JP6799988B2 - Sticking device - Google Patents

Description

The present invention relates to a pasting device.

With the increasing functionality of mobile phones, digital AV equipment, IC cards, etc., the semiconductor elements (electronic components) to be mounted have been made smaller and thinner, so that the semiconductor elements are highly integrated in the semiconductor package (semiconductor device). The demand to do is increasing.

Here, as a semiconductor package including a semiconductor element, WLP (Wafer Level Package) and the like are known. For semiconductor packages such as WLP and PLP (Panel Level Package), fan-in type technology such as fan-in type WLP (Fan-in Wafer Level Package) that rearranges the terminals at the ends of bare chips in the chip area , Fan-out type technology such as fan-out type WLP (Fan-out Wafer Level Package) that rearranges terminals outside the chip area is known. In particular, the fan-out type technology is applied to the fan-out type PLP (Fan-out Panel Level Package) in which semiconductor elements are arranged and packaged on a panel, and the semiconductor package is integrated, thinned, and miniaturized. Fan-out technologies such as these are attracting attention in order to realize this.

In Patent Document 1, a sticking device for sticking a substrate and a support via an adhesive layer, and manufacturing a laminate obtained by laminating the substrate, the adhesive layer, and the support in this order. A pair of plate members that sandwich the laminated body and a support member that supports the plate members are provided, and the support members that support at least one of the plate members are equidistantly spaced on the plate member. A pasting device characterized in that it is located in a plurality of dots or lines adjacent to the is described.

Japanese Unexamined Patent Publication No. 2014-220389 (published on November 20, 2014)

Although the sticking device described in Patent Document 1 can stick a circular substrate and a substrate to a uniform thickness, it is difficult to stick a rectangular substrate and a support to a uniform thickness. Further, the method of semiconductor packaging has become more sophisticated, and a new attachment device capable of attaching a rectangular substrate and a support to a uniform thickness is useful.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a sticking device capable of uniformly sticking a rectangular support and a substrate.

In order to solve the above problems, the sticking device according to the present invention is a sticking device for sticking a substrate and a support that supports the substrate, and is a pair of plates that sandwich the substrate and the support. A member, a plurality of support members that support one of the pair of plate members, and a pressing portion that presses the other plate member of the pair of plate members toward the one plate member. , A pressing force detecting unit for detecting the pressing force applied to the other plate member by the pressing unit is provided between the pressing unit and the other plate member, and each of the pair of plate members is provided with a pressing force detecting unit. Each of the plurality of support members has a rectangular flat surface portion, and each of the plurality of support members has N ² pieces (here, N) which are similar to the rectangular shape in an area occupying the entire flat surface portion of the one plate member. Is an integer of 2 or more). Each of the divided support areas, which is equally divided into the divided support areas, is arranged so as to individually support from the back surface side of the flat surface portion of one of the above plate members. It is characterized by.

According to the present invention, there is an effect that it is possible to provide a new sticking device capable of uniformly sticking a rectangular support and a substrate.

It is a figure which shows the schematic structure of the sticking apparatus 100 which concerns on one Embodiment (first Embodiment) of this invention. It is a figure explaining the arrangement of the load cell 15 and the support member 10 in the sticking apparatus 100 which concerns on one Embodiment (first Embodiment) of this invention. It is a figure explaining the arrangement of the lower plate member 1a, the holding part 16, the driving part 17, the position sensor 18, and the decompression chamber 50 in the sticking apparatus 100 which concerns on one Embodiment (1st Embodiment) of this invention. It is a figure explaining the operation of the sticking apparatus 100 which concerns on one Embodiment (first Embodiment) of this invention. It is a figure explaining the operation of the sticking apparatus 100 which concerns on one Embodiment (first Embodiment) of this invention. It is a figure explaining the operation of the sticking apparatus 100 which concerns on one Embodiment (first Embodiment) of this invention. It is a figure explaining the operation of the sticking apparatus 100 which concerns on one Embodiment (first Embodiment) of this invention. It is a figure explaining the operation of the sticking apparatus 100 which concerns on one Embodiment (first Embodiment) of this invention. It is a figure explaining the operation of the sticking apparatus 100 which concerns on one Embodiment (first Embodiment) of this invention. It is a figure explaining the operation of the sticking apparatus 100 which concerns on one Embodiment (first Embodiment) of this invention. It is a figure explaining the operation of the sticking apparatus 100 which concerns on one Embodiment (first Embodiment) of this invention. It is a figure which shows the schematic structure of the sticking apparatus 101 which concerns on another embodiment (second embodiment) of this invention. It is a figure explaining the arrangement of the load cell 15'and the support member 10 in the sticking apparatus 101 which concerns on another embodiment (second embodiment) of this invention. It is a figure which shows the schematic structure of the sticking apparatus 102 which concerns on still another embodiment (third embodiment) of this invention. It is a figure explaining the outline of the substrate 30 to be processed and the support panel 40 to which the sticking apparatus which concerns on each embodiment of this invention sticks.

<Attachment device 100>
The sticking apparatus 100 according to one embodiment (first embodiment) of the present invention will be described in detail with reference to FIGS.

FIG. 1 is a diagram showing a schematic configuration of a sticking device 100 according to the present embodiment. FIG. 2 is a diagram illustrating an arrangement of a load cell 15 ((a) in FIG. 2) and an arrangement of a support member 10 ((b) in FIG. 2) in the attachment device 100 according to the present embodiment.

FIG. 3 is a diagram illustrating the arrangement of the lower plate member 1a, the holding portion 16, the position sensor 18, and the decompression chamber 50 in the sticking device 100 according to the embodiment of the present invention.

As shown in FIG. 1, the sticking device 100 according to the present embodiment includes a pair of plate members 1, and the pair of plate members 1 includes a lower plate member 1a and an upper plate member 1b. .. Here, the divided support area 12 formed by equally dividing the area of the lower plate member 1a that occupies the entire surface of the substrate 30 to be processed and the flat surface portion 11a that supports the support panel 40 is divided into the lower plate member 1a. It is supported by a plurality of support members 10 from the back surface side.

As a result, when the pressing force is applied by the upper plate member 1b, the sticking device 100 can uniformly receive the pressing force by the lower plate member 1a. Here, the flat surface portion 11a of the lower plate member 1a and the flat surface portion 11b of the upper plate member 1b are rectangular. Therefore, the affixing device 100 can uniformly apply a pressing force to the entire surface including the corners of the rectangle in the rectangular substrate 30 to be processed and the rectangular support panel 40. Therefore, the sticking device 100 can form a rectangular laminated body having a uniform thickness. That is, the sticking device 100 is a device capable of suitably sticking a substrate and a support in PLP (Panel Level Package) technology, which typically forms a panel-type laminate to process a substrate. ..

