaging box, paper such as thick paper and corrugated cardboard, resin such as foamed styrol, hard plastic and soft plastic, metal plate or foil such as aluminum, and a composite thereof can be used.
The constituent material of the packaging box is preferably a material that easily transmits RFID radio waves.
However, when a material that does not easily transmit RFID radio waves is used for the purpose of protecting inclusions or the like, the RFID may be arranged outside the material that does not easily transmit RFID radio waves in the packaging box.
Examples of the material that does not easily transmit RFID radio waves include a metal plate, a metal foil, a metal mesh, a metal plating, a coating layer containing metal particles, a printing layer, and the like.
前記開口部の断面積は、５０ｍｍ２以上であることが好ましい。上記範囲であれば、積載体内のすべてのＲＦＩＤラベルとリーダ．／ライタとの送受信エラーが著しく低減する。
前記開口部の断面積の上限は、包装箱を積上げたときの安定性により決定すべきものであり、前記開口部によって切り取られる包装箱の底面または天面の面積が、包装箱の設置面積の４０％以下であることが好ましい。
The cross-sectional area of the opening is preferably 50 mm 2 or more. Within the above range, all RFID labels and readers in the load. / Transmission / reception errors with the writer are significantly reduced.
The upper limit of the cross-sectional area of the opening should be determined by the stability when the packaging boxes are stacked, and the area of the bottom surface or the top surface of the packaging box cut out by the opening is 40 of the installation area of the packaging box. % Or less is preferable.
前記開口部の貫通方向は、水平方向であっても垂直方向であっても良く、リーダ．／ライタが作業時に配置される場所等の使用環境によって適宜選択される。例えばリーダ．／ライタが倉庫の天井近くに配置される場合は、前記開口部の貫通方向が垂直方向であることが好ましい。 The penetrating direction of the opening may be horizontal or vertical, and the reader. / It is appropriately selected depending on the usage environment such as the place where the writer is placed at the time of work. For example, reader. / When the writer is placed near the ceiling of the warehouse, it is preferable that the penetration direction of the opening is vertical.
本発明の包装箱に使用される情報を送信および／または受信可能なＩＣチップは、一般にＲＦＩＤと呼ばれる技術またはＲＦＩＤに準じた技術により、非接触でＩＣチップ内の情報の読取または書換えを行うことができるものである。
ＩＣチップの形状は、円筒形、コイン型、薄膜型などがある。
また、ＩＣチップの包装箱への貼付方法は、粘着テープ、糊付け、包装箱基材内への埋め込み等、如何なる方法であっても良いが、作業性の点から粘着ラベル内にＩＣチップを内包したラベルを用いることが好ましい。
The IC chip capable of transmitting and / or receiving the information used in the packaging box of the present invention shall read or rewrite the information in the IC chip in a non-contact manner by a technique generally called RFID or a technique similar to RFID. Can be done.
The shape of the IC chip includes a cylindrical shape, a coin type, a thin film type, and the like.
The IC chip may be attached to the packaging box by any method such as adhesive tape, gluing, or embedding in the packaging box base material, but the IC chip is included in the adhesive label from the viewpoint of workability. It is preferable to use the labeled label.
１：ＩＣチップ、 ２：開口部 1: IC chip, 2: Opening
Claims (3)
前記１層を縦方向または横方向に貫通する開口部、若しくは、前記複数層を貫通する開口部が形成され、
前記開口部に接する前記包装箱の構成部分に前記ＩＣチップが貼付されており、
前記開口部の断面積が５０ｍｍ２以上であり、
前記包装箱はＲＦＩＤの電波を吸収または遮蔽する物品を内包する、積載体。 The packaging box to which the IC chip capable of transmitting and / or receiving information is attached has three or more rows in the horizontal direction and three or more rows in the horizontal direction as one layer so that the occupied area of the one layer is minimized. It is a loading body in which the packaging boxes are closely arranged with each other and the one layer is stacked in a plurality of layers.
An opening that penetrates the one layer in the vertical or horizontal direction, or an opening that penetrates the plurality of layers is formed.
The IC chip is attached to a component of the packaging box in contact with the opening.
The cross-sectional area of the opening is 50 mm 2 or more .
The packaging box is a load body containing an article that absorbs or shields RFID radio waves .
前記包装箱の少なくとも１つの側面または天面からの投影形状は、矩形の一部が切り取られた形状であることにより、前記１層を縦方向または横方向に貫通する開口部、若しくは、前記複数層を貫通する開口部が形成され、
前記開口部の断面積が５０ｍｍ２以上であり、
前記ＩＣチップは前記開口部に接する部分に位置する前記包装箱の部位に貼付され、
前記包装箱はＲＦＩＤの電波を吸収または遮蔽する物品を内包し、
いずれの方向も他の包装箱と接している包装箱に貼付されたＩＣチップの情報が積載体の外側から読取可能であることを特徴とする、積載体形成方法。 The packaging box to which the IC chip capable of transmitting and / or receiving information is attached is composed of three or more rows in the vertical direction and three or more rows in the horizontal direction as one layer so that the occupied area of the one layer is minimized. It is a method of forming a loading body of a packaging box in which packaging boxes are closely arranged and the one layer is stacked in a plurality of layers.
The projected shape from at least one side surface or top surface of the packaging box is a shape in which a part of the rectangle is cut off, so that the opening that penetrates the one layer in the vertical or horizontal direction, or the plurality of. An opening is formed through the layer,
The cross-sectional area of the opening is 50 mm 2 or more.
The IC chip is attached to a portion of the packaging box located at a portion in contact with the opening.
The packaging box contains an article that absorbs or shields RFID radio waves.
A method for forming a loading body, characterized in that information on an IC chip attached to a packaging box in contact with another packaging box can be read from the outside of the loading body in either direction.
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| JP2005347870A (en) | 2004-05-31 | 2005-12-15 | Fuji Xerox Co Ltd | Ic tag communication relaying apparatus, and ic tag communication relaying method |
| JP2006027773A (en) | 2004-07-13 | 2006-02-02 | Ntn Corp | Inspection system using integrated circuit tag |
| JP2006309733A (en) | 2005-03-28 | 2006-11-09 | Hitachi Information Systems Ltd | Rfid tag system and communication system for this rfid tag system |
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| JP7355101B2 (en) | 2021-01-13 | 2023-10-03 | コクヨ株式会社 | booth |
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