JP7087738B2 - Optical communication device and manufacturing method of optical communication device - Google Patents

Description

The present invention relates to an optical communication device and a method for manufacturing the optical communication device.

The optical communication module often uses an IC chip (hereinafter referred to as a SiP chip) manufactured by using silicon photonics technology. Such an optical communication module is used, for example, in a small device such as WDM (Wavelength Division Multiplexing) having an SFP + (Small Form-Factor Pluggable Plus) or less that handles multiple wavelengths.

Generally, as an optical communication module, an optical module called TOSA (Transmitter Optical SubAssembly), ROSA (Receiver Optical SubAssembly) or BOSA (Bi-directional Optical SubAssembly) is generally mounted three-dimensionally on a substrate. For example, Patent Document 1 discloses an optical transceiver in which an optical transmission / reception module and a transmission / reception circuit are connected by an FPC (Flexible Printed Circuits) substrate.

Japanese Unexamined Patent Publication No. 2013-172037 (Fig. 9)

In order to connect the optical transmission / reception module and the PCB (Printed Circuit Board) on which electronic components are mounted, lead wires are complicatedly mounted on the board, or FPC is used as in the technique described in Patent Document 1. The assembly process was complicated because it had to be done. Further, even if the optical component (LD (LASER Diode), PD (Photo Diode), etc.) is small, there is a problem that the optical module becomes large and hinders the miniaturization of the communication module.

In addition, the SiP (Silicon Photonics) chip is a monolithic optical component, and is extremely small. However, the optical moduleization loses the meaning of its miniaturization. If possible, surface mounting of the SiP chip on the PCB is desirable, but it is difficult at present because the optical system fluctuates due to the shape change (expansion and contraction) due to the temperature of the PCB. Therefore, for example, it is necessary to construct an optical system on a metal such as stainless steel.

By the way, it is conceivable to have a PCB insertion type structure in which linear recesses are provided on both sides of a metal housing in which an optical system (for example, an optical circuit or a lens) is constructed, and a PCB is inserted into the linear recesses. Even at this time, positioning of the PCB (electrical circuit board) (particularly, positioning in the insertion direction) is difficult.

The present invention has been made to solve such a problem, and provides an optical communication device capable of positioning an electric circuit board and an optical circuit unit, and a method for manufacturing the optical communication device. Is the subject.

In order to achieve the above object, the present invention is an optical communication device to which a communication optical fiber is connected, wherein the optical communication device includes an optical circuit unit for transmitting and receiving signal light and an input / output terminal of the signal light. An optical coupling element that spatially optically couples the input / output end of the communication optical fiber, a base base material into which the optical circuit unit and the optical coupling element are incorporated, and a control circuit that controls the optical circuit unit. An electric circuit board that is incorporated and has a plurality of VIA holes is provided, and the base material has a groove or a recess formed outside the optical circuit portion and the built-in region of the optical coupling element, and any of the VIA holes. It is characterized by further including a fixing pin inserted into the groove or the recess.

The fixing pin is inserted (press-fitted) into the VIA hole of the electric circuit board, and is inserted (fitted) into the groove or recess formed in the base base material. As a result, the base base material in which the optical circuit unit and the optical coupling element are incorporated and the electric circuit board in which the control circuit is incorporated are positioned. Therefore, the optical circuit unit, the optical coupling element, and the control circuit are positioned.

According to the present invention, the electric circuit board and the optical circuit unit can be positioned.

