JP6739018B2

JP6739018B2 - Lighting device and method of manufacturing lighting device

Info

Publication number: JP6739018B2
Application number: JP2016219789A
Authority: JP
Inventors: 規義浅田; 進長; 和貴吉田
Original assignee: Ｆｋｋ株式会社
Priority date: 2016-11-10
Filing date: 2016-11-10
Publication date: 2020-08-12
Anticipated expiration: 2036-11-10
Also published as: JP2018078044A

Description

本発明は、照明装置および照明装置の製造方法に関する。 The present invention relates to a lighting device and a method for manufacturing a lighting device.

複数の発光素子が列状に実装された長尺のフレキシブル回路基板と、透光性の軟性樹脂材料から角筒状に形成された中空チューブと、を備え、中空チューブの内側にフレキシブル回路基板が挿入されてなるフレキシブル発光体が提案されている（例えば特許文献１参照）。 A long flexible circuit board on which a plurality of light emitting elements are mounted in a row and a hollow tube formed from a light-transmitting soft resin material in a rectangular tube shape are provided, and the flexible circuit board is provided inside the hollow tube. A flexible light emitter inserted is proposed (for example, refer to Patent Document 1).

特開２００７−１５０２７１号公報JP, 2007-150271, A

ところで、特許文献１に記載のフレキシブル発光体は、フレキシブル回路基板を中空チューブ内に挿入してからその中空チューブの長手方向における両端部を封着してなるものである。これにより、フレキシブル回路基板の長手方向における両端部のみが、中空チューブに固定された状態で中空チューブ内に配置されるというものである。従って、フレキシブル回路基板の中央部、即ち、中空チューブに固定されていない部分では、フレキシブル発光体の設置状態が変化すると、それに伴いフレキシブル回路基板に撚れが生じその姿勢が変化してしまう場合がある。 By the way, the flexible light-emitting body described in Patent Document 1 is obtained by inserting a flexible circuit board into a hollow tube and then sealing both ends of the hollow tube in the longitudinal direction. As a result, only the both ends in the longitudinal direction of the flexible circuit board are arranged inside the hollow tube while being fixed to the hollow tube. Therefore, in the central part of the flexible circuit board, that is, in the part that is not fixed to the hollow tube, if the installation state of the flexible light-emitting body changes, the flexible circuit board may be twisted and its posture may change. is there.

本発明は、上記事由に鑑みてなされたものであり、カバー内での回路基板の撚れの発生が抑制された照明装置および照明装置の製造方法を提供することを目的とする。 The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a lighting device and a method for manufacturing the lighting device in which twisting of the circuit board in the cover is suppressed.

上記目的を達成するため、本発明に係る照明装置は、
可撓性を有する長尺の回路基板と、
前記回路基板に列状に実装された複数の発光素子と、
透光性の軟性材料から形成され前記回路基板および前記複数の発光素子を覆う透光性部を有する長尺のカバーと、を備え、
前記回路基板の長手方向の両端部と、前記回路基板の少なくとも長手方向の中央部における短手方向の両端部と、は、前記カバーに埋設され、
前記カバーは、
透光性材料から長尺な筒状に形成され、外壁に前記カバーの長手方向に沿って形成された取付面を有する筒状部と、
透光性材料から長尺な板状に形成され、前記筒状部の内側において前記取付面に対して傾斜した姿勢で短手方向の両端部が前記筒状部に接続されるとともに、一面に前記回路基板が固定される固定部と、を有する。 In order to achieve the above object, the lighting device according to the present invention,
A long circuit board having flexibility,
A plurality of light emitting elements mounted in a row on the circuit board,
A long cover having a translucent portion formed of a translucent soft material and covering the circuit board and the plurality of light emitting elements;
Both ends of the circuit board in the longitudinal direction and both ends of the circuit board in the lateral direction at the central portion of at least the longitudinal direction are embedded in the cover ,
The cover is
A tubular portion formed of a translucent material in a long tubular shape, and having a mounting surface formed along the longitudinal direction of the cover on the outer wall,
It is formed in a long plate shape from a translucent material, and both ends in the lateral direction are connected to the tubular portion in a posture inclined with respect to the mounting surface inside the tubular portion, and on one surface. A fixing portion to which the circuit board is fixed .

他の観点から見た本発明に係る照明装置の製造方法は、
可撓性を有する長尺の回路基板に複数の発光素子を列状に実装する工程と、
断面コ字状の長尺の第１金型部が、前記回路基板の前記複数の発光素子が実装される第１主面において前記回路基板の短手方向における両端部を除く部位を覆うように配置されるとともに、長尺のキャビティを有する第２金型部の前記キャビティ内に前記回路基板および前記第１金型部が配置された状態で、前記第１金型部と前記第２金型部との間の領域に軟性材料を充填して押し出すことにより、前記回路基板および前記複数の発光素子を覆うカバーを形成する工程と、を含む。 From a different point of view, the manufacturing method of the lighting device according to the present invention,
A step of mounting a plurality of light emitting elements in a row on a flexible long circuit board;
A long first mold part having a U-shaped cross section covers a part of the first main surface of the circuit board on which the plurality of light emitting elements are mounted, except for both ends in the lateral direction of the circuit board. The first mold part and the second mold with the circuit board and the first mold part arranged in the cavity of the second mold part having a long cavity. Forming a cover for covering the circuit board and the plurality of light emitting elements by filling and extruding a soft material into a region between the circuit board and the portion.

本発明によれば、回路基板の短手方向における両端部が、カバーに埋設されている。これにより、複数の発光素子が実装された回路基板の長手方向全体に亘って回路基板がカバーに固定されるので、照明装置の設置状態に関わらず回路基板の姿勢が一定である。従って、カバー内での回路基板の撚れの発生が抑制される。 According to the present invention, both ends of the circuit board in the lateral direction are embedded in the cover. As a result, the circuit board is fixed to the cover over the entire length of the circuit board on which the plurality of light emitting elements are mounted, and therefore the posture of the circuit board is constant regardless of the installation state of the lighting device. Therefore, the twisting of the circuit board in the cover is suppressed.

