JP6770426B2 - Molding mold, resin molding equipment - Google Patents

Description

The present invention relates to a molding technique.

Japanese Unexamined Patent Publication No. 2012-162013 (Patent Document 1) describes that a release film that is adsorbed and held on the cavity concave surface is used in order to facilitate mold release (peeling) of the molded product from the cavity concave surface. (Especially its paragraph [0002]). Further, Patent Document 1 describes that a protruding portion projecting into the cavity recess is provided on the peripheral edge of the end surface of the cavity piece (block) (particularly claim 1).

Japanese Unexamined Patent Publication No. 2012-162013

As in the technique described in Patent Document 1 (FIG. 3), there is a molding cavity (mold recess) that opens in a rectangular shape in the mold plane view (plan view) and is defined by the bottom surface and the side surface. The opening corner portion and the bottom surface corner portion of such a molding cavity having a rectangular shape when viewed from the mold surface generally have an R chamfered shape (arc shape). The radius of curvature of the bottom corner is the same or smaller than that of the opening corner of the molding cavity. Therefore, in the molded product provided with the resin portion molded in the molding cavity, the radius of curvature of the main surface (upper surface) corner portion is the same or smaller than that of the bottom surface corner portion in the top view (plan view). For this reason, especially when the molding cavity is deep, it becomes difficult for the molded product to be released from the corner portion, and the productivity of the molded product may decrease.

Even if an attempt is made to facilitate mold release using a release film, the release film cannot be completely followed at the corners, and the stretched release film may be torn when resin pressure is applied. For this reason, it becomes necessary to perform maintenance and the like, and eventually the productivity of the molded product is lowered.

An object of the present invention is to provide a technique capable of improving the productivity of a molded product. One object and other objects of the present invention as well as novel features will be clarified from the description of the present specification and the accompanying drawings.

A brief outline of the typical inventions disclosed in the present application is as follows.

The molding die according to one solution of the present invention is a molding die that is recessed and opened on the mold surface and has mold recesses defined on the bottom surface and side surfaces, and the side surface of the mold recess is. A side surface extending in a predetermined shape and a side surface of a corner portion connected to the side surface of the side portion in a state of being bent from the side surface of the side portion, and the bottom surface and the side surface in the recess of the mold. the angle formed, the side portion side the corner portion side is rather large is configured from, the bottom surface in contact with the corner portion side is larger chamfered shape than the mold surface contacting to the corner side surfaces, release A plurality of suction paths for adhering the film to the mold surface are provided on the side portion of the mold recess . According to this, it is possible to easily release the resin portion molded in the mold recess, and it is possible to improve the productivity of the molded product.

In addition , it is possible to more easily release the resin portion formed in the concave portion of the mold.

Further, it is more preferable that the mold recess is a molding cavity or an overflow cavity. According to this, it is possible to easily release the resin portion molded in the molding cavity or the overflow cavity.

Further, it is more preferable that the molding die includes a release film that includes the bottom surface and the side surface and is attached to the mold surface. According to this, the release film can be used in a state where it is easy to follow the shape of the concave portion of the mold and it is difficult to tear.

Further, it is more preferable that the resin molding apparatus includes the molding die. According to this, the productivity of the molded product can be improved.

The molded product according to one solution of the present invention is a molded product having a resin portion defined on a main surface and a side surface on a carrier, and the side surface of the resin portion is a side portion extending in a predetermined shape. It has a side surface and a corner side surface connected to the side surface in a state of being bent from the side surface, and the angle formed by the main surface and the side surface in the resin portion is from the side surface. It is characterized by being large on the side surface of the corner. According to this, the productivity of the molded product can be improved.

Among the inventions disclosed in the present application, the effects obtained by typical ones will be briefly described as follows. According to the molding technique according to one solution of the present invention, the productivity of a molded product can be improved.

