JP6818522B2 - Imprint equipment and article manufacturing method - Google Patents

Description

The present invention relates to an imprinting apparatus and a method for manufacturing an article.

For example, an imprint device for forming a fine pattern on the order of several nanometers on a substrate is known. The imprint device forms a pattern by bringing the mold into contact with the imprint material on the substrate. For accurate superposition between the area on the substrate (imprint area or shot area) and the pattern, the imprinting device requires accurate alignment of the area with the mold. Patent Document 1 discloses an imprint device that aligns a mold and a substrate by using an encoder for detecting the position of a stage and an optical system for obtaining a relative position between the mold and the substrate.

Special table 2012-507173

When the natural frequency of the system including the mold and the member supporting it is relatively or relatively high with respect to the frequency band controlled by the board stage by the encoder, the imprint device is subjected to disturbance vibration such as floor vibration. Large relative displacements can occur between the mold and the substrate. Patent Document 1 discloses that the mold and the substrate can be aligned by using an optical system without using an encoder. Performing wideband positioning control of the substrate stage in such alignment can be advantageous in reducing the large relative displacement between the mold and the substrate due to the above-mentioned disturbance vibration. However, the imprint material can exhibit a non-linear property in which the elasticity changes due to a change in the relative position between the contacting mold and the substrate. In the case of exhibiting such characteristics, if the positioning control of the substrate stage in a wide band as described above is performed, the substrate stage (control system) can oscillate due to the non-linearity.

An object of the present invention is, for example, to provide an imprinting apparatus which is advantageous in terms of robustness of alignment between a mold and a substrate.

One aspect of the present invention is an imprinting apparatus that forms a pattern on the substrate by contacting a mold with the imprinting material on the substrate.
A holding portion that holds one of the substrate and the mold,
A drive unit that moves the holding unit and
The first measuring unit that measures the position of the holding unit and
A second measuring unit that measures the amount of misalignment between the substrate and the mold,
Has a control system including
The control system includes the first control that controls the drive unit based on the output of the first measurement unit and the first target value during the first period in which the displacement amount exceeds the threshold value during the contact. The second control for controlling the offset value to be added to the first target value based on the output of the second measurement unit and the second target value is performed, and the misalignment amount is equal to or less than the threshold value during the contact. In the second period, instead of performing the first control and the second control, a third control for controlling the drive unit is performed based on the output of the second measurement unit and the second target value. It is an imprinting apparatus characterized by being configured as described above.

According to the present invention, for example, it is possible to provide an imprinting apparatus which is advantageous in terms of robustness of alignment between a mold and a substrate.

The figure which shows the structural example of the imprint apparatus which concerns on Embodiment 1. The figure which shows the modification of the imprint apparatus which concerns on Embodiment 1. The figure which shows the structural example of the imprint apparatus which concerns on Embodiment 2. The figure which shows the modification of the imprint apparatus which concerns on Embodiment 2. The figure which illustrates the embodiment which concerns on the article manufacturing method.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In principle (unless otherwise noted), the same members and the like are designated by the same reference numerals throughout the drawings for explaining the embodiments, and the repeated description thereof will be omitted.

[Embodiment 1]
The imprint device 1a according to the present embodiment will be described. FIG. 1 is a diagram showing a configuration example of an imprint device according to the first embodiment. The imprint device 1a is a device used for manufacturing a semiconductor device or the like as an article, and forms an imprint material 14 on a substrate 10 with a mold 8 (mold) to form a pattern on the substrate 10. Here, the imprint material 14 is a photocurable resin (ultraviolet curable resin, etc.), and an imprint device to which a photocuring method (ultraviolet curable method, etc.) is applied will be described. Not limited. It is assumed that the Z axis is taken parallel to the optical axis 7 of the irradiation unit 2 that irradiates the imprint material with light, and the X axis and the Y axis that are orthogonal to each other are taken in a plane perpendicular to the Z axis. The imprint device 1a includes a main body structure 27, a light irradiation unit 2, a mold stage 15 (holding unit or mold holding unit), a substrate stage 4 (board holding unit), a supply unit 5 (dispenser), and a scope. 6 (second measuring unit) may be included. The main body structure 27 is supported by the floor 100 (or pedestal) via the mount 29. Here, the holding portion is intended to hold the mold, but may hold one of the mold and the substrate. A configuration example of the control system (configuration example for solving the problem) including the holding portion (board holding portion) for holding the substrate will be described in the second embodiment.

