JP6911170B2 - Fluid discharge device including integrated circuits - Google Patents

Description

A background printer is a device that attaches a fluid such as ink to a printing medium such as paper. The printer can include a printhead that is connected to a print material reservoir. The printing material can be ejected, dispensed (distributed) and / or ejected from the printhead onto a physical medium.

It is a block diagram which shows some components of an exemplary fluid discharge device. It is a block diagram which shows some components of an exemplary fluid discharge device. It is a block diagram of some components of an exemplary fluid discharge device. FIG. 5 is a cross-sectional view taken along line 4-4 of FIG. 3 of an exemplary fluid discharge device. It is an isometric view of some components of an exemplary fluid discharge device. It is a block diagram of an exemplary fluid discharge device. FIG. 6B is a cross-sectional view taken along line 6B-6B of FIG. 6A of an exemplary fluid discharge device. FIG. 3 is an isometric view of an exemplary printed fluid cartridge, including an exemplary fluid discharge device. It is a flow chart of an exemplary process. It is a flow chart of an exemplary process. 9 is a block diagram showing an exemplary process of the exemplary process of FIGS. 9 and 10. 9 is a block diagram showing an exemplary process of the exemplary process of FIGS. 9 and 10. 9 is a block diagram showing an exemplary process of the exemplary process of FIGS. 9 and 10. 9 is a block diagram showing an exemplary process of the exemplary process of FIGS. 9 and 10. 9 is a block diagram showing an exemplary process of the exemplary process of FIGS. 9 and 10. 9 is a block diagram showing an exemplary process of the exemplary process of FIGS. 9 and 10. 9 is a block diagram showing an exemplary process of the exemplary process of FIGS. 9 and 10. 9 is a block diagram showing an exemplary process of the exemplary process of FIGS. 9 and 10. 9 is a block diagram showing an exemplary process of the exemplary process of FIGS. 9 and 10. 9 is a block diagram showing an exemplary process of the exemplary process of FIGS. 9 and 10. 9 is a block diagram showing an exemplary process of the exemplary process of FIGS. 9 and 10. It is a flow chart which shows the series of operations which can be performed by the integrated circuit of an exemplary fluid discharge device. It is a flow chart which shows the series of operations which can be performed by the integrated circuit of an exemplary fluid discharge device.

Throughout the drawings, the same reference numerals indicate elements that are similar, but not necessarily identical. The drawings do not necessarily follow a uniform scale and the size of some parts may be exaggerated to show the illustrated example more clearly.

Description Examples of fluid discharge devices can include molded panels, at least one discharge die, and integrated circuits. The discharge die and integrated circuit are molded into a molded panel. As used herein, molding into a molded panel can mean that the discharge die and / or integrated circuit is at least partially embedded within the molded panel. The discharge die comprises a plurality of discharge nozzles, in which case the discharge nozzles can be used to selectively dispense the printing material. The integrated circuit can be electrically connected to the discharge die, and the integrated circuit can control the selective distribution of the printing material using the discharge nozzle. The molded panel supports and at least partially surrounds the discharge die and integrated circuit, so that the discharge die and integrated circuit are at least partially covered by the molding material of the molded panel. In addition, the molded panel can have a fluid communication channel formed through the molded panel. The fluid communication channel of the molded panel is fluid connected to the discharge die, so that the printing material can be fed to the discharge die and its discharge nozzle via the fluid communication channel.

The ejection nozzle ejects / distributes the printing material under the control of an integrated circuit to form content printed with the printing material on a physical medium. Nozzles generally include a fluid discharger for discharging / distributing the printing material from the nozzle orifice. Some examples of fluid discharger types realized in fluid discharge devices include thermal dischargers, piezoelectric dischargers, and / or other such dischargers capable of discharging / distributing printing material from a nozzle orifice. include. In some examples, the discharge die may be formed of silicon or a silicon-based material. Various feature elements such as nozzles can be formed from various materials used in silicon devices based on manufacturing (eg, silicon dioxide, silicon nitride, metals, epoxies, polyimides, other carbon-based materials, etc.). ..

In some examples, the discharge die may be referred to as a slice (sliver). In general, flakes can accommodate discharge dies having a thickness of about 650 μm or less, external dimensions of about 30 mm or less, and / or a length-to-width ratio of about 3: 1 or greater. In some examples, the length-to-width ratio of flakes can be about 10: 1 or greater. In some examples, the length-to-width ratio of flakes can be about 50: 1 or greater. In some examples, the discharge die may have a non-rectangular shape. In these examples, the first portion of the discharge die can have dimensions / features similar to those described above, and the second portion of the discharge die is larger and longer in width than the first portion. It can be shortened. In some examples, the width of the second portion can be about twice the size of the width of the first portion. In these examples, the discharge die can have an elongated first portion in which the discharge nozzles can be arranged, and the discharge die can have a second portion in which the electrical connection points of the discharge dies can be arranged.

In some examples, the molded panel can include an epoxy resin molding material such as CEL400ZHF40WG from Hitachi Kasei Co., Ltd. and / or other such materials. Thus, in some examples, the molded panel can be substantially homogeneous. In some examples, the molded panel can be formed by integral molding, so that the molded panel can include a joint or seamless molding material. In some examples, the molded panel can be monolithic.

