JP6767625B2 - Parts mounting device - Google Patents

Description

The present invention relates to a component mounting device for mounting components in an end region of a film-shaped substrate.

In the component mounting device used in the manufacture of liquid crystal panels and the like, components are mounted (temporarily crimped) in an end region of a substrate. The component mounting device includes a board holding table and its moving mechanism, a recognition camera, a backup stage, and a mounting head. When the component mounting device mounts the component on the board, first, the board holding table holds the central portion of the board, and the end region of the board on which the component is mounted is in a horizontally protruding state. Then, the moving mechanism moves the substrate holding table, and in a state where the lower surface of the end region of the substrate is supported by the backup stage, a mark for recognizing the substrate provided in the end region is displayed from below the end region. The recognition camera recognizes the backup stage through the notches provided at the top and bottom. When the recognition camera recognizes the mark, the mounting head picks up the component, presses the component together with the substrate against the backup stage, and mounts the component on the edge region of the substrate (Patent Document 1 below).

Japanese Unexamined Patent Publication No. 2016-82111

The notch provided in the backup stage is usually set to the minimum size so that the mark for recognizing the substrate can be recognized by the recognition camera. For this reason, a dedicated backup stage is prepared according to the model of the board (according to the position of the mark), and if the position of the mark for board recognition changes due to switching of the board model, the backup stage is used. It will need to be replaced. Therefore, when the switching of the board model involves the replacement work of the backup stage, a large amount of time is required, and there is a problem that the productivity may be lowered accordingly.

Therefore, an object of the present invention is to provide a component mounting device capable of shortening the time required for switching a substrate model and improving productivity.

The component mounting device of the present invention is provided on a substrate holding table that holds a central portion of a film-shaped substrate on which components are mounted in a component mounting portion provided in an end region, a backup base, and an upper portion of the backup base. A backup unit having a plurality of support blocks and supporting the end region of the substrate whose central portion is held by the substrate holding table from below, and an end region supported by the backup unit. from below, in order to recognize the two mark provided at a position sandwiching the component mounting portion of the end region, and a two recognition cameras are provided so as to be change the interval in accordance with the spacing of the mark The plurality of support blocks include a movable block whose position with respect to the substrate holding table can be set by being movably provided with respect to the backup base, and the movable block includes the plurality of movable blocks. The position of the substrate held on the substrate holding table with respect to the mark is set so that the support block can support the end region without interfering with the recognition of the mark by the recognition camera.

According to the present invention, it is possible to shorten the time required for the work of switching the model of the substrate and improve the productivity.

Perspective view of the component mounting device according to the embodiment of the present invention. A side view of a part of the component mounting device according to the embodiment of the present invention. A perspective view showing a substrate on which a component is mounted by the component mounting device according to the embodiment of the present invention together with the component. A perspective view showing a board holding portion included in the component mounting device according to the embodiment of the present invention together with the board. A perspective view showing a board holding portion included in the component mounting device according to the embodiment of the present invention together with the board. (A) (b) Side view of a part of the component mounting device according to the embodiment of the present invention. An exploded perspective view of a substrate holding portion included in the component mounting device according to the embodiment of the present invention. (A) (b) Cross-sectional side view showing a part of a substrate holding portion included in the component mounting device according to the embodiment of the present invention together with the substrate. (A) (b) Top view of the substrate holding portion included in the component mounting device according to the embodiment of the present invention. A plan view showing a board holding portion included in the component mounting device according to the embodiment of the present invention together with the board. A block diagram showing a control system of a component mounting device according to an embodiment of the present invention. (A) (b) A perspective view showing a substrate holding portion included in the component mounting device according to the embodiment of the present invention together with a recognition camera. (A) (b) (c) Operational explanatory view of the component mounting device according to the embodiment of the present invention. (A) (b) (c) Operational explanatory view of the component mounting device according to the embodiment of the present invention. A perspective view showing a state in which a component is mounted on a substrate by a mounting head included in the component mounting device according to the embodiment of the present invention. Perspective view of the substrate holding portion included in the component mounting device in the first modification of the first embodiment of the present invention. A perspective view showing a substrate holding portion included in a component mounting device according to a second modification of an embodiment of the present invention together with a substrate. A plan view showing a substrate holding portion included in a component mounting device according to a second modification of an embodiment of the present invention together with a substrate.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. 1 and 2 show the component mounting device 1 according to the present embodiment. The component mounting device 1 is a device for mounting the film-shaped component 3 on the component mounting portion 2a provided in the end region 2R of the film-shaped substrate 2 (for example, a flexible substrate) also shown in FIG. In the following description, the left-right direction seen from the worker OP is the X-axis direction, and the front-back direction seen from the worker OP is the Y-axis direction. Further, the vertical direction is the Z-axis direction.

