JP6818523B2 - Manufacturing method of imprinting equipment and articles - Google Patents

Description

The present invention relates to an imprinting device and a method for manufacturing an article.

With the increasing demand for miniaturization of semiconductor devices and MEMS, in addition to the conventional photolithography technology, imprint technology that can form fine patterns (structures) on the order of several nanometers on a substrate has attracted attention. There is. In the imprint technology, an uncured imprint material is supplied (coated) on a substrate, and the imprint material and a mold (mold) are brought into contact with each other to imprint corresponding to a fine uneven pattern formed on the mold. This is a microfabrication technology for forming a material pattern on a substrate.

In the imprint technology, there is a photocuring method as one of the curing methods of the imprint material. In the photo-curing method, the imprint material supplied to the shot region on the substrate is in contact with the mold, and the imprint material is irradiated with light to cure the imprint material, and the mold is separated from the cured imprint material. This is a method of forming a pattern of a printing material on a substrate.

In the manufacturing process of a semiconductor device, a plurality of patterns are superimposed. Therefore, it is necessary to match the position of the pattern formed on the substrate with the position of the pattern formed on the mold. The imprinting apparatus that employs imprinting technology employs a die-by-die alignment method as a method for aligning the mold and the substrate. Further, the accuracy of alignment between the mold and the substrate is called overlay accuracy, and techniques for improving the overlay accuracy have been conventionally proposed (see Patent Documents 1 and 2).

Special Table 2012-507173 JP-A-2002-229602

In the technique disclosed in Patent Document 1, cascade control is performed in order to stably align the mold and the substrate. Specifically, the position feedback control system of the board stage is a minor loop, and the control system that adds a correction amount calculated based on the relative displacement between the mold and the board to the target position (target value) of the board stage is a major loop. .. The relative displacement between the mold and the substrate is obtained by detecting the alignment marks formed on the mold and the substrate, respectively. Cascade control suppresses the non-linear characteristics of the imprint material and makes it possible to stably align the mold and the substrate.

However, when a disturbance such as floor vibration is applied to the imprint device, a vibrational relative displacement occurs between the mold and the substrate due to the difference between the eigenvalue of the holding portion holding the mold and the servo band of the substrate stage. When an oscillating relative displacement occurs between the mold and the substrate, the correction amount calculated based on the relative displacement between the mold and the substrate also becomes oscillating. If the alignment between the mold and the substrate is completed in such a state and the correction amount is held at the value at the end of the alignment, the correction amount is the value at the end of the vibration amplitude (maximum value or minimum value). In some cases, a steady relative displacement is generated between the mold and the substrate. The steady relative displacement between the mold and the substrate is a factor that reduces the overlay accuracy.

Further, in the technique disclosed in Patent Document 2, the command is terminated when the differential value of the command of the target position changes from non-zero to zero, and the command is terminated after the position command deviation becomes zero until the next command is started. Zero is output as a speed command. However, the value calculated based on the output of the stable pre-filter used for the speed command before the end of the command is not output.

The present invention has been made in view of such problems of the prior art, and an exemplary object is to provide an imprinting apparatus that is advantageous for aligning a mold and a substrate.

In order to achieve the above object, the imprinting apparatus as one aspect of the present invention is an imprinting apparatus for forming a pattern of an imprint material on a substrate by using a mold, and includes a stage for holding the substrate and a stage for holding the substrate. Based on the operation amount determined based on the target position of the stage, the drive unit that moves the stage, the measurement unit that measures the relative positional deviation between the mold and the substrate, and the operation amount are described. It has a control unit that is given to a drive unit to control the movement of the stage, and the control unit determines a first correction amount of the target position based on a measurement value of the measurement unit, and a mold. The measured value of the measuring unit or the first correction amount corresponding to the measured value during at least a part of the period from the contact between the imprinted material and the imprinted material to the start of curing of the imprinted material. The process of determining the second correction amount of the target position based on one of the values smaller than the maximum value and larger than the minimum value is performed, and before the time when the imprint material starts to be cured. In addition, the correction amount used for determining the operation amount is switched from the first correction amount to the second correction amount.