The light irradiation unit 2 irradiates the imprint material 14 with light 9 (ultraviolet rays or the like) via the mold 8. The light irradiation unit 2 includes a light source and an optical element for irradiating the imprint material 14 with light 9 from the light source. The outer shape of the mold 8 may be rectangular. The mold 8 includes a pattern portion 8a (mesa portion) having a pattern corresponding to a pattern to be formed on the substrate, such as a pattern for forming a circuit, on a surface facing the substrate 10. The mold 8 is made of a material capable of transmitting light 9, and may be quartz, for example. Since the mold 8 deforms the pattern portion 8a convexly toward the substrate 10 as described later, the mold 8 may have a shape in which a cavity (recess) is formed on the opposite side of the substrate 10.

The mold stage 15 has a mold chuck 11 for holding the mold 8 and is supported by the main body structure 27 via a mold drive unit 12. The mold drive unit 12 can move the mold 8 together with the mold chuck 11. The mold driving unit 12a is configured so that the mold 8 can be selectively brought into contact with the imprint material 14 on the substrate 10 (mold release) or the mold 8 is separated from the imprint material 14 (mold release). Therefore, the mold driving unit 12a can, for example, move the mold 8 in the Z-axis direction, move in the θx-axis direction (rotation around the X-axis), and move in the θy-axis direction (rotation around the Y-axis). The actuator that can be used in the mold drive unit 12a is, for example, a linear motor or an air cylinder. Further, the mold driving unit 12b moves the mold chuck 11 in, for example, the X-axis direction, the Y-axis direction, and the θz-axis direction (around the Z-axis) in order to align the mold 8 with the substrate 10. sell. The actuator that can be used in the mold drive unit 12b is, for example, a linear motor or a voice coil motor. The configuration of the mold drive unit 12b will be described later. The mold chuck 11 holds the mold 8 by attracting a region along the outer circumference of the mold 8 by, for example, a vacuum suction force or an electrostatic force. When the mold chuck 11 holds the mold 8 by a vacuum suction force, the mold chuck 11 is connected to a vacuum pump (not shown), and the mold 8 is attached / detached (attached / detached) by turning on / off the vacuum suction force by the vacuum pump. ) Can be switched. Further, the mold chuck 11 is formed with an opening region 13 so that the imprint material 14 on the substrate 10 can be irradiated with the light 9 from the light irradiation unit 2. In the opening region 13, a light transmitting member (for example, a glass plate) for sealing a space surrounded by at least a part of the opening region 13 and the mold 8 is installed, and the pressure in the space is determined by a vacuum pump or the like. It can be adjusted by a pressure adjusting unit (not shown) including. The pressure adjusting unit may, for example, make contact between the mold 8 and the imprint material 14 on the substrate 10 in a state where the pressure in the space is higher than the pressure outside the mold 8. That is, the mold 8 can be brought into contact with the imprint material 14 from the central portion of the pattern portion 8a in a state where the pattern portion 8a is bent toward the substrate 10 in a convex shape. Then, the mold 8 can be brought into contact with the imprint material 14 gradually from the central portion of the pattern portion 8a toward the peripheral portion. Therefore, the gas in the atmosphere is less likely to remain between the pattern portion 8a and the imprint material 14, which may be advantageous for filling the imprint material 14 between the pattern portion 8a and the substrate.

The substrate 10 may be, for example, a single crystal silicon substrate or an SOI (Silicon on Insulator) substrate. An imprint material 14 for forming a pattern is supplied (dispensed) to the surface of the substrate 10 by the pattern portion 8a of the mold 8. The substrate stage 4 holds the substrate 10 and for alignment (alignment) between the mold 8 and the substrate 10 during contact (during stamping) between the mold 8 and the imprint material 14 on the substrate 10. The movement of is controlled. The substrate stage 4 includes a substrate chuck 16 that attracts and holds the substrate 10 by, for example, a vacuum attraction force or an electrostatic force, and holds the substrate chuck 16. The board stage drive unit 17 can move the board stage 4 in the X-axis direction, the Y-axis direction, and the θz-axis direction (around the Z-axis). The actuator that can be used in the substrate stage drive unit 17 is, for example, a linear motor or a flat motor.