In FIG. 3, a plurality of electrodes 2d are provided side by side in the X-axis direction in the end region 2R of the substrate 2. These plurality of electrodes 2d are covered with a thermosetting resin tape JT such as ACF (Anisotropic Conducive Film) attached in a step prior to the component mounting device 1. In the present embodiment, the component mounting portion 2a means a part of the end region 2R of the substrate 2 in which the plurality of electrodes 2d are covered with the thermosetting resin tape JT. Two marks for recognizing the substrate (hereinafter, referred to as the substrate side mark 2m) are provided at positions on the end region 2R of the substrate 2 that sandwich the component mounting portion 2a from the X-axis direction. Each of the two substrate-side marks 2m can be recognized (imaged) from the lower side of the substrate 2.

In FIG. 3, a plurality of component-side terminals 3d are provided side by side in the X-axis direction on the lower surface of the front end portion of the component 3. Two marks for component recognition (hereinafter, referred to as component side marks 3m) are provided at positions sandwiching the component side terminal 3d from the X-axis direction. The distance between the two component-side marks 3 m is substantially the same as the distance between the two board-side marks 2 m provided on the substrate 2. Each of the two component-side marks 3m can be recognized (imaged) from above the component 3.

In FIGS. 1 and 2, the component mounting device 1 is based on the base 11, and has a substrate holding unit 12, two recognition cameras 13, a component supply table 14, a relay table 15, a transfer head 16, a mark imaging camera 17, and a mark imaging camera 17. A mounting head 18 is provided. The board holding portion 12 is provided at the front portion of the base 11 (front side seen from the worker OP), and the parts supply table 14 is provided at the rear portion of the base 11 (back side seen from the worker OP). ing. The relay table 15 is provided at a position between the board holding portion 12 and the component supply table 14 on the base 11, and the two recognition cameras 13 are provided at a position between the board holding portion 12 and the relay table 15. ing. The mark imaging camera 17 is provided above the relay table 15.

In FIGS. 2 and 4, the substrate holding unit 12 includes a substrate holding table 21 and a backup unit 22, and holds the substrate 2 in a horizontal posture. As shown in FIGS. 4 and 5, the substrate holding table 21 supports the lower surface of the central portion 2C of the substrate 2 on its upper surface. The backup unit 22 includes a backup base 31 extending horizontally rearward from the rear portion of the substrate holding table 21 and a plurality of support blocks 32 provided above the backup base 31, and the central portion 2C of the substrate holding table 21. The lower surface of the end region 2R of the substrate 2 on which the lower surface of the substrate 2 is supported is supported by a plurality of support blocks 32. The board holding portion 12 is moved in the X-axis direction, the Y-axis direction, and the Z-axis direction with respect to the base 11 by the board holding portion moving mechanism 12M (see also FIGS. 1 and 2) provided on the base 11. .. That is, the board holding unit moving mechanism 12M is a moving mechanism that integrally moves the board holding table 21 and the backup unit 22.