The plate member 1, the support member 10, the servomotor 13, the load cell 15, the holding portion 16, and the position sensor 18 included in the sticking device 100 will be described in more detail below.

[Plate member 1]
As shown in FIG. 1, the plate member 1 is a member for attaching the substrate 30 to be processed and the panel (support) 40. Each of the plate members 1 is composed of a lower plate member (one plate member) 1a and an upper plate member (the other plate member) 1b arranged in the vertical direction. Further, each of the plate members 1 is attached with the substrate 30 to be processed and the support panel 40 so as to be sandwiched between the flat surface portion 11a of the lower plate member 1a and the flat surface portion 11b of the upper plate member 1b. The laminated body 60 is formed (FIG. 11).

[Lower plate member 1a]
The lower plate member 1a is a plate member on which the substrate 30 to be processed and the support panel 40 are placed, and is supported by a plurality of support members 10. The lower plate member 1a has a configuration including a mounting plate 2, a lower intermediate plate 3, and a lower support plate 4.

The flat surface portion 11a of the lower plate member 1a preferably has a similar shape to the substrate to be processed 30 and the support panel 40 to be attached, and has the same area as the substrate to be processed 30 and the support panel 40. Alternatively, it has a larger area than the substrate 30 to be processed and the support panel 40. More specifically, when the area of the flat surface portion 11a is larger than the area of the substrate 30 to be processed and the support panel 40, the outer peripheral end portion of the substrate 30 to be processed and the support panel 40 is larger than the outer peripheral end portion of the flat surface portion 11a. It is more preferable that all of the plurality of support members 10 are arranged inside and are arranged on the inner peripheral portion of the substrate 30 to be processed and the support panel 40.

As shown in FIG. 2B, the region occupying the entire surface of the flat surface portion 11a is composed of the divided support regions 12 that divide the region into 16 equal parts, and each of the divided support regions 12 is a flat surface portion. It is a similar figure to the shape of 11a. In addition, in FIG. 2B, each region which divides the in-plane of the plane portion 11a by the alternate long and short dash line is the split support region 12, and only one of the split support regions 12 is designated by a reference numeral. The reference numerals are omitted for the divided support region 12 of the above. Further, as shown in FIG. 2 (b), the support member 10 is described by a broken line in the divided support region 12, and only one of the support members 10 is designated by a reference numeral, and the other support members 10 are designated. Reference numerals are omitted for the support member 10.

The affixing device 100 is formed by a plurality of support members 10 from the back surface side of each of the 16 divided support regions 12 which are equally divided so as to have a similar shape to the flat surface portion 11a of the lower plate member 1a. Support the member.

By arranging the plurality of support members 10 on the back surface side of each of the divided support regions 12 in this way, the rectangular processed substrate 30 arranged on the flat surface portion 11a and the corner portions of the rectangular support panel 40 are arranged. The support member 10 can be arranged on the entire surface including the peripheral portion of the above. As a result, the pressing force applied by the upper plate member 1b can be uniformly received by the rectangular flat surface portion 11a. Therefore, the sticking device 100 can suitably stick the rectangular substrate 30 to be processed and the rectangular support panel 40 so as to have a uniform thickness.

Note that, in the sticking apparatus 100, the number of the divided support region 12 is 16, the number of divided pressing region is similar figure of area occupying the entire surface of the flat portion is the upper plate member, 16, i.e. 4 ² Not limited to individuals. The number of the divided support regions 12 may be such that the region that occupies the entire surface of the flat surface portion is equally divided into the N ² divided pressing regions. Here, N may be appropriately designed according to the size of the lower plate member 1a, but if N is an integer of 2 or more, the pressing force applied to the plate member can be equally divided and received. it can. For example, when the substrate 30 to be processed and the support panel 40 having an area of 510 mm × 510 mm to 550 mm × 550 mm are attached, N is preferably an integer of 2 to 8 and 4 to 8, although it is not limited. More preferably, it is an integer in the range.

[Support member 10]
As shown in FIGS. 1 and 2B, the plurality of support members 10 individually support each of the divided support regions 12 from the back surface side of the flat surface portion 11a of the lower plate member. .. The support member 10 is preferably arranged so that the center point in the cross section of the support member 10 and the center point of the divided support region 12 coincide with each other on the XY plane parallel to the plane portion 11a. Further, it is more preferable that the shape of the cross section of the support member 10 is circular. The diameter of the support member 10 is not particularly limited, but it has the strength required to support the lower plate member 1a when pressed, and is thin enough not to release the heat of the lower plate member 1a. For example, 40 mm to 80 mm is preferable, 50 to 70 mm is more preferable, and 60 mm is further preferable.

Further, the support member 10 is made of a metal such as stainless steel. The plurality of support members 10 are fixed to the bottom of the decompression chamber 50, and individually support the lower plate member 1a from the back surface side of the flat surface portion 11a of the lower plate member 1a based on the divided support region 12. ing. The height of each of the support members 10 is increased by shims (adjusting members, not shown) so that the flatness of the flat surface portion 11a can be maintained when a pressing force is applied by the upper plate member 1b. May be adjusted as appropriate.

(Other configurations in the lower plate member 1a)
In addition, the lower plate member 1a is a portion in contact with the substrate 30 to be processed or the support panel 40, and for example, a laminate in which the substrate 30 to be processed and the support panel 40 are laminated with the support panel 40 side facing up is placed. It is composed of a mounting plate 2 to be mounted, a lower support plate 4 which is a portion supported by the support member 10, and a lower intermediate plate 3 provided between the mounting plate 2 and the lower support plate 4. There is. Further, the lower plate member 1a includes a plurality of support pins 5 for supporting the substrate 30 to be processed or the support panel 40.

The mounting plate 2 and the lower intermediate plate 3 are made of ceramics such as alumina. Further, between the mounting plate 2 and the lower intermediate plate 3, a heating device such as a surface heater or a cartridge heater for heating the laminated body at the time of pressing by heating the lower plate member 1a (not shown). ) Is sandwiched. That is, the lower plate member 1a has a built-in heating device. The flat surface portion 11a of the lower plate member is heated by the heating device. This allows, for example, the substrate 30 to be processed, or the support panel 40, or the overlapping substrate 30 to be processed and the support panel 40 to be successfully bonded. Therefore, for example, when the substrate 30 to be processed and the support panel 40 are attached via the adhesive layer, the adhesive layer can be suitably heated. The heating device may appropriately adjust the heating conditions according to, for example, the thermoplastic resin, the curable resin, and the like contained in the adhesive layer.