It is a perspective view which shows the internal structure of the optical communication apparatus which is 1st Embodiment of this invention. It is a top view of the optical communication device which is 1st Embodiment of this invention. It is a front view of the optical communication device which is 1st Embodiment of this invention. It is a top view of the base base material used in the optical communication apparatus which is 1st Embodiment of this invention. It is a front view of the base base material used in the optical communication apparatus which is 1st Embodiment of this invention. It is a top view of the PCB used in the optical communication apparatus which is 1st Embodiment of this invention. It is a top view of an optical circuit part and a control circuit. It is sectional drawing of the press-fitting pin and PCB used in the optical communication apparatus which is 1st Embodiment of this invention. It is a top view explaining the 1st manufacturing process of the optical communication apparatus which is 1st Embodiment of this invention. It is a top view explaining the 2nd manufacturing process of the optical communication apparatus which is 1st Embodiment of this invention. It is a top view explaining the 3rd manufacturing process of the optical communication apparatus which is 1st Embodiment of this invention. It is a top view explaining the 1st manufacturing process of the optical communication apparatus which is 2nd Embodiment of this invention. It is a top view explaining the 2nd manufacturing process of the optical communication apparatus which is 2nd Embodiment of this invention. It is a top view explaining the 3rd manufacturing process of the optical communication apparatus which is 2nd Embodiment of this invention. It is a top view explaining the 4th manufacturing process of the optical communication apparatus which is 2nd Embodiment of this invention. It is a top view of the photoelectric fusion module used in the optical communication apparatus which is 3rd Embodiment of this invention. It is sectional drawing of the groove of the base base material of the 1st modification of this invention. It is a perspective view of the base base material which formed the groove with the same width and spacing. It is a perspective view of the base base material which formed a plurality of circular recesses.

Hereinafter, embodiments of the present invention (hereinafter referred to as “the present embodiment”) will be described in detail with reference to the drawings. It should be noted that each figure is merely shown schematically to the extent that the present invention can be fully understood. Further, in each figure, common components and similar components are designated by the same reference numerals, and duplicate description thereof will be omitted.

(First Embodiment)
(Explanation of configuration)
FIG. 1 is a perspective view showing an internal structure of an optical communication device according to a first embodiment of the present invention, FIG. 2A is a plan view thereof, and FIG. 2B is a front view thereof.
The optical communication device 1a includes a base base material 10a, a SiP chip 20 as an optical circuit unit, a PCB 30 as an electric circuit board, an IC 40 as a control circuit, a receptacle buffer plate 50, a receptacle 60, and an optical coupling element. Lens 65 as The receptacle 60 is connected to the communication optical fiber 100. The optical fiber 100 for communication may be a pigtail type (coaxial type).

FIG. 3A is a plan view of a base base material used in the optical communication device according to the first embodiment of the present invention. FIG. 3B is a front view thereof.
The base base material 10a is a metal member having a rectangular shape in a plan view, and has a U-shape (substantially U-shape) in a cross-sectional view. On the bottom 13 of the base base material 10a, grooves 11a are formed in a net shape outside the built-in region of the SiP chip 20 and the lens 65. As a result, a plurality of cross-shaped grooves and their intersections (intersections) are formed in the bottom portion 13 of the base base material 10a. Further, linear recesses 12a and 12b are formed on the side walls 14a and 14b of the base base material 10a. Both sides of the PCB 30 are inserted into the linear recesses 12a and 12b.

A SiP chip 20 and a lens 65 are arranged on the bottom 13 of the base base material 10a. The SiP chip 20 is an optical circuit unit composed of a silicon thin wire waveguide, and a photoelectric conversion element such as a Si photodiode 23 (FIG. 5) may be formed. Therefore, a plurality of electrode pads 26, 26 are formed on the upper surface of the SiP chip 20, and the electrode pads 26, 26 are electrically connected to the IC 40 by wires 80, 80.

FIG. 4 is a plan view of a PCB used in the optical communication device according to the first embodiment of the present invention.
As shown in the cross-sectional view of FIG. 6, the PCB 30 includes a ground layer 34c, a wiring layer 34d close to the ground layer 34c, a power supply layer 34b, a wiring layer 34a close to the power supply layer 34b, and insulating layers 35a and 35b. , 35c is a multilayer board. Further, the PCB 30 includes a plurality of wiring VIAs (not shown) connecting the wiring layers 34a, 34d and the power supply layer 34b, and a plurality of ground VIAs 31, 31, 34d connecting the ground layer 34c and the wiring layers 34a, 34d.・ Has.