It is a schematic sectional view of the main part of the molding die which concerns on Embodiment 1 of this invention. It is a schematic plan view of the main part of the mold surface of the molding die shown in FIG. It is a schematic perspective view of the molding die shown in FIG. It is a schematic cross-sectional view of the corner part of the molding cavity which the molding die shown in FIG. 1 has. It is a schematic cross-sectional view of the side part of the molding cavity which the molding die shown in FIG. 1 has. FIG. 6A is a schematic plan view of a modified example of the bottom surface in contact with the corner side surface of the molding cavity, FIG. 6A shows a state of R chamfer, FIG. 6B shows a C chamfer, and FIG. 6C shows a state of polygonal chamfer. It is explanatory drawing of the resin molding process which concerns on Embodiment 1 of this invention, FIG. 7A shows the state before the release film is adsorbed, FIG. 7B is in the process of adsorbing a release film, and FIG. 7C shows the state where the release film is adsorbed. It is explanatory drawing of the resin molding process (schematic sectional view of the main part of a molding die) following FIG. 7, and shows the state which the mold was closed and resin molded. It is a schematic sectional view of the molding die which concerns on Embodiment 2 of this invention. It is a schematic plan view of the main part of the mold surface of the molding die which concerns on Embodiment 3 of this invention. It is a schematic plan view of the main part of the mold surface of the molding die which concerns on Embodiment 4 of this invention.

In the following embodiments of the present invention, if necessary, the description will be divided into a plurality of sections and the like, but in principle, they are not unrelated to each other, and one is related to some or all of the other modifications, details, etc. It is in. Therefore, in all the drawings, members having the same function are designated by the same reference numerals, and the repeated description thereof will be omitted. In addition, the number of components (including the number, numerical value, quantity, range, etc.) is limited to the specific number unless otherwise specified or in principle clearly limited to the specific number. It is not a thing, and may be more than or less than a specific number. In addition, when referring to the shape of a component, etc., it shall include those that are substantially similar to or similar to the shape, etc., unless otherwise specified or when it is considered that this is not the case in principle. ..

(Embodiment 1)
The molding die 10 according to the embodiment of the present invention will be described with reference to FIGS. 1 to 6. FIG. 1 is a schematic cross-sectional view of a main part of a molding die 10 included in the resin molding apparatus 50 (corresponding to the line II shown in FIG. 2). FIG. 2 is a schematic plan view of a main part of the mold surface 11a of the upper mold 11 of the molding mold 10. FIG. 3 is a schematic perspective view of the upper mold 11 of the molding die 10. FIG. 4 is a schematic cross-sectional view of a corner portion 26 of a molding cavity 20 included in the molding die 10. FIG. 5 is a schematic cross-sectional view of the side portion 27 of the molding cavity 20 included in the molding die 10. FIG. 6 is a schematic plan view of a modified example of the bottom surface 20a in contact with the corner side surface 20ba of the molding cavity 20, where FIG. 6A shows an R chamfer, FIG. 6B shows a C chamfer, and FIG. 6C shows a polygonal chamfer.

Roughly speaking, the resin molding apparatus 50 includes a press unit provided with a molding die 10, a supply unit for supplying a work W (molded product) and a resin R, and a storage unit for storing the work W (molded product). It is configured to include a transport unit for transporting the work W and the like between the two. In the present embodiment, as the work W, for example, on a carrier 100 (for example, a lead frame in addition to the wiring board of the present embodiment, various carrier plates made of glass or metal, a wafer, etc.). Those in which a plurality of electronic components 101 (for example, semiconductor dies, passive elements, conductive components, etc.) are mounted in a matrix (for example, wire bonding mounting or flip chip bonding mounting) are used. Further, as the resin R, for example, a thermosetting resin such as an epoxy type is used.

The press portion includes a molding die 10 (in this embodiment, one upper die 11 and the other lower die 12 are paired) so that the die can be opened and closed. For example, the molding die 10 is opened / closed (contact / detached) with respect to the fixed platen by a known press mechanism (mold opening / closing mechanism) that moves the movable platen forward and backward by a toggle link driven by an electric motor. When the upper mold 11 is a fixed mold and the lower mold 12 is a movable mold, the upper mold 11 is fixed to a fixed platen and the lower mold 12 is fixed to a movable platen and assembled to open and close the molding mold 10.