The scope 6 measures the amount of misalignment between the alignment mark formed on the mold 8 (pattern portion 8a or the like) and the alignment mark formed on the substrate (shot region or imprint region). That is, the scope 6 constitutes a measuring unit (second measuring unit) for measuring the amount of misalignment between the mold 8 and the substrate in the X-axis and Y-axis directions.

The supply unit 5 is installed in the vicinity of the mold stage 15 and supplies or dispenses the imprint material 14 on (the shot area or the imprint area) of the substrate 10. Here, the imprint material 14 can be appropriately selected depending on various processing conditions (for example, etching conditions) in the semiconductor device manufacturing process. Further, the amount or distribution of the imprint material 14 supplied (discharged) from the nozzle 5a of the supply unit 5 onto the substrate 10 (shot region or imprint region) is a characteristic of the pattern to be formed on the substrate 10. For example, it can be appropriately set depending on the residual film thickness or density).

Here, the control system of the mold stage 15 including the mold drive unit 12b will be described. The control system of the mold stage 15 is configured to be switched between the first control and the second control and the third control, which will be described later, according to the amount of misalignment between the mold 8 and the substrate 10. The first control is a signal obtained by amplifying the difference between the output signal 201a (position of the mold stage 15) of the mold stage sensor 20 (first measuring unit) and the first target value 21a with the first compensator 22a. 202a (operation amount) is defined as the operation amount 205a of the mold drive unit 12b. As a result, the mold stage 15 can be positioned with respect to the main body structure 27. The first compensator 22a may be, for example, a PI compensator (including a PID compensator) for PI control (including PID control). In the second control, the difference between the output signal 301 (the amount of misalignment between the mold 8 and the substrate 10) of the scope 6 (second measuring unit) and the second target value 61 is set as the second compensator 62a. The signal 302a (offset value) obtained by amplification in is added to the first target value 21a. Thereby, the misalignment between the mold 8 and the substrate 20 can be reduced. The second compensator 62a can be, for example, a PI compensator for PI control. The first control and the second control constitute a so-called cascade control in which the first control is a minor loop and the second control is a major loop.

Then, in the third control, the difference between the output signal 301 of the scope 6 and the second target value 61 is amplified by the third compensator 63a, and the obtained signal 303a (operation amount) is operated by the mold drive unit 12b. The amount is 205a. As a result, the mold 8 can be directly positioned with respect to the substrate 10. The third compensator 63a can be, for example, a PI compensator for PI control.

Here, a control system (second control system) for positioning the substrate stage 4 will be described. The control system includes a substrate stage 4, a substrate stage sensor 18, a fourth compensator 42a, a substrate stage drive unit 17a, and a fourth target value 41a. As a result, the substrate stage 4 can be positioned with respect to the main body structure 27. The fourth compensator 42a obtains an operation amount 102a to the substrate stage drive unit 17 based on the signal 101a (position of the substrate stage 4) of the substrate stage sensor 18. The fourth compensator 42a can be, for example, a PID compensator for PID control. In the present embodiment, the servo band (control frequency band) of the control system of the mold stage 15 includes a frequency higher than the servo band of the control system of the substrate stage 4.

Since the cascade control (first control and second control) related to the mold stage 15 has the first control as a minor loop, it is not easily affected by the non-linear characteristics of the imprint material 14 described above, and the mold 8 and the substrate 10 There is an advantage that the alignment between the two can be performed stably. However, the first control has a disadvantage when a disturbance vibration such as a floor vibration is transmitted to the imprint device. That is, when the frequency band of the first control is relatively or relatively high (including higher frequencies) with respect to the frequency band of the substrate stage control (second control system) by the encoder, disturbance vibration such as floor vibration Can cause large relative displacements between the mold and the substrate.

On the other hand, in the third control related to the mold stage 15, since the mold 8 is directly positioned with respect to the substrate 10, the relative displacement due to the above-mentioned disturbance vibration can be reduced by controlling in a relatively high servo band. There is. However, unlike the case of cascade control, since there is no minor loop (first control), it is easily affected by the non-linear characteristics of the imprint material 14. Therefore, under the influence, the control system tends to oscillate, which is disadvantageous.