In FIG. 1, the two recognition cameras 13 are arranged side by side in the X-axis direction, and the imaging optical axes are directed upward. The two recognition cameras 13 capture and recognize the two substrate-side marks 2m included in the substrate 2 held by the substrate holding unit 12 from below. Each of the two recognition cameras 13 is movable in the X-axis direction by the recognition camera moving mechanism 13M (see also FIGS. 1 and 2) attached to the base 11, and has two board-side marks 2m provided on the board 2. The interval can be changed according to the interval.

In FIGS. 1 and 2, the component supply table 14 is composed of a plate-shaped member having a flat upper surface, and a plurality of components 3 mounted on the substrate 2 are placed on the component supply table 14. The parts supply table 14 is moved in the X-axis direction and the Y-axis direction by the parts supply table moving mechanism 14M provided on the base 11. By operating the component supply table moving mechanism 14M to move the component supply table 14, any component 3 placed on the component supply table 14 is attracted to a predetermined component supply position (the component 3 is attracted to the transfer head 16). Position) can be positioned.

In FIGS. 1 and 2, the relay table 15 is made of a plate-shaped member having a flat upper surface. The relay table 15 is moved in the Y-axis direction by the relay table moving mechanism 15M provided on the base 11. By operating the relay table moving mechanism 15M, the relay table 15 can be moved between the rear position (the position shown in FIG. 6A) and the front position (the position shown in FIG. 6B).

In FIG. 2, the transfer head 16 is provided with a component suction port 16K at the lower end for sucking the component 3. The transfer head 16 is moved in the Y-axis direction and the Z-axis direction by the transfer head moving mechanism 16M (see also FIG. 1) provided on the base 11.

In FIGS. 1 and 2, the mark imaging camera 17 points the imaging optical axis downward. The mark imaging camera 17 is moved in the X-axis direction by the mark imaging camera moving mechanism 17M provided on the base 11, so that the two component-side marks 3m included in the component 3 placed on the relay table 15 can be moved from above. Image and recognize.

In FIG. 2, the mounting head 18 is provided with a component suction portion 18K that sucks the component 3 at the lower end. The mounting head 18 is located above a predetermined position (hereinafter referred to as a working position SG) set above the recognition camera 13 (see also FIGS. 6A and 6B), and is mounted on the base 11. It is moved in the Z-axis direction by the mounted head moving mechanism 18M (see also FIG. 1) provided, and is rotated around the Z-axis.

Next, the configuration of the substrate holding portion 12 will be described. In FIGS. 5, 7 and 8 (a) and 8 (b), a guide portion 31G extending upward is formed at the rear end of the backup base 31 provided at the rear portion of the substrate holding table 21. The backup base 31 is provided with a through hole 33 extending in the X-axis direction and penetrating in the vertical direction.

In FIGS. 5, 7 and 8 (a) and 8 (b), a block fixing member 34 is provided on the upper surface of the backup base 31 so as to extend in the X-axis direction. The block fixing member 34 is detachably attached to the backup base 31 by a plurality of fixing screws 35 at a position in front of the through hole 33. The rear surface 34 m (FIGS. 7 and 8 (a)) of the block fixing member 34 has a slope whose normal line faces diagonally backward and downward.

In FIGS. 5, 7 and 8 (a) and 8 (b), each of the three support blocks 32 is arranged on the upper surface of the backup base 31. The rear surface of each support block 32 is in contact with the front surface of the guide portion 31G. The front surface 32 m (FIGS. 7 and 8 (a)) of each support block 32 is a slope whose normal line faces diagonally upward and forward, and is in contact with the rear surface 34 m of the block fixing member 34.

In FIGS. 5 and 7, the three support blocks 32 are composed of one fixed block 32A arranged in the center and two movable blocks 32B arranged on the left and right sides of the fixed block 32A. The fixed block 32A is fixedly provided at the central portion of the backup base 31, and each of the two movable blocks 32B is provided with a notch 32K penetrating in the vertical direction (FIGS. 9A and 9A, See also b)).