本発明の実施の形態に係る照明装置を示し、（Ａ）は平面図であり、（Ｂ）は斜視図である。The illuminating device which concerns on embodiment of this invention is shown, (A) is a top view, (B) is a perspective view. 実施の形態に係る照明装置の図１（Ａ）のＡ−Ａ線における断面矢視図である。FIG. 2 is a cross-sectional view taken along the line AA of FIG. 1A of the lighting device according to the embodiment. （Ａ）は実施の形態に係る照明装置の製造方法を説明するための図であり、（Ｂ）は実施の形態に係る押出成型機の概略断面図である。(A) is a figure for demonstrating the manufacturing method of the illuminating device which concerns on embodiment, (B) is a schematic sectional drawing of the extrusion molding machine which concerns on embodiment. 実施の形態に係る押出成型機の図３（Ｂ）のＢ−Ｂ線における断面矢視図である。It is a cross-sectional arrow view in the BB line of FIG.3(B) of the extrusion molding machine which concerns on embodiment. （Ａ）乃至（Ｃ）は変形例に係る照明装置の断面図である。(A) thru|or (C) are sectional drawings of the illuminating device which concerns on a modification. （Ａ）乃至（Ｃ）は変形例に係る照明装置の断面図である。(A) thru|or (C) are sectional drawings of the illuminating device which concerns on a modification. （Ａ）および（Ｂ）は変形例に係る照明装置の断面図である。(A) And (B) is sectional drawing of the illuminating device which concerns on a modification. （Ａ）乃至（Ｃ）は変形例に係る照明装置の断面図である。(A) thru|or (C) are sectional drawings of the illuminating device which concerns on a modification. （Ａ）乃至（Ｃ）は変形例に係る照明装置の断面図である。(A) thru|or (C) are sectional drawings of the illuminating device which concerns on a modification. （Ａ）および（Ｂ）は変形例に係る照明装置の断面図である。(A) And (B) is sectional drawing of the illuminating device which concerns on a modification. （Ａ）および（Ｂ）は変形例に係る照明装置の断面図である。(A) And (B) is sectional drawing of the illuminating device which concerns on a modification.

以下に、本発明の実施の形態に係る照明装置について添付図面を参照しながら説明する。図１（Ａ）および（Ｂ）に示すように、照明装置１は、可撓性を有する長尺の回路基板２１と、複数の発光素子２２と、発光素子２２に流れる電流を制限するための限流素子２３と、可撓性を有する長尺なカバー１１と、を備える。また、照明装置１は、発光素子２２へ電流を供給するための導電線１３と、カバー１１の長手方向における両端部に装着されカバー１１内を密閉するキャップ１２と、を備える。照明装置１は、導電線１３を介して直流電源（図示せず）に接続される。 Hereinafter, a lighting device according to an embodiment of the present invention will be described with reference to the accompanying drawings. As shown in FIGS. 1A and 1B, the lighting device 1 has a flexible long circuit board 21, a plurality of light emitting elements 22, and a current for flowing through the light emitting elements 22. The current limiting element 23 and the flexible elongated cover 11 are provided. Further, the lighting device 1 includes a conductive wire 13 for supplying a current to the light emitting element 22, and caps 12 attached to both ends of the cover 11 in the longitudinal direction to seal the inside of the cover 11. The lighting device 1 is connected to a DC power supply (not shown) via a conductive wire 13.

回路基板２１は、例えばＦＰＣ（Flexible Printed Circuits）から構成されており、導体パターン（図示せず）が形成されている。 The circuit board 21 is composed of, for example, FPC (Flexible Printed Circuits), and has a conductor pattern (not shown) formed thereon.

発光素子２２は、例えばＳＭＤ（Surface Mount Device）タイプＬＥＤ（Light Emitting Diode）素子から構成される。複数の発光素子２２は、回路基板２１の第１主面（以下「実装面２１ｂ」と称する。）２１ｂに等間隔に列状に実装されている。発光素子２２は、回路基板２１に形成された導体パターンを介して、互いに直列または並列に接続されている。限流素子２３は、回路基板２１に形成された導体パターンに介挿され、発光素子２２に流れる電流を予め設定された大きさに制限する。直流電源から導電線１３および導電パターンを通じて発光素子２２に電流が流れると、発光素子２２が点灯する。 The light emitting element 22 is composed of, for example, an SMD (Surface Mount Device) type LED (Light Emitting Diode) element. The plurality of light emitting elements 22 are mounted on the first main surface (hereinafter referred to as “mounting surface 21b”) 21b of the circuit board 21 in a row at equal intervals. The light emitting elements 22 are connected in series or in parallel with each other via a conductor pattern formed on the circuit board 21. The current limiting element 23 is inserted in the conductor pattern formed on the circuit board 21, and limits the current flowing through the light emitting element 22 to a preset magnitude. When a current flows from the DC power supply to the light emitting element 22 through the conductive wire 13 and the conductive pattern, the light emitting element 22 lights up.

カバー１１は、透光性の軟性材料から形成されている。軟性材料としては、透光性を有する熱硬化性のポリウレタン樹脂やシリコーン樹脂等を採用することができる。カバー１１全体が、発光素子２２から放射される光を透過する透光性部となっている。カバー１１は、角筒状である。カバー１１は、回路基板２１に実装された複数の発光素子２２からの光を出射する平坦な光出射面１１３（第２面）と、光出射面１１３に対向する平坦な背面１１４と、を有する。回路基板２１および複数の発光素子２２は、カバー１１の内側に配置されている。回路基板２１の短手方向における両端部２１ａは、カバー１１に埋設されており、回路基板２１における実装面２１ｂとは反対側の第２主面（以下「裏面」と称する）２１ｃは、カバー１１に密着している。ここで、回路基板２１の少なくとも長手方向の中央部における短手方向の両端部が、カバー１１に埋設されている。また、回路基板２１の長手方向の両端部も、カバー１１に埋設されている。また、カバー１１は、その外壁の角部に、その長手方向に沿ってテーパ面（第１面）１１２が形成されている。カバー１１の光出射面１１３は、回路基板２１の実装面２１ｂに平行であり、カバー１１の、実装面２１ｂが臨む方向側の外壁にカバー１１の長手方向に沿って形成されている。光出射面１１３には、カバー１１の長手方向に沿って延長された溝１１１が設けられている。この溝１１１は、装飾用の溝である。テーパ面１１２は、図２に示すように、回路基板２１における複数の発光素子２２が実装される実装面２１ｂに対して傾斜している。 The cover 11 is made of a translucent soft material. As the soft material, a translucent thermosetting polyurethane resin or silicone resin can be used. The entire cover 11 is a translucent portion that transmits the light emitted from the light emitting element 22. The cover 11 has a rectangular tube shape. The cover 11 has a flat light emitting surface 113 (second surface) that emits light from the plurality of light emitting elements 22 mounted on the circuit board 21, and a flat back surface 114 that faces the light emitting surface 113. .. The circuit board 21 and the plurality of light emitting elements 22 are arranged inside the cover 11. Both ends 21a in the lateral direction of the circuit board 21 are embedded in the cover 11, and the second main surface (hereinafter referred to as “rear surface”) 21c of the circuit board 21 opposite to the mounting surface 21b is a cover 11. Is in close contact with. Here, at least both ends of the circuit board 21 in the lateral direction at the central portion in the longitudinal direction are embedded in the cover 11. Both ends of the circuit board 21 in the longitudinal direction are also embedded in the cover 11. Further, the cover 11 has a taper surface (first surface) 112 formed at the corner of the outer wall along the longitudinal direction thereof. The light emitting surface 113 of the cover 11 is parallel to the mounting surface 21b of the circuit board 21, and is formed on the outer wall of the cover 11 on the side facing the mounting surface 21b along the longitudinal direction of the cover 11. The light emitting surface 113 is provided with a groove 111 extending along the longitudinal direction of the cover 11. The groove 111 is a groove for decoration. As shown in FIG. 2, the tapered surface 112 is inclined with respect to the mounting surface 21b of the circuit board 21 on which the plurality of light emitting elements 22 are mounted.