The lower support plate 4 is made of a metal such as stainless steel, ceramics, stone or the like. Therefore, the lower intermediate plate 3 has a function as an insulator for preventing a short circuit between the heating device and the lower support plate 4. Further, since the lower support plate 4 is made of metal, it is easy to fix the lower plate member 1a to the support member 10. The mounting plate 2, the lower intermediate plate 3, and the lower support plate 4 are fixed to each other with a plurality of bolts and nuts. Therefore, when the lower support plate 4 is made of metal, it is easy to fix it with bolts and nuts.

The surface of the mounting plate 2, that is, the flat surface portion 11a is formed so that the flatness when not pressed is 1.0 μm or less. Here, the flatness is a numerical value indicating the degree of unevenness with respect to the flat surface, and "flatness of 1.0 μm or less" is the unevenness of the surface of the mounting plate 2 (and the pressing plate 6 described later) when not pressed. Indicates that is ± 1.0 μm or less. Further, the mounting plate 2 has, for example, a thickness of 35 mm or more (thickness in the vertical direction) so that the amount of bending at the time of pressing can be reduced. Since the mounting plate 2 is made of ceramics, it can be easily processed so that the flatness of the surface thereof is 1.0 μm or less. Further, since ceramics have a smaller coefficient of thermal expansion than metal, the surface of the flat surface portion 11a and the surface of the pressing plate 6 (that is, the flat surface portion 11b described later) during pressing in a heated state are curved or distorted. It can be made less likely to occur. Therefore, the flatness (horizontality) of the flat surface portion 11a of the lower plate member 1a and the flat surface portion 11b of the upper plate member 1b can be maintained. The lower plate member 1a may further include a thermometer (not shown) including, for example, a thermoelectric pair, which measures the temperature of the flat surface portion 11a.

(Support pin 5)
The plurality of support pins 5 shown in FIG. 3A are pins provided on the lower plate member 1a, and are driving means (not shown) in a state of supporting the substrate 30 to be processed or the support panel 40. Moves up and down with respect to the flat surface portion 11a. As a result, the plurality of support pins 5 support the substrate 30 or the support panel 40 to be processed from the bottom surface thereof and move them up and down. When the plate member 1 is pressed so as to sandwich the substrate 30 to be processed and the support panel 40, the support pin 5 is housed inside the lower plate member 1a.

In the sticking device 100, the six support pins 5 are arranged on the intersection of the line segments (dotted chain lines) that divide the divided support region 12 in the plane of the flat surface portion 11a of the lower plate member 1a.

The material of the support pin 5 is not particularly limited, but may be aluminum having good thermal conductivity, stainless steel (SUS) or the like, or may be made of a wear-resistant resin such as polyimide resin. Examples of the polyimide resin include Vespel (registered trademark) and the like.

[Upper plate member 1b]
The affixing device 100 presses the upper plate member 1b so as to sandwich the substrate 30 to be processed and the support panel 40 by moving the upper plate member 1b toward the lower plate member 1a. As a result, the laminated body 60 is formed by sticking the substrate 30 to be processed and the support panel 40. The size of the flat surface portion 11b of the upper plate member 1b is the same as the size of the flat surface portion 11a of the lower plate member 1a.

The upper plate member 1b is composed of a pressing plate 6, an upper intermediate plate 7, and an upper support plate 8. The upper plate member 1b applies a pressing force to the substrate 30 to be processed and the support panel 40 by transmitting the force applied to the upper support plate 8 to the pressing plate 6 via the upper intermediate plate 7. Further, a heating device (not shown) is sandwiched between the pressing plate 6 and the upper intermediate plate 7. As the heating device, the same device as the above-mentioned heating device can be used, and the temperature for heating the flat surface portion 11b of the upper plate member is preferably the same temperature as described above.

The pressing plate 6 and the upper intermediate plate 7 are made of ceramics such as alumina, and the upper support plate 8 is made of metal such as stainless steel, ceramics, stone or the like. Therefore, the upper intermediate plate 7 has a function as an insulator for preventing a short circuit between the heating device and the upper support plate 8. Further, since the upper support plate 8 is made of metal, it is easy to fix the upper plate member 1b to the lower pressing shaft (pressing shaft) 14b. The pressing plate 6, the upper intermediate plate 7, and the upper support plate 8 are fixed to each other with a plurality of bolts and nuts. Therefore, when the upper support plate 8 is made of metal, it is easy to fix it with bolts and nuts.

The flat surface portion of the pressing plate 6, that is, the flat surface portion 11b is formed so that the flatness when not pressed is 1.0 μm or less. Further, the pressing plate 6 has a thickness of, for example, 35 mm or more (thickness in the vertical direction) so that the amount of bending at the time of pressing can be reduced. Since the pressing plate 6 is made of ceramics, it can be easily processed so that the flatness of the flat surface portion 11b is 1.0 μm or less.

The upper plate member 1b further includes a thermometer (not shown) including, for example, a thermoelectric pair for measuring the temperature of the flat surface portion 11b, and also includes a pressing pin 9 at a portion of the pressing plate 6 in contact with the laminated body. ..

(Pressing pin 9)
The pressing pin 9 is a pin that presses the substrate 30 to be processed or the support panel 40 previously conveyed into the decompression chamber 50 downward in the Z direction. In the present embodiment, six pressing pins 9 are provided on the pressing plate 6, and the tip portions of the pressing pins 9 are arranged so as to face the respective tip portions of the support pins 5. In FIG. 1, a part of the six pressing pins 9 is illustrated, and the others are omitted.

Each of the pressing pins 9 can be moved up and down at the same time in the Z direction by the pressing shaft 14, and when it comes into contact with the upper surface of the substrate 30 to be processed or the support panel 40, it is said by the spring (biasing member) 9a. The substrate 30 to be processed or the support panel 40 is urged downward in the Z direction. By arranging the support pin 5 and the pressing pin 9 in this way and urging the substrate 30 or the support panel 40 to be processed, a part of the inner peripheral portion of the flat surface portion of the substrate 30 or the support panel 40 to be processed can be removed. It can be pressed suitably. The pressing pin 9 is housed inside the upper plate member 1b when the plate member 1 applies pressing force by sandwiching the substrate 30 to be processed and the support panel 40.

In the present specification, the pressing pin 9 does not move downward in the Z direction, and is therefore in a position where it does not come into contact with the substrate 30 to be processed or the support panel 40 held by the holding portion 16. The pressing pin 9 is said to be in the "standby position" (FIG. 8). On the other hand, the upper plate member 1b is moved downward, and as a result, the substrate 30 to be processed or the support panel 40 held by the holding portion 16 is in a position where it can be urged by the spring 9a. In the specification, the pressing pin 9 is in the "pressing position" (FIG. 9).