When the fixing screw 35 is tightened to bring the block fixing member 34 into close contact with the upper surface of the backup base 31, the front surface 32m of each movable block 32B is pressed downward and backward by the rear surface 34m of the block fixing member 34, and each movable block 32B backs up. It is fixed to the base 31. On the other hand, when the fixing screw 35 is loosened, the fixing of each movable block 32B to the backup base 31 is released, and each movable block 32B is moved in the X-axis direction with respect to the backup base 31 (and therefore with respect to the through hole 33). Can be done. Therefore, the position of each movable block 32B with respect to the backup base 31 can be arbitrarily changed.

9 (a) and 9 (b) show an example in which the positions of the two movable blocks 32B in the X-axis direction are changed. FIG. 9A shows an example in which the two movable blocks 32B are arranged close to the fixed block 32A located at the center, and FIG. 9B shows the two movable blocks 32B separated from the fixed block 32A. This is an example of placement.

The two movable blocks 32B have two substrate-side marks 2m of the substrate 2 in a state where the end region 2R of the substrate 2 whose central portion 2C is held by the substrate holding table 21 is supported by the three supporting blocks 32. It is positioned and fixed with respect to the backup base 31 so that the notch 32K is located directly below (that is, the substrate side mark 2m can be visually recognized from below through the notch 32K and the through hole 33) (FIG. 4 and FIG. 10).

In FIGS. 5, 7 and 8 (a) and 8 (b), a porous member 36 having a flat upper surface is embedded in each of the central portion of the substrate holding table 21 and the plurality of support blocks 32. Has been done. The upper surface of each porous member 36 is exposed upward from the substrate holding table 21 or each support block 32.

In FIGS. 8A and 8B, a vacuum pressure supply line 41 extends inside the substrate holding table 21, and the vacuum pressure supply line 41 is formed on a porous member 36 provided on the board holding table 21. It is connected. The vacuum pressure supply line 41 is connected to the control valve 42 outside the substrate holding table 21, and the control valve 42 is connected to the vacuum source VC provided outside the component mounting device 1.

When the vacuum pressure supplied by the vacuum source VC is supplied from the vacuum pressure supply line 41 to the porous member 36 provided on the substrate holding table 21 by the operation of the control valve 42, the pores of the porous member 36 are formed. A suction force is generated on the upper surface of the porous member 36 (that is, the upper surface of the substrate holding table 21). When the substrate 2 is placed on the substrate holding table 21 (FIG. 8 (a) → FIG. 8 (b)) and a suction force is generated on the upper surface of the substrate holding table 21 in this state, the suction force causes the center of the substrate 2. Part 2C is suction-held on the upper surface of the substrate holding table 21 (FIG. 8 (b)).

In FIGS. 8A and 8B, a suction pipe line 43 is connected to each support block 32. Each suction line 43 is connected to the above-mentioned control valve 42, and the vacuum pressure supplied by the vacuum source VC is supplied from the suction line 43 to each support block 32 by the operation of the control valve 42. A suction force is generated on the upper surface of each porous member 36 (that is, the upper surface of each support block 32) through the pores of each porous member 36. When a suction force is generated on the upper surface of each support block 32 while the substrate 2 is placed on the substrate holding table 21, the end region 2R of the substrate 2 is attracted to the upper surface side of each support block 32 by this suction force. , The lower surface of the support block 32 is in close contact with the upper surface of each support block 32 (FIG. 8 (b)).

As described above, in the present embodiment, the vacuum source VC, the control valve 42, and the suction pipe line 43 serve as a suction mechanism 44 that sucks the end region 2R of the substrate 2 and brings it into close contact with the upper surface of each of the plurality of support blocks 32. (FIGS. 8 (a) and 8 (b)).

As described above, the central portion 2C and the end region 2R of the substrate 2 are sucked through the pores of the porous member 36, but the pores of the porous member 36 have a pore diameter of about 60 μm. Since the thickness of the substrate 2 is sufficiently small as compared with the thickness of the substrate 2, the surface of the substrate 2 is not pulled into the pores.