キャップ１２は、透光性を有する樹脂材料から形成され、有底角筒状の形状を有する。キャップ１２の底壁には、導電線１３を導出するための導出孔１２ａが設けられている。キャップ１２の内側断面の寸法は、カバー１１の断面の外形寸法よりも大きく、カバー１１の長手方向における両端部を覆うように装着されている。 The cap 12 is formed of a translucent resin material and has a bottomed rectangular tube shape. The bottom wall of the cap 12 is provided with a lead-out hole 12a for leading out the conductive wire 13. The size of the inner cross section of the cap 12 is larger than the outer size of the cross section of the cover 11, and the cap 12 is mounted so as to cover both ends in the longitudinal direction of the cover 11.

次に、本実施の形態に係る照明装置１の製造方法について説明する。本実施の形態に係る照明装置１の製造方法は、回路基板２１に複数の発光素子２２を列状に実装する工程と、回路基板２１および複数の発光素子２２を覆うカバー１１を形成する工程と、を含む。回路基板２１に発光素子２２を実装する工程では、可撓性を有するテープ状の樹脂基板上に導体パターンを形成し、その後、発光素子２２および限流素子２３を列状にボンディングすることによりテープ状発光モジュール２０Ｂを作製する。カバー１１を形成する工程では、例えば図３（Ａ）に示すようなカバー形成装置が使用される。カバー形成装置は、第１リール１０１１と、押し出し成型機１０１２と、軟性樹脂供給部１０１３と、熱硬化機１０１４と、カバー１１Ａと一体となったテープ状発光モジュール２０Ｂを巻き取る第２リール１０１５と、を備える。そして、テープ状発光モジュール２０Ｂは、カバー１１を形成する工程を行う前において、予め第１リール１０１１に巻回されている。ここで、軟性樹脂供給部１０１３は、軟性樹脂を押し出し成型機１０１２へ供給するためのものである。 Next, a method for manufacturing the lighting device 1 according to the present embodiment will be described. The method of manufacturing the lighting device 1 according to the present embodiment includes a step of mounting a plurality of light emitting elements 22 on the circuit board 21 in a row, and a step of forming the cover 11 that covers the circuit board 21 and the plurality of light emitting elements 22. ,including. In the step of mounting the light emitting elements 22 on the circuit board 21, a conductor pattern is formed on a flexible tape-shaped resin substrate, and then the light emitting elements 22 and the current limiting elements 23 are bonded in rows to form a tape. The light emitting module 20B is manufactured. In the step of forming the cover 11, for example, a cover forming device as shown in FIG. 3(A) is used. The cover forming device includes a first reel 1011, an extrusion molding machine 1012, a soft resin supply unit 1013, a thermosetting machine 1014, and a second reel 1015 that winds the tape-shaped light emitting module 20B integrated with the cover 11A. , Is provided. The tape-shaped light emitting module 20B is wound around the first reel 1011 in advance before the step of forming the cover 11. Here, the soft resin supply unit 1013 is for supplying the soft resin to the extrusion molding machine 1012.

押し出し成型機１０１２は、図３（Ｂ）に示すような金型１１２１を有する。金型１１２１は、長尺の第１金型部１１２４と第２金型部１１２５とを有する。第１金型部１１２４は、図４に示すように、断面コ字状に形成され、第２金型部１１２５は、長尺のキャビティ１１２５ａを有する。また、第２金型部１１２５のキャビティ１１２５ａの内壁には、第１金型部１１２４と第２金型部１１２５との間の領域Ａ１へ突出するリブ１１２３が設けられている。そして、第１金型部１１２４が、回路基板２１Ｂの発光素子２２が実装される実装面において回路基板２１Ｂの短手方向における両端部を除く部位を覆うように配置され、第２金型部１１２５のキャビティ１１２５ａ内に回路基板２１Ｂおよび第１金型部１１２４が配置される。この状態で、導入孔１１２２を通じて軟性材料を領域Ａ１に充填して押し出すことにより、回路基板２１Ｂおよび発光素子２２を覆う非加熱軟性樹脂部１１Ｂが形成される。この非加熱軟性樹脂部１１Ｂは、熱硬化処理を行う前の状態の軟性樹脂材料から形成されている。また、第２金型部１１２５にリブ１１２３が設けられていることにより、軟性材料を領域Ａ１に充填して押し出すことにより形成された非加熱軟性樹脂部１１Ｂに、カバー１１の溝１１１の基となる溝が形成される。 The extrusion molding machine 1012 has a mold 1121 as shown in FIG. The mold 1121 has a long first mold part 1124 and a long mold part 1125. As shown in FIG. 4, the first mold part 1124 is formed in a U-shaped cross section, and the second mold part 1125 has an elongated cavity 1125a. Further, a rib 1123 is provided on the inner wall of the cavity 1125a of the second mold part 1125 so as to project to the region A1 between the first mold part 1124 and the second mold part 1125. Then, the first die part 1124 is arranged so as to cover a portion of the circuit board 21B on which the light emitting elements 22 are mounted, excluding both ends in the lateral direction of the circuit board 21B, and the second die part 1125. The circuit board 21B and the first mold part 1124 are arranged in the cavity 1125a of the. In this state, the region A1 is filled with the soft material through the introduction hole 1122 and extruded to form the non-heated soft resin portion 11B that covers the circuit board 21B and the light emitting element 22. The non-heated soft resin portion 11B is formed of the soft resin material in a state before the thermosetting treatment. Further, since the ribs 1123 are provided on the second mold part 1125, the non-heated soft resin part 11B formed by filling the region A1 with the soft material and extruding the base material into the groove 111 of the cover 11 Groove is formed.

ここで、カバー形成装置の動作の概要について説明する。まず、第１リール１０１１に巻回されたテープ状発光モジュール２０Ｂが、押し出し成型機１０１２に供給される。そして、押し出し成型機１０１２において、前述のように非加熱軟性樹脂部１１Ｂが形成される。押し出し成型機１０１２により非加熱軟性樹脂部１１Ｂと一体となったテープ状発光モジュール２０Ｂは、熱硬化機１０１４に供給される。そして、熱硬化機１０１４において、非加熱軟性樹脂部１１Ｂが加熱され硬化されることにより、カバー１１Ａが形成される。カバー１１Ａと一体となったテープ状発光モジュール２０Ｂは、第２リール１０１５に巻き取られる。 Here, an outline of the operation of the cover forming apparatus will be described. First, the tape-shaped light emitting module 20B wound around the first reel 1011 is supplied to the extrusion molding machine 1012. Then, in the extrusion molding machine 1012, the non-heated soft resin portion 11B is formed as described above. The tape-shaped light emitting module 20B integrated with the non-heated soft resin portion 11B by the extrusion molding machine 1012 is supplied to the thermosetting machine 1014. Then, in the thermosetting machine 1014, the cover 11A is formed by heating and curing the non-heated soft resin portion 11B. The tape-shaped light emitting module 20B integrated with the cover 11A is wound on the second reel 1015.