[Servo motor 13]
The servomotor (pressing portion) 13 moves the upper plate member 1b downward in the Z direction, so that the substrate 30 to be processed and the support panel arranged between the upper plate member 1b and the lower plate member 1a are arranged. It is a motor that applies pressing force to 40. As shown in FIG. 1, in the sticking device 100, the servomotor 13 is arranged outside the decompression chamber 50 and is fixed to the fixed frame 71. Further, the decompression chamber 50 is fixed to the pedestal portion 72. That is, in the sticking device 100, the servomotor 13 and the decompression chamber 50 are fixed separately, not integrally. Here, if the servomotor 13 is fixed to the decompression chamber 50, when a pressing force is applied from the servomotor 13 to the substrate 30 to be processed and the support panel 40, a load is applied to the decompression chamber 50, which may cause distortion. .. On the other hand, by fixing the servomotor 13 and the decompression chamber 50 separately, it is possible to prevent the decompression chamber from being loaded. For example, by fixing the servomotor 13 to the fixed frame 71 and fixing the decompression chamber 50 to the pedestal portion 72, the fixed frame 71 and the pedestal portion 72 are each loaded, and the decompression chamber is not burdened.

The servomotor 13 applies pressing force to the upper plate member 1b arranged inside the decompression chamber 50 via the pressing shaft 14 provided with the upper pressing shaft 14a and the lower pressing shaft 14b. More specifically, the pressing shaft 14 is provided with a load cell 15 between the upper pressing shaft 14a and the lower pressing shaft 14b, and the force applied via the load cell 15 is applied to the lower portion inserted into the decompression chamber 50. It is transmitted to the upper plate member 1b via the pressing shaft 14b. That is, in the sticking device 100, the load cell 15 is provided outside the decompression chamber 50.

[Load cell 15]
Further, the load cell ((load cell; load converter) pressing force detecting unit) 15 detects the pressing force applied by the servomotor 13 to the substrate 30 to be processed and the support panel 40 via the upper plate member 1b. It is provided between the upper pressing shaft 14a and the lower pressing shaft 14b outside the decompression chamber 50. The load cell 15 detects the load applied to the upper plate member 1b by the servomotor 13 and converts it into an electric signal.

The sticking device 100 uses a compression type load cell as a pressing force detecting unit. Examples of the compression type load cell include beam type, column type, S-shaped and diaphragm type load cells.

Further, as shown in FIG. 2A, in the sticking device 100, the load cell 15 applies a pressing force applied from the back surface side of the flat surface portion 11b of the upper plate member 1b around the center point of the flat surface portion 11b. One is arranged so as to detect. As a result, the pressing force applied by the servomotor 13 to the upper plate member 1b is adjusted based on the magnitude of the pressing force detected by the load cell 15. Therefore, the pressing force for bonding the substrate 30 to be processed and the support panel 40 can be suitably adjusted.

[Holding unit 16]
The holding portion 16 is a member that holds the substrate 30 to be processed or the support panel 40 carried into the decompression chamber 50 between the lower plate member 1a and the upper plate member 1b. The holding portion 16 includes a spacer 16a, a tubular portion 16b, and a shaft portion 16c ((b) and (c) in FIG. 3).

As shown in FIG. 3B, the spacer 16a supports a part of the peripheral edge portion on the bottom surface side of the substrate 30 to be processed or the support panel 40 carried into the decompression chamber 50. The material of the spacer 16a is not particularly limited, and for example, a material obtained by chamfering stainless steel (SUS) and coating it with a resin such as polytetrafluoroethylene can be used.

The shaft portion 16c is inserted into a tubular portion 16b that communicates the outside and the inside of the decompression chamber 50, and the shaft portion 16c is parallel to the X direction so as to slide inside the tubular portion 16b. Move to. The gap between the decompression chamber 50 formed by the shaft portion 16c and the tubular portion 16b is provided with known means such as an oil seal and a metal seal so that air does not flow into the decompression chamber 50 from the outside. It may be hermetically sealed.

As shown in FIG. 3A, the sticking device 100 includes four holding portions 16. Further, the sticking device 100 includes two connecting shafts 17, and each of the four holding portions 16 is connected by the connecting shafts 17 so as to form a set of two outside the decompression chamber 50. There is. Each of the two sets of holding portions 16 connected by the connecting shaft 17 sandwiches the lower plate member 1a inside the decompression chamber 50, and the spacers 16a of the holding portions 16 are arranged so as to face each other. When the affixing device 100 moves the two connecting shafts 17 so as to approach each other by a drive unit (not shown), the ends of the two holding portions 16 connected to each of the connecting shafts 17 face each other. It moves parallel to the X direction so as to approach the end of the arranged spacer 16a. As a result, as shown in FIGS. 3 (b) and 3 (c), each of the four holding portions 16 allows the peripheral portion of the substrate 30 to be processed or the support panel 40, which is rectangular, to be removed from the bottom surface by the spacer 16a. Move to be able to support.

When the substrate 30 or the support panel 40 to be processed is carried to the upper part of the holding portion 16, each of the four spacers 16a is moved to a position where it does not overlap the substrate 30 to be processed or the support panel 40 at all. In this specification, the spacer 16a is referred to as being in the "pulling position" in this state. After the substrate 30 or the support panel 40 to be processed is carried above the holding portion 16, the substrate 30 to be processed is provided with each of the four spacers 16a so that the substrate 30 or the support panel 40 can be supported by the holding portion 16. Alternatively, return it to a position where it overlaps with the support panel 40. In this state, the spacer 16a is referred to as being in the "insertion position" in this state. Note that FIG. 3A shows a state in which the spacer 16a is in the “pulling position”, and FIGS. 3B and 3C show a state in which the spacer 16a is in the “insertion position”. There is.

The width d ₃ of the overlap between the spacer 16a that supports the substrate 30 to be processed or the support panel 40 of the holding portion 16 and the substrate 30 or the support panel 40 to be processed is not limited to that of the substrate 30 or the support panel 40 to be processed. It can be about 1 to 5 mm from the peripheral edge to the inside. It is preferably 5 mm. Further, the width d ₄ of the spacer 16a may be 5 mm, but the width d ₄ is not limited to this.

[Position sensor 18]
The position sensor (position detection unit) 18 is provided outside the decompression chamber 50, and from the position of the holding unit 16 outside the decompression chamber 50, the end of the holding unit 16 inside the decompression chamber 50, that is, a spacer. It is a magnetic sensor that detects the position of 16a.