Further objects or other aspects of the invention will be manifested in the preferred embodiments described below with reference to the accompanying drawings.

According to the present invention, for example, it is possible to provide an imprinting apparatus that is advantageous for aligning a mold and a substrate.

It is the schematic which shows the structure of the imprinting apparatus as one aspect of this invention. It is a figure for demonstrating the determination of the 2nd correction amount of the target position of the substrate stage in the imprint apparatus shown in FIG. It is a figure for demonstrating the determination of the 2nd correction amount of the target position of the substrate stage in the imprint apparatus shown in FIG. It is a figure for demonstrating the manufacturing method of an article.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. In each figure, the same members are assigned the same reference numbers, and duplicate description will be omitted.

1 (a) and 1 (b) are schematic views showing the configuration of the imprint device 1 as one aspect of the present invention. The imprint device 1 is a lithography device used for manufacturing a semiconductor device or the like as an article, and forms a pattern of an imprint material on a substrate by using a mold. In the present embodiment, the imprinting apparatus 1 brings the imprinting material supplied on the substrate into contact with the mold, and applies energy for curing to the imprinting material to transfer the uneven pattern of the mold to the cured product. Form the pattern of.

As the imprint material, a curable composition (sometimes referred to as an uncured resin) that cures when energy for curing is applied is used. Electromagnetic waves, heat, etc. are used as the energy for curing. As the electromagnetic wave, for example, light such as infrared rays, visible light rays, and ultraviolet rays whose wavelength is selected from the range of 10 nm or more and 1 mm or less is used.

The curable composition is a composition that is cured by irradiation with light or by heating. The photocurable composition that is cured by irradiation with light contains at least a polymerizable compound and a photopolymerization initiator, and may contain a non-polymerizable compound or a solvent, if necessary. The non-polymerizable compound is at least one selected from the group of sensitizers, hydrogen donors, internal release mold release agents, surfactants, antioxidants, polymer components and the like.

The imprint material may be applied in a film form on the substrate by a spin coater or a slit coater. Further, the imprint material may be applied onto the substrate in the form of droplets or islands or films formed by connecting a plurality of droplets by the liquid injection head. The viscosity of the imprint material (viscosity at 25 ° C.) is, for example, 1 mPa · s or more and 100 mPa · s or less.

The imprint device 1 employs a photocuring method as a curing method for the imprint material. The imprint device 1 includes an irradiation unit 2, a substrate stage 4, a supply unit 5, an alignment scope 6, a mold holding unit 15, a stage driving unit 17, a position measuring unit 18, and a main body structure 27. Have. The main body structure 27 is supported by the floor 100 via the mount 29. Here, the direction parallel to the optical axis of the ultraviolet rays 9 irradiated on the imprint material on the substrate is defined as the Z axis, and the directions orthogonal to each other in the plane perpendicular to the Z axis are defined as the X axis and the Y axis.

When the imprint material 14 on the substrate is cured, the irradiation unit 2 irradiates the imprint material 14 on the substrate with ultraviolet rays 9 via the mold 8. The irradiation unit 2 includes, for example, a light source (not shown) and an optical system that adjusts the ultraviolet rays 9 emitted from the light source to light suitable for curing the imprint material 14.

The mold 8 has a rectangular outer peripheral shape, and has a pattern 8a in which a concavo-convex pattern (for example, a circuit pattern) to be transferred to the substrate 10 is formed three-dimensionally on a surface facing the substrate 10. The mold 8 is made of a material capable of transmitting ultraviolet rays 9, for example, quartz. The mold 8 has a cavity (recess) having a circular planar shape and a certain depth on the surface irradiated with ultraviolet rays 9.