An exemplary fluid discharge device, as described herein, can be implemented in a printing device such as a two-dimensional printer and / or a three-dimensional (3D) printer. As will be appreciated, some exemplary fluid discharge devices can be printheads. In some examples, the fluid discharge device can be incorporated into a printing device to print content on media such as paper, layers of powder-based construction material, reaction devices (eg, lab-on-a-chip devices), etc. Can be used to An exemplary fluid ejection device may be an ink-based ejection device, a digital titration device, a 3D printing device, a drug administration device, a lab-on-a-chip device, a fluid diagnostic circuit, and / or a certain amount of fluid dispensed / ejected. Including other such devices.

In some examples, a printing device on which a fluid discharge device can be mounted can print content by adhering consumable fluid in a layer-by-layer stacking process. Consumable fluids and / or consumable materials can include all materials and / or compounds used, including, for example, inks, toners, fluids or powders, or other raw materials for printing. Further, as described herein, the printing material can include consumable fluids as well as other consumable materials. Printing materials can include inks, toners, fluids, powders, colorants, varnishes, finishing materials, gloss enhancers, binders, and / or other such materials that may be utilized in the printing process.

Now, with reference to the drawings, especially FIG. 1, this figure provides a block diagram showing some components of an exemplary fluid discharge device 10. In this example, the fluid discharge device 10 includes a molded panel 12. The molded panel 12 has a fluid communication channel 14 formed through it. Further, the fluid discharge device 10 includes a fluid discharge die 16 cast into a molded panel and an integrated circuit 18. In this example, the molded panel has a first surface 20 (which may be referred to as the rear surface) and a second surface 22 (which may be referred to as the front surface) which is opposite the first surface 20. Similarly, the discharge die 16 has a first surface 24 and a second surface 26, and the integrated circuit 18 has a first surface 28 and a second surface 30.

As shown, the fluid communication channel 14 is formed on the first surface 20 of the molded panel 12. The surface defining the fluid communication channel 14 facilitates fluid communication with the discharge die 16. In particular, the portion of the first surface 24 of the discharge die 16 is exposed to the fluid communication channel 14. Although not shown in this example, the discharge die 16 may include a penetratingly formed fluid supply hole that fluidly connects the fluid communication channel 14 with the discharge nozzle of the discharge die 16. The orifice of the discharge nozzle of the discharge die 16 may be formed on the second surface 26 of the discharge die 16. As illustrated in this example, the second surface 22 of the molded panel 12, the second surface 26 of the discharge die 26, and the second surface of the integrated circuit 30 can be substantially coplanar.

Therefore, in an example similar to the example of FIG. 1, the discharge die 16 and the integrated circuit 18 can be molded into a molding panel 12. As shown, the discharge die 16 and the integrated circuit 18 are at least partially embedded in the molding panel such that the discharge die 16 and the integrated circuit are coupled to the molding panel 12. For example, with respect to the discharge die 16, the first surface 24 and sides of the discharge die are at least partially covered by the molding panel 12. The second surface 26 of the ejection die 16 to which the ejection nozzle can dispense the printing material can be exposed and substantially coplanar with the second surface of the molding panel 12. Similarly, for the integrated circuit 18, the first surface 28 and sides may be covered by the molded panel 12. The second surface 30 of the integrated circuit 18 can be exposed and substantially coplanar with the second surface of the molded panel 12. As will be appreciated, by molding the discharge die 16 and the integrated circuit 18 into the molded panel 12, the discharge die 16 and the integrated circuit 18 can be coupled to the molded panel without the use of adhesives. In such an example, if the discharge die 16 and the integrated circuit 18 are at least partially covered by the material of the molded panel, the discharge die 16 and the integrated circuit can be described as being at least partially embedded in the molded panel 12. ..

Now, with reference to FIG. 2, this figure provides a block diagram showing some components of an exemplary fluid discharge device 50. In this example, the fluid discharge device 50 includes a discharge die 54 and a molded panel 52 into which the integrated circuit 56 can be cast. In this example, the molded panel 52 can have a fluid communication channel 58 formed through it. As will be appreciated, the fluid communication channel 58 is such that the fluid communication channel 58 is formed on the rear surface of the molding panel 52, while the front surface of the molding panel is substantially flush with the front surface of the discharge die 54 and the front surface of the integrated circuit 56. It is indicated by a dashed line to indicate that it is.

In this example, the discharge die 54 is electrically connected to the integrated circuit 56 via at least one conductive element 60. In some examples, at least one conductive element 60 is a trace formed from a conductive material (eg, copper-based material, gold-based material, silver-based material, aluminum-based material, conductive polymer, etc.). Can include. In some examples, at least one conductive element 60 may be located in front of the exemplary fluid discharge device 50. In some examples, at least one conductive element 60 may be included in the insulating material. For example, at least one conductive element 60 can include an insulating thin film such as a polyamide thin film or a polyimide thin film. In such an example, at least one conductive element may be coupled to the molded panel for electrical connection of the discharge die 54 and the integrated circuit 56 via an automatic tape bonding (TAB) process. In another example, a portion of at least one conductive element 60 may be at least partially embedded in the molded panel 52. In some examples, at least one conductive element 60 may be coupled to the discharge die 54 and the integrated circuit in a wire bonding process.

As shown in the example of FIG. 2, the discharge die 54 can be a non-rectangular die. In such an example, the discharge die 54 may include an elongated first portion 62 and a second portion 64. The discharge nozzles of the discharge die 54 can be arranged along the length of the elongated first portion 62, and the electrical contacts of the discharge die 54 can be arranged in the second portion 64. Thus, as illustrated, at least one conductive element 60 may be connected to the discharge die 54 in the second portion 64. Further, the integrated circuit 56 can be arranged close to the discharge die 54 at the first end of the discharge die 54, with the second portion 64 being the discharge die on the opposite side of the first end. It is located at the second end of 54.