その後、第２リール１０１５に巻き取られたカバー１１Ａと一体となったテープ状発光モジュール２０Ｂを、照明装置１の仕様により定められた長さに切断する。これにより得られる回路基板２１、発光素子２２およびカバー１１からなる構造体が得られる。そして、この構造体にキャップ１２および導電線１３を接続することにより、照明装置１が得られる。 After that, the tape-shaped light emitting module 20B integrated with the cover 11A wound on the second reel 1015 is cut into a length determined by the specifications of the lighting device 1. As a result, a structure including the circuit board 21, the light emitting element 22 and the cover 11 is obtained. Then, the lighting device 1 is obtained by connecting the cap 12 and the conductive wire 13 to this structure.

以上説明したように、本実施の形態に係る照明装置１によれば、回路基板２１の長手方向の両端部と、回路基板２１の少なくとも長手方向の中央部における短手方向の両端部と、が、カバー１１に埋設されている。これにより、複数の発光素子２２が実装された回路基板２１の長手方向全体に亘って、回路基板２１がカバー１１に固定されるので、照明装置１の設置状態に関わらず回路基板２１の姿勢が一定である。従って、カバー１１内での回路基板２１の撚れの発生が抑制される。 As described above, according to the lighting device 1 of the present embodiment, the longitudinal end portions of the circuit board 21 and the lateral end portions of the circuit board 21 at least in the central portion in the longitudinal direction are provided. Embedded in the cover 11. As a result, the circuit board 21 is fixed to the cover 11 over the entire longitudinal direction of the circuit board 21 on which the plurality of light emitting elements 22 are mounted, so that the posture of the circuit board 21 is maintained regardless of the installation state of the lighting device 1. It is constant. Therefore, the occurrence of twist of the circuit board 21 in the cover 11 is suppressed.

また、本実施の形態に係る照明装置１によれば、回路基板２１の長手方向の両端部と、回路基板２１の少なくとも長手方向の中央部における短手方向の両端部と、が、カバー１１に埋設されていることにより、高い防水性を有するという利点がある。 Further, according to the lighting device 1 according to the present embodiment, the longitudinal ends of the circuit board 21 and the lateral ends of at least the central portion of the circuit board 21 in the lateral direction are provided in the cover 11. By being embedded, there is an advantage that it has high waterproofness.

更に、本実施の形態に係る照明装置１の製造方法によれば、第１リール１０１１に巻回されたテープ状発光モジュール２０Ｂが、押し出し成型機１０１２に供給されると、押し出し成型機１０１２において、前述のように非加熱軟性樹脂部１１Ｂが形成される。そして、非加熱軟性樹脂部１１Ｂと一体となったテープ状発光モジュール２０Ｂが、熱硬化機１０１４において加熱され硬化されることにより、カバー１１Ａが形成される。これにより、例えばカバー１１Ａを作製してからカバー１１Ａにテープ状発光モジュール２０Ｂを挿入する製造方法に比べて工程数を低減することができるという利点がある。 Furthermore, according to the method for manufacturing the lighting device 1 according to the present embodiment, when the tape-shaped light emitting module 20B wound around the first reel 1011 is supplied to the extrusion molding machine 1012, the extrusion molding machine 1012 The non-heated soft resin portion 11B is formed as described above. Then, the tape-shaped light emitting module 20B integrated with the non-heated soft resin portion 11B is heated and hardened in the thermosetting machine 1014 to form the cover 11A. This has an advantage that the number of steps can be reduced as compared with a manufacturing method in which the cover 11A is manufactured and then the tape-shaped light emitting module 20B is inserted into the cover 11A.

また、本実施の形態に係る照明装置１によれば、カバー１１が、長尺な角筒状であり、外壁に回路基板２１の実装面２１ｂに対して傾斜し、カバー１１の長手方向に沿って形成されたテーパ面１１２を有する。また、カバー１１は、外壁に回路基板２１の実装面２１ｂに対して平行であり、外壁における回路基板２１の実装面２１ｂが臨む方向側にカバー１１の長手方向に沿って形成された光出射面１１３を有する。そして、光出射面１１３には、カバー１１の長手方向に沿って延長された溝１１１が設けられている。これにより、カバー１１の意匠性が向上するので、照明装置１の見栄えが良くなるという利点がある。 Further, according to the illumination device 1 according to the present embodiment, the cover 11 has a long rectangular tube shape, is inclined with respect to the mounting surface 21b of the circuit board 21 on the outer wall, and extends along the longitudinal direction of the cover 11. It has the taper surface 112 formed by. In addition, the cover 11 is parallel to the mounting surface 21b of the circuit board 21 on the outer wall, and the light emitting surface formed along the longitudinal direction of the cover 11 on the side of the outer wall facing the mounting surface 21b of the circuit board 21. It has 113. The light emitting surface 113 is provided with a groove 111 extending along the longitudinal direction of the cover 11. As a result, the design of the cover 11 is improved, and there is an advantage that the appearance of the lighting device 1 is improved.

更に、本実施の形態に係る照明装置１では、回路基板２１の裏面２１ｃが、カバー１１に密着している。これにより、発光素子２２で発生した熱が、回路基板２１およびカバー１１を通じて、カバー１１の外部へ放出され易くなる。 Further, in the lighting device 1 according to the present embodiment, the back surface 21c of the circuit board 21 is in close contact with the cover 11. Thereby, the heat generated in the light emitting element 22 is easily released to the outside of the cover 11 through the circuit board 21 and the cover 11.

（変形例）
以上、本発明の実施の形態について説明したが、本発明は前述の実施の形態の構成に限定されるものではない。例えば、図５（Ａ）に示す照明装置２０１のように、カバー２１１が、角筒状であり、テーパ面や溝が形成されていないものであってもよい。また、図５（Ｂ）に示す照明装置３０１のように、カバー３１１の、回路基板２１の実装面２１ｂが臨む方向側の外壁にテーパ面３１１ａが形成されている構成であってもよい。或いは、図５（Ｃ）に示す照明装置４０１のように、カバー４１１の、回路基板２１の実装面２１ｂが臨む方向側とは反対側の外壁にテーパ面４１１ａが形成されている構成であってもよい。なお、図５（Ａ）乃至（Ｃ）において、実施の形態に係る照明装置１と同様の構成については図２と同一の符号を付している。本構成によれば、実施の形態に係る構成に比べて、押し出し成型機１０１２で使用される金型の構造を簡素化することができる。 (Modification)
Although the embodiments of the present invention have been described above, the present invention is not limited to the configurations of the above-described embodiments. For example, like the illumination device 201 shown in FIG. 5A, the cover 211 may be in the shape of a rectangular tube without a tapered surface or groove. Further, as in an illumination device 301 shown in FIG. 5B, a tapered surface 311a may be formed on the outer wall of the cover 311 on the side facing the mounting surface 21b of the circuit board 21. Alternatively, as in a lighting device 401 illustrated in FIG. 5C, a structure in which a tapered surface 411a is formed on an outer wall of the cover 411 opposite to a side facing the mounting surface 21b of the circuit board 21 is provided. Good. 5A to 5C, the same components as those of the illumination device 1 according to the embodiment are denoted by the same reference numerals as those in FIG. According to this configuration, the structure of the mold used in the extrusion molding machine 1012 can be simplified as compared with the configuration according to the embodiment.