The mold holding unit 15 includes a mold chuck 11 for holding the mold 8 and a mold driving unit 12 for movably holding the mold chuck 11. The mold chuck 11 holds the mold 8 by attracting the outer peripheral region of the ultraviolet 9 irradiation region of the mold 8 by a vacuum adsorption force or an electrostatic force. For example, when holding the mold 8 by a vacuum suction force, the mold chuck 11 is connected to a vacuum pump (not shown) installed outside, and the attachment / detachment of the mold 8 can be switched by turning the vacuum pump ON / OFF. Be done. The mold drive unit 12 sets the mold chuck 11 on the Z axis, θx, so that the imprint material 14 can be brought into contact with the mold 8 (seal) and the mold 8 can be separated from the imprint material 14 (mold release). Move in the directions of the axis (around the X axis) and the θy axis (around the Y axis). Examples of the actuator that can be used in the mold drive unit 12 include a linear motor and an air cylinder.

The mold chuck 11 has an opening region in the central portion (inside) that allows ultraviolet rays 9 from the irradiation portion 2 to irradiate the imprint material 14 on the substrate. In such an opening region, a light transmitting member (for example, a glass plate) having a space surrounded by a part of the opening region and the mold 8 as a closed space is installed. The pressure inside the enclosed space is adjusted by a pressure regulator (not shown) including a vacuum pump or the like. In such a pressure adjusting device, for example, when the imprint material 14 on the substrate and the mold 8 are brought into contact with each other, the pressure inside the closed space is made higher than the pressure outside the imprint material 14, so that the pattern 8a (pattern) of the mold 8 is formed. The surface) is deformed into a convex shape toward the substrate 10. As a result, the imprint material 14 on the substrate can be brought into contact with the central portion of the pattern 8a, and gas (air) is suppressed from remaining between the pattern 8a and the imprint material 14, so that the pattern 8a can be brought into contact with the imprint material 14. The imprint material 14 can be filled to every corner.

The substrate 10 includes, for example, a single crystal silicon substrate and an SOI (Silicon on Insulator) substrate. An imprint material 14 for transferring the pattern 8a of the mold 8 is supplied to the substrate 10.

The substrate stage 4 holds the substrate 10 via a substrate chuck 16 that attracts the substrate 10 by an attractive force. The substrate stage 4 is used for aligning the mold 8 and the substrate 10 when the imprint material 14 on the substrate and the mold 8 are brought into contact with each other.

The stage drive unit 17 moves the substrate stage 4 in the X-axis, Y-axis, and θz-axis directions. Examples of the actuator that can be adopted in the stage drive unit 17 include a linear motor and a flat motor. In the present embodiment, the stage drive unit 17 moves the substrate stage 4 based on the operation amount determined based on the position of the substrate stage 4 measured by the position measurement unit 18 and the target position of the substrate stage 4.

The supply unit 5 is arranged in the vicinity of the mold holding unit 15. The supply unit 5 includes a dispenser 5a for discharging the imprint material 14, and supplies the imprint material 14 on the substrate. In the present embodiment, the imprint material 14 has a property of being cured by irradiation with ultraviolet rays 9, but the type thereof is appropriately selected according to various conditions such as a manufacturing process of a semiconductor device. The amount of the imprint material 14 discharged from the dispenser 5a is appropriately determined according to the thickness (residual film thickness) of the imprint material 14 to be formed on the substrate, the density of the pattern to be formed on the substrate, and the like. Will be done.

The alignment scope 6 detects the alignment marks formed on the mold 8 and the substrate 10, and measures the misalignment between the mold 8 and the substrate 10 in each of the X-axis and Y-axis directions. As described above, the alignment scope 6 functions as a measuring unit for measuring the relative positional deviation between the mold 8 and the substrate 10 in each of the X-axis and Y-axis directions.

The position measuring unit 18 has a function of measuring the position of the substrate stage 4. The position measuring unit 18 includes, for example, an interferometer, an encoder, and the like, and in the present embodiment, measures the position and angle in the direction of each axis of the substrate stage 4.