Since the PCB 30 is designed for high-speed signals, a large number of ground VIA 31s are formed to strengthen the ground. Further, the outermost layer of the PCB 30, particularly the wiring layer 34a (FIG. 6) below the IC 40, has a solid pattern 32 (FIG. 4) and a ground VIA 31 connecting the solid pattern 32 and the ground layer 34c (FIG. 6). Is formed.

The PCB 30 is formed in a U-shape in a plan view, and the total spokes substantially match the widths of the linear recesses 12a and 12b of the base base material 10a. As shown in FIG. 2A, the U-shaped recess is a region for incorporating the SiP chip 20 and the lens 65.

FIG. 5 is a plan view of the optical circuit unit and the control circuit.
The SiP chip 20 as an optical circuit unit is, for example, an optical circuit of a single-core bidirectional communication module, and has a plurality of electrode pads 26, 26 formed on the upper surface thereof. Further, in the SiP chip 20, for example, spot size converters 21a and 21b, a wavelength combiner / demultiplexer 22 as a wavelength dividing filter, and a photodiode 23 as a light receiving element are formed on the surface of a Si substrate (not shown). It was done.

The wavelength combiner / demultiplexer 22 is composed of a silicon thin wire waveguide and is used as a wavelength dividing filter. The wavelength combiner / demultiplexer 22 guides the laser beam incident on the spot size converter 21a to the photodiode 23. Further, the wavelength combiner / demultiplexer 22 guides the laser light incident on the spot size converter 21b to the spot size converter 21a.

The spot size converter 21a couples between the lens 65 and the silicon thin wire waveguide, and functions as an input / output end of signal light. The silicon thin wire waveguide is an optical waveguide in which the core material is silicon and the clad material is quartz, and the light path can be sharply bent as compared with the quartz optical waveguide.

The IC 40 includes, for example, a laser diode 43, a drive control circuit 44 for driving and controlling the laser diode 43, a transimpedance amplifier 41 as a control circuit for controlling the photodiode 23, a monitoring photodiode 42, and a transimpedance amplifier 41. The electrode pads 46, 46 connected to the above are provided. Further, the electrode pads 46, 46 and the electrode pads 26, 26 of the SiP chip 20 are arranged close to each other.

The laser diode 43 irradiates the spot size converter 21b with laser light (signal light). The transimpedance amplifier 41 converts the current signal output by the photodiode 23 into a voltage signal. The monitoring photodiode 42 monitors the emission intensity of the laser diode 43.

By the way, in order to perform bidirectional communication with one communication optical fiber 100, the SiP chip 20 has a wavelength of light incident on the photodiode 23 and a laser diode provided at the other end of the communication optical fiber 100. It is set to be different from the wavelength of the light emitted by.

The lens 65 spatially optically couples the spot size converter 21a and the input / output end of the communication optical fiber 100.

FIG. 6 is a cross-sectional view of a press-fit pin and a PCB used in the optical communication device according to the first embodiment of the present invention.
The PCB 30 is a multilayer substrate in which insulating layers 35a, 35b, 35c and metal layers (ground layer 34c, wiring layers 34a, 34d, power supply layer 34b) are alternately laminated. Further, the PCB 30 is formed of a cylindrical metal in which the entire area of the ground layer 34c and the annular region (circular band region) of the wiring layers 34a and 34d are electrically connected. The cylindrical metal and the annular region of the wiring layers 34a and 34d are referred to as ground VIA31, and the inner surface of the cylindrical metal is referred to as a VIA hole. The cylindrical metal forming the ground VIA 31 is insulated from the power supply layer 34b and the wiring layers 34a and 34d other than the band region.