In FIG. 11, the control device 50 included in the component mounting device 1 is the movement of the board holding portion 12 by the board holding portion moving mechanism 12M, the imaging of the board side mark 2m by the two recognition cameras 13, and the two recognition camera moving mechanisms 13M. The movement of the recognition camera 13, the movement of the parts supply table 14 by the parts supply table movement mechanism 14M, and the movement of the relay table 15 by the relay table movement mechanism 15M are controlled.

Further, as shown in FIG. 11, the control device 50 attracts the component 3 by the transfer head 16, moves the transfer head 16 by the transfer head moving mechanism 16M, and images the component side mark 3 m by the mark imaging camera 17. The mark imaging camera moving mechanism 17M controls the movement of the mark imaging camera 17, the mounting head 18 attracts the component 3, and the mounting head moving mechanism 18M controls the movement of the mounting head 18. Further, the control device 50 controls the generation of the suction force of the substrate 2 on the upper surfaces of the substrate holding table 21 and the plurality of support blocks 32 by the control valve 42.

In FIG. 11, the image information obtained by the two recognition cameras 13 and the image data obtained by the mark imaging camera 17 are sent to the control device 50, respectively, and the control device 50 performs required image recognition based on the image data. I do. An input / output device 51 such as a touch panel is connected to the control device 50, and the operator OP can perform necessary input to the component mounting device 1 through the input / output device 51. Further, the worker OP can obtain various information about the component mounting device 1 through the input / output device 51.

When the component 3 is mounted on the board 2 by the component mounting device 1 having such a configuration, the operator OP operates the recognition camera moving mechanism 13M so that the distance between the two recognition cameras 13 is two boards. Make sure that it matches the distance between the side marks 2 m (arrow A shown in FIG. 12 (a)). Further, in order to make the two substrate side marks 2m located in the end region 2R of the substrate 2 visible from below the substrate holding portion 12, the positions of the two movable blocks 32B having the notch 32K are adjusted. deep.

As described above, in the component mounting device 1 of the present embodiment, the movable block 32B can support the end region 2R of the substrate 2 without the plurality of support blocks 32 hindering the recognition of the substrate side mark 2m by the recognition camera 13. Is set to a position with respect to the substrate holding table 21.

First, the component mounting device 1 operates the board holding unit moving mechanism 12M to position the board holding unit 12 at a predetermined board receiving position, and receives the board 2 supplied from the outside of the component mounting device 1 by the board holding unit 12. .. Then, the control valve 42 is operated so that the substrate holding portion 12 sucks and holds the substrate 2 (board holding step).

In the substrate holding step, the central portion 2C of the substrate 2 is held by the substrate holding table 21, and the end region 2R is supported by the three support blocks 32. Therefore, the end region 2R of the substrate 2 does not hang downward, and the substrate 2 is held in a horizontal posture as a whole (FIG. 12A).

After the substrate holding portion 12 sucks and holds the substrate 2, the control device 50 operates the substrate holding portion moving mechanism 12M to position the end region 2R of the substrate 2 at the working position SG (working position moving step. FIG. Arrow B shown in 12 (b) and FIG. 13 (a). At this time, since the board holding table 21 and the three support blocks 32 move integrally, the board 2 held in the horizontal posture by the board holding table 21 and the three support blocks 32 moves in a state of maintaining the horizontal posture. .. When the end region 2R of the substrate 2 is located at the working position SG, the two substrate-side marks 2m included in the substrate 2 are located above the two recognition cameras 13 (FIGS. 12 (b) and 13 (a)). ..

When the end region 2R of the substrate 2 is located at the working position SG, the control device 50 operates the two recognition cameras 13 to image the two substrate-side marks 2m (board-side mark imaging step). The control device 50 recognizes the image data obtained by this, grasps the posture of the component mounting portion 2a located at the working position SG, and rotates the component mounting portion 2a in the X-axis direction, the Y-axis direction, and the Z-axis. The positional deviation in each rotation direction is calculated (the substrate side positional deviation calculation step).