Here, the control unit CN that controls the movement of the substrate stage 4 by giving an operation amount to the stage drive unit 17 will be described. The control unit CN performs a first process and a second process as a process of determining a correction amount for correcting the target position (target value) of the substrate stage 4. The first process is a process of determining the first correction amount of the target position of the substrate stage 4 based on the measured value of the alignment scope 6 (the relative positional deviation between the mold 8 and the substrate 10 measured by the alignment scope 6). Is. In the second process, the second correction amount of the target position of the substrate stage 4 is determined based on the measured value of the alignment scope 6 in the predetermined period in which the mold 8 and the imprint material 14 on the substrate are in contact with each other. In the second process, one of the values smaller than the measured value of the alignment scope 6 in a predetermined period or the maximum value of the first correction amount corresponding to the measured value and larger than the minimum value is set as the target position of the substrate stage 4. Is determined as the second correction amount of. In the second process, the second correction value may be directly determined from the measured value (variation) of the alignment scope 6, or the first correction value (variation) determined based on the measured value of the alignment scope 6 may be determined. The second correction value may be determined from (variation in). Here, the predetermined period during which the mold 8 and the imprint material 14 on the substrate are in contact is from the time when the mold 8 is brought into contact with the imprint material 14 on the substrate until the imprint material 14 starts to cure. At least a part of the period between. Then, the control unit CN switches the correction amount used for determining the operation amount of the stage drive unit 17 from the first correction amount to the second correction amount before the time when the imprint material 14 starts to be cured. Further, after switching the correction amount used for determining the operation amount from the first correction amount to the second correction amount, the control unit CN is based on the second correction amount while the imprint material 14 is being cured. The determined operation amount is given to the stage drive unit 17. In other words, the correction amount used to determine the operation amount is held in the second correction amount.

The specific configuration and function of the control unit CN will be described. In the present embodiment, the control unit CN performs cascade control including the first control system and the second control system, with the first control system as a minor loop and the second control system as a major loop. In the first control system, the difference between the measured value of the position measuring unit 18 (the position of the board stage 4 measured by the position measuring unit 18) 101 and the first target position 41 of the board stage 4 is set by the first compensator 42. It is amplified to set the operation amount 102 of the stage drive unit 17. As a result, the substrate stage 4 can be positioned with respect to the main body structure 27. In the present embodiment, the first compensator 42 includes a PID compensator.

In the second control system, the difference between the measured value 301 of the alignment scope 6 and the second target position 61 of the substrate stage 4 is amplified by the second compensator 62 to obtain the first correction amount 362. In the present embodiment, the second compensator 62 includes the PI compensator and determines the first correction amount 362 based on the measured value 301 of the alignment scope 6. Then, the relative displacement between the mold 8 and the substrate 10 is reduced by adding the first correction amount 362 to the first target position 41.

FIG. 2 shows a change in the first correction amount 362 in the step of aligning the mold 8 and the substrate 10 with a broken line. In FIG. 2, the vertical axis represents the first correction amount [nm], and the horizontal axis represents the time [s]. With reference to FIG. 2, immediately after the alignment of the mold 8 and the substrate 10 is started, the mold 8 and the substrate 10 are largely deviated from each other, so that the first correction amount 362 is significantly changed. Then, as the alignment between the mold 8 and the substrate 10 progresses, that is, as the time to start curing the imprint material 14 on the substrate approaches, the change in the first correction amount 362 becomes smaller. However, since the eigenvalue of the mold holding portion 15 and the servo band of the substrate stage 4 are different, when a disturbance such as floor vibration is applied to the imprint device 1, a vibrational relative displacement occurs between the mold 8 and the substrate 10. Occurs. Since the servo band of the second compensator 62 is as low as about several Hz, it is not possible to suppress the high frequency component of the relative displacement between the mold 8 and the substrate 10. Therefore, when a vibrating relative displacement occurs between the mold 8 and the substrate 10, the first correction amount 362 calculated (determined) based on the measured value 301 of the alignment scope 6 also becomes vibrating. When the alignment between the mold 8 and the substrate 10 is completed in such a state and the first correction amount 362 is held at the value at the end of the alignment, the first correction amount is as shown by the broken line in FIG. 362 may be the value at the end of the amplitude of vibration. In this case, a steady relative displacement is generated between the mold 8 and the substrate 10, which causes a decrease in overlay accuracy.