実施の形態では、２つの溝１１１が、カバー１１の外壁に形成された回路基板２１の実装面２１ｂに対して平行な光出射面１１３に設けられている構成について説明したが、溝が設けられる面は、この光出射面１１３に限定されるものではない。例えば、図６（Ａ）に示す照明装置５０１のように、カバー５１１が、角筒状であり、その回路基板２１の実装面２１ｂに対して直交する２つの側面（第３面）５１４それぞれに溝５１１ａが設けられた構成であってもよい。また、図６（Ｂ）に示す照明装置６０１のように、カバー６１１が、角筒状でありその２つの側面（第３面）６１４それぞれに溝６１１ａが設けられるとともに、４つの角部それぞれにテーパ面６１１ｂが形成されている構成であってもよい。或いは、図６（Ｃ）に示す照明装置７０１のように、カバー７１１が、角筒状でありその２つの側面（第３面）７１４それぞれに溝７１１ａが設けられるとともに、カバー７１１の、回路基板２１の実装面２１ｂが臨む方向側の外壁にテーパ面７１１ｂが形成されている構成であってもよい。なお、溝５１１ａ、６１１ａ、７１１ａは、カバー５１１、６１１、７１１の長手方向に沿って延長されている。なお、図６（Ａ）乃至（Ｃ）において、実施の形態に係る照明装置１と同様の構成については図２と同一の符号を付している。 In the embodiment, the configuration in which the two grooves 111 are provided on the light emitting surface 113 parallel to the mounting surface 21b of the circuit board 21 formed on the outer wall of the cover 11 has been described, but the grooves are provided. The surface is not limited to this light emitting surface 113. For example, as in a lighting device 501 shown in FIG. 6A, the cover 511 is in the shape of a rectangular tube and is provided on each of two side surfaces (third surface) 514 orthogonal to the mounting surface 21b of the circuit board 21. A configuration in which the groove 511a is provided may be used. Further, as in a lighting device 601 shown in FIG. 6B, the cover 611 is in the shape of a rectangular tube, and two side surfaces (third surface) 614 of the cover 611 are provided with grooves 611a and four corners are provided. The taper surface 611b may be formed. Alternatively, as in a lighting device 701 illustrated in FIG. 6C, the cover 711 has a square tubular shape and a groove 711a is provided on each of two side surfaces (third surface) 714 of the cover 711 and a circuit board of the cover 711 is provided. The taper surface 711b may be formed on the outer wall of the side of the mounting surface 21b facing the mounting surface 21b. The grooves 511a, 611a, 711a are extended along the longitudinal direction of the covers 511, 611, 711. Note that in FIGS. 6A to 6C, the same components as those of the lighting device 1 according to the embodiment are denoted by the same reference numerals as those in FIG.

本構成によれば、実施の形態と同様にカバー５１１、６１１、７１１の意匠性が向上するので、照明装置５０１、６０１、７０１の見栄えが良くなるという利点がある。 According to this configuration, the designability of the covers 511, 611, 711 is improved as in the case of the embodiment, so that there is an advantage that the lighting devices 501, 601, 701 look good.

実施の形態では、カバー１１の形状が角筒状である場合について説明したが、カバー１１の形状はこれに限定されるものではない。例えば図７（Ａ）に示す照明装置８０１のように、カバー８１１の回路基板２１の実装面２１ｂが臨む方向側の外壁が外方へ凸となる形で湾曲している、即ち、カバー８１１がいわゆる蒲鉾型の形状を有するものであってもよい。或いは、図７（Ｂ）に示す照明装置１２０１のように、円筒状のカバー１２１１を備えるものであってもよい。なお、図７（Ａ）および（Ｂ）において、実施の形態に係る照明装置１と同様の構成については図２と同一の符号を付している。 In the embodiment, the case where the shape of the cover 11 is a rectangular tube has been described, but the shape of the cover 11 is not limited to this. For example, like an illumination device 801 shown in FIG. 7A, the outer wall of the cover 811 on the side facing the mounting surface 21b of the circuit board 21 is curved so as to project outward, that is, the cover 811 is It may have a so-called kamaboko shape. Alternatively, the lighting device 1201 illustrated in FIG. 7B may include a cylindrical cover 1211. 7A and 7B, the same components as those of the lighting device 1 according to the embodiment are denoted by the same reference numerals as those in FIG.

また、例えば図８（Ａ）に示す照明装置１３０１のように、カバー１３１１が、透光性の軟性材料から角筒状に形成された筒状部１３１２と、透光性の軟性材料から三角柱状に形成され筒状部１３１２と連続一体の透光性部１３１３と、を有するものであってもよい。ここで、透光性部１３１３は、回路基板２１の実装面２１ｂに対して傾斜したテーパ面１３１１ｂを有する。或いは、図８（Ｂ）に示す照明装置１４０１のように、カバー１４１１が、透光性の軟性材料から角筒状に形成された筒状部１４１２と、透光性の軟性材料から三角柱状に形成され筒状部１４１２と連続一体の２つの透光性部１４１３、１４１４と、を有するものであってもよい。ここで、２つの透光性部１４１３、１４１４は、それぞれ回路基板２１の実装面２１ｂに対して傾斜したテーパ面１４１１ｂ、１４１１ｃを有する。そして、テーパ面１４１１ｂとテーパ面１４１１ｃとは、互いに交差している。更に、図８（Ｃ）に示す照明装置２００１のように、カバー２０１１が、透光性の軟性材料から角筒状に形成された筒状部２０１２と、透光性の軟性材料から台形柱状に形成され筒状部２０１２と連続一体の透光性部２０１３と、を有するものであってもよい。ここで、透光性部２０１３は、それぞれ回路基板２１の実装面２１ｂに対して平行な平行面２０１３ａと、実装面２１ｂに対して傾斜した２つのテーパ面２０１３ｂ、２０１３ｃと、を有する。なお、図８（Ａ）乃至（Ｃ）において、実施の形態に係る照明装置１と同様の構成については図２と同一の符号を付している。 Further, for example, like a lighting device 1301 illustrated in FIG. 8A, a cover 1311 includes a cylindrical portion 1312 formed of a light-transmitting soft material in a square tube shape, and a light-transmitting soft material having a triangular prism shape. And a transparent portion 1313 which is formed integrally with the cylindrical portion 1312 and is continuously integrated. Here, the translucent portion 1313 has a tapered surface 1311b inclined with respect to the mounting surface 21b of the circuit board 21. Alternatively, as in a lighting device 1401 illustrated in FIG. 8B, a cover 1411 includes a cylindrical portion 1412 formed of a light-transmitting soft material in a square tube shape, and a light-transmitting soft material in a triangular prism shape. It may have two transparent portions 1413, 1414 that are formed integrally with the tubular portion 1412. Here, the two light transmissive portions 1413 and 1414 have tapered surfaces 1411b and 1411c that are inclined with respect to the mounting surface 21b of the circuit board 21, respectively. The tapered surface 1411b and the tapered surface 1411c intersect each other. Further, as in a lighting device 2001 illustrated in FIG. 8C, a cover 2011 includes a tubular portion 2012 formed of a light-transmitting soft material in a square tube shape, and a light-transmitting soft material in a trapezoidal column shape. It may have a light-transmitting portion 2013 formed integrally with the tubular portion 2012. Here, the translucent portion 2013 has a parallel surface 2013a parallel to the mounting surface 21b of the circuit board 21 and two tapered surfaces 2013b and 2013c inclined with respect to the mounting surface 21b. 8A to 8C, the same components as those of the illumination device 1 according to the embodiment are denoted by the same reference numerals as those in FIG.