The molding die 10 performs transfer molding by a known transfer mechanism including a plunger 51 for pumping the resin R to the molding cavity 20. In the molding die 10, the resin R filled in the molding cavity 20 closed by closing the mold is thermally cured under predetermined conditions (holding pressure, temperature, time, etc.), and the resin portion is formed on the work W. The molding die 10 is configured to be heated to a molding temperature at which, for example, the resin R is thermally cured by a known heating mechanism.

Further, the molding die 10 includes a molding cavity 20, a runner gate 21, a cal 22, and a pot 23, and is configured to communicate with each other by closing the mold. In the present embodiment, the molding cavity 20 and the runner gate are recessed (that is, become a mold recess) from the mold surface 11a of the upper mold 11 and the surface (parting surface) to be molded with the lower mold 12. 21 and cal 22 are provided on the upper die 11. Of these, the molding cavity 20 is opened at the mold surface 11a of the upper mold 11, is defined by the bottom surface 20a and the side surface 20b, and has an opening 20c. Here, the bottom surface 20a is a portion that constitutes the bottom of a region recessed from the mold surface 11a as the main surface of the mold recess of the molding cavity 20, but is above the mold surface 11a as shown in FIG. It may be arranged, or conversely, it may be arranged on the lower side of the mold surface 12a of the lower mold 12.

Further, the pot 23 is provided in the lower mold 12 so as to face the cal 22 of the upper mold 11. A plunger 51 that can be reciprocated by a transfer mechanism is inserted into the pot 23. Further, the molding die 10 includes a work set portion 24 in which the work W is set. The work set portion 24 is provided in the lower mold 12 so as to face the molding cavity 20 of the upper mold 11 and be recessed from the mold surface 12a of the lower mold 12.

Further, the molding die 10 includes a release film F, and is configured such that the release film F is attached to the mold surface 11a of the upper mold 11 including the inner surface (bottom surface 20a and side surface 20b) of the molding cavity 20. In the present embodiment, the molding die 10 includes a plurality of suction passages 25 (suction holes) that open at the peripheral edge (boundary with the side surface 20b) of the bottom surface 20a of the molding cavity 20, and is known through these suction passages 25. The release film F is attached (sucked and held) to the mold surface 11a of the upper mold 11 by a suction mechanism (consisting of, for example, a vacuum pump).

The molding die 10 may be configured so that the release film F is not provided, but the work W (molded product) can be easily taken out from the upper mold 11 by providing the release film F. Therefore, the release film F is easily peeled off from the mold surface 11a of the upper mold 11, and is composed of a film material having heat resistance, flexibility, and extensibility. As the release film F, for example, PTFE, ETFE, PET, FEP, fluorine-impregnated glass cloth, polypropylene, polychlorinated vinylidine and the like are used.

The molding cavity 20 recessed from the mold surface 11a has a rectangular opening 20c and a bottom surface 20a in view of the mold surface (FIG. 2), and is open so as to expand toward the mold surface 11a from the bottom surface 20a (FIG. 2). 1, FIG. 4, FIG. 5). That is, the bottom surface 20a of the molding cavity 20 is located inside the opening 20c (inner edge of the mold surface 11a) in the mold surface view. Further, the molding cavity 20 that opens in a rectangular shape in the mold plane view has a corner portion 26 and a side portion 27 in the mold plane view. In the present embodiment, the corner portion 26 has an opening 20c and a bottom surface 20a that are R-chamfered, and the side portion 27 has an opening 20c and a bottom surface 20a that are linear. The corner portion in the present invention refers not only to a corner portion that is bent at a right angle as in the corner portion 26 shown in the figure, but also to a portion that is bent and forms a corner when compared with the side portion 27. Further, the side portion in the present invention does not necessarily have to be formed in a straight line, and refers to a portion that bends more gently and is close to a straight line when compared with the corner portion 26.

As shown in FIG. 3, for example, the side surface 20b of such a molding cavity 20 has a side surface 20bb extending in a predetermined shape (straight line) and a state of being bent more than the side surface 20bb (R chamfered shape). It has a corner side surface 20ba connected to the side side surface 20bb. That is, the corner side surface 20ba is connected in a bent state between two adjacent ends of the side portion 27. Specifically, in the configuration shown in the figure, two orthogonal linear side surfaces 20bb are connected by a curved surface.

