JP6677938B2 - Laminated film, electromagnetic wave shielding gasket, shielded cable - Google Patents
Laminated film, electromagnetic wave shielding gasket, shielded cable Download PDFInfo
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- Laminated Bodies (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Insulated Conductors (AREA)
Description
本発明は、電子機器等に使用して、電子機器等から発生する電磁波を遮蔽したり、電子機器を電磁波から保護するために使用される電磁波シールドフィルムに関し、電磁波遮蔽ガスケットやシールドケーブル等に用いられる積層フィルムに関する。 The present invention relates to an electromagnetic wave shielding film used for an electronic device or the like to shield an electromagnetic wave generated from the electronic device or the like and to protect the electronic device from the electromagnetic wave, and is used for an electromagnetic wave shielding gasket, a shielded cable, and the like. To a laminated film to be produced.
従来、電磁波遮蔽のための極薄でフレキシブル性を有する電磁波シールドフィルムが知られている。 2. Description of the Related Art Conventionally, an ultra-thin and flexible electromagnetic wave shielding film for shielding electromagnetic waves has been known.
電磁波シールドフィルムは、一般に、電磁波の遮蔽にかかり、特に、電子機器に搭載されているプリント基板から放射される電磁波を防止するガスケットに使用される。例えば、電子機器の一例としてコンピュータや通信制御装置は、搭載されているプリント基板からの電磁波対策としてその筐体に嵌め込み可能なガスケットを使用しており、電磁波を遮蔽するという物理的な構造に加えて、電子機器の筐体に嵌め込み易く、かつ、脱落しにくい構造が求められる。 The electromagnetic wave shielding film is generally used for a gasket which shields electromagnetic waves and prevents electromagnetic waves radiated from a printed circuit board mounted on an electronic device. For example, as an example of an electronic device, a computer or a communication control device uses a gasket that can be fitted into its housing as a measure against electromagnetic waves from a mounted printed circuit board, and has a physical structure that shields electromagnetic waves in addition to a physical structure. Therefore, a structure that is easy to fit into the housing of the electronic device and that is difficult to fall off is required.
近年、デジタル情報通信の発展および需要拡大に伴い、多くの情報電子装置の信号伝送にシールドケーブルが広く用いられるようになっている。通信用のシールドケーブルには、並行２心型のシールドケーブルが使用され、これを多数本集合して多心ケーブル化することも行われている。並行２心型のシールドケーブルの構成は、中心導体（素線）を絶縁体で絶縁した２本の心線を対にして、シールド導体で覆い、このシールド導体と２本の心線との間に、シールド導体の導電面と接触するようにドレインワイヤを縦添えし、相互に導通して電磁波遮蔽性を確保している。さらに、シールド導体が巻きほぐれないように、外被として接着機能を有する接着積層テープを巻いて接着している。巻き方は、螺旋状に巻き回す螺旋巻きと、縦添えして巻き回すシガレット巻きとがあり、シガレット巻きは螺旋巻きに比べて巻きほぐれやすいことから、一般的には螺旋状に巻き回されている。 2. Description of the Related Art In recent years, with development and demand expansion of digital information communication, shielded cables have been widely used for signal transmission of many information electronic devices. As a shielded cable for communication, a parallel two-core shielded cable is used, and a large number of these cables are assembled into a multicore cable. The configuration of a parallel two-core shielded cable consists of a pair of two cores insulated from the center conductor (elementary wire) with an insulator, covered with a shielded conductor, and placed between the shielded conductor and the two cores. In addition, a drain wire is longitudinally attached so as to be in contact with the conductive surface of the shield conductor, and is mutually conductive to ensure electromagnetic wave shielding. Furthermore, an adhesive laminated tape having an adhesive function is wound and adhered as a jacket so that the shield conductor is not unraveled. There are two types of winding: spiral winding, which is wound spirally, and cigarette winding, which is wound vertically with cigarette winding.Since cigarette winding is easier to unwind than spiral winding, it is generally wound spirally. I have.