It is also conceivable to add a low-pass filter to the second control system so that the first correction amount 362 does not become oscillating. However, if a low-pass filter is added to the second control system, the phase of the second control system is delayed, so that the servo band must be further lowered. When the servo band is lowered, the time until the first correction amount 362 (positional deviation between the mold 8 and the substrate 10) falls within the permissible range is delayed, so that the throughput of the imprint device 1 is lowered.

Therefore, in the present embodiment, as shown in FIGS. 1A and 1B, the imprint device 1 has a third compensator 63 and a switching unit 25 in the subsequent stage of the second compensator 62. Have. The third compensator 63 is an arithmetic unit that performs an operation related to an output from the second compensator 62, that is, a process for determining a second correction amount 363 based on the first correction amount 362. The switching unit 25 sets the correction amount (correction amount used for determining the operation amount of the stage drive unit 17) to be added to the first target position 41 before the time when the imprint material 14 starts to cure, as the first correction amount 362. To switch to the second correction amount 363.

As shown in FIG. 2, the third compensator 63 makes a first correction output from the second compensator 62 at a time (predetermined period) before a predetermined time before the time at which the imprint material 14 starts to cure. An operation for determining the second correction amount 363 is performed based on the amount 362. As an operation for determining the second correction amount 363, the third compensator 63 is, for example, in a predetermined period of the first correction amount 362 corresponding to the measured value 301 of the alignment scope 6 calculated after the start of alignment. The process of obtaining the average value and standard deviation of the first correction amount 362 is performed. The third compensator 63 is one of the values within the range from the value obtained by adding the standard deviation to the average value of the first correction amount 362 to the value obtained by subtracting the standard deviation from the average value of the first correction amount 362. Is determined as the second correction amount 363. Further, the switching unit 25 switches the correction amount to be added to the first target position 41 from the first correction amount 362 to the second correction amount 363 before a predetermined time of the time when the imprint material 14 starts to be cured. In other words, as shown by the solid line in FIG. 2, the switching unit 25 makes the correction amount to be added to the first target position 41 smaller than the maximum value and smaller than the minimum value of the first correction amount 362 within a predetermined period. Hold it at one of the large values within the range of the mean value ± standard deviation of the first correction amount 362. As a result, the correction amount added to the first target position 41 is suppressed from becoming vibrating, and the correction amount added to the first target position 41 is within the range of the average value ± standard deviation of the first correction amount 362. Can be held at one of the values of. Therefore, it is possible to reduce the occurrence of a steady relative displacement between the mold 8 and the substrate 10 and suppress a decrease in overlay accuracy.

The third compensator 63 is the first of the first correction amount 362 corresponding to the measured value 301 of the alignment scope 6 calculated after the start of alignment as a calculation for determining the second correction amount 363 in a predetermined period. A process of obtaining the average value of the correction amount 362 may be performed. Then, the third compensator 63 determines the average value of the first correction amount 362 as the second correction amount 363. Further, the switching unit 25 switches the correction amount to be added to the first target position 41 from the first correction amount 362 to the second correction amount 363 before a predetermined time of the time when the imprint material 14 starts to be cured. In other words, the switching unit 25 holds the correction amount to be added to the first target position 41 at the average value of the first correction amount 362. As a result, it is possible to suppress the correction amount added to the first target position 41 from becoming vibrating, and to hold the correction amount added to the first target position 41 at the average value of the first correction amount 362. .. Therefore, it is possible to reduce the occurrence of a steady relative displacement between the mold 8 and the substrate 10 and suppress a decrease in overlay accuracy.