After recognizing the two board-side marks 2m by the two recognition cameras 13 and calculating the positional deviation of the component mounting portion 2a at the working position SG, the control device 50 moved the transfer head 16 above the component supply table 14. The component 3 is attracted to the transfer head 16 by lowering it. Then, the transfer head 16 on which the component 3 is attracted is moved above the relay table 15, and the component 3 is placed (temporarily placed) on the relay table 15 located at the rear position by the relay table moving mechanism 15M. (FIG. 13 (a). Temporary parts placement step).

When the transfer head 16 temporarily places the component 3 on the relay table 15, the control device 50 moves the transfer head 16 upward and further rearward from the transfer head 16 to move the component 3 to the upper region (mark) of the relay table 15. The transfer head 16 is retracted from the image pickup region by the image pickup camera 17), and the transfer head 16 is then moved above the component 3 to be transferred to the relay table 15 (FIG. 13 (b)). When the transfer head 16 is retracted from the upper region of the relay table 15, the control device 50 causes the mark imaging camera 17 to image the two component-side marks 3m included in the component 3 on the relay table 15 (FIG. 13B). ). Imaging of the two component-side marks 3 m is performed by moving the mark imaging camera 17 in the X-axis direction by the mark imaging camera moving mechanism 17M (component-side mark imaging step).

When the mark imaging camera 17 images the component side mark 3m, the control device 50 recognizes the image obtained by the imaging and grasps the position of the component 3 on the relay table 15. Then, when the position of the component 3 on the relay table 15 in the X-axis direction deviates from the regular position, the amount of the misalignment from the regular position is calculated (part side misalignment calculation step).

After calculating the amount of misalignment of the component 3 on the relay table 15 from the normal position, the control device 50 operates the relay table moving mechanism 15M to move the relay table 15 from the rear position to the front position (FIG. 13 (FIG. 13). c). Relay table moving process). When the relay table 15 is moved in the X-axis direction in this relay table moving step, the control device 50 corrects the displacement amount of the component 3 on the relay table 15 calculated in the component side position deviation calculation step in the X-axis direction. .. By the relay table moving step, the component 3 on the relay table 15 is located above the working position SG, that is, directly below the mounting head 18. The control device 50 moves the transfer head 16 above the component supply table 14 while executing the relay table moving step, and then attracts the component 3 to be mounted on the relay table 15 to the transfer head 16. (FIG. 13 (c)).

After the relay table 15 is positioned in the front position, the control device 50 lowers the mounting head 18. Then, the component 3 on the relay table 15 is attracted to the mounting head 18, and the component 3 is picked up by the mounting head 18 (FIG. 14 (a). Pickup step).

When the mounting head 18 picks up the component 3, the control device 50 moves the relay table 15 to the rear position and retracts the relay table 15 from above the working position SG (FIG. 14 (b). Relay table retracting step). At the same time, the control device 50 moves the transfer head 16 above the relay table 15 that has been moved to the rear position (FIG. 14 (b)).

When the relay table 15 is retracted from above the work position SG, the control device 50 determines the amount of misalignment on the substrate 2 side calculated in the substrate side misalignment calculation step and the component 3 side calculated in the component side misalignment calculation step. Based on the amount of misalignment, position correction is performed so that the two board-side marks 2m and the two component-side marks 3m coincide with each other in a plan view. Specifically, the substrate holding portion moving mechanism 12M is operated to move the substrate holding portion 12 (that is, the substrate 2) in a horizontal plane, and the mounting head moving mechanism 18M is operated to move the mounting head 18 (that is, the component 3). ) Rotate around the Z axis (position correction process).

In the component mounting device 1 according to the present embodiment, the substrate holding table 21 that holds the lower surface of the central portion 2C of the substrate 2 and the plurality of support blocks 32 that support the lower surface of the end region 2R of the substrate 2 are integrally moved. Therefore, the position correction can be performed while the substrate 2 is supported by the support block 32.