Therefore, the present embodiment has a switching means 25 for switching between the two controls (modes) in order to utilize the advantages of the first control and the second control and the advantages of the third control. .. Then, during the period in which the mold and the imprint material before the start of curing are in contact (during contact or the contact period before the start of curing), the amount of misalignment between the mold and the substrate is a threshold value (a predetermined small amount). During the first period (first period) that exceeds (can exceed) the first control and the second control are performed. This makes it possible to stably align the mold and the substrate even under the influence of the non-linear characteristics of the imprint material. Then, during the period (second period) after the amount of misalignment between the mold and the substrate becomes equal to or less than the threshold value, the third control is performed instead of the first control and the second control. The mold can be positioned with high accuracy with respect to the substrate even under the influence of disturbance vibration. The first period and the second period are periods before the start of curing of the imprint material. Then, the characteristics (elasticity, etc.) of the imprint material 14 may exhibit non-linearity that changes depending on the amount of misalignment between the mold 8 and the substrate 10, but after the amount of misalignment becomes equal to or less than the threshold value. Since the third control is performed, oscillation of the control system is unlikely to occur. Here, the switching of control from the first control and the second control (cascade control) to the third control can be based on the elapsed time from the start of alignment. In FIG. 1, the switching means 25 is configured to switch the control as described above based on the elapsed time obtained by the timing of the timer 27. As for the timing of the switching, for example, a threshold value of the elapsed time such that the amount of misalignment between the mold and the substrate is 50 nm or less, more preferably 10 nm or less is obtained in advance by an experiment or the like, and the comparator included in the switching means 25 (includes). Etc.). The switching means 25 may include a setting unit for that purpose. Here, the present embodiment relates to the three controls described above in the contact period before the start of curing, that is, only cascade control (first control and second control), only third control, and switching between them. The table below summarizes the superiority and inferiority of control. ◯ indicates that it is relatively more advantageous than Δ for each item of resistance to non-linearity and resistance to disturbance. This table simply shows that the control according to this embodiment is advantageous in terms of robustness of alignment between the mold and the substrate.

When switching the control, the control system can oscillate when the operation amount 205a to the mold drive unit 12b changes stepwise from zero. Therefore, when switching the control, it is preferable to hold the manipulated variable 202a immediately before that and start the third control with the held manipulated variable 202a as the initial value.

Light 9 is irradiated on the condition that the alignment state by the third control is within the permissible range, and the imprint material 14 is cured. Then, the mold 8 is separated (released) from the pattern obtained by curing. As the imprint material 14 is cured, the optical characteristics of the imprint material 14 may change, making it impossible to perform alignment measurement with the scope 6, or making alignment itself impossible. Therefore, it is preferable to hold the operation amount 205a at a predetermined value from an appropriate time point after the start of curing of the imprint material 14.

Here, FIG. 2 is a diagram showing a modified example of the imprinting apparatus according to the first embodiment. In the configuration example of FIG. 1, the switching means 25 is configured to switch the control based on the elapsed time from the start of the alignment obtained by the timing of the timer 27. In this modification, the switching means 25 is configured to switch the control based on the output signal 301 of the scope 6. That is, the timing of the switching (the timing of switching from the first period to the second period) is, for example, the timing when the output signal 301 (the amount of misalignment between the mold and the substrate) is 50 nm or less, more preferably 10 nm or less. It can be. For that purpose, a predetermined threshold value for the amount of misalignment may be set in the switching means 25 (comparator or the like included in the switching means 25). The switching means 25 may include a setting unit for that purpose.

As understood from the above description, the present embodiment can provide, for example, an imprinting apparatus that is advantageous in terms of robustness of alignment between the mold and the substrate.

[Embodiment 2]
The imprint device 1b according to the second embodiment will be described. FIG. 2 is a diagram showing a configuration example of the imprint device according to the second embodiment. In the first embodiment, the mold stage 15 is movable in the X-axis direction, the Y-axis direction, and the θz-axis direction (around the Z-axis) and has an alignment function. Instead, in the present embodiment, the substrate is used. Stage 4 is responsible for that function. In the present embodiment, the substrate stage 4 includes a fine movement stage 50 and a coarse movement stage 53. The coarse movement stage 53 mounts the fine movement stage 50 and is used for the function of coarse (coarse) alignment between the mold 8 and the substrate 10. Therefore, it has a coarse movement stage drive unit 55 that moves the coarse movement stage 53 in the X-axis direction and the Y-axis direction, and a coarse movement stage sensor 54 that measures the position of the coarse movement stage 53 with respect to the main body structure 27. .. The actuator that can be used in the coarse movement stage drive unit 55 is, for example, a linear motor or a flat motor. The coarse movement stage 53 is positioned with respect to the main body structure 27 by a control system including a coarse movement stage sensor 54, a fourth compensator 42b, a coarse movement stage drive unit 55, and a fourth target value 41b. The fourth compensator 42b can be, for example, a PID compensator for PID control. The fine movement stage 50 is used for the function of fine (fine) alignment between the mold 8 and the substrate 10. Therefore, it has a fine movement stage drive unit 52 that positions the fine movement stage 50 with respect to the coarse movement stage 53, and a fine movement stage sensor 51 (constituting the first measurement unit) that measures the position of the fine movement stage 53 with respect to the main body structure 27. doing. The actuator that can be used in the fine movement stage drive unit 52 is, for example, a linear motor or a flat motor.