更に、例えば図９（Ａ）に示す照明装置１５０１のように、カバー１５１１が、透光性材料から角筒状に形成された筒状部１５１２と、透光性材料から半円柱状に形成され筒状部１５１２と連続一体の透光性部１５１３と、を有するものであってもよい。ここで、透光性部１５１３は、回路基板２１の実装面２１ｂが臨む方向側の外壁が外方へ凸となる形で湾曲しているいわゆる蒲鉾型の形状を有する。或いは、図９（Ｂ）に示す照明装置１６０１のように、カバー１６１１が、透光性の軟性材料から角筒状に形成された筒状部１６１２と、透光性の軟性材料から台形柱状に形成された透光性部１６１３と、を有するものであってもよい。ここで、透光性部１６１３は、その断面における上底に対応する面側で筒状部１６１２に接続されており、回路基板２１の実装面２１ｂに対して傾斜したテーパ面１６１３ａ、１６１３ｂと、実装面２１ｂに平行な平行面１６１３ｃと、を有する。或いは、図９（Ｃ）に示す照明装置１７０１のように、カバー１７１１が、透光性の軟性材料から角筒状に形成された筒状部１７１２と、透光性の軟性材料から形成され筒状部１７１２の上面から隆起した隆起部１７１３と、を有するものであってもよい。隆起部１７１３は、その長手方向に直交する断面が外方へ凸となる形で湾曲している。また、隆起部１７１３は、頂部に窪み部１７１１ｂが形成されている。なお、図９（Ａ）乃至（Ｃ）において、実施の形態に係る照明装置１と同様の構成については図２と同一の符号を付している。 Further, for example, as in a lighting device 1501 shown in FIG. 9A, a cover 1511 is formed of a light-transmitting material in a square tubular shape and a tubular portion 1512 formed of a light-transmitting material in a semicylindrical shape. It may have a cylindrical portion 1512 and a light-transmitting portion 1513 that is continuously integrated. Here, the translucent portion 1513 has a so-called kamaboko shape in which the outer wall on the side facing the mounting surface 21b of the circuit board 21 is curved so as to be convex outward. Alternatively, as in a lighting device 1601 illustrated in FIG. 9B, a cover 1611 includes a tubular portion 1612 formed of a light-transmitting soft material in a square tube shape, and a light-transmitting soft material in a trapezoidal column shape. And the formed light-transmitting portion 1613. Here, the translucent portion 1613 is connected to the tubular portion 1612 on the surface side corresponding to the upper bottom in its cross section, and tapered surfaces 1613a and 1613b inclined with respect to the mounting surface 21b of the circuit board 21, And a parallel surface 1613c parallel to the mounting surface 21b. Alternatively, as in a lighting device 1701 illustrated in FIG. 9C, a cover 1711 includes a cylindrical portion 1712 formed of a light-transmitting soft material in a square tube shape, and a tube formed of a light-transmitting soft material. And a raised portion 1713 that is raised from the upper surface of the shaped portion 1712. The raised portion 1713 is curved so that its cross section orthogonal to the longitudinal direction is convex outward. In addition, the raised portion 1713 has a recessed portion 1711b formed at the top. 9A to 9C, the same components as those of the illumination device 1 according to the embodiment are denoted by the same reference numerals as those in FIG.

以上図７乃至図９に示す構成によれば、実施の形態と同様にカバー８１１、１２１１、１３１１、１４１１、２０１１、１５１１、１６１１、１７１１の意匠性が向上するので、照明装置８０１、１２０１、１３０１、１４０１、２００１、１５０１、１６０１、１７０１の見栄えが良くなるという利点がある。 According to the configurations shown in FIGS. 7 to 9 above, the design of the covers 811, 1211, 1311, 1411, 2011, 1511, 1611, 1711 is improved as in the case of the embodiment, so that the illumination devices 801, 1201, 1301 are improved. , 1401, 2001, 1501, 1601, 1701 have the advantage that they look good.