The press-fit pin 70 as a fixing pin is formed by a head portion 71 and a shaft portion 72. The outer diameter of the shaft portion 72 is formed to be slightly thicker than the inner diameter of the ground VIA 31 of the PCB 30, and is electrically joined to the ground VIA 31 by press fitting. Further, the outer diameter of the shaft portion 72 is formed to be slightly thicker than the width of the groove 11a. At the cross-shaped intersection where the press-fit pin 70 is fitted, the thickness of the shaft portion 72 is preferably slightly thicker than the length of the diagonal line of the intersection. The press-fit pin 70 is made of any material of stainless steel, aluminum, and copper-tungsten alloy.

Further, the width of the groove 11a is slightly shorter than the inner diameter of the ground VIA31. Therefore, by fitting the shaft portion 72, the shape of the tip of the shaft portion 72 and the shape of the groove 11a substantially match, and the press-fit pin 70 and the base base material 10a come into electrical contact with each other. Further, the depth of the groove 11a may be not limited to a depth at which the press-fitting pin is stable (for example, 0.5 mm or more). The head 71 is formed into a semi-elliptical cross-sectional view by caulking with a predetermined tool.

FIGS. 7, 8 and 9 are plan views illustrating a manufacturing process of the optical communication device according to the first embodiment of the present invention. FIG. 7 shows the first step (SP1), FIG. 8 shows the second step (SP2), and FIG. 9 shows the third step (SP3).

As shown in FIG. 7, in the first manufacturing process (SP1), parts are mounted on the base base material 10a and the PCB 30. Specifically, the SiP chip 20 and the lens 65 are attached to the upper surface of the base base material 10a. Further, a receptacle buffer plate 50 having a receptacle 60 is attached to the front surface of the base base material 10a. Further, IC40 and the like are mounted on the PCB 30 by surface mounting.

As shown in FIG. 8, in the second manufacturing step (SP2), the PCB 30 is inserted into the linear recesses 12a and 12b on both sides of the base base material 10a from the rear. Then, when the tip of the PCB 30 and the receptacle buffer plate 50 come into contact with each other, the position of the ground VIA 31 of the PCB 30 and the cross-shaped intersection of the grooves 11a of the base base material 10a substantially coincide with each other.

As shown in FIG. 9, in the third manufacturing process (SP3), the press-fit pin 70 is inserted into the gland VIA 31. Then, when the head 71 (FIG. 6) of the press-fitting pin 70 is hit through a tool having a predetermined shape, the head 71 is deformed into a predetermined shape, and the tip of the shaft portion 72 (FIG. 6) is grooved 11a. It transforms into the shape of and fits. In order to deform into the shape of the groove 11a, the width of the groove 11a is preferably shorter than the inner diameter of the ground VIA 31. As a result, the base base material 10a and the PCB 30 are fixed by caulking. Further, the position of the ground VIA 31 of the PCB 30 coincides with the cross-shaped intersection of the grooves 11a.

Further, the electrode pads 26, 26 of the SiP chip 20 and the electrode pads 46, 46 of the IC 40 are connected by wires 80, 80. From the above, the optical communication device 1a is completed.

The SiP chip 20 and the lens 65 are arranged at predetermined positions on the base base material 10a. Since the press-fit pin 70 fixes the positional relationship between the SiP chip 20 and the lens 65 and the ground VIA 31, the positional relationship between the IC 40 arranged in the vicinity of the ground VIA 31 and the SiP chip 20 and the lens 65 is fixed. .. Therefore, regardless of the thermal expansion of the PCB 30, the positional relationship between the laser diode 43 inside the IC 40 and the SiP chip 20 and the lens 65 is fixed.

Further, since the positional relationship between the electrode pad 26 of the SiP chip 20 and the electrode pad 46 of the IC 40 is fixed, the length of the wire 80 becomes constant. Further, the electrode pads 26, 26 and the electrode pads 46, 46 are arranged in close proximity to each other. Therefore, the waveform of the high frequency signal transmitted from the IC 40 to the SiP chip 20 becomes good.