The third compensator 63 is the first of the first correction amount 362 corresponding to the measured value 301 of the alignment scope 6 calculated after the start of alignment as a calculation for determining the second correction amount 363 in a predetermined period. The process of obtaining the median value and the standard deviation of the correction amount 362 may be performed. The process of obtaining the median value and standard deviation of the first correction amount 362 corresponding to the measured value 301 of the alignment scope 6 in a predetermined period may be performed. The third compensator 63 is one of the values within the range from the value obtained by adding the standard deviation to the median value of the first correction amount 362 to the value obtained by subtracting the standard deviation from the median value of the first correction amount 362. Is determined as the second correction amount 363. Further, the switching unit 25 switches the correction amount to be added to the first target position 41 from the first correction amount 362 to the second correction amount 363 before a predetermined time of the time when the imprint material 14 starts to be cured. In other words, the switching unit 25 holds the correction amount to be added to the first target position 41 to one of the values within the range of the median value ± standard deviation of the first correction amount 362. As a result, the correction amount added to the first target position 41 is suppressed from becoming vibrating, and the correction amount added to the first target position 41 is within the range of the median ± standard deviation of the first correction amount 362. Can be held at one of the values of. Therefore, it is possible to reduce the occurrence of a steady relative displacement between the mold 8 and the substrate 10 and suppress a decrease in overlay accuracy.

The third compensator 63 is the first of the first correction amount 362 corresponding to the measured value 301 of the alignment scope 6 calculated after the start of alignment as a calculation for determining the second correction amount 363 in a predetermined period. The process of obtaining the median value of the correction amount 362 may be performed. Then, the third compensator 63 determines the median value of the first correction amount 362 as the second correction amount 363. Further, the switching unit 25 switches the correction amount to be added to the first target position 41 from the first correction amount 362 to the second correction amount 363 before a predetermined time of the time when the imprint material 14 starts to be cured. In other words, the switching unit 25 holds the correction amount to be added to the first target position 41 at the median value of the first correction amount 362. As a result, it is possible to suppress the correction amount added to the first target position 41 from becoming vibrating, and to hold the correction amount added to the first target position 41 at the median value of the first correction amount 362. .. Therefore, it is possible to reduce the occurrence of a steady relative displacement between the mold 8 and the substrate 10 and suppress a decrease in overlay accuracy.

Here, in a certain time zone before a predetermined time, which is the time when the imprint material 14 shown in FIG. 2 starts to be cured, that is, in a predetermined period, the relative positional deviation between the mold 8 and the substrate 10 is predetermined. It is a time that falls within the specified allowable range. The predetermined period is set in advance. For example, as shown in FIG. 1A, the timer T is used to measure the elapsed time from the time when the alignment between the mold 8 and the substrate 10 is started. May be good. Further, the predetermined period may be determined based on the measured value 301 of the alignment scope 6 as shown in FIG. 1 (b).

Until now, one of the values (mean value, median value, standard deviation, etc.) obtained by the third compensator 63 statistically processing the first correction amount 362 corresponding to the measured value 301 of the alignment scope 6 in a predetermined period. Was determined as the second correction amount 363. However, the third compensator 63 can be replaced with a low-pass filter. In this case, as shown by the solid line in FIG. 3, one of the values obtained by removing the high frequency component of the first correction amount 362 corresponding to the measured value 301 of the alignment scope 6 in a predetermined period through the low-pass filter. Is determined as the second correction amount 363. Then, the switching unit 25 switches the correction amount to be added to the first target position 41 from the first correction amount 362 to the second correction amount 363 before a predetermined time of the time when the imprint material 14 starts to be cured. In other words, the switching unit 25 holds the correction amount to be added to the first target position 41 to a value obtained by removing the high frequency component from the first correction amount 362 via the low-pass filter. As a result, the correction amount added to the first target position 41 is suppressed from vibrating at a high frequency, and the correction amount added to the first target position 41 is held at a value near the average value of the first correction amount 362. can do. Therefore, it is possible to reduce the occurrence of a steady relative displacement between the mold 8 and the substrate 10 and suppress a decrease in overlay accuracy.