Here, in the molding cavity 20, the angle θ1 between the bottom surface 20a and the side surface 20b at the corner portion 26 (see FIG. 4) is the angle θ2 between the bottom surface 20a and the side surface 20b at the side portion 27 (see FIG. 5). Greater than. That is, the angle formed by the bottom surface 20a and the side surface 20b in the molding cavity 20 is larger at the corner side surface 20ba (angle θ1) than at the side surface 20bb (angle θ2). In other words, the side surface 20b of the corner portion 26 sleeps more than the side surface 20b of the side portion 27 with respect to the bottom surface 20a (the inclination is large and the surface is gentle). When releasing the resin portion (molded product) molded in the molding cavity 20, if there is a corner portion 26 that is relatively difficult to release and a side portion 27 that is easy to release, the angle is larger than the angle θ2. By increasing θ1, it is possible to easily release the resin portion formed by the corner portion 26, and the entire resin portion can be released in a well-balanced manner. The side surface 20b may be a curved surface (a surface having an arcuate cross-sectional view) instead of the flat surface as shown in FIG.

Therefore, according to the molding die 10, it is possible to easily release the resin portion molded in the molding cavity 20, that is, the work W as a molded product, thereby preventing the occurrence of a mold release defect of the work W. The productivity of the molded product can be improved. Further, even when the release film F is used to facilitate mold release, it is easy to follow the shape of the molding cavity 20 (particularly the corner portion 26) and it is difficult to tear (elongation due to resin pressure is suppressed). State) can be. By eliminating the tearing of the release film F, the resin R does not leak inside the mold, and it is possible to prevent the mold from becoming dirty and the resin portion from having a poor shape. Further, the space 20d (see FIG. 4) formed by the side surface 20b laid down at the corner portion 26 of the molding cavity 20 can be used like the overflow cavity. Further, by providing the corner portion 26 and an air vent (not shown) communicating with the corner portion 26 in the molding die 10, it is possible to vent the air inside the mold and the outgas from the resin R.

By the way, in the prior art as described in Patent Document 1, as shown by the broken line in FIG. 6A, the width of the side surface 20b is configured to be uniform over the entire circumference in order to widen the molding region. Specifically, the radius of curvature r11 of the bottom surface 20a of the R chamfered shape at the corner 26 is smaller than the radius of curvature r2 of the opening 20c (the inner edge of the mold surface 11a) of the R chamfered shape at the corner 26. For this reason, it is difficult for the resin portion to be released from the corner portion 26, and the release film F is likely to be torn. On the other hand, in the molding die 10, as shown in FIG. 6A, the radius of curvature r1 of the bottom surface 20a of the R chamfered shape at the corner 26 is larger than the radius of curvature r2 of the opening 20c of the R chamfered shape at the corner 26. are doing. In this way, the corners are chamfered so that the portion of the bottom surface 20a (radius of curvature r1) in contact with the corner side surface 20ba is larger than the portion of the mold surface 11a (curvature radius r2) in contact with the corner side surface 20ba. The side surface 20b of the portion 26 is in a laid-down state (large angle), and the resin portion molded in the molding cavity 20 can be easily released from the mold. Even if the bottom surface 20a of the corner portion 26 is C-chamfered (FIG. 6B) or polygonally chamfered (FIG. 6C), the side surface 20b of the corner portion 26 is laid down (large angle), and the same is true. The action effect can be obtained.

Next, a resin molding method using the molding die 10 according to the embodiment of the present invention will be described with reference to FIGS. 1, 7, and 8. 7A and 7B are explanatory views of the resin molding process according to the present embodiment. FIG. 7A shows a state before the release film F is adsorbed, FIG. 7B shows a state where the release film F is adsorbed, and FIG. 7C shows a state where the release film F is completely adsorbed. ing. FIG. 8 is an explanatory view of a resin molding process following FIG. 7 (a schematic cross-sectional view of a main part of a molding die 10), showing a state in which the mold is closed and resin molded.