Here, the control system of the fine movement stage 50 including the fine movement stage drive unit 52 will be described. Similar to the control system of the mold stage 15 in the first embodiment, the control system of the fine movement stage 50 has the first control, the second control, and the third control described later according to the amount of misalignment between the mold 8 and the substrate 10. It is configured to switch between control and control. The first control is a signal obtained by amplifying the difference between the output signal 201b (position of the fine movement stage 15) of the fine movement stage sensor 51 (first measurement unit) and the first target value 21b with the first compensator 22b. 202b (operation amount) is the operation amount 205b of the fine movement stage drive unit 52. As a result, the fine movement stage 15 can be positioned with respect to the main body structure 27 (coarse movement stage 53). The first compensator 22b can be, for example, a PI compensator (including a PID compensator) for PI control (including PID control). As described above, the configuration of the control system of the coarse motion stage 53 including the coarse motion stage drive unit 55 can be the same as the configuration of the control system of the substrate stage 4 including the substrate stage drive unit 17 in the first embodiment. The control band (servo band) of the control system including the fine movement stage 50 includes a higher frequency than that of the control system including the coarse movement stage 53.

In the second control, the difference between the output signal 301 (the amount of misalignment between the mold 8 and the substrate 10) of the scope 6 (second measuring unit) and the second target value 61 is amplified by the second compensator 62b. The signal 302b (offset value) thus obtained is added to the first target value 21b. Thereby, the misalignment between the mold 8 and the substrate 20 can be reduced. The second compensator 62b can be, for example, a PI compensator for PI control. The first control and the second control constitute a so-called cascade control in which the first control is a minor loop and the second control is a major loop.

Then, in the third control, the signal 303b (operation amount) obtained by amplifying the difference between the output signal 301 of the scope 6 and the second target value 61 with the third compensator 63b is used by the fine movement stage drive unit 52. The operation amount is 205b. As a result, the substrate 10 can be directly positioned with respect to the mold 8. The third compensator 63b can be, for example, a PI compensator for PI control.

Since the cascade control (first control and second control) related to the fine movement stage 50 has the first control as a minor loop, it is not easily affected by the non-linear characteristics of the imprint material 14 described above, and the mold 8 and the substrate 10 There is an advantage that the alignment between the two can be performed stably. However, the first control has a disadvantage when a disturbance vibration such as a floor vibration is transmitted to the imprint device. That is, the natural frequency of the system including the mold and the mold holder is relatively or relatively high with respect to the frequency band of the fine movement stage control (first control) by the fine movement stage sensor (the upper limit of the frequency band). If it exceeds the frequency), a large relative displacement can occur between the mold and the substrate.

On the other hand, in the third control related to the fine movement stage 50, since the substrate 10 is directly positioned with respect to the mold 8, the relative displacement due to the above-mentioned disturbance vibration can be reduced by controlling in a relatively high servo band. There is. However, unlike the case of cascade control, since there is no minor loop (first control), it is easily affected by the non-linear characteristics of the imprint material 14. Therefore, under the influence, the control system tends to oscillate, which is disadvantageous.