As described above, according to the optical communication device 1a of the first embodiment, the groove 11a having a width equal to or less than the inner diameter of the ground VIA 31 is provided on the upper surface of the base base material 10a on which the SiP chip 20 is mounted. Further, the base base material 10a and the PCB 30 can be fixed by inserting (pressing) the press-fitting pin 70 for positioning and fixing into the gland VIA 31 and inserting (fitting) into the groove 11a. That is, the PCB 30 can be fixed by forming the linear recesses 12a and 12b without considering the plate thickness accuracy of the PCB 30.

Since the base base material 10a has a plurality of grooves 11a, the designer of the PCB 30 can design holes (recesses) for positioning and fixing with a certain degree of freedom. Further, since the ground VIA31 is used, it is not necessary to separately design additional holes for positioning and fixing, and the degree of freedom in design is improved. As a result, the overall size of the optical communication device 1a using the SiP chip 20 can be reduced due to the degree of freedom in designing the PCB 30.

(Second Embodiment)
In the optical communication device 1a of the first embodiment, the press-fit pin 70 is provided around the IC 40, but the press-fit pin 70 can also be provided directly under the IC 40. In order to realize the optical communication device 1b (FIG. 13) having such a configuration, the manufacturing process is different from that of the first embodiment.

FIGS. 10, 11, 12, and 13 are plan views illustrating a manufacturing process of an optical communication device according to a second embodiment of the present invention. 10 shows the first step (SP11), FIG. 11 shows the second step (SP12), FIG. 12 shows the third step (SP13), and FIG. 13 shows the third step (SP13).

As shown in FIG. 10, in the first manufacturing process (SP11), parts are mounted on the base base material 10a and the PCB 30. At this time, it differs from FIG. 7 (SP1) of the first embodiment in that the IC 40 is not mounted on the PCB 30. Therefore, the ground VIA 31 at the center of the solid pattern 32 can be confirmed. As shown in FIG. 11, in the second manufacturing process (SP12), the PCB 30 is inserted into the linear recesses 12a and 12b on both sides of the base base material 10a from the rear, as in FIG. 8 (SP8) of the first embodiment. Will be done.

As shown in FIG. 12, in the third manufacturing process (SP13), a plurality of press-fitting pins 70 are press-fitted into the gland VIA 31 and fitted into the groove 11a. At this time, the press-fitting pin 70 is press-fitted not only to the peripheral portion of the region where the IC 40 is mounted but also to that region (that is, directly under the IC 40), which is different from FIG. 9 (SP3) of the first embodiment. do.

Further, as shown in FIG. 13, in the fourth step (SP14), the IC 40 is mounted by soldering. Then, the electrode pad 26 of the SiP chip 20 and the electrode pad 46 of the IC 40 are connected by a wire 80. This completes the optical communication device 1b.

In the optical communication device 1b of the present embodiment, the ground VIA 31 is also struck directly under the IC 40. Therefore, the electrical connection between the solid pattern 32 and the ground layer 34c is ensured. Therefore, the optical communication device 1b has better high frequency characteristics than the optical communication device 1a of the embodiment.

(Third Embodiment)
In the optical communication devices 1a and 1b of the first and second embodiments, the photodiode 23 is included in the SiP chip 20 and the laser diode 43 is built in the IC 40. It is also possible to use the photoelectric fusion module 25 in which the electric circuit of the above is mounted on a Si substrate by surface mounting.

FIG. 14 is a plan view of the photoelectric fusion module used in the optical communication device according to the third embodiment of the present invention.
The photoelectric fusion module 25 is a modularized version of the optical circuit 27 and the electric circuit 28, and functions as an optical circuit unit as a whole. The optical circuit 27 includes a spot size converter 21a and a wavelength combiner / demultiplexer 22 as a wavelength dividing filter, and the electric circuit 28 has a photodiode 23 as an optical signal receiver and a laser diode 43 as an optical signal generator. A drive control circuit 44, a transimpedance amplifier 41, a monitoring photodiode 42, and a plurality of electrode pads 26, 26, 26, 26 are provided. The electric circuit 28 is surface-mounted and fixed on the Si substrate.