First, the work W, the resin R, and the release film F are set (supplied) inside the mold in a state where the molding mold 10 is opened (a state in which the upper mold 11 and the lower mold 12 are separated from each other) (FIG. 1). reference). Specifically, the work W is transported from the supply unit to the inside of the mold by the loader (or operator) of the transport unit, and the electronic component 101 is set in the work set portion 24 of the lower mold 12 toward the molding cavity 20 side. Will be done. Further, the resin R is, for example, in the shape of a tablet, is transported from the supply unit to the inside of the mold by the loader of the transport unit, and is set in the pot 23 of the lower mold 12 with the plunger 51 retracted downward.

Further, the release film F is drawn out from the feeding roll wound in a roll shape by a known film supply mechanism, passes through the mold surface 11a of the upper mold 11, and is wound on the winding roll. As a result, as shown in FIG. 7A, the mold surface 11a of the upper mold 11 is covered with the release film F. After the mold surface 11a of the upper mold 11 is covered with the release film F, the release film F is sucked from the suction path 25, so that the release film F enters the molding cavity 20 (FIG. 7B). Finally, it is set (sucked and held) according to the shape of the molding cavity 20 (FIG. 7C). As the release film F, a single-wafer film cut out from a roll film wound with a long film into, for example, a circular shape or a rectangular shape can also be used.

In the configuration using these release films F, when the release film F is set following the shape of the molding cavity 20, the release film F is attracted to the inner surface (bottom surface 20a and side surface 20b) of the molding cavity 20. , Stretched. In this case, although the release film F has some elasticity, it will be torn when it is stretched excessively. On the other hand, as described above, since the side surface 20b at the corner portion 26 is in a laid-down state (large angle), the release film F is prevented from being excessively stretched, and the release film F is formed. It can also prevent tearing.

Subsequently, the upper die 11 and the lower die 12 are brought closer to each other, and as shown in FIG. 8, the work W (carrier 100) is clamped (the molding cavity 20 is closed) and the molding die 10 is closed. Then, the plunger 51 is moved to the cal 22 side and the resin R is press-fitted into the molding cavity 20 via the runner gate 21 to fill the molding cavity 20 with the resin R. Then, the resin R filled in the molding cavity 20 is heat-cured for a predetermined time while holding the pressure, and then the mold is opened to take out the work W as a molded product, and a predetermined step (for example, a degate step of removing unnecessary resin) is performed. )I do. In this way, a molded product (work) in which the resin portion 102 (FIG. 8) defined by the main surface 102a and the side surface 102b is provided on the carrier 100 on which the electronic component 101 is mounted, and the resin portion 102 protects the electronic component 101. W) is manufactured.

By using such a molding die 10, it is possible to easily release the work W as a molded product, and it is possible to prevent the release film F from being torn. Therefore, the productivity of the molded product can be improved.

Further, since the resin portion 102 of the molded product is molded in the molding cavity 20 (FIG. 2), the side portion side surface 102bb and the corner portion side surface 102ba corresponding to the side portion side surface 20bb and the corner portion side surface 20ba are respectively formed of the resin portion 102. The side surface 102b will have. That is, the side surface 102bb extends in a predetermined shape like the side surface 20bb, and the side surface 102ba of the corner is connected to the side surface 102bb in a state of being bent more than the side surface 102bb like the side surface 20ba. Will be done. Further, the angle formed by the main surface 102a and the side surface 102b in the resin portion 102 is larger at the corner side surface 102ba (angle θ1) than at the side surface 102bb (angle θ2). A molded product (work W) provided with a resin portion 102 having such a shape can be easily released from the molding cavity 20, and productivity is improved.

(Embodiment 2)
The molding die 10A according to the embodiment of the present invention will be described with reference to FIG. FIG. 9 is a schematic cross-sectional view of a main part of the molding die 10A included in the resin molding apparatus 50. In the first embodiment, the case where it is applied to transfer molding has been described, but in this embodiment, the case where it is applied to compression molding will be described.