Further, in this example, the discharge die 54 may include at least one temperature sensor 66. In such an example, the integrated circuit 56 can receive sensor data from at least one temperature sensor 66. Based on sensor data, at least in part, the integrated circuit 56 can determine the temperature associated with the discharge die 54. For example, at least one temperature sensor 66 can include a resistance element. The resistance value of the resistance element can change based on the temperature. In such an example, the integrated circuit 56 can urge the temperature sensor to receive sensor data corresponding to the resistance value of the resistance element, and the integrated circuit 56 is associated with the discharge die 54 based on the sensor data. The temperature can be calculated.

Further, the discharge die 54 may include at least one heating element 68. In such an example, the integrated circuit 56 can control at least one heating element 68. In some examples, the integrated circuit 56 can control at least one heating element 68 based at least in part on the sensor data received from at least one temperature sensor 66. In some examples, the discharge die can have a defined operating temperature range stored in the memory of the integrated circuit 56. In such an example, the integrated circuit 56 electrically urges at least one heating element 68 to heat the discharge die 54, depending on the determination that the temperature of the discharge die 54 is below the specified operating temperature range. be able to. Further, the integrated circuit 56 can stop the electrical urging of at least one heating element 68 depending on the determination that the temperature of the discharge die 54 is within or above the specified operating temperature range. In some examples, at least one heating element 68 can be a resistance heating element.

In this example, the integrated circuit 56 includes a controller 70 and a memory 72. As used herein, a controller may include a configuration of logical components for data processing. Examples of controllers include central processing units (CPUs), graphics processing units (GPUs), application specific integrated circuits (ASICs), microcontrollers, and / or other such devices.

As used herein, memory can include various types of volatile and / or non-volatile memory. A memory such as the memory 72 of the exemplary device 50 can be a machine-readable storage medium. In some examples, memory is persistent. Examples of memory include random access memory (RAM), read-only memory (ROM) (eg, mask ROM, PROM, EPROM, EEPROM, etc.), flash memory, semiconductor memory, magnetic disk memory, and SONOS (silicon-oxide-nitride). -oxide-silicon) Memory, as well as other memory devices / modules that maintain stored information. In some examples, the controller 70 and memory 72 can reside in a single package and can consist of a single integrated circuit. For example, an integrated circuit can include a microcontroller with a controller and memory in a single package.

As illustrated, the memory 72 of the exemplary device 50 is enabled by the integrated circuit 56 (and / or its controller 70) to cause the integrated circuit 56 to perform the operations described herein. Includes an instruction 74 that can. For example, by executing the instruction 74 by the integrated circuit 56, the integrated circuit 56 can control the selective distribution of the printing material through the discharge nozzle of the discharge die 54. As another example, by executing the instruction 74 by the integrated circuit 56, the integrated circuit 56 can urge the temperature sensor 66 to receive sensor data from the temperature sensor. Further, by executing the instruction 74 by the integrated circuit 56, the integrated circuit can control at least one heating element 68.

FIG. 3 is a top view showing an example of some components of the fluid discharge device 100. In this example, the fluid discharge device 100 includes a molding panel 102, a discharge die 104 cast into the molding panel 102, and an integrated circuit 106 cast into the molding panel 102. In this example, the discharge die 104 and the integrated circuit 106 are electrically connected via conductive elements arranged on a thin film forming the tape automatic bonding (TAB) element 108. As shown in this example, the TAB element 108 is located in front of the fluid discharge device 100. In the examples described herein, the front surface of the fluid discharge device 100 comprises the front surface of the molding panel 102, the front surface of the discharge die 104, and the front surface of the integrated circuit 106. In the example, the front surface of the molding panel 102, the front surface of the discharge die 104, and the front surface of the integrated circuit 106 are substantially coplanar.

In this particular example, the TAB element 108 is at least partially located in front of the discharge dies 104 and the integrated circuit 106 on either side of the molding panel 102. Further, the TAB element 108 is electrically connected to the electrical connection point 110 of the discharge die 104. The electrical connection point 110 of the discharge die 104 is shown by an imaginary line to reflect that the electrical connection point 110 is covered by a portion of the TAB element 108. Similarly, the TAB element 108 is electrically connected to the electrical connection point 112 of the integrated circuit 106. The electrical connection point 112 of the integrated circuit 106 is shown by an imaginary line to reflect that the electrical connection point 112 is covered by a portion of the TAB element 108. As used herein, electrical connection points can include bonding pads or other such electrical terminals. As will be appreciated, electrical connection points can include copper and / or other conductive materials.

Although not shown in this example, the TAB element 108 can extend beyond the molded panel 102 so that the fluid discharge device 100 can be electrically connected to additional devices. For example, the TAB element 108 may extend beyond the molding panel 102 to connect the fluid discharge device 100 to a series of electrical contacts, which in turn may then be electrically connected to the controller of the printing device.

Further, as shown in this example, the discharge die 104 includes a plurality of discharge nozzles 114. The discharge nozzle 114 can be controlled to selectively dispense the printing material. In this example, the electrical connection between the discharge die 104 and the integrated circuit 106 can facilitate the control of the discharge nozzle 114 by the integrated circuit 106. For example, the integrated circuit 106 may include a controller for controlling the selective distribution of the printing material via the ejection nozzle 114.