Therefore, the present embodiment has a switching means 25 for switching between the two controls (modes) in order to utilize the advantages of the first control and the second control and the advantages of the third control. .. Then, during the period in which the mold and the imprint material before the start of curing are in contact (during contact or the contact period before the start of curing), the amount of misalignment between the mold and the substrate is a threshold value (a predetermined small amount). During the first period (first period) that exceeds (can exceed) the first control and the second control are performed. This makes it possible to stably align the mold and the substrate even under the influence of the non-linear characteristics of the imprint material. Then, during the period (second period) after the amount of misalignment between the mold and the substrate becomes equal to or less than the threshold value, the third control is performed instead of the first control and the second control. The mold can be positioned with high accuracy with respect to the substrate even under the influence of disturbance vibration. The first period and the second period are periods before the start of curing of the imprint material. Then, the characteristics (elasticity, etc.) of the imprint material 14 may exhibit non-linearity that changes depending on the amount of misalignment between the mold 8 and the substrate 10, but after the amount of misalignment becomes equal to or less than the threshold value. Since the third control is performed, oscillation of the control system is unlikely to occur. Here, the switching of control from the first control and the second control (cascade control) to the third control can be based on the elapsed time from the start of alignment. In FIG. 3, the switching means 25 is configured to switch the control as described above based on the elapsed time obtained by the timing of the timer 27. As for the timing of the switching, for example, a threshold value of the elapsed time such that the amount of misalignment between the mold and the substrate is 50 nm or less, more preferably 10 nm or less is obtained in advance by an experiment or the like, and the comparator included in the switching means 25 (includes). Etc.). The switching means 25 may include a setting unit for that purpose. Here, the present embodiment relates to the three controls described above in the contact period before the start of curing, that is, only cascade control (first control and second control), only third control, and switching between them. The table below summarizes the superiority and inferiority of control. ◯ indicates that it is relatively more advantageous than Δ for each item of resistance to non-linearity and resistance to disturbance. This table simply shows that the control according to this embodiment is advantageous in terms of robustness of alignment between the mold and the substrate.

When switching the control, the control system can oscillate when the operation amount 205b to the fine movement stage drive unit 52 changes stepwise from zero. Therefore, when switching the control, it is preferable to hold the manipulated variable 202b immediately before that and start the third control with the held manipulated variable 202b as the initial value.

Light 9 is irradiated on the condition that the alignment state by the third control is within the permissible range, and the imprint material 14 is cured. Then, the mold 8 is separated (released) from the pattern obtained by curing. As the imprint material 14 is cured, the optical characteristics of the imprint material 14 may change, making it impossible to perform alignment measurement with the scope 6, or making alignment itself impossible. Therefore, it is preferable to hold the operation amount 205b at a predetermined value from an appropriate time point after the start of curing of the imprint material 14.

Here, FIG. 4 is a diagram showing a modified example of the imprinting apparatus according to the second embodiment. In the configuration example of FIG. 3, the switching means 25 is configured to switch the control based on the elapsed time from the start of the alignment obtained by the timing of the timer 27. In this modification, the switching means 25 is configured to switch the control based on the output signal 301 of the scope 6. That is, the timing of the switching (the timing of switching from the first period to the second period) is, for example, the timing when the output signal 301 (the amount of misalignment between the mold and the substrate) is 50 nm or less, more preferably 10 nm or less. It can be. For that purpose, a predetermined threshold value for the amount of misalignment may be set in the switching means 25 (comparator or the like included in the switching means 25). The switching means 25 may include a setting unit for that purpose.

As understood from the above description, the present embodiment can provide, for example, an imprinting apparatus that is advantageous in terms of robustness of alignment between the mold and the substrate.

[Embodiment of Article Manufacturing Method]
The pattern of the cured product formed by using the imprint device 1 (1a, 1b) is used permanently for at least a part of various articles or temporarily when manufacturing various articles. The article is an electric circuit element, an optical element, a MEMS, a recording element, a sensor, a mold, or the like. Examples of the electric circuit element include volatile or non-volatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, and semiconductor elements such as LSI, CCD, image sensor, and FPGA. Examples of the mold include a mold for imprinting.

The cured product pattern is used as it is as a constituent member of at least a part of the above-mentioned article, or is temporarily used as a resist mask. The resist mask is removed after a process such as etching or ion implantation is performed in the process of processing the substrate.

Next, a specific manufacturing method of the article will be described. Here, FIG. 5 is a diagram illustrating an embodiment related to an article manufacturing method. As shown in FIG. 5A, a substrate 10 such as a silicon wafer on which a material to be processed such as an insulator is formed on the surface is prepared, and subsequently, an imprint material is applied to the surface of the material to be processed by an inkjet method or the like. Is given. Here, a state in which a plurality of droplet-shaped imprint materials are applied onto the substrate is shown.