The resin molding apparatus 50 according to the present embodiment includes a mold opening / closing mold 10A having a molding cavity 20 in the lower mold 12. The lower mold 12 includes a base (not shown), a cavity piece 30 fixed to the base and assembled, and a clamper 31 that surrounds the cavity piece 30 and is assembled to the base via an elastic member (not shown). To be equipped. That is, in the molding die 10A, the bottom surface 20a of the molding cavity 20 is formed by the upper surface of the cavity piece 30, and the side surface 20b of the molding cavity 20 is formed by the inner side surface of the clamper 31. Further, in the molding die 10A, the cavity piece 30 and the clamper 31 are relatively movable, and the depth of the molding cavity 20 from the opening 20c (mold surface 12a) (that is, the volume of the molding cavity 20). Is variably configured. The depth of the molding cavity 20 does not necessarily have to be variable, and the clamper 31 may be fixed to the base and assembled without using an elastic member.

Further, the molding die 10A includes a work set portion 24 provided in the upper die 11 facing the forming cavity 20 of the lower die 12 so as to hold the work W by a known suction mechanism, a chuck mechanism, or the like. Further, the molding die 10A includes a release film F, and is configured such that the release film F is attached to the mold surface 12a of the lower mold 12 including the inner surface (bottom surface 20a and side surface 20b) of the molding cavity 20. In the lower mold 12, a gap is formed between the outer surface of the cavity piece 30 and the inner surface of the clamper 31, and this is used as the suction path 25, and the lower mold is used by a known suction mechanism via the suction path 25. The release film F is attached (adsorbed / held) to the mold surface 12a of the 12 molds.

If the molding cavity 20 of the molding mold 10A is opened in a rectangular shape in the mold plane view (plan view), the molding cavity 20 shown in FIGS. 4 to 6 is the lower mold 12 in the same manner as in the first embodiment. The corner portion 26 and the side portion 27 are provided, and the angle formed by the bottom surface 20a and the side surface 20b in the molding cavity 20 is larger on the corner side surface 20ba than on the side surface 20bb. Even with such a molding die 10A, it is possible to easily release the work W as a molded product and prevent the release film F from being torn. Even if the molding cavity 20 of the molding die 10A opens in a circular shape in terms of the mold surface, the same effect can be obtained by laying down the side surface 20b.

Next, a resin molding method using the molding die 10A according to the embodiment of the present invention will be described with reference to FIG. First, the work W, the resin R, and the release film F are set (supplied) inside the mold in a state where the molding mold 10A is opened (a state in which the upper mold 11 and the lower mold 12 are separated from each other). Specifically, the work W is conveyed to the inside of the mold by the loader, and the electronic component is set in the work set portion 24 of the upper mold 11 toward the molding cavity 20 side. Further, the release film F is carried into the mold by the film supply mechanism, and is set (sucked / held) on the mold surface 12a of the lower mold 12 including the inner surface of the molding cavity 20 via the suction path 25. Further, the resin R is conveyed to the inside of the mold by the loader and set in the molding cavity 20 via the release film F. The resin R can be supplied into the molding cavity 20 by arranging the resin R on the central portion of the single-wafer-shaped release film F outside the mold and carrying it into the mold together with the release film F. ..

Subsequently, the upper mold 11 and the lower mold 12 are brought closer to each other, the work W is clamped (the molding cavity 20 is closed) to close the molding mold 10A, and the upper mold 11 and the lower mold 12 are further formed. Is brought close to each other and molded, and the resin R in the molding cavity 20 is compressed. According to this mold clamping, the elastic member supporting the clamper 31 is compressed and the clamper 31 moves to the base side (lower side in FIG. 9), so that the upper surface of the cavity piece 30 waits deeply in the forming cavity 20. The molding position is shallow from the position. Then, the resin R filled in the molding cavity 20 is thermally cured for a predetermined time while holding the pressure, and then the mold is opened to take out the work W as a molded product.

By using such a molding die 10A, it is possible to easily release the work W as a molded product, and it is possible to prevent the release film F from being torn. Therefore, the productivity of the molded product can be improved.