FIG. 4 provides a cross-sectional view of an exemplary fluid discharge device 100 of FIG. 3 along line 4-4 of FIG. As shown, the molded panel 102 includes a fluid communication channel 120 formed through it. The fluid communication channel 120 is in fluid contact with the discharge die 104, so that the printing material can be fed to the discharge die 104 via the fluid communication channel 120 for selective distribution by the discharge die 104. In this example, the cross section shows some components of the discharge die 104 and the discharge nozzle 114. The discharge die 104 has a fluid supply hole 122 formed on the rear surface of the discharge die 104, in which case the fluid supply hole 122 is fluid-connected to the fluid communication channel 120 and the discharge chamber 124 of the discharge nozzle 114. The discharge chamber 124 is fluidly connected to the nozzle orifice 126 of the discharge nozzle 114. Although not shown in this example, the fluid discharger of the discharge nozzle 114 may be located in the discharge chamber 124. The selective urging of the fluid discharger allows the fluid in the discharge chamber 124 to be dispensed / discharged out of the orifice 126. As shown, the substantially planar front surface of the fluid discharge device 100 can consist of the front surface of the molding panel 102 and the exposed front surface of the discharge die 104. The nozzle orifice 126 corresponds to an opening on the front surface of the discharge die 104, and the fluid communication channel 120 is formed on the rear surface of the molded panel 102.

Further, in this example, the cross section shows a cross section of the TAB element 108. As shown, the TAB element 108 includes a conductive element 130 located in front of the fluid discharge device 100. The conductive element 130 may be at least partially covered by the insulating thin film 132. Further, the conductive element 130 may be electrically connected to the integrated circuit 106 and the discharge die 104 in the automatic tape bonding process. Therefore, the TAB element 108 may be coupled to the front surface of the fluid discharge device 100 via an adhesive. As will be appreciated, the integrated circuit 106 and the discharge die 104 are electrically connected via the TAB element 108 while the TAB element 108 is coupled to the front surface of the fluid discharge device 100.

FIG. 5 is an assembly / disassembly isometric view of the exemplary fluid discharge device 100 of FIGS. 3 and 4. In this figure, the TAB element 108 is separated from the molded panel 102 to indicate the underlying electrical connection point 110 of the discharge die 104 and the underlying electrical connection point 112 of the integrated circuit 106. As shown in FIG. 5, the discharge die 104 may have a non-rectangular shape. In this example, the discharge die 104 has a first elongated portion 150 into which the discharge nozzles 114 can be arranged. In some examples, the length of the elongated portion can correspond to the print width of the ejection die 104. Further, the discharge die 104 has a second portion 152 in which the electrical contacts 110 of the discharge die 104 can be arranged. As shown, the second portion 152 of the discharge die 104 can be located at the first end of the fluid discharge device 100 and the integrated circuit 106 is at the second end of the fluid discharge device 100. Can be placed. The first elongated portion 150 of the discharge die 104 may be disposed between the integrated circuit 106 and the second portion 152.

FIG. 6A is a block diagram showing some components of an exemplary fluid discharge device 200. The fluid discharge device 200 includes a molding panel 202, a plurality of discharge dies 204 cast into the molding panel 202, and a plurality of integrated circuits 206 cast into the molding panel 202. As shown in this example, the discharge dies 204 can be generally arranged end-to-end along the width of the fluid discharge device 200 (and the width of the molded panel 202). Further, the discharge dies 204 may be arranged in a staggered / partially overlapping relationship.

In an example similar to the example of FIG. 6A, the width of the fluid discharge device 200 in which the discharge dies 204 can be arranged can correspond to the print width of the printing system in which the fluid discharge device can be mounted. In some examples, the fluid discharge device 200 may be implemented in a page width printing system. In these examples, the fluid discharge device 200 can facilitate the print width corresponding to the width of the medium to which the print material should be selectively distributed. In another example, a plurality of fluid discharge devices similar to the illustrated example may be arranged in a staggered / partially overlapping end-to-end arrangement corresponding to the print width of the printing system. Each discharge die 204 includes a plurality of discharge nozzles 210 that selectively distribute the printing material. In this example, the discharge nozzles 210 may be configured in a staggered arrangement along the length of the elongated portion of each discharge die 204.

For each of the plurality of discharge dies 204, the fluid discharge device 200 includes each integrated circuit 206 cast into the molded panel 200 in close proximity to the discharge dies 204. As described in connection with other examples, each individual discharge die 204 may be electrically connected to an individual integrated circuit 206, and the individual integrated circuits may be printed material by the individual discharge dies 204. It is possible to control the selective distribution of. In the examples presented herein, exemplary fluid discharge devices include integrated circuits for each discharge die, but as will be appreciated, other examples include fewer integrated circuits than discharge dies, or discharge dies. Can have more integrated circuits. As a particular example, a fluid discharge device can include one integrated circuit that is electrically connected to at least two discharge dies, which control the selective distribution of printing material by at least two discharge dies. can do.

FIG. 6B is a cross-sectional view taken along line 6B-6B of the exemplary fluid discharge device 200 of FIG. 6A. As shown in this example, the molded panel 202 has its own fluid communication channel 220 for each discharge die 204. Each fluid communication channel 220 has its own discharge so that the printing material to be selectively distributed by the respective discharge dies 204 can be fed from the printing material reservoir to the discharge dies 204 via the respective fluid communication channels. Fluidly connected to die 204. Each fluid communication channel 220 is formed through the rear surface of the molded panel 202. Each discharge die 204 may have a fluid supply hole 222 that fluidly connects the respective fluid communication channels 220 to the discharge nozzle 210. As shown in the cross section, the discharge die 204 can be at least partially embedded in the molding panel 202 so that the front surface of each discharge die 204 is exposed and the sides of the discharge die 204 are molded panels. At least a part of the rear surface of the discharge die 204 is wrapped in the material of the molded panel.