When the control device 50 corrects the positions so that the two board-side marks 2m and the two component-side marks 3m match in a plan view, the mounting head moving mechanism 18M is operated to move the mounting head 18 to the working position SG. Lower from above. As a result, the mounting head 18 presses the component 3 against the component mounting portion 2a of the board 2 supported by the three support blocks 32 (arrows C shown in FIGS. 14C and 15), and crimps the component 3 to the substrate 2. (Parts mounting process. FIGS. 14 (c) and 15). At this time, the pressing force of the component 3 by the mounting head 18 acts on the substrate holding table 21 from the support block 32. At the same time, the control device 50 moves the transfer head 16 and places the component 3 attracted to the transfer head 16 on the relay table 15 located at the rear position (FIG. 14 (c)). ).

When the component 3 is mounted on the board 2, the control device 50 operates the mounting head moving mechanism 18M to raise the mounting head 18. When the mounting head 18 is raised, the control device 50 operates the board holding portion moving mechanism 12M to move the board holding portion 12 to a predetermined board delivery position. When the board holding portion 12 is located at the board delivery position, the control device 50 operates the control valve 42 to release the suction force of the board 2 in the board holding table 21 and each support block 32, and then the component 3 is mounted. The board 2 is delivered to an external mechanism (not shown) of the component mounting device 1 (board delivery step). As a result, the mounting work of the component 3 per board 2 is completed.

As described above, in the component mounting device 1 according to the present embodiment, the backup unit 22 that supports the end region 2R of the substrate 2 in which the central portion 2C is held by the substrate holding table 21 from below is the backup base 31 and its backup unit 22. It is composed of a plurality of support blocks 32 provided on the upper portion, and these plurality of support blocks 32 include a movable block 32B that is movable with respect to the backup base 31. The movable block 32B is positioned with respect to the backup base 31 so that the plurality of support blocks 32 can support the end region 2R of the substrate 2 without interfering with the recognition of the substrate side mark 2m by the recognition camera 13. It has become. Therefore, when the position of the board side mark 2m changes due to the switching of the board 2 model, the position of the movable block 32B with respect to the backup base 31 may be changed, depending on the board 2 model (the position of the board side mark 2m). Instead, the recognition camera 13 can recognize the board-side mark 2m.

Further, as in the present embodiment, the substrate holding table 21 and the backup unit 22 are integrally moved by the moving mechanism (board holding part moving mechanism 12M), and the end region 2R of the board 2 is at a predetermined position (in the above example). In the configuration in which the recognition camera 13 recognizes the board side mark 2m from below the end region 2R while being positioned at the working position SG), the central portion 2C is held by the substrate holding table 21 and the end portion is held. The substrate 2 can be moved while the region 2R is supported by the backup unit 22. Therefore, even if the substrate 2 is in the form of a film, the end region 2R does not hang down, and the recognition camera 13 can accurately recognize the substrate side mark 2m, so that the mounting accuracy of the component 3 is improved.

In the component mounting device 1 according to the present embodiment, the suction mechanism 44 sucks the end region 2R of the substrate 2 held by the substrate holding portion 12 and brings it into close contact with the upper surface of each of the plurality of support blocks 32. There is. Therefore, even if the end region 2R of the film-shaped substrate 2 is deformed such as wrinkles or warpage, the deformation is corrected and flattened, and the recognition accuracy of the substrate side mark 2 m by the recognition camera 13 is corrected. Is improved.

Further, in the component mounting device 1 according to the present embodiment, the movable block 32B is provided with a notch 32K penetrating in the vertical direction (Z-axis direction), and the recognition camera 13 is provided with the substrate side mark 2m through the notch 32K. It is designed to be recognized. Therefore, the peripheral portion of the board side mark 2m in the component 3 can be stably supported in the area surrounding the notch 32K of the movable block 32B, and the pressing force applied to the component 3 when the component 3 is mounted is applied to the substrate side mark 2m. The component 3 can be reliably mounted (crimped) on the substrate 2 by acting on the peripheral portion of the substrate 2.