(Embodiment 3)
The molding die 10B according to the embodiment of the present invention will be described with reference to FIG. FIG. 10 is a schematic plan view of a main part of the molding die 10B included in the resin molding apparatus 50. In the first embodiment, the molding cavity 20 (mold recess) that opens in a rectangular shape in the mold plane view (plan view) has been described. In the present embodiment, the work W having a V-notch 32 and having a circular shape in a plan view (for example, a wafer, a temporary carrier, etc.) has a circular shape in a mold plane view (plan view) that follows the shape of the work W. A molding cavity 20 having an opening in the bottom surface 20a and a side surface 20b will be described. Note that FIG. 10 shows the mold surface view (plan view) of the molding die 10B, but the work W is also shown for ease of explanation.

As shown in FIG. 10, the molding cavity 20 (mold recess) of the molding mold 10B has a corner portion 26 and a side portion 27 (peripheral portion) corresponding to the V notch 32 in the opening 20c in the mold plane view. The side surface 20b of the molding cavity 20 extends in a predetermined shape (circular shape or arc shape) in the molding die 10B as in the case described with reference to FIGS. 4 and 5 in the first embodiment. It has a portion side surface 20bb and a corner side surface 20ba connected to the side surface 20bb in a state of being bent (R chamfered shape) from the side surface 20bb. That is, the corner side surface 20ba is connected in a bent state between two adjacent ends of the side portion 27. Further, the angle formed by the bottom surface 20a and the side surface 20b in the molding cavity 20 is also a corner portion from the side surface 20bb (angle θ2) as in the case described with reference to FIGS. 4 and 5 in the first embodiment. It is large on the side surface 20ba (angle θ1). In other words, in the case of the side surface 20b formed by connecting arcs with different curvatures, the side surface 20b is laid down (angle) for the portion having a large curvature (the portion that becomes a corner) expressed as the reciprocal of the radius. Can be in a large state.

With such a shape, the side surface 20b (corner side surface 20ba) is laid down at the corner 26 compared to the shape of the bottom surface of the prior art shown by the broken line in FIG. 10, and the molding cavity 20 is formed. The release of the resin portion can be facilitated. Further, when the release film F is used for resin molding, it is possible to prevent the release film F from being torn.

(Embodiment 4)
The molding die 10C according to the embodiment of the present invention will be described with reference to FIG. FIG. 11 is a schematic plan view of a main part of the molding die 10C included in the resin molding apparatus 50. In the first embodiment, the molding cavity 20 (mold recess) opened at the mold surface 11a and having the bottom surface 20a and the side surface 20b has been described. In the present embodiment, the overflow cavity 40 (mold recess) communicating with the molding cavity 20 will be described. The overflow cavity 40 as shown in a part of the figure is not often a rectangle like the molded cavity 20 shown in FIG. 2, and may have an elongated rectangle, an oblong shape, or a bent shape as a whole. To do.

Further, the overflow cavity 40 is communicated with the molding cavity 20 of the upper mold 11 described in the first embodiment with reference to FIG. 2 on the opposite side (right side in the drawing) to the runner gate 21 (cal 22). As a result, the quality of the resin portion (molded product) molded in the molding cavity 20 can be improved by pushing out gas and air in the molding cavity 20 together with the resin R into the overflow cavity 40.

As shown in FIG. 11, the molding die 10C includes an overflow cavity 40 (mold recess) which is opened at the mold surface 11a and has a bottom surface 40a, a side surface 40b, and an opening 40c. The portion shown in the figure is a part of the overflow cavity 40, and a part of an elongated rectangle in which the linear side surfaces 40b extending in a parallel state face each other is bent 180 degrees at the end portion thereof. Is connected.

The overflow cavity 40 has a strip-shaped opening (inner edge of the mold surface 11a) in view of the mold surface, and extends from the bottom surface 40a toward the mold surface 11a. Such an overflow cavity 40 also has a corner portion 41 and a side portion 42, similarly to the molding cavity 20. In this molding die 10C as well, as in the case described with reference to FIGS. 4 and 5 in the first embodiment, the side surface 40b of the overcavity 40 extends in a predetermined shape (straight line). And a corner side surface 40ba connected to the side surface 40bb in a state of being bent (R chamfered shape) from the side surface 40bb. That is, the corner side surface 40ba is connected in a bent state between two adjacent ends of the side portion 42. Further, the angle formed by the bottom surface 40a and the side surface 40b in the overcavity 40 is also a corner portion from the side surface 40bb (angle θ2) as in the case described with reference to FIGS. 4 and 5 in the first embodiment. It is large on the side surface 40ba (angle θ1).