Further, although not shown, the IC 40 (FIGS. 1, 2A, etc.) is formed with a control circuit for controlling the drive control circuit 44 and the transimpedance amplifier 41, and the same number of electrode pads 46 are provided as the electrode pads 26. .. Further, the same number of wires 80 are provided as the electrode pads 26.

According to the optical communication device 1c (not shown) of the present embodiment, the electrode pads 26, 26, 26, 26 and the electrode pads 46 are the same as the optical communication devices 1a, 1b of the first and second embodiments. , Closely placed. Further, since the positional relationship between the electrode pad 26 of the SiP chip 20 and the electrode pad 46 of the IC 40 is fixed, the length of the wire 80 becomes constant. Therefore, the waveform of the high frequency signal transmitted from the IC 40 to the SiP chip 20 becomes good.

(Modification example)
The present invention is not limited to the above-described embodiment, and various modifications such as the following are possible, for example.

(1) The groove 11a of the embodiment has a rectangular shape in a cross-sectional view, and the width of the shallow portion and the width of the deep portion are equal to each other, but the width can be widened toward the deeper portion. FIG. 15 is a cross-sectional view of a groove of the base base material of the first modification of the present invention. The groove 11b formed in the base base material 10b has a trapezoidal shape in cross section. That is, the width of the deep portion of the groove 11b is longer than the width of the surface. When the press-fit pin 70 as a fixing pin is press-fitted (fitted), the tip of the shaft portion 72 is deformed into a trapezoidal shape in cross section, so that the press-fit pin 70 is difficult to remove from the base base material 10b. If the press-fit pin 70 is a resin member, thermal deformation due to heating is likely to occur.

(2) The width of the groove 11a of the first embodiment is slightly smaller than the outer diameter of the shaft portion 72 of the press-fit pin 70, and the distance from the adjacent groove 11a is increased. FIG. 16 is a perspective view of a base base material having grooves having the same width and spacing. In the base base material 10c, the distance (pitch) between the groove 11c and the adjacent groove 11c is close to the width of the groove 11c, and a plurality of pillars 18 are formed. Further, since the distance from the adjacent groove 11c is shorter than the distance from the adjacent groove 11a according to the embodiment, the degree of freedom in the position where the press-fit pin 70 is hit is improved. That is, the degree of freedom in the board design for determining the position of the ground VIA 31 is improved. As a result, the effects of improving the transmission characteristics of the module and reducing the size can be obtained.

(3) The groove 11a of the first embodiment is linear, but a plurality of recesses having other shapes such as a circle may be formed. Further, a plurality of columnar columns may be formed. FIG. 17 is a perspective view of a base base material having a plurality of circular recesses formed therein. The base base material 10d is formed with a plurality of circular recesses 19. This also improves the degree of freedom in the position where the press-fit pin 70 is hit. That is, the degree of freedom in the board design for determining the position of the ground VIA 31 is improved. As a result, the effect of improving the transmission characteristics of the module and reducing the size can be obtained.

(4) In the optical communication device 1a of the above embodiment, the PCB 30 is inserted into the linear recesses 12a and 12b on both sides of the base base material 10a, but the PCB 30 is placed on the base base material 10b (not shown). It does not matter if it is placed flat. That is, the base base material 10a is provided with linear recesses 12a and 12b on both sides, but these may not be provided.

(5) In the first and second embodiments, the optical communication devices 1a and 1b have been described, but even in a device such as a laser pointer, a combination of the groove 11a, the PCB 30, and the press-fit pin 70 can be used. Although the external view (FIG. 1) of the optical communication device 1a described above does not specify sealing, it is also possible to provide a lid for sealing.