As described above, the second correction amount may be directly determined from the measured value 301 within the predetermined period of the alignment scope 6.
For example, one of the values in the range from the value obtained by adding the standard deviation to the average value of the measured values 301 within the predetermined period of the alignment scope 6 to the value obtained by subtracting the standard deviation from the average value of the first correction amount 362. calculate. Then, the correction amount corresponding to the calculated one value may be set as the second correction amount 363. Also by this, the correction amount corresponding to the value smaller than the maximum value and larger than the minimum value of the measured value 301 can be added to the first target position 41. Therefore, by holding the determined second correction amount 363, it is possible to reduce the occurrence of a steady relative displacement between the mold 8 and the substrate 10 and suppress a decrease in overlay accuracy.

The pattern of the cured product formed by using the imprint device 1 is used permanently for at least a part of various articles or temporarily when producing various articles. The article is an electric circuit element, an optical element, a MEMS, a recording element, a sensor, a mold, or the like. Examples of the electric circuit element include volatile or non-volatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, and semiconductor elements such as LSI, CCD, image sensor, and FPGA. Examples of the mold include a mold for imprinting.

The cured product pattern is used as it is as a constituent member of at least a part of the above-mentioned article, or is temporarily used as a resist mask. The resist mask is removed after etching or ion implantation in the substrate processing process.

Next, a specific manufacturing method of the article will be described. As shown in FIG. 4A, a substrate 10 such as a silicon wafer on which a work material such as an insulator is formed on the surface is prepared, and subsequently, an imprint material is printed on the surface of the work material by an inkjet method or the like. 14 is given. Here, a state in which a plurality of droplet-shaped imprint materials 14 are applied onto the substrate is shown.

As shown in FIG. 4B, the imprint mold 8 is opposed to the imprint material 14 on the substrate with the side on which the uneven pattern is formed facing. As shown in FIG. 4C, the substrate 10 to which the imprint material 14 is applied is brought into contact with the mold 8 to apply pressure. The imprint material 14 is filled in the gap between the mold 8 and the material to be processed. When light is irradiated through the mold 8 as energy for curing in this state, the imprint material 14 is cured.

As shown in FIG. 4D, when the mold 8 and the substrate 10 are separated from each other after the imprint material 14 is cured, a pattern of the cured product of the imprint material 14 is formed on the substrate. The pattern of the cured product has a shape in which the concave portion of the mold 8 corresponds to the convex portion of the cured product and the convex portion of the mold 8 corresponds to the concave portion of the cured product, that is, the uneven pattern of the mold 8 is formed on the imprint material 14. Is transcribed.

As shown in FIG. 4 (e), when etching is performed using the pattern of the cured product as an etching resistant mask, the portion of the surface of the material to be processed that has no cured product or remains thin is removed to form a groove. .. As shown in FIG. 4 (f), when the pattern of the cured product is removed, an article having grooves formed on the surface of the material to be processed can be obtained. Here, the pattern of the cured product is removed, but it may be used as a film for interlayer insulation contained in a semiconductor element or the like, that is, as a constituent member of an article, without being removed even after processing.

Although the preferred embodiments of the present invention have been described above, it goes without saying that the present invention is not limited to these embodiments, and various modifications and modifications can be made within the scope of the gist thereof.