FIG. 16 shows a first modification of the component mounting device 1 according to the present embodiment. In this first modification, instead of each of the plurality of support blocks 32 having a porous member 36, a plurality of suction ports 32S opening on the upper surface are provided, and a suction pipe line 43 is provided in these suction ports 32S. It has a connected configuration. Even in the component mounting device of the first modification as described above, similarly to the component mounting device 1 in the above-described embodiment, the end region 2R of the substrate 2 is sucked and brought into close contact with the upper surface of each support block 32. Can be made to.

17 and 18 show a second modification of the component mounting device 1 according to the present embodiment. In this second modification, there are five support blocks 32, of which two movable blocks 32B are provided on the left and right sides of the central fixed block 32A, but all four movable blocks 32B are notched 32K. Does not have. The position of each movable block 32B with respect to the substrate holding table 21 is set so that the substrate side mark 2m is located between the adjacent movable blocks 32B. Even in the component mounting device of the second modification as described above, similarly to the component mounting device 1 in the above-described embodiment, the substrate side mark 2m provided on the substrate 2 is passed through the through hole 33 from below the backup unit 22. It can be accurately recognized by the recognition camera 13.

Although embodiments of the present invention have been described so far, the present invention is not limited to those described above. For example, in the above-described embodiment, one of the plurality of (three or five) support blocks 32 is a fixed block 32A fixed to the backup base 31, but the fixed block 32A may not be present. All of the support blocks 32 may be movable blocks 32B. The number of movable blocks 32B may be at least one, and the number of support blocks 32 (the number of fixed blocks 32A and the number of movable blocks 32B) is not limited.

Further, in the above-described embodiment, the backup unit 22 is not fixed to the base 11, and the board holding table 21 and the backup unit 22 are integrally moved by a moving mechanism (board holding unit moving mechanism 12M). Although it has a configuration, the present invention can also be applied to a component mounting device of a type in which the backup unit 22 is fixed to the base 11.

Provided is a component mounting device capable of shortening the time required for switching board models and improving productivity.

1 Component mounting device 2 Board 2C Central part 2R End area 2m Board side mark (mark)
3 Parts 12M Board holder Moving mechanism (moving mechanism)
13 Recognition camera 21 Board holding table 22 Backup unit 31 Backup base 32 Support block 32B Movable block 32K Notch 44 Suction mechanism SG Working position (predetermined position)

Claims (4)

A substrate holding table that holds the central portion of a film-shaped substrate on which components are mounted in a component mounting portion provided in the end region,
A backup unit having a backup base and a plurality of support blocks provided on the upper part of the backup base, and supporting the end region of the substrate from below, the central portion of which is held by the substrate holding table.
From below of the support is the end regions in said backup unit, in order to recognize the two mark provided at a position sandwiching the component mounting portion of the end region, change the interval in accordance with the spacing of the mark two recognition camera provided so as to be,
It is a component mounting device equipped with
The plurality of support blocks include a movable block whose position with respect to the substrate holding table can be set by being movably provided with respect to the backup base, and the movable block includes the plurality of support blocks formed by the recognition camera. A component mounting device characterized in that a position of the substrate held on the substrate holding table with respect to the mark is set so that the end region can be supported without interfering with the recognition of the mark. The substrate holding table and the backup unit are integrally moved by a moving mechanism, and the recognition camera recognizes the mark from below the end region in a state where the end region is located at a predetermined position. The component mounting device according to claim 1. A suction mechanism that attracts the end region of the substrate whose central portion is held by the substrate holding table and whose end region is supported by the backup portion and brings the end region into close contact with the upper surface of each of the plurality of support blocks. The component mounting device according to claim 1 or 2, wherein the component mounting device is provided. The component mounting device according to any one of claims 1 to 3, wherein the movable block is provided with a notch penetrating in the vertical direction.

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