As shown in FIG. 3B, the position sensor 18 is arranged in front of and behind the magnet 18a provided on the shaft portion fixed to the connecting shaft 17 in the moving direction of the magnet 18a, and the displacement of the magnet 18a. It is provided with two sensor heads 18b and 18c for detecting. Here, the magnet 18a is provided at the end of the shaft portion fixed to the connecting shaft 17, and the sensor heads 18b and 18c are provided in the cylinder through which the shaft portion is inserted. When the connecting shaft 17 moves along the X direction, the magnet 18a moves equidistantly inside the cylinder at the same time as the two spacers 16a. At this time, the two sensor heads 18b and 18c detect the position of the magnet 18a based on the change in magnetism emitted from the magnet 18a. Thereby, the positions of the two spacers 16a that move equidistantly at the same time as the magnet 18a can be specified. Therefore, the position of the end portion of the holding portion 16 can be confirmed independently of the operation of the decompression chamber 50 while maintaining the decompression environment of the decompression chamber 50. Further, when the drive unit (not shown) that drives the connecting shaft 17 is, for example, an air drive unit, the spacer 16a is caused by an operation error caused by a change in the moving distance of the drive unit that may occur due to a change in air pressure. , It is possible to preferably prevent the substrate 30 to be processed or the support panel 40 from failing to be held.

Although the sticking device 100 according to the present embodiment employs a magnetic sensor, the detection unit is not limited to the magnetic sensor. Specifically, any position measurement sensor that can detect the displacement of the object by light, ultrasonic waves, laser, or the like can be used.

Examples of the position measurement sensor include an ultrasonic sensor, an eddy current sensor, a laser sensor, a contact type sensor, and the like, in addition to the magnetic sensor.

[Decompression chamber 50]
The decompression chamber 50 is a room for attaching the substrate 30 to be processed and the support panel 40 in an environment where decompression is possible, and the plate member 1 and the support member 10 in the attachment device 100 are housed therein. Further, the decompression chamber 50 is provided with a known decompression means (not shown), and the internal pressure in the decompression chamber 50 can be controlled by the decompression means.

Further, the decompression chamber 50 is provided with an openable and closable transfer window (not shown) for carrying in the substrate 30 to be processed and the support panel 40 and carrying out the laminated body 60 to which the laminated body 60 is attached. The substrate 30 to be processed and the support panel 40 can be carried in and the laminated body 60 can be carried out by a known transfer device such as a robot arm or by hand.

Since the decompression chamber 50 has a structure capable of depressurizing, the adhesive layer is formed between the substrate 30 to be processed and the support panel 40 by attaching the substrate 30 to be processed and the support panel 40 via the adhesive layer in a decompression atmosphere. It is possible to preferably prevent the generation of air bubbles in the air, and it is possible to preferably prevent the sticking failure due to the air bubbles. Further, for example, it is possible to preferably prevent the generation of voids between the adhesive layer and the substrate 30 to be processed.

[Operation of affixing device 100]
Subsequently, a schematic operation for attaching the substrate 30 to be processed and the support panel 40 in the attachment device 100 according to the present embodiment will be described.

4 to 11 are views for explaining the operation of the sticking device 100 in the present embodiment according to the internal state of the decompression chamber 50. For convenience of explanation, the servomotor 13, the upper pressing shaft 14a, and the load cell 15 are not shown.

(1. Carrying the support panel 40 into the decompression chamber 50)
First, the support panel 40 is carried in through the transfer window (not shown) of the decompression chamber 50. The carried-in support panel 40 is supported by the support pin 5 (see FIG. 4). At this stage, the holding portion 16 is left in the unplugged position.

(2. Delivery of the support panel 40 to the spacer 16a)
Next, by moving the support pin 5 in the Z direction, the support panel 40 placed on the support pin 5 is moved to a position above the holding portion 16 and not in contact with the pressing pin 9 (FIG. 5). Then, after moving the spacer 16a to the insertion position, the support pin 5 moves downward in the Z direction. As a result, the support panel 40 is supported by the spacer 16a without changing the horizontal position (see FIG. 6).

(3. Carrying the substrate 30 to be processed into the decompression chamber 50)
Next, as in the case of the support panel 40, in this state, the substrate 30 to be processed is carried in through the transfer window of the decompression chamber 50 (see FIG. 7). Then, after closing the delivery window, decompression of the decompression chamber 50 is started. The decompression condition of the decompression chamber 50 is preferably 10 Pa or less.

(4. Heating of substrate 30 to be processed)
Next, by moving the support pin 5 downward in the Z direction, the substrate 30 to be processed is placed on the lower plate member 1a and heated. As a result, the adhesive layer formed on the upper surface of the substrate 30 to be processed is heated (see FIG. 8).

(5. Temporary fixing)
Next, the heated upper plate member 1b is lowered in the Z direction to bring it into contact with the upper surface of the support panel 40. As the upper plate member 1b comes into contact with the upper surface of the support panel 40, the pressing pin 9 moves from the standby position to the pressing position, so that the support panel 40 supported by the spacer 16a is lowered in the Z direction by the spring 9a. Force is applied so that it is urged toward the side. Subsequently, the substrate 30 to be processed mounted on the support pin 5 is moved upward in the Z direction by the support pin 5. As a result, the adhesive layer formed on the upper surface of the substrate 30 to be processed is moved to the vicinity of the bottom surface of the support panel 40 supported by the spacer 16a (see FIG. 9). After that, by moving the spacer 16a to the pulling position, the substrate 30 to be processed and the support panel 40 are sandwiched by the support pin 5 and the pressure pin 9 by the force applied by the spring 9a of the pressing pin 9. Press (see FIG. 10). As a result, the substrate 30 to be processed and the support panel 40 are overlapped and temporarily fixed.

(6. Attachment of the substrate 30 to be processed and the support panel 40)
Next, the support pin 5 and the upper plate member 1b are lowered at the same speed. As a result, the substrate to be processed 30 and the support panel 40 are sandwiched and pressed between the heated upper plate member 1b and the heated lower plate member 1a, whereby the substrate to be processed 30 and the support panel 40 are pressed. And paste (see FIG. 11).

[Laminated body 60]
The outline of the substrate 30 to be processed, the support panel 40, and the laminated body 60 to be attached to the attachment device 100 according to the present embodiment shown in FIG. 15 will be described. The laminated body 60 is a laminated body in which the substrate 30 to be processed and the support panel 40 are attached.

(Substituent 30 to be processed)
In the present embodiment, the substrate 30 to be processed re-arranges the terminal at the end of the element 32 outside the chip area on one flat surface portion of the sealing body in which the element 32 is sealed by the sealing material 33. It is a substrate provided with a sealing substrate (board) 35 on which a wiring layer 31 is formed, and the sealing substrate 35 is supported by a panel (support) 41 via an adhesive layer 43 and a separation layer 42. An adhesive layer 43 is formed on the surface of the rewiring layer 31 in contact with the support panel 40. The adhesive layer 43 formed on the rewiring layer 31 can adopt the same member as the adhesive layer 43 between the element 32 and the sealing material 33 and the separation layer 42, and the substrate 30 to be processed can be used. As the panel (support) 41 and the separation layer 42 in the above, the same members and the like as those provided in the support panel 40 described later can be adopted.