(6) In the first and second embodiments, the SiP chip 20 and the lens 65 are arranged in advance on the base base material 10a (SP1), and then the PCB 30 is inserted into the linear recesses 12a and 12b (SP2). It is also possible to insert the PCB 30 into the linear recesses 12a and 12b, and then dispose the SiP chip 20 and the lens 65 on the base base material 10a.

1a, 1b, 1c Optical communication device 10a, 10b, 10c, 10d Base base material 11a, 11b, 11c Groove 12a, 12b Linear recess 14a, 14b Side wall 19 Circular recess 20 SiP chip (optical circuit section)
22 Wavelength combiner / demultiplexer (wavelength division filter)
23 Photodiode (optical signal receiver in the third embodiment)
25 Photoelectric fusion module (optical circuit section)
26,46 Electrode pad 30 PCB (electric circuit board)
31 Grand VIA (VIA hole)
32 Solid pattern 40 IC (control circuit)
43 Laser diode (optical signal generation unit in the third embodiment)
65 lens (optical coupling element)
70 Press-fit pin (fixing pin)
80 Wire 100 Optical fiber for communication

Claims (9)

An optical communication device to which an optical fiber for communication is connected.
An optical circuit unit that transmits and receives signal light,
An optical coupling element that spatially optically couples the input / output end of the signal light and the input / output end of the communication optical fiber.
The base material into which the optical circuit unit and the optical coupling element are incorporated, and
A control circuit for controlling the optical circuit unit is incorporated, and an electric circuit board having a plurality of VIA holes is provided.
The base base material has grooves or recesses formed outside the optical circuit portion and the built-in region of the optical coupling element.
An optical communication device further comprising a fixing pin inserted into any of the VIA holes and the groove or recess. The optical communication device according to claim 1.
An optical communication device, wherein the VIA hole into which the fixing pin is inserted is arranged in one or both of directly under and in the vicinity of the control circuit. The optical communication device according to claim 1 or 2.
The base base material is an optical communication device characterized in that a linear recess for inserting the electric circuit board is formed on a side wall in the optical axis direction of the optical circuit portion. The optical communication device according to claim 1.
The fixing pin is fitted into the groove or the recess, and is fitted into the groove or the recess.
The electric circuit board is an optical communication device characterized in that it is fixed to the base base material. The optical communication device according to claim 4.
The groove is a continuously arranged cross-shaped groove, and is a cross-shaped groove.
An optical communication device, wherein the fixing pin is fitted at an intersection of the cross-shaped grooves. The optical communication device according to claim 1.
An optical communication device, wherein the fixing pin is made of any material of stainless steel, aluminum, and copper-tungsten alloy. The optical communication device according to claim 1.
The groove is an optical communication device characterized in that the width of the deep portion is longer than the width of the surface in a cross-sectional view. The optical communication device according to claim 1.
The optical circuit unit includes an optical signal generation unit that generates transmission signal light, an optical signal reception unit that receives reception signal light, and a wavelength division filter that separates the transmission signal light and the reception signal light. Optical communication device. Incorporation of an optical circuit unit that transmits and receives signal light, an optical coupling element that spatially optically couples the input / output end of the signal light and the input / output end of a communication optical fiber, and the optical circuit unit and the optical coupling element. Optical communication for manufacturing an optical communication device including a base base material having a groove or a recess formed outside the region and an electric circuit board having a control circuit for controlling the optical circuit unit and having a plurality of VIA holes. It ’s a method of manufacturing equipment.
The first step in which the optical circuit unit and the optical coupling element are incorporated in the base substrate, and
In the second step, in which the electric circuit board incorporated in the first step is inserted into the first recess of the base base material,
The light is characterized by having at least one of the plurality of VIA holes of the electric circuit board inserted in the second step, and a third step in which a fixing pin is inserted into the groove or the recess. Manufacturing method of communication equipment.

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