1: Imprint device 4: Board stage 6: Alignment scope 8: Mold 10: Board 17: Stage drive unit CN: Control unit

Claims (14)

An imprinting device that forms a pattern of imprinting material on a substrate using a mold.
A stage that holds the substrate and
A drive unit that moves the stage based on an operation amount determined based on the target position of the stage, and
A measuring unit that measures the relative positional deviation between the mold and the substrate,
A control unit that controls the movement of the stage by giving the operation amount to the drive unit,
Have,
The control unit starts the process of determining the first correction amount of the target position based on the measured value of the measurement unit and the imprint material after contacting the mold with the imprint material. Based on one of the measured values of the measuring unit or the value smaller than the maximum value of the first correction amount corresponding to the measured value and larger than the minimum value in at least a part of the period until The process of determining the second correction amount of the target position is performed, and the correction amount used for determining the operation amount is changed from the first correction amount to the first correction amount before the time when the curing of the imprint material is started. An imprint device characterized by switching to two correction amounts. After switching the correction amount used for determining the operation amount from the first correction amount to the second correction amount, the control unit is based on the second correction amount while the imprint material is cured. The imprinting apparatus according to claim 1, wherein the driving unit is provided with the amount of operation determined. The imprint device according to claim 1 or 2, wherein the control unit determines one of the values obtained by statistically processing the measured values of the measurement unit during the period as the second correction amount. .. The process of determining the second correction amount includes a process of obtaining the average value and standard deviation of the measured values of the measuring unit during the period, and from the value obtained by adding the standard deviation to the average value, the said average value is used. The imprinting apparatus according to claim 3, wherein one of the values within the range up to the value obtained by subtracting the standard deviation is determined as the second correction amount. The third aspect of the present invention is that the process of determining the second correction amount includes a process of obtaining an average value of the measured values of the measuring unit during the period, and the average value is determined as the second correction amount. The imprinting device described. The process of determining the second correction amount includes a process of obtaining the median value and standard deviation of the measured values of the measuring unit during the period, and from the value obtained by adding the standard deviation to the median value, the median value is used as the standard deviation. The imprinting apparatus according to claim 3, wherein one of the values in the range up to the value obtained by subtracting the standard deviation is determined as the second correction amount. The third aspect of the present invention is that the process of determining the second correction amount includes a process of obtaining the median value of the measured value of the measuring unit during the period, and the median value is determined as the second correction amount. The imprinting device described. 1. The process for determining the second correction amount is characterized in that the second correction amount is determined based on the first correction amount determined based on the measurement value of the measurement unit in the period. The imprinting device described in. The imprint device according to any one of claims 1 to 8, wherein the control unit includes an arithmetic unit that performs an operation related to a process for determining the second correction amount. The imprinting apparatus according to any one of claims 1 to 9, wherein the period is a time during which the relative positional deviation between the mold and the substrate falls within a predetermined allowable range. .. The imprinting apparatus according to claim 10, wherein the period is set in advance. The imprint device according to claim 10, wherein the period is determined based on the measured value of the measuring unit. An imprinting device that forms a pattern of imprinting material on a substrate using a mold.
A stage that holds the substrate and
A drive unit that moves the stage based on an operation amount determined based on the target position of the stage, and
A measuring unit that measures the relative positional deviation between the mold and the substrate,
A control unit that controls the movement of the stage by giving the operation amount to the drive unit,
Have,
The control unit
Including low pass filter
The process of determining the first correction amount of the target position based on the measured value of the measuring unit and the curing of the imprint material after bringing the mold and the imprint material into contact with each other via the low-pass filter. A process of determining one of the values obtained by removing the high-frequency component of the measured value of the measuring unit as the second correction amount of the target position during at least a part of the period until the start is performed. An imprinting apparatus characterized in that the correction amount used for determining the operation amount is switched from the first correction amount to the second correction amount before the time when the curing of the imprint material is started. A step of forming a pattern on a substrate by using the imprinting apparatus according to any one of claims 1 to 13.
A step of processing the substrate on which the pattern is formed in the step and a step of processing the substrate.
A method of manufacturing an article, which comprises.

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