FIG. 7 provides an isometric view of some components of an exemplary printing fluid cartridge 250, including an exemplary fluid discharge device 260 coupled to a container 262 capable of containing printing material. The fluid discharge device 260 includes a molded panel 264, a discharge die 266 cast into the molded panel 264, and an integrated circuit 268 cast into the molded panel. As will be appreciated, the fluid discharge device 260 includes features and components similar to the other fluid discharge devices 260 described herein, including fluid communication channels, discharge nozzles, electrical contacts, and conductive elements. include. Further, the integrated circuit 268 can control the selective distribution of the printing material by the ejection die 266 as described herein. In an example such as the exemplary printing fluid cartridge 250, the fluid communication channel can fluidly connect the container 262 and the discharge die 266 so that the printing material stored in the container 262 is selectively selected by the discharge die 266. It can be sent to the discharge die 266 for fluid distribution.

In this example, the fluid discharge device 260 is electrically connected to the flexible circuit 270, in which case the flexible circuit 270 can include a conductive element. In some examples, the flexible circuit 270 can electrically connect the discharge die 266 and the integrated circuit 268. Further, as illustrated, the flexible circuit 270 includes electrical contacts 272 that can facilitate electrical connection of the fluid discharge device 260 and the printing fluid cartridge 250 to external devices such as printing devices.

In such an example, the externally connected device is electrically connected to the fluid discharge device 260, so that the external device can transmit nozzle data to the integrated circuit 268. In such an example, the integrated circuit can receive the nozzle data and the integrated circuit can control the selective distribution of the printing material using the ejection nozzle at least partially based on the nozzle data.

However, in some examples, the nozzle data received may not correspond to the discharge nozzle configuration of the fluid discharge device 260. For example, an integrated circuit can facilitate printing with a printing fluid cartridge having a fluid discharge device similar to the example provided herein in a legacy printing system, in which case such functionality is backward compatible. Can be called sex. In such an example, the nozzle data received in the integrated circuit can be converted to the latest (updated) nozzle data, in which case the latest nozzle data is the configuration of the discharge nozzle of the discharge die to which the integrated circuit is electrically connected. Corresponds to.

FIG. 8 provides a flow chart showing an exemplary process 300 that can be performed to form an exemplary device as described herein. The discharge die is arranged for the manufacture of the fluid discharge device (block 302). The individual integrated circuits are placed in close proximity to the individual discharge dies (block 304). The molded panel is formed so that the molded panel includes a discharge die and an integrated circuit cast into the molded panel (block 306). A portion of the molded panel is removed to form an individual fluid communication channel for each discharge die (block 308).

FIG. 9 provides a flow chart showing an exemplary process 350 that can be performed to form an exemplary device as described herein. In this example, the discharge die and integrated circuit can be placed on the support (block 352). In some examples, each discharge die and the front surface of each integrated circuit can be detachably coupled to the support using an adhesive. For example, the adhesive can be a heat-removable tape. A molded panel containing a discharge die and an integrated circuit cast into the molded panel can be formed (block 354). In some examples, forming a molding panel involves depositing the molding material on an integrated circuit and discharge die on a support to mold the molding material. For example, the molding material can be compression molded to form a molding panel. Other types of exposed die molding, such as transfer molding, may be performed.

After forming the molded panel, the molded panel is removed from the support (block 356). As described, in some examples, the integrated circuit and discharge die can be detachably coupled to a support that is located with a removable adhesive such as a heat-removable tape. In such an example, the adhesive that binds the integrated circuit and the discharge die to the support is released. The individual discharge dies can be electrically connected to the individual integrated circuits (block 358). In some examples, the discharge dies and integrated circuits may be electrically connected by a wire bonding process. In another example, the discharge die and the integrated circuit may be electrically connected by a process of automatic tape bonding.

After removing the molded panel from the support, individual fluid communication channels can be formed for each individual discharge die (block 360). In the examples provided herein, forming a fluid communication channel can include removing a portion of the molded panel. For example, the rear surface of a molded panel can be slot plunged. In another example, removing a portion of the molded panel can include cutting the molded panel with a laser or other cutting device. Further, removing a portion of the molded panel can include performing other microfabrication processes (eg, ultrasonic cutting, powder blasting, etc.). After the formation of the fluid communication channel, the molded panel can be unified into a fluid discharge device such as the exemplary fluid discharge device described herein. In some examples, unifying a molded panel can include dicing the molded panel, cutting the molded panel, and / or other such known unification processes.

10 to 14B provide exemplary block diagrams showing examples corresponding to the steps of the processes of FIGS. 8 and 9. FIG. 10 shows a support 400, a discharge die 402 placed on the support, and an integrated circuit 404 placed on the support. In this example, the front surfaces of the discharge die 402 and the integrated circuit 404 are arranged on the support 400, so that the rear surfaces of the discharge die 402 and the integrated circuit 404 are upright in this figure. In FIG. 11A, the molding material was deposited on the support 400 and the molding material was molded to form a molding panel 420 including a discharge die 402 and an integrated circuit 404.