The substrate 30 to be processed is attached to the support panel 40 by the attachment device 100 to form a laminate 60, and then light is emitted from the panel 41 side of the substrate 30 to be processed toward the separation layer 42 on the substrate 30 side to be processed. Is irradiated. As a result, the separation layer 42 is altered, and the panel 41 on the substrate 30 side to be processed is separated from the laminate 60. After that, processing such as mounting another element (not shown) is performed on the surface of the sealing substrate 35 supported by the support panel 40 where the rewiring layer 31 is not provided.

The element 32 is a semiconductor element or other element, and may have a single-layer or multi-layer structure. When the element 32 is a semiconductor element, the electronic component obtained by dicing the sealing substrate 35 is a semiconductor device.

As the sealing material 33, for example, an epoxy-based resin, a silicone-based resin, or the like can be used. In one embodiment, the sealing material 33 is not provided for each element 32, but integrally seals all of the plurality of elements 32 mounted on the adhesive layer 43.

The rewiring layer 31 is also called an RDL (Redistribution Layer) and is a thin-film wiring body constituting a wiring connected to the element 32, and may have a single-layer or a plurality of-layer structure. In one embodiment, the rewiring layer 31 is made of a dielectric (for example, silicon oxide (SiOx), a photosensitive resin such as photosensitive epoxy) and a conductor (for example, aluminum, copper, titanium, nickel, gold, etc.). The wiring may be formed of metal or the like), but the wiring is not limited to this.

In the substrate 30 to be processed shown in FIG. 15, the adhesive layer 43 is provided on the surface of the rewiring layer 31 in contact with the support panel 40, but in another embodiment, the adhesive layer 43 is on the support panel 40. It may be provided on the surface of the separation layer 42 in contact with the substrate 30 to be processed.

Further, the sticking device 100 may stick the sealing substrate 35, which is not supported by the panel 41, to the support panel 40 instead of the substrate 30 to be processed. Further, the substrate 30 to be processed is not limited to a substrate in which the sealing substrate 35 is supported by the panel 41, and can be any substrate such as a silicon wafer substrate, a ceramic substrate, a thin film substrate, and a flexible substrate.

(Support panel 40)
The support panel 40 is a support that supports the substrate 30 to be processed, and a panel (support) 41 and a separation layer 42 are formed on the panel 41. The support panel 40 is attached to the sealing substrate 35 of the substrate 30 to be processed via the separation layer 42.

The panel 41 only needs to have the strength necessary to prevent the substrate from being damaged or deformed during processes such as thinning, transporting, and mounting the substrate, and is preferably lighter. From the above viewpoint, the panel 41 is preferably made of glass, silicon, acrylic resin, ceramic or the like, and more preferably made of glass.

The separation layer 42 is a layer that is altered by absorbing the light emitted through the panel 41. The separation layer 42 is preferably formed only from a material having a structure that absorbs light, but a material that does not have a structure that absorbs light is added as long as the essential characteristics of the separation layer are not impaired. Then, the separation layer 42 may be formed.

In one embodiment, the separation layer 42 may be made of fluorocarbon. Since the separation layer 42 is composed of fluorocarbon, it is deteriorated by absorbing light, and as a result, the strength or adhesiveness before being irradiated with light is lost. Therefore, by applying a slight external force (for example, lifting the support panel 40, etc.), the separation layer 42 is destroyed, and the panel 41 and the sealing substrate 35 can be easily separated. The fluorocarbon constituting the separation layer 42 can be suitably formed by a plasma CVD (chemical vapor deposition) method.

Further, in another embodiment, for example, the separation layer 42 contains a polymer having a light-absorbing structure in its repeating unit, an inorganic substance, a compound having an infrared-absorbing structure, and a reactive policy. It may be formed using lucesquioxane or the like. The light absorption rate of the separation layer 42 is preferably 80% or more.

The lower limit of the thickness of the separation layer 42 is preferably 0.05 μm or more, and more preferably 0.3 μm or more. The upper limit of the thickness of the separation layer 42 is preferably 50 μm or less, and more preferably 1 μm or less. If the thickness of the separation layer 42 is within the range of 0.05 μm to 50 μm, the separation layer 42 can be subjected to desired alteration by short-time light irradiation and low-energy light irradiation. Further, it is particularly preferable that the thickness of the separation layer 42 is within the range of 1 μm or less from the viewpoint of productivity.

The adhesive layer 43 is a layer for adhering the sealing substrate 35 and the support panel 40 on the substrate 30 to be processed, and is formed by applying an adhesive to at least one of the substrate and the panel. The adhesive constituting the adhesive layer may contain, for example, a thermoplastic resin whose heat fluidity is improved by heating as an adhesive material, or may contain a curable resin that is cured by heat or light. Examples of the thermoplastic resin include acrylic resin, styrene resin, maleimide resin, hydrocarbon resin, thermoplastic elastomer, polysulfone resin and the like. In addition, examples of the curable resin include an acrylic resin, an epoxy resin, and a resin composition containing a curable monomer such as an acrylic monomer in the above-mentioned thermoplastic resin.

The method of forming the adhesive layer, that is, the coating method of applying the adhesive to the substrate or the panel, or the forming method of applying the adhesive to the substrate to form the adhesive tape is not particularly limited, but is bonded. Examples of the method for applying the agent include a spin coating method, a dipping method, a roller blade method, a spray method, a slit nozzle method, and the like.

The thickness of the adhesive layer may be appropriately set according to the type of the substrate and panel to be attached, the treatment to be applied to the substrate after attachment, etc., but may be within the range of 10 to 150 μm. It is preferably in the range of 15 to 100 μm, more preferably in the range of 15 to 100 μm.

[Modification example of laminated body]
The laminate formed by the sticking device 100 sticking the substrate and the support is not limited to the above embodiment. The laminate formed by the affixing device 100 may include either an adhesive layer or a separation layer as long as the sealing substrate 35 and the panel 41 can be attached.