With such a shape, the side surface 40b (corner side surface 40ba) at the corner 41 is more than the shape of the bottom surface of the prior art which is configured so that the width of the side surface 20b is uniform as shown by the broken line in FIG. Is laid down, and the resin portion formed in the overflow cavity 40 can be easily released from the mold. Further, when the release film F is used for resin molding, it is possible to prevent the release film F from being torn.

Although the present invention has been specifically described above based on the embodiments, it goes without saying that the present invention is not limited to the above-described embodiments and can be variously modified without departing from the gist thereof.

In the above-described embodiment, a case where the mold is applied to a cavity or an overflow cavity as a mold recess having a bottom surface and a side surface and opened at the mold surface has been described. Not limited to this, it can also be applied to mold recesses such as cals and runner gates. Further, the mold recess may be provided in either the upper mold 11 or the lower mold 12, or may be provided in both. For example, a molded product using a lead frame as a carrier often has a resin portion on both sides thereof, and a mold recess for forming the resin portion is often formed deeply. Even in such a case, the present invention is effective from the viewpoints of releasability and prevention of film tearing.

Further, in the molding cavity 20 in the above embodiment, as shown in FIG. 4 and the like, a configuration example in which the side surface 20b arranged between the mold surface 11a and the bottom surface 20a linearly connects them in a cross-sectional view will be described. However, the present invention is not limited to this. For example, the side surface 20b may be provided between the mold surface 11a and the bottom surface 20a in a curved state or a bent linear shape in a cross-sectional view, and these may be connected. In this case, the surface corresponding to the side surface 20b defined by the line connecting the portion where the side surface 20b is connected to the bottom surface 20a and the portion where the side surface 20b is connected to the mold surface 11a, and the bottom surface 20a. It is also possible to define the relationship between the side surface 20bab and the side surface 20ba of the corner as described above based on the angle formed.

Further, as an angle corresponding to the angle formed by the bottom surface 20a and the side surface 20b in the molding cavity 20, the angle formed by the mold surface 11a and the side surface 20b inside the upper mold 11 (shown in θ3 and FIG. 5 shown in FIG. 4). Based on θ4), the relationship between the side surface 20bb and the corner surface 20ba as described above can also be defined.

Also in these configurations, the resin portion at the corner portion 26 is easily released from the mold as in the above embodiment, and the release film F is prevented from being torn.

10 Molding mold 11 Upper mold 11a Mold surface 20 Molding cavity 20a Bottom surface 20b Side surface 20ba Corner side surface 20bb Side surface

Claims (6)

A molding mold that is recessed and opened on the mold surface and has mold recesses defined on the bottom and side surfaces.
The side surface of the mold recess has a side surface extending in a predetermined shape and a corner side surface connected to the side surface in a state of being bent from the side surface of the side.
The angle formed by the bottom surface and the side surface in the mold recess is larger on the corner side surface than on the side surface surface.
The bottom surface in contact with the side surface of the corner is chamfered larger than the mold surface in contact with the side surface of the corner.
A molding die characterized in that a plurality of suction paths for adsorbing a release film on the mold surface are provided on the side portion of the mold recess. The molding mold according to claim 1, wherein the mold recess is a molding cavity. It said mold cavity is a circular opening, work according to claim 2, characterized in that it has the side portion side of the V-notch pair of which is formed corresponding to the angle portion side and an arc shape having Molding mold. The molding mold according to any one of claims 1 to 3, wherein the mold recess is an overflow cavity. The molding mold according to any one of claims 1 to 4, further comprising the release film to be attached to the mold surface including the bottom surface and the side surface. A resin molding apparatus comprising the molding die according to any one of claims 1 to 5.

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