FIG. 11B is a cross-sectional view of an example of FIG. 11A along lines 11B-11B. As shown in FIG. 11B, the support 400 is coupled to the discharge die 402 via a removable adhesive 422. Further, as described above, the front surface of each discharge die 402 on which the nozzle orifice 430 is formed is coupled to the support 400 via a removable adhesive 422. The rear surface of each discharge die 402 has a fluid supply hole 432 formed therein. However, during the manufacturing process, the fluid supply hole 432 may be filled with a protective material to prevent the molding material from depositing in the fluid supply hole 432. FIG. 11C is a cross-sectional view of an example of FIG. 11A along lines 11C-11C. As shown in FIGS. 11B and 11C, the molded panel 420 partially surrounds the discharge die 402 and the integrated circuit 404. In particular, at this stage of the exemplary process, the rear and side surfaces of the discharge die 402 and the integrated circuit 404 are covered with the molding material of the molding panel 420.

In FIG. 12A, the molded panel 420 is removed from the support, resulting in exposure of the front surfaces of the discharge die 402 and the integrated circuit 404. FIG. 12B is a detailed view of the example of FIG. 12A. As shown in FIG. 12B, the front surfaces of the discharge die 402 and the integrated circuit 404 are exposed, and as a result, the discharge nozzle 440 of the discharge die 402 is exposed. Further, the electrical contacts 450 of the discharge die 402 and the electrical contacts 452 of the integrated circuit are exposed. As shown, the front surface of the discharge die 402, the front surface of the integrated circuit 404, and the front surface of the molding panel 420 are substantially coplanar.

In FIG. 13A, a fluid communication channel 460 was formed on the back surface of the molded panel 420. As will be appreciated, FIGS. 12A-12B show the front surface of the molded panel 420 and FIG. 13 shows the opposite rear surface. FIG. 13B provides a cross-sectional view of the example of FIG. 13A along lines 13B-13B. As shown, each fluid communication channel 460 is fluid connected to an individual discharge die 402. In particular, the fluid communication channel 460 can be fluid connected to the fluid supply hole 432 of each discharge die 402. FIG. 13C provides a cross-sectional view of the example of FIG. 13A along lines 13C-13C.

14A-14B show an exemplary unified fluid discharge device 480 that can be formed by unifying the example of FIG. 13A. FIG. 14A shows the front surface of the exemplary fluid discharge device 480, and FIG. 14B shows the rear surface of the exemplary fluid discharge device 480. In FIG. 14A, the front surface of the exemplary fluid discharge device 480 corresponds to the front surface of the discharge die 402 and the integrated circuit 404, so that the discharge nozzle 430 and the electrical contacts 450, 452 are exposed (ie, the molded panel 420). Not covered by the molding material). In FIG. 14B, the discharge dies 402, the integrated circuits 404, and the electrical contacts 450, 452 are shown with imaginary lines to show their placement with respect to the fluid communication channels 460 formed on the rear surface of the molded panel 420. There is.

15 and 16 are flow charts that provide an exemplary set of procedures that can be performed by an integrated circuit of an exemplary fluid discharge device to perform exemplary processes and methods. In some examples, the procedures included in the flow chart can be embodied in memory resources (eg, exemplary memory 72 in FIG. 2) in the form of instructions that can be made executable by integrated circuits. According to the instruction, the integrated circuit performs an operation (procedure) corresponding to the instruction.

Flow as shown in FIG. 500, an integrated circuit of an exemplary fluid discharge device can receive nozzle data (block 502). The integrated circuit can convert the received nozzle data into the latest nozzle data corresponding to the discharge nozzle configuration of the discharge die of the fluid discharge device (block 504). The integrated circuit can control the selective distribution of printing material through the ejection nozzles, at least in part, based on the latest nozzle data (block 506). Thus, in an example similar to the example provided in FIG. 15, some examples are described herein in a printing system that transmits nozzle data that is not formatted in the discharge nozzle configuration of an exemplary fluid discharge device. Delayed compatibility of the illustrated exemplary fluid discharge devices can be facilitated.

Flow in FIG. 16 With respect to FIG. 550, an integrated circuit of an exemplary fluid discharge device can urge the temperature sensor of the discharge die to receive sensor data from the temperature sensor (block 552). The integrated circuit can determine the temperature of the discharge die based on the sensor data (block 554), and the integrated circuit can control the heating element of the discharge die at least partially based on the temperature of the discharge die (block). 556).

Thus, the examples provided herein can provide a fluid discharge device that includes a molded panel with integrated circuits and discharge dies cast inside. In addition, examples can include non-rectangular dies that can reduce the complexity of electrical connections. In addition, examples can facilitate delayed compatibility of exemplary fluid discharge devices in some legacy printing systems. Further, in some examples, localizing the control operation of the discharge die to a nearby integrated circuit can reduce the manufacturing complexity associated with the discharge die.

The above description has been presented to illustrate and illustrate examples of the principles described. This description is not intended to be exhaustive or to limit these principles to any of the exact same forms disclosed. Many changes and modifications are possible in light of this description. Therefore, the above examples provided in the drawings and described herein should not be construed as a limitation of the scope of the present disclosure as defined in the claims.