For example, in the laminate according to one modification, a sealing substrate (substrate) and a panel (support) formed of a material that transmits light are laminated via a separation layer that is altered by absorbing light. It may be a laminated body made of. That is, unlike the laminated body 60, the adhesive layer 43 may not be provided between the separation layer 42 and the sealing substrate 35. As a separation layer for forming such a laminate, a separation layer having adhesiveness can be mentioned, and the separation layer is, for example, a curable resin or a thermoplastic resin and absorbs light. Examples thereof include a separation layer formed by using a resin having properties, a separation layer formed by blending a resin having adhesiveness with a material that absorbs light, and the like. Examples of the separation layer formed by using a curable resin or a thermoplastic resin having light absorption include a separation layer formed by using a polyimide resin. Further, the separation layer formed by blending a light-absorbing material with a resin having adhesiveness includes, for example, a separation layer formed by blending an acrylic ultraviolet curable resin with carbon black or the like, and an adhesive resin. Examples thereof include a separation layer formed by blending an infrared absorbing material of Glass Bubbles or the like. It should be noted that these separation layers are also in the category of separation layers that are altered by absorbing light regardless of whether or not they have adhesiveness.

Further, the laminated body according to still another modification is, for example, a laminated body formed by laminating a sealing substrate (substrate) and a panel (support) formed of a material that transmits light via an adhesive layer. It is a body, and the adhesive layer is an adhesive layer having an adhesive force that can be peeled off by applying a mechanical force. Examples of the adhesive capable of forming such a laminated body include a pressure-sensitive adhesive (adhesive) and a peelable adhesive. Examples of the pressure-sensitive adhesive include known pressure-sensitive adhesives. The peelable adhesive may be, for example, an adhesive whose adhesive strength is adjusted by blending a mold release agent such as wax or silicone with a thermoplastic resin, a photocurable resin, a thermosetting resin, or the like. Good. Further, a curable adhesive may be used, which contains a thermosetting resin, a photocurable resin, or the like, and exhibits peelability by curing these resins. Further, such a peelable adhesive may be an adhesive containing a thermoplastic resin having low adhesive strength such as beeswax or wax as a main component.

<Attachment device 101>
The sticking device according to the present invention is not limited to the above-described embodiment (first embodiment). As shown in FIGS. 12 and 13, for example, the sticking device 101 according to one embodiment (second embodiment) includes four load cells 15', and the servomotor 13 has one upper pressing shaft 14. A pressing force is applied to the four load cells 15'via the'a', and each of the load cells 15'applies a pressing force to the upper plate member 1b via the lower pressing shaft 14'b.

FIG. 12 is a diagram showing a schematic configuration of the attachment device 101 according to the second embodiment, and FIG. 13 (a) is a diagram for explaining the arrangement of the load cell 15'in the attachment device 101 according to the second embodiment. 13 (b) is a diagram illustrating the arrangement of the support member 10. The members having the same reference numerals as those in the first embodiment refer to the same members, and the description thereof will be omitted. Further, in FIGS. 12 and 13, only one of the four load cells 15'is assigned a reference numeral, and the other load cells 15'shown in the same shape are omitted from the reference numerals. Similarly, with respect to the split pressing region for equally dividing the flat surface portion 11b by the alternate long and short dash line, only one split pressing region 19 is designated with a reference numeral, and the other split pressing regions 19 are not designated with reference numerals.

As shown in FIG. 13 (a), in the affixing device 101, four load cells 15'are arranged so as to press the center points of the four divided pressing regions 19 divided by the alternate long and short dash lines. ing. In each of the four load cells 15', the upper plate member 1b is arranged via the lower pressing shaft 14'b. As a result, the pressing force applied by the servomotor 13 to the flat surface portion 11b of the upper plate member 1b can be detected in each of the divided pressing regions 19 in which the flat surface portion 11b is equally divided into four. Therefore, unlike the case where one load cell 15 detects the pressing force applied to the flat surface portion 11b of the upper plate member 1b, the difference in pressing force applied to the flat surface portion 11b of the upper plate member 1b, that is, the bias of the pressing force is preferable. Can be detected. Therefore, by reducing the difference in the pressing force detected in each of the divided pressing regions 19 in which the flat surface portion 11b is equally divided into four, the pressing force applied to the plate member 1 by one load cell is detected. However, a uniform pressing force distribution can be obtained.

In the affixing device 101, the substrate 30 to be processed and the support panel 40 as a standard sample, or the adjusting work (the plate to be processed as a standard sample) is placed between the lower plate member 1a and the upper plate member 1b. By arranging the arrangement and applying a pressing force by the servomotor 13, the difference in pressing force detected by each load cell 15'may be specified, and then the difference in pressing force may be adjusted to be small.

To reduce the difference in pressing pressure detected by each of the four load cells 15', for example, a shim (adjusting member, not shown) is inserted into the gap between the load cell 15'and the lower pressing shaft 14'b. Therefore, a method of adjusting the difference in pressing force can be mentioned.

As shown in FIG. 13B, the sticking device 101 is provided with a support member 10 that supports each of the divided support regions 12 from the back surface side, as in the case of the sticking device 100, and is provided on the lower side. The pressing force applied to the flat surface portion 11a of the plate member 1a can be uniformly received. Therefore, the sticking device 101 can uniformly receive the pressing force applied from the flat surface portion 11b of the upper plate member 1b in a uniform distribution on the flat surface portion 11a of the lower plate member 1a. Therefore, the substrate 30 to be processed and the support panel 40 can be suitably attached to a uniform thickness.

In the sticking device 101, the number of split pressing regions 19 is 4, but the number of split pressing regions, which is similar to the region occupying the entire surface of the flat surface portion of the upper plate member, is 4, that is, 2. Not limited to ^two . The number of the division pressing regions 19 may be such that the region occupying the entire surface of the flat surface portion is equally divided into the M ² division pressing regions. Here, M may be appropriately designed according to the size of the upper plate member 1b, but if M is an integer of 2 or more, the distribution of the pressing force applied to the plate member can be suitably detected. .. Further, if M is an integer of 2 or more and is an integer smaller than N that defines the number of the divided support regions 12, it is possible to suitably detect the bias of the pressing force applied to the entire surface of the plate member. It is possible, and M is preferably an integer of 2-8, more preferably an integer in the range 4-8.

<Attachment device 102>
The sticking device according to the present invention is not limited to the above-described embodiments (first embodiment and second embodiment). As shown in FIG. 14, for example, the sticking device 102 according to one embodiment (third embodiment) includes four servomotors 13'instead of one servomotor 13 in the second embodiment. The configuration further includes a pressing force specifying unit 20 and a control unit 21.

Thereby, the sticking device 102 can individually adjust the pressing force applied to the plate member 1 by the four servomotors 13'based on the pressing force detected in each of the four load cells 15'. Therefore, for example, the pressing force applied to the plate member 1 can be suitably adjusted so as to adapt to changes in individual differences and types of the substrate 30 to be processed and the support panel 40.