実施の形態に係る照明装置１では、回路基板２１の実装面２１ｂがカバー１１の背面１１４と平行になる姿勢で、回路基板２１がカバー１１の内側に配置される例について説明したが、回路基板２１の姿勢はこれに限定されるものではない。例えば図１０（Ａ）に示す照明装置９０１のように、回路基板２１の実装面２１ｂが、カバー９１１の取付面９１１ａに対して傾斜した姿勢で、回路基板２１がカバー９１１の内側に配置される構成であってもよい。なお、図１０（Ａ）において実施の形態に係る照明装置１と同様の構成については図２と同一の符号を付している。ここにおいて、カバー９１１は、筒状部９１２と、固定部９１３と、を有する。筒状部９１２は、透光性材料から長尺な三角筒状に形成され、外壁にカバー９１１の長手方向に沿って形成された取付面９１１ａ、９１１ｂを有する。また、固定部９１３は、透光性材料から長尺な矩形板状に形成され、筒状部９１２の内側において取付面９１１ａ、９１１ｂに対して傾斜した姿勢で短手方向の両端部が筒状部９１２に接続されている。そして、固定部９１３の一面には、回路基板２１が固定される。固定部９１３は、取付面９１１ａ、９１１ｂに対して傾斜しており筒状部９１２の長手方向に沿って形成された傾斜面９１１ｃに平行な姿勢である。そして、回路基板２１は、固定部９１３における筒状部９１２の傾斜面９１１ｃを臨む面に固定されている。また、筒状部９１２の、回路基板２１の実装面２１ｂが臨む方向側の外壁に、回路基板２１の厚さ方向に平行なテーパ面９１１ｄ、９１１ｅと、取付面９１１ａ、９１１ｂに平行なテーパ面９１１ｆ、９１１ｇと、が形成されている構成であってもよい。或いは、図１０（Ｂ）に示す照明装置１１０１のように、カバー１１１１が、外壁に平坦な取付面１１１１ａ、１１１１ｂと、外方に凸となる形で湾曲した曲面１１１１ｃと、が形成された筒状部１１１２を有する構成であってもよい。なお、図１０（Ｂ）において図１０（Ａ）と同様の構成については同一の符号を付している。本構成によれば、発光素子２２から放射される光の配光領域を、取付面９１１ａ、９１１ｂ、１１１１ａ、１１１１ｂと交差する方向へ傾けることができる。 In the lighting device 1 according to the embodiment, an example in which the circuit board 21 is arranged inside the cover 11 with the mounting surface 21b of the circuit board 21 parallel to the back surface 114 of the cover 11 has been described. The posture of 21 is not limited to this. For example, like a lighting device 901 shown in FIG. 10A, the circuit board 21 is arranged inside the cover 911 such that the mounting surface 21b of the circuit board 21 is inclined with respect to the mounting surface 911a of the cover 911. It may be configured. Note that in FIG. 10A, the same components as those of the illumination device 1 according to the embodiment are denoted by the same reference numerals as those in FIG. Here, the cover 911 has a tubular portion 912 and a fixing portion 913. The tubular portion 912 is formed of a translucent material into a long triangular tubular shape, and has attachment surfaces 911 a and 911 b formed on the outer wall along the longitudinal direction of the cover 911. The fixing portion 913 is formed of a light-transmissive material in the shape of a long rectangular plate, and has both ends in the lateral direction of the tubular portion 912 that are inclined with respect to the mounting surfaces 911 a and 911 b inside the tubular portion 912. It is connected to the section 912. Then, the circuit board 21 is fixed to one surface of the fixing portion 913. The fixed portion 913 is inclined with respect to the attachment surfaces 911 a and 911 b and is in a posture parallel to the inclined surface 911 c formed along the longitudinal direction of the tubular portion 912. The circuit board 21 is fixed to the surface of the fixed portion 913 facing the inclined surface 911c of the tubular portion 912. Further, on the outer wall of the tubular portion 912 on the side facing the mounting surface 21b of the circuit board 21, tapered surfaces 911d and 911e parallel to the thickness direction of the circuit board 21 and tapered surfaces parallel to the mounting surfaces 911a and 911b. 911f and 911g may be formed. Alternatively, as in a lighting device 1101 illustrated in FIG. 10B, a cover 1111 has a flat mounting surface 1111a and 1111b on the outer wall and a curved surface 1111c that is curved outwardly. A configuration having the shape portion 1112 may be used. Note that in FIG. 10B, the same components as those in FIG. 10A are denoted by the same reference numerals. According to this configuration, the light distribution region of the light emitted from the light emitting element 22 can be tilted in the direction intersecting the mounting surfaces 911a, 911b, 1111a, 1111b.

実施の形態では、カバー１１の全体が透光性の軟性材料から形成されている例について説明したが、これに限らず、例えばカバーの一部が非透光性材料から形成されていてもよい。例えば図１１（Ａ）に示す照明装置１８０１のように、カバー１８１１が、全体として角筒状であり、透光性の軟性材料から形成された透光性部１８１２と、非透光性の軟性材料から形成され回路基板２１および複数の発光素子２２の一部を覆う非透光性部１８１３と、を有するものであってもよい。ここにおいて、回路基板２１は、カバー１８１１における非透光性部１８１３に埋設されている。或いは、図１１（Ｂ）に示す照明装置１９０１のように、カバー１９１１が、発光素子２２の光出射方向側を覆うように設けられた非透光性部１９１３と、回路基板２１、発光素子２２および非透光性部１９１３を覆う透光性部１９１２と、を有するものであってもよい。本構成によれば、透光性部１８１２、１９１２および非透光性部１８１３、１９１３それぞれの配置により、照明装置１８０１、１９０１の配光特性を変化させることができる。 In the embodiment, the example in which the entire cover 11 is made of a light-transmitting soft material has been described, but the present invention is not limited to this, and for example, a part of the cover may be made of a non-light-transmitting material. .. For example, as in a lighting device 1801 illustrated in FIG. 11A, a cover 1811 has a square tubular shape as a whole, a light-transmitting portion 1812 formed of a light-transmitting soft material, and a non-light-transmitting soft material. A non-translucent part 1813 formed of a material and covering a part of the circuit board 21 and the plurality of light emitting elements 22 may be included. Here, the circuit board 21 is embedded in the non-translucent portion 1813 of the cover 1811. Alternatively, like a lighting device 1901 shown in FIG. 11B, a cover 1911 is provided with a non-translucent portion 1913 provided so as to cover the light emitting direction side of the light emitting element 22, the circuit board 21, and the light emitting element 22. And a light transmitting portion 1912 that covers the non-light transmitting portion 1913. According to this configuration, the light distribution characteristics of the lighting devices 1801 and 1901 can be changed by disposing the translucent portions 1812 and 1912 and the non-translucent portions 1813 and 1913, respectively.

実施の形態では、発光素子２２がＳＭＤタイプのＬＥＤ素子から構成される例について説明したが、発光素子２２の種類はこれに限定されるものではなく、例えばいわゆる砲弾型のＬＥＤ素子から構成されるものであってもよい。或いは、発光素子２２が、有機ＥＬ素子または他の無機ＬＥ素子から構成されるものであってもよい。 In the embodiment, the example in which the light emitting element 22 is configured by the SMD type LED element has been described, but the type of the light emitting element 22 is not limited to this, and is configured by, for example, a so-called shell type LED element. It may be one. Alternatively, the light emitting element 22 may be composed of an organic EL element or another inorganic LE element.

実施の形態では、導電線１３が照明装置１の長手方向における片端部のみから導出されている例について説明したが、これに限らず、導電線が、照明装置１の長手方向における
両端部それぞれから導出している構成であってもよい。 In the embodiment, the example in which the conductive wire 13 is led out from only one end in the longitudinal direction of the lighting device 1 has been described, but the present invention is not limited to this, and the conductive wire is led from both ends in the longitudinal direction of the lighting device 1. It may be a derived structure.

以上、本発明の各実施の形態および変形例（なお書きに記載したものを含む。以下、同様。）について説明したが、本発明はこれらに限定されるものではない。本発明は、実施の形態及び変形例が適宜組み合わされたもの、それに適宜変更が加えられたものを含む。 Although the respective embodiments and modifications of the present invention (including those described in the description. The same applies hereinafter) have been described above, the present invention is not limited to these. The present invention includes a combination of the embodiments and the modified examples as appropriate, and a suitably modified version thereof.