As shown in FIG. 5B, the imprint mold 8 is opposed to the imprint material on the substrate with the side on which the uneven pattern is formed facing the imprint material. As shown in FIG. 5C, the substrate 10 to which the imprint material is applied is brought into contact with the mold 8 to apply pressure. The imprint material is filled in the gap between the mold 8 and the material to be processed. In this state, when light is irradiated through the mold 8 as energy for curing, the imprint material is cured.

As shown in FIG. 5D, when the mold 8 and the substrate 10 are separated from each other after the imprint material is cured, a pattern of the cured product of the imprint material is formed on the substrate. The pattern of the cured product has a shape in which the concave portion of the mold 8 corresponds to the convex portion of the cured product and the convex portion of the mold 8 corresponds to the concave portion of the cured product, that is, the cured product of the imprint material is formed by the mold 8. This means that the uneven pattern has been transferred.

As shown in FIG. 5 (e), when the etching process is performed using the cured product pattern as an etching resistant mask, the portion of the surface of the material to be processed that has no cured product or remains thin is removed and a groove is formed. It becomes. It is also preferable to remove the remaining portion in advance by an etching treatment different from the etching treatment. As shown in FIG. 5 (f), when the pattern of the cured product is removed, an article having grooves formed on the surface of the material to be processed can be obtained. Here, the pattern of the cured product is removed, but it may be used as a film for interlayer insulation contained in a semiconductor element or the like, that is, as a constituent member of an article, without being removed even after processing.

Although the preferred embodiments of the present invention have been described above, it goes without saying that the present invention is not limited to these embodiments, and various modifications and modifications can be made within the scope of the gist thereof.

1a Imprint device 6 2nd measurement unit 12b Drive unit (for mold holder)
15 (Mold) holding part 20 1st measuring part (for mold holding part)

Claims (12)

An imprinting apparatus that forms a pattern on the substrate by contacting a mold with the imprint material on the substrate.
A holding portion that holds one of the substrate and the mold,
A drive unit that moves the holding unit and
The first measuring unit that measures the position of the holding unit and
A second measuring unit that measures the amount of misalignment between the substrate and the mold,
Has a control system including
The control system includes the first control that controls the drive unit based on the output of the first measurement unit and the first target value during the first period in which the displacement amount exceeds the threshold value during the contact. The second control for controlling the offset value to be added to the first target value based on the output of the second measurement unit and the second target value is performed, and the misalignment amount is equal to or less than the threshold value during the contact. In the second period, instead of performing the first control and the second control, a third control for controlling the drive unit is performed based on the output of the second measurement unit and the second target value. An imprinting device characterized in that it is configured in such a manner. The imprint device according to claim 1, wherein the control system switches from the first period to the second period based on the output of the second measurement unit. The imprint device according to claim 1 or 2, further comprising a setting unit for setting the threshold value. The imprint device according to claim 1, wherein the control system is set to the first period for a predetermined time and then to the second period. The imprint device according to any one of claims 1 to 4, wherein the first control includes PI control. One of claims 1 to 5, wherein the switching from the first period to the second period is performed while maintaining the amount of operation on the drive unit in the first period. The imprinting device described in. The holding part holds the mold and
A second holding unit that holds the substrate, a second driving unit that moves the second holding unit, and a third measuring unit that measures the position of the second holding unit, which are different from the holding unit, are included. It has a second control system that controls the second drive unit based on the output of the third measurement unit.
The imprinting apparatus according to any one of claims 1 to 6, wherein the imprinting apparatus is characterized. The imprint device according to claim 7, wherein the frequency band of the first control includes a frequency higher than the frequency band of the control of the second control system. The holding portion holds the substrate and holds the substrate.
It has a second holding part that holds the mold, which is different from the holding part.
The imprinting apparatus according to any one of claims 1 to 6, wherein the imprinting apparatus is characterized. The imprint device according to claim 9, wherein the natural frequency of the system including the second holding portion and the mold exceeds the upper limit frequency of the frequency band of the first control. The imprinting apparatus according to any one of claims 1 to 10, wherein the first period and the second period are periods before the start of curing of the imprint material. A step of forming a pattern on a substrate by using the imprinting apparatus according to any one of claims 1 to 11.
A step of processing the substrate on which the pattern is formed in the step and a step of processing the substrate.
A method for manufacturing an article, which comprises.