Hereinafter, a plurality of servomotors 13', a pressing force specifying unit 20, and a control unit 21 included in the affixing device 102 according to the present embodiment will be described in more detail with reference to FIG.

FIG. 14 is a diagram showing a schematic configuration of the sticking device 102 according to the present embodiment. The members having the same reference numerals as those in the first embodiment refer to the same members, and the description thereof will be omitted. Further, in FIG. 14, the members shown in the same shape are members having the same configuration as the members having the reference numerals attached to one of them.

The sticking device 102 includes four servomotors 13'so as to apply pressing force to each of the four load cells 15' (FIGS. 14 and 13 (a)). That is, one servomotor 13'is provided for one load cell 15'. As a result, the pressing force applied to the plate member 1 can be individually adjusted by the four servomotors 13'.

The pressing force specifying unit 20 identifies the difference in pressing force detected by each of the four load cells 15'. As shown in FIG. 14, the pressing force specifying unit 20 is connected to each of the load cells 15'by wire or wirelessly, and is acquired as data of the pressing force value measured by each of the load cells 15'. The control unit 21 controls the servomotor 13'based on the respective pressing pressure values of the load cell 15'acquired by the pressing pressure specifying unit 20.

More specifically, the sticking device 102 first controls each of the four servomotors 13'so that the control unit 21 moves the upper plate member 1b downward in the Z direction. Next, the control unit 21 controls each of the four servomotors 13'so as to apply a predetermined pressing force to the superposed substrate 30 and the support panel 40. Here, the pressing force specifying unit 20 receives the value of the pressing force detected by each of the load cells 15'as data. Subsequently, the pressing pressure specifying unit 20 uses the obtained pressing pressure data, for example, by performing a summing process or the like, so that each of the four servomotors 13'applies to each of the divided pressing regions 19. Each of the four servomotors 13'finds a correction value for the pressing force to be applied to the split pressing area 19 so as to reduce the pressure difference. After that, the control unit 21 controls the pressing force applied to the upper plate member 1b by each of the four servomotors 13'based on the correction value of the pressing force obtained by the pressing force specifying unit 20. As a result, even if there is a difference in the pressing force applied to the flat surface portion 11b of the upper plate member, that is, the divided pressing region 19, the difference can be reduced. As a result, the substrate 30 to be processed and the support panel 40 can be attached to a uniform thickness. The control unit 21 moves the upper plate member 1b upward in the Z direction when a predetermined time elapses after the difference in pressing pressure applied to each of the split pressing regions 19 is adjusted within a predetermined range. Each of the four servomotors 13'is controlled so as to be moved. As a result, the laminated body 60 can be formed from the substrate 30 to be processed and the support panel 40.

The present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the claims, and the embodiments obtained by appropriately combining the technical means disclosed in the different embodiments. Is also included in the technical scope of the present invention.

The present invention can be suitably used in the manufacture of semiconductor devices.

1 Plate member 1a Upper plate member (plate member)
1b Lower plate member (plate member)
10 Support member 11 Flat surface portion 11a Flat surface portion (flat surface portion) of the lower plate member
11b Flat surface portion (flat surface portion) of the upper plate member
12 Divided support area 13, 13'Pressing part 14, 14'Pressing shaft 14a, 14'a Upper pressing shaft (pressing shaft)
14b, 14'b Lower pressing shaft (pressing shaft)
15, 15'Pressure pressure detection unit 16 Holding unit 16a Spacer (holding unit)
16b Cylindrical part (holding part)
16c shaft part (holding part)
17 Connecting shaft (holding part)
18 Position sensor (position detector)
18a magnet (position detector)
18b, 18c sensor head (position detector)
19 Divided pressing area 20 Pressing pressure specifying unit 21 Control unit 30 Substrate to be processed (board)
35 Encapsulation board (board)
40 Support panel (support)
41 panel (support)
50 Decompression chamber 100, 101, 102 Sticking device

Claims (7)

A sticking device for sticking a substrate and a support that supports the substrate.
A pair of plate members that sandwich the substrate and the support,
A plurality of support members that support one of the pair of plate members, and
A pressing portion that presses the other plate member of the pair of plate members toward the one plate member, and
Between the pressing portion and the other plate member, a pressing pressure detecting unit that detects the pressing force applied by the pressing portion to the other plate member, and
A decompression chamber for storing the pair of plate members and the plurality of support members, and
It is provided with a holding portion that is inserted from the outside to the inside of the decompression chamber and holds the substrate or the support that has been carried into the decompression chamber between the pair of plate members in a decompression atmosphere.
Each of the pair of plate members has a rectangular flat surface portion.
The people each of the plurality of support members, divided support region of the region occupied by the entire surface of the flat portion of one of the plate member above N ² or a similar shape of the rectangle (here, N is an integer of 2 or more) Each of the divided support areas divided into equal parts is arranged so as to be individually supported from the back surface side of the flat surface portion of one of the above plate members .
In each of the plurality of support members, the center point in the cross section of the support member and the center point of the divided support region coincide with each other on the XY plane parallel to the plane portion of the one plate member. A sticking device characterized by being fixed . The push pressure detection unit is composed of a plurality of push pressure detection units.
In the plurality of pressing force detecting units, the region occupying the entire surface of the flat surface portion of the other plate member is divided into two M ² (here, M is an integer of 2 or more) having a similar shape to the rectangle. The affixing device according to claim 1, wherein the pressing force applied to each of the divided pressing regions, which is equally divided into two parts, is arranged so as to be separately detected. The pressing portion is composed of a plurality of pressing portions.
Each of the plurality of pressing portions is arranged so as to individually press each of the plurality of pressing pressure detecting portions.
A pressing force specifying unit that specifies the difference in pressing pressure detected by each of the pressing pressure detecting units,
The feature is that each of the plurality of pressing portions is provided with a control unit that controls the pressing force applied to the other plate member so that the difference in pressing pressure specified by the pressing pressure specifying portion becomes small. The sticking device according to claim 2. The sticking device according to claim 2 or 3, wherein N is an integer larger than M. The sticking device according to any one of claims 2 to 4, wherein N is 4 and M is 2. A drive unit provided outside the decompression chamber and moving the holding unit parallel to at least one flat surface portion of the pair of plate members.
It is further provided with a position detecting unit which is provided outside the decompression chamber and detects the position of the end portion of the holding portion inside the decompression chamber from the position of the holding portion outside the decompression chamber. The sticking device according to any one of claims 1 to 5, wherein the sticking device is characterized by The pressing portion is fixed outside the decompression chamber separately from the decompression chamber, and presses the pressing force on the other plate member via a pressing shaft inserted from the outside to the inside of the decompression chamber. The sticking device according to any one of claims 1 to 6, wherein the sticking device is added.

Images