In the following, an exemplary embodiment consisting of a combination of various constituents of the present invention will be shown.
1. 1. A fluid discharge device
Molded panels with fluid communication channels formed through,
At least one discharge die cast into the molded panel, wherein the at least one discharge die includes a plurality of discharge nozzles fluidly connected to the fluid communication channel, and each discharge nozzle is the fluid communication channel. With at least one ejection die that selectively distributes the printing material received from
Including an integrated circuit cast into the molded panel and electrically connected to the discharge die.
The integrated circuit is a fluid discharge device that receives nozzle data and controls the selective distribution of printing material through the plurality of discharge nozzles based on the nozzle data at least in part.
2. The at least one discharge die comprises a temperature sensor and at least one heating element, and the integrated circuit further receives sensor data from the temperature sensor and at least partially based on the sensor data, said at least one. The fluid discharge device according to 1 above, which controls the at least one heating element of one discharge die.
3. 3. The fluid discharge device according to 1 above, wherein the integrated circuit and the at least one fluid discharge die are electrically connected by an automatic tape bonding process.
4. The integrated circuit converts the received nozzle data into the latest nozzle data corresponding to the configuration of the plurality of nozzles of the at least one discharge die, and the integrated circuit at least a part of the latest nozzle data. 1. The fluid discharge device according to 1 above, which controls the selective distribution of printing material through the plurality of discharge nozzles.
5. The discharge die further includes a plurality of electrical contacts electrically connected to the discharge nozzle, the discharge die has an elongated portion in which the plurality of discharge nozzles are arranged, and the discharge die has the plurality of electric charges. The fluid discharge device according to 1 above, which has a connecting portion in which contacts are arranged.
6. 5. The fluid discharge according to 5 above, wherein the elongated portion of the discharge die has a length-to-width ratio of at least 50 and the width of the connecting portion of the discharge die is approximately twice the width of the elongated portion. device.
7. The fluid discharge device has a front surface, and the plurality of discharge nozzles are exposed along the front surface.
The discharge die has a first end and a second end opposite the first end, and the discharge die is located at the first end of the discharge die. Includes a first set of electrical contacts electrically connected to the discharge nozzle.
The integrated circuit die is placed on the molded panel in close proximity to the second end of the discharge die, the integrated circuit die comprising a second set of electrical contacts.
The fluid discharge according to 1 above, wherein the discharge device is arranged in front of the fluid discharge device and further includes a conductive element that electrically connects the first set of electrical contacts and the second set of electrical contacts. device.
8. The at least one discharge die comprises a plurality of discharge dies, the fluid discharge device comprises an integrated circuit for each of the plurality of discharge dies, and the molding panel comprises a plurality of discharge dies for each of the plurality of discharge dies. , Each has its own fluid communication channel formed inside,
The molded panel has a width corresponding to the width of the page width print, and the plurality of ejection dies are generally arranged end-to-end along the width of the molded panel, and each integrated circuit for each ejection die. 1. The fluid discharge device according to 1 above, which is arranged close to each of the discharge dies along the width of the molded panel.
9. Place multiple discharge dies, each containing multiple discharge nozzles,
Each integrated circuit is arranged close to each of the plurality of ejection dies, and each integrated circuit controls the selective distribution of the printing material through the ejection nozzle of the respective ejection dies. ,
A molded panel containing the plurality of discharge dies and their respective integrated circuits is formed.
A part of the molding panel is removed to form each fluid communication channel for each of the plurality of discharge dies, and each of the fluid communication channels is fluid-connected to the discharge nozzle of each of the discharge dies. Including, process.
10. 9. The process of 9 above, further comprising forming the molded panel and then electrically connecting each of the discharge dies to the respective integrated circuit using a conductive element on the front surface of the molded panel.
11. The process according to 10.
12. 9. The process of 9 above, wherein removing a portion of the molded panel comprises slot cutting the rear surface of the molded panel.
13. It further comprises unifying the molded panel into individual fluid discharge devices, each of which is associated with at least one of the plurality of discharge dies and at least one of the discharge dies. 9. The process of claim 9, comprising an integrated circuit of.
14. It is a printing fluid cartridge
A container for storing printing materials and
The fluid discharge device includes a fluid discharge device coupled to the container.
A molded panel having a fluid communication channel formed inside and fluidly connected to the container.
A discharge die cast into the molded panel, wherein the discharge die includes a plurality of discharge nozzles fluidly connected to the fluid communication channel, and the plurality of discharge nozzles are via the fluid communication channel. A discharge die that selectively distributes the printing material received from the container,
A printing fluid cartridge that includes an integrated circuit cast into the panel and electrically connected to the discharge nozzles, the integrated circuit controlling the selective distribution of printing material through the plurality of discharge nozzles. ..
15. The integrated circuit further
Receive nozzle data,
The received nozzle data is converted into the latest nozzle data corresponding to the configuration of the discharge nozzle of the discharge die, and the data is converted into the latest nozzle data.
14. The printing fluid cartridge according to 14 above, wherein the integrated circuit controls the selective distribution of printing material through the plurality of ejection nozzles, at least partially based on the latest nozzle data.