本発明の照明装置は、各種商業施設の照明用途として好適に使用される。 INDUSTRIAL APPLICABILITY The lighting device of the present invention is suitably used for lighting of various commercial facilities.

１，２０１，３０１，４０１，５０１，６０１，７０１，８０１，９０１，１１０１，１２０１，１３０１，１４０１，１５０１，１６０１，１７０１，１８０１，１９０１，２００１：照明装置、１１，１１Ａ，２１１，３１１，４１１，５１１，６１１，７１１，８１１，９１１，１１１１，１２１１，１３１１，１４１１，１５１１，１６１１，１７１１，１８１１，１９１１，２０１１：カバー、１１Ｂ：非加熱軟性樹脂部、１２：キャップ、１２ａ：導出孔、１３：導電線、２０Ｂ：テープ状発光モジュール、２１，２１Ｂ：回路基板、２１ａ：両端部、２１ｂ：実装面、２１ｃ：裏面、２２：発光素子、２３：限流素子、１１１，５１１ａ，６１１ａ，７１１ａ：溝、１１２，３１１ａ，４１１ａ，６１１ｂ，７１１ｂ，９１１ｄ，９１１ｅ，９１１ｆ，９１１ｇ，１３１１ｂ，１４１１ｂ，１４１１ｃ，１６１３ａ，１６１３ｂ，２０１３ｂ，２０１３ｃ：テーパ面、１１３：光出射面、１６１３ｃ，２０１３ａ：平行面、１１４：背面、５１４，６１４，７１４：側面、９１１ａ、９１１ｂ、１１１１ａ、１１１１ｂ：取付面、９１１ｃ：傾斜面、９１２，１１１２、１３１２，１４１２，１５１２，１６１２，１７１２，２０１２：筒状部、９１３：固定部、１０１１：第１リール、１０１２：押し出し成型機、１０１３：軟性樹脂供給部、１０１４：熱硬化機、１０１５：第２リール、１１１１ｃ：曲面、１１２１：金型、１１２２：導入孔、１１２３：リブ、１１２４：第１金型部、１１２５：第２金型部、１１２５ａ：キャビティ、１３１３，１４１３，１４１４，１５１３，１６１３，１８１２，１９１２，２０１３：透光性部、１８１３，１９１３：非透光性部、１７１１ｂ：窪み部、１７１３：隆起部 1, 201, 301, 401, 501, 601, 701, 801, 901, 1101, 1201, 1301, 1401, 1501, 1601, 1701, 1801, 1901, 20011: Illumination device, 11, 11A, 211, 311, 411 , 511, 611, 711, 811, 911, 1111, 1211, 1311, 1411, 1511, 1611, 1711, 1811, 1911, 2011: cover, 11B: non-heated soft resin portion, 12: cap, 12a: lead-out hole, 13: Conductive wire, 20B: Tape-shaped light emitting module, 21, 21B: Circuit board, 21a: Both ends, 21b: Mounting surface, 21c: Back surface, 22: Light emitting element, 23: Current limiting element, 111, 511a, 611a, 711a: groove, 112, 311a, 411a, 611b, 711b, 911d, 911e, 911f, 911g, 1311b, 1411b, 1411c, 1613a, 1613b, 2013b, 2013c: tapered surface, 113: light emitting surface, 1613c, 2013a: parallel. Surface, 114: back surface, 514, 614, 714: side surface, 911a, 911b, 1111a, 1111b: mounting surface, 911c: inclined surface, 912, 1112, 1312, 1412, 1512, 1612, 1712, 2012: tubular portion, 913: fixed part, 1011: first reel, 1012: extrusion molding machine, 1013: soft resin supply part, 1014: thermosetting machine, 1015: second reel, 1111c: curved surface, 1121: mold, 1122: introduction hole, 1123: rib, 1124: first mold part, 1125: second mold part, 1125a: cavity, 1313, 1413, 1414, 1513, 1613, 1812, 1912, 2013: translucent part, 1813, 1913: non- Translucent part, 1711b: hollow part, 1713: raised part

Claims

A long circuit board having flexibility,
A plurality of light emitting elements mounted in a row on the circuit board,
A long cover having a translucent portion formed of a translucent soft material and covering the circuit board and the plurality of light emitting elements;
Both ends of the circuit board in the longitudinal direction and both ends of the circuit board in the lateral direction at the central portion of at least the longitudinal direction are embedded in the cover ,
The cover is
A tubular portion formed of a translucent material in a long tubular shape, and having a mounting surface formed along the longitudinal direction of the cover on the outer wall,
It is formed in a long plate shape from a translucent material, and both ends in the lateral direction are connected to the tubular portion in a posture inclined inside the tubular portion with respect to the mounting surface, and on one surface. A fixing portion to which the circuit board is fixed,
Lighting equipment.

A long circuit board having flexibility,
A plurality of light emitting elements mounted in a row on the circuit board,
A long cover having a translucent portion formed of a translucent soft material and covering the circuit board and the plurality of light emitting elements;
Both ends of the circuit board in the longitudinal direction and both ends of the circuit board in the lateral direction at least at the center in the longitudinal direction are embedded in the cover,
A gap is formed between the cover and the first main surface side of the circuit board on which the plurality of light emitting elements are mounted.
Lighting equipment.

The cover has an elongated tubular shape, is parallel to a first main surface of the circuit board on which the plurality of light emitting elements are mounted, and is a direction facing a mounting surface of the circuit board on the cover. A side has a second surface formed along the longitudinal direction of the cover, and the second surface is provided with a groove extended along the longitudinal direction of the cover;
The lighting device according to claim 2 .

The cover has a long tubular shape, and a third outer wall is formed orthogonal to a first main surface of the circuit board on which the plurality of light emitting elements are mounted and formed along a longitudinal direction of the cover. A surface, and a groove extending along the longitudinal direction of the cover is provided on the third surface,
The lighting device according to claim 2 .

The cover has a long tubular shape, and has a first outer surface that is inclined with respect to a first main surface of the circuit board on which the plurality of light emitting elements are mounted and is formed along a longitudinal direction of the cover. Has a face,
The lighting device according to claim 1 or 2.

The cover further includes a non-translucent portion formed of a non-translucent soft material and covering a part of the circuit board and the plurality of light emitting elements,
The lighting device according to any one of claims 1 to 5.

A second main surface of the circuit board opposite to the first main surface is in close contact with the cover;
The lighting device according to any one of claims 2 to 4.

A step of mounting a plurality of light emitting elements in a row on a flexible long circuit board;
A long first mold part having a U-shaped cross section covers a part of the first main surface of the circuit board on which the plurality of light emitting elements are mounted, except for both ends in the lateral direction of the circuit board. The first mold part and the second mold with the circuit board and the first mold part arranged in the cavity of the second mold part having a long cavity. A step of forming a cover that covers the circuit board and the plurality of light emitting elements by filling and extruding a soft material in an area between the light emitting element and the area.
Lighting device manufacturing method.