ここで、電磁波遮蔽ガスケットの従来技術による一般的な構成を図１に示す。弾性材からなる芯材と、この芯材の表面を被覆する導電層が形成された導電性被覆材とを備えており、この芯材は、耐熱性を有する発泡ポリウレタンフォームであって、断面視長方形状の長尺部材として構成されており、この導電性被覆材は、フレキシブル性を有するフィルムの片面に金属層を形成したものである。この金属層を形成する技法としては、蒸着法、スパッタリング法等がある。かかる導電性被覆材の金属層を外側にして芯材をシガレット巻きで巻き回して被覆するのであるが、従来、導電性被覆材が芯材から剥がれ落ちないようにするために、芯材に接着温度が１００〜１３０℃の熱可塑性の接着剤を塗布しておき、被覆後加熱接着する方法などが採られていた。 Here, FIG. 1 shows a general configuration of an electromagnetic wave shielding gasket according to the related art. A core material made of an elastic material and a conductive coating material having a conductive layer covering the surface of the core material are provided. The core material is a heat-resistant foamed polyurethane foam, The conductive covering material is formed as a rectangular long member, and is formed by forming a metal layer on one surface of a flexible film. Techniques for forming the metal layer include a vapor deposition method and a sputtering method. The core material is wound by cigarette winding with the metal layer of the conductive coating material on the outside, and the coating is conventionally performed. In order to prevent the conductive coating material from peeling off from the core material, it is bonded to the core material. A method has been adopted in which a thermoplastic adhesive having a temperature of 100 to 130 ° C. is applied in advance, followed by heating and bonding after coating.
また、シールドケーブルの従来技術による一般的な構成を図２に示す。シールドケーブルについて、中心導体を電気的に絶縁するために絶縁体を被覆する。絶縁体としては、出来るだけ誘電率の小さいものが用いられ、例えば、ポリエチレン（ＰＥ）、エチレン酢酸ビニル共重合体（ＥＶＡ）、フッ素樹脂等が用いられる。中心導体を被覆したものを複数より合わせ、複数の信号線を一括シールドすることもできる。この中心導体と絶縁層とによって形成されたコアを心線といい、この心線２本を一対とする。次に、一対の心線の間に１本のドレインワイヤを設け、このドレインワイヤをシールドするために、金属積層テープが用いられている。この金属積層テープとしては、ＰＥＴ等のプラスチック基材（樹脂テープ）に、アルミ箔あるいは箔などの金属箔をラミネートにより基材フィルムと積層したものを、細幅にスリットしたラミネートテープ、あるいは基材フィルムにアルミあるいは銅などの金属層を真空蒸着法などで形成し、同様に細幅にスリットした金属蒸着テープなどを螺旋巻きで巻き回すことが一般的に実施されている。 FIG. 2 shows a general configuration of a shielded cable according to the related art. For a shielded cable, an insulator is coated to electrically insulate the center conductor. As the insulator, an insulator having as small a dielectric constant as possible is used, for example, polyethylene (PE), ethylene vinyl acetate copolymer (EVA), fluororesin, or the like. A plurality of signal conductors covered with the center conductor may be combined to collectively shield a plurality of signal lines. The core formed by the center conductor and the insulating layer is referred to as a core, and the two cores constitute a pair. Next, one drain wire is provided between a pair of core wires, and a metal laminated tape is used to shield the drain wire. As the metal laminated tape, a laminated tape obtained by laminating a metal base material such as an aluminum foil or a foil on a base material film by laminating a plastic base material (resin tape) such as PET, or a narrow slit is used. Generally, a metal layer such as aluminum or copper is formed on a film by a vacuum evaporation method or the like, and a narrow metal slit tape or the like is spirally wound.
従来の技術においては、シールド導体の外周に、巻きほぐれないように外被が施される。外被としては上記と同様のプラスチック基材に接着層を積層し複合構造とした接着積層テープを螺旋状に巻き付け、加熱することで外被の接着層が接着し、シールドケーブルとなる。 In the prior art, a jacket is provided on the outer periphery of the shield conductor so as not to be unwound. As the jacket, an adhesive laminated tape having a composite structure in which an adhesive layer is laminated on the same plastic base material as described above is spirally wound and heated, whereby the adhesive layer of the jacket is adhered to form a shielded cable.
しかしながら、上述のガスケットを筐体や接地面に接地および固定するためには、ビスとワッシャーなどで固定し、かつ電気的に導通させる必要があった。固定を簡略化するため、例えば金属層上に導電性の粘着層をコーティングし粘着面を筐体や接地面に貼り付けて固定する方法が考えられるが、この方法では導電性の粘着層のコストが嵩む欠点があり、接着層の接触抵抗で筐体や接地面との導通が不十分になるケースがある。 However, in order to ground and fix the gasket to the housing or the grounding surface, it is necessary to fix the gasket with a screw and a washer and to electrically conduct the gasket. In order to simplify the fixing, for example, a method of coating a conductive adhesive layer on a metal layer and attaching the adhesive surface to a housing or a grounding surface and fixing it is conceivable, but in this method, the cost of the conductive adhesive layer is reduced. In some cases, contact with the housing or the ground plane becomes insufficient due to the contact resistance of the adhesive layer.
また、上述したシールドケーブルで、シールド導体に使用される金属積層テープとしては、アルミ箔あるいは銅箔などの金属箔をラミネートによりプラスチック基材と積層したものを、細幅にスリットしたラミネートテープ、あるいはプラスチック基材にアルミあるいは銅などの金属層を真空蒸着法などで形成し、同様に細幅にスリットした金属蒸着テープなどが用いられている。通例、一対の心線とドレインワイヤの外周に当該金属積層テープはドレインワイヤと金属層が接触するように螺旋状に巻き回されている。しかしながら、係る構成のシールドケーブルは、螺旋状に巻き回されている影響により、電流の流れを阻害することがあるので、高周波領域では十分な減衰特性が得られなくなってきている。本発明はこれを解決することを課題とする。 In the above-described shielded cable, the metal laminated tape used for the shield conductor is a laminated tape obtained by laminating a metal foil such as an aluminum foil or a copper foil and a plastic base material by laminating, a narrow slit, or A metal evaporation tape or the like is used in which a metal layer such as aluminum or copper is formed on a plastic base material by a vacuum evaporation method or the like and similarly slit into a narrow width. Usually, the metal laminated tape is spirally wound around the outer periphery of the pair of core wires and the drain wire such that the drain wire and the metal layer are in contact with each other. However, the shielded cable having such a configuration may hinder the flow of current due to the effect of being spirally wound, so that sufficient attenuation characteristics cannot be obtained in a high frequency region. An object of the present invention is to solve this.
上記の課題に鑑み、本発明は、電磁波遮蔽に用いられる積層フィルムであって、該積層フィルムは基材フィルムの少なくとも片面に金属層と接着層がこの順に形成されており、接着層が全面に形成されておらず、金属層の一部の金属が接着層側で露出していることにより、接着層が導体と接した際に、該導体と該積層フィルムの金属層の導通が保たれることを特徴とする積層フィルムである。 In view of the above problems, the present invention is a laminated film used for electromagnetic wave shielding, wherein the laminated film has a metal layer and an adhesive layer formed in this order on at least one surface of a base film, and the adhesive layer is formed on the entire surface. Not being formed, since a part of the metal of the metal layer is exposed on the adhesive layer side, when the adhesive layer comes into contact with the conductor, conduction between the conductor and the metal layer of the laminated film is maintained. It is a laminated film characterized by the above.
本発明の積層フィルムは、基材フィルムの少なくとも片面に金属層と接着層がこの順に形成されており、接着層が全面に形成されておらず、接着層が導体と接した際に該導体と積層フィルムの金属層の導通が保たれるので、導通を阻害することなく簡便な工法で筐体や接地面に固定しかつ接地することができる。 The laminated film of the present invention, a metal layer and an adhesive layer are formed in this order on at least one surface of the base film, the adhesive layer is not formed on the entire surface, and when the adhesive layer comes into contact with the conductor, Since the conduction of the metal layers of the laminated film is maintained, it can be fixed to the housing or the ground plane and grounded by a simple method without hindering the conduction.
ガスケットの導電性被覆材に本発明の積層フィルムを用いることで、簡便な工法で筐体や接地面に固定しかつ接地することができる。 By using the laminated film of the present invention for the conductive coating material of the gasket, it can be fixed to the housing or the ground surface and grounded by a simple construction method.
シールドケーブルのシールド導体に本発明の積層フィルムを用いることで、積層フィルムの金属層はドレインワイヤと導通するとともに接着層によりフィルム同士が接着されるので、簡便な工法でのシールドケーブルを形成でき、かつシガレット巻きでも巻きほぐれることがなくシールドケーブルを形成できる。接着層もあるため合わせ巻きの必要がない。 By using the laminated film of the present invention for the shield conductor of the shielded cable, the metal layer of the laminated film is electrically connected to the drain wire and the films are adhered to each other by the adhesive layer, so that a shielded cable can be formed by a simple method, In addition, a shielded cable can be formed without being unwound even by cigarette winding. Since there is also an adhesive layer, there is no necessity of winding together.
本発明について以下詳細に説明する。 The present invention will be described in detail below.
本発明の積層フィルムを図３に示す。本発明は、電磁波遮蔽に用いられる積層フィルムであって、単層の基材フィルムあるいは複数層を持つ基材フィルムの少なくとも片面に、金属層と接着層がこの順に形成されているものである。金属層と接着層は片面でも良いが、両面に形成されていても良い。 FIG. 3 shows the laminated film of the present invention. The present invention is a laminated film used for electromagnetic wave shielding, wherein a metal layer and an adhesive layer are formed in this order on at least one surface of a single-layer substrate film or a substrate film having a plurality of layers. The metal layer and the adhesive layer may be formed on one side, or may be formed on both sides.
本発明で用いられる基材フィルムとしては、特に限定されず一般的に使用される高分子フィルムが使われる。高分子フィルムとしては、例えば、ポリエチレンテレフタレート（ＰＥＴ）、ポリエチレンナフタレート（ＰＥＮ）などのポリエステル、ポリプロピレン（ＰＰ）、ポリスチレン（ＰＳ）などのポリオレフィン、ポリフェニレンスルフィド（ＰＰＳ）、ポリイミド（ＰＩ）、ポリカーボネート、ポリアミド、ポリフッ化ビニリデン、ポリパラキシレンなどのフィルムが挙げられる。また、これらの共重合体や、他の有機重合体との混合体、積層体であっても良い。これらの高分子化合物に、公知の添加剤、例えば、滑剤や可塑剤などが含まれても良い。より好ましくは、コスト、加工性の観点から、ポリエチレンテレフタレート（ＰＥＴ）、ポリエチレンナフタレート（ＰＥＮ）、ポリフェニレンスルフィド（ＰＰＳ）、ポリイミド（ＰＩ）及びこれらの共重合体から選ばれた１種であることが好ましく、特に好ましくはポリエチレンテレフタレート（ＰＥＴ）である。 The substrate film used in the present invention is not particularly limited, and a commonly used polymer film is used. Examples of the polymer film include polyester such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), polyolefin such as polypropylene (PP) and polystyrene (PS), polyphenylene sulfide (PPS), polyimide (PI), and polycarbonate. Films of polyamide, polyvinylidene fluoride, polyparaxylene and the like can be mentioned. Further, a mixture of these copolymers, another organic polymer, or a laminate may be used. Known additives such as a lubricant and a plasticizer may be contained in these polymer compounds. More preferably, it is one selected from polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyphenylene sulfide (PPS), polyimide (PI) and a copolymer thereof from the viewpoint of cost and processability. Is particularly preferable, and polyethylene terephthalate (PET) is particularly preferable.
本発明で用いられる基材フィルムの厚みは、特に限定されないが、０．５〜２０μｍの範囲であることが好ましい。０．５μｍ未満では薄すぎて扱いづらく加工時あるいは使用時に損傷してしまうおそれがあり、２０μｍを超えて厚くすると剛性が必要以上に強くなり加工時あるいは使用時に支障が生じる場合がある。柔軟性をもたせる観点から、より好ましくは基材フィルムの厚みは０．５〜１０μｍの範囲である。 The thickness of the substrate film