Claims (15)

A fluid discharge device
Molded panels with fluid communication channels formed on the front and through,
A plurality of discharge nozzles, a first end, the first end, which are at least one discharge die molded into the molded panel, exposed along the front surface and fluidly connected to the fluid communication channel. Each discharge nozzle comprises a second end opposite to the discharge nozzle and a first set of electrical contacts located at the first end of the at least one discharge die and electrically connected to the discharge nozzle. With at least one discharge die, which is designed to selectively discharge the printing material received from the fluid communication channel.
An integrated circuit that is molded into the molded panel and is located close to the second end of the at least one discharge die and includes a second set of electrical contacts.
A conductive element located on the front surface of the molded panel and electrically connecting the first set of electrical contacts and the second set of electrical contacts.
The integrated circuit is a fluid discharge device that controls selective discharge of printing material through the plurality of discharge nozzles. The at least one discharge die comprises a temperature sensor and at least one heating element, and the integrated circuit further receives sensor data from the temperature sensor and at least partially based on the sensor data, said at least one. The fluid discharge device according to claim 1, wherein the at least one heating element of one discharge die is controlled. The integrated circuit urges the at least one heating element when the temperature of the at least one discharge die is below the specified operating temperature range, and the temperature of the at least one discharge die is within the specified operating temperature range. The fluid discharge device according to claim 2, wherein the urging of at least one heating element can be stopped when the temperature exceeds that. The fluid discharge device according to any one of claims 1 to 3, wherein the first set of electrical contacts and the second set of electrical contacts are electrically connected by an automatic tape bonding process. The fluid discharge device according to any one of claims 1 to 4, wherein the at least one discharge die has a front surface and the integrated circuit has a front surface. The fluid discharge device according to claim 5, wherein the front surface of the molded panel, the front surface of the at least one discharge die, and the front surface of the integrated circuit are substantially flush with each other. The first set of electrical contacts is arranged in front of the at least one discharge die, the second set of electrical contacts is arranged in front of the integrated circuit, and the conductive element is at least one. The fluid discharge device according to claim 5 or 6, which is arranged along the discharge die. The at least one discharge die has an elongated portion in which the plurality of discharge nozzles are arranged, and the at least one discharge die has a connection portion in which the first set of electrical contacts are arranged. The fluid discharge device according to any one of claims 1 to 7, wherein an elongated portion is arranged between the integrated circuit and the connection portion. The elongated portion of the at least one discharge die has a length-to-width ratio of at least 50: 1 , and the width of the connecting portion of the at least one discharge die is approximately twice the width of the elongated portion. The fluid discharge device according to claim 8. The at least one discharge die comprises a plurality of discharge dies, the fluid discharge device comprises an integrated circuit for each of the plurality of discharge dies, and the molding panel comprises a plurality of discharge dies for each of the plurality of discharge dies. , Each has its own fluid communication channel formed inside,
The molded panel has a width corresponding to the width of the page width print, and the plurality of ejection dies are generally arranged end-to-end along the width of the molded panel, and each integrated circuit for each ejection die. The fluid discharge device according to any one of claims 1 to 9, wherein the fluid discharge device is arranged close to each of the discharge dies along the width of the molded panel. A plurality of discharge dies are arranged, and each discharge die has a front surface, and a plurality of discharge nozzles arranged on the front surface of the discharge die, a first end portion, and a second portion opposite to the first end portion. Includes a first set of electrical contacts located at two ends and at the first end of the discharge die and arranged in front of the discharge die and electrically connected to the discharge nozzle.
Each integrated circuit is arranged close to the second end of each of the plurality of discharge dies, and each integrated circuit has a front surface and is interposed through the discharge nozzle of each of the discharge dies. It is designed to control the selective ejection of the printed material and includes a second set of electrical contacts arranged in front of each integrated circuit.
A molded panel including the plurality of discharge dies and their respective integrated circuits is formed, the molded panel has a front surface, and the plurality of discharge nozzles are exposed along the front surface of the molded panel.
Conductive elements for electrically connecting the first set of electrical contacts and the second set of electrical contacts are placed on the front surface of the molded panel and along the respective discharge dies.
A part of the molding panel is removed to form each fluid communication channel for each of the plurality of discharge dies, and each of the fluid communication channels is fluid-connected to the discharge nozzle of each of the discharge dies. Including, process. Arranging the plurality of discharge dies, arranging the respective integrated circuits, and forming the molded panel is the front surface of each discharge die, the front surface of each integrated circuit, and the front surface of the molded panel. 11. The process of claim 11, comprising arranging the devices so that they are substantially coplanar. It further comprises unifying the molded panel into individual fluid discharge devices, each of which is associated with at least one of the plurality of discharge dies and at least one of the discharge dies. The process of claim 11 or 12, comprising the integrated circuit of. It is a printing fluid cartridge
A container for storing printing materials and
The fluid discharge device includes a fluid discharge device coupled to the container.
Molded panels with fluid communication channels formed on the front and inside and fluidly connected to the container.
A plurality of discharge nozzles formed on the molded panel, wherein the discharge die has a front surface, is exposed along the front surface of the discharge die, and is fluid-connected to the fluid communication channel. The plurality of portions arranged at one end, a second end opposite the first end, and the first end of the discharge die and arranged in front of the discharge die. The plurality of discharge nozzles include a first set of electrical contacts electrically connected to the discharge nozzles, the plurality of discharge nozzles being adapted to selectively discharge the printing material received from the container via the fluid communication channel. Discharge die and
An integrated circuit that is molded into the molded panel and is located close to the second end of the discharge die, has a front surface, and includes a second set of electrical contacts arranged in front of the front surface.
Includes a conductive element located on the front surface of the molded panel and along the discharge die to electrically connect the first set of electrical contacts and the second set of electrical contacts.
A printing fluid cartridge in which the integrated circuit controls the selective ejection of printing material through the plurality of ejection nozzles. The printing fluid cartridge according to claim 14, wherein the front surface of the molded panel, the front surface of the discharge die, and the front surface of the integrated circuit are substantially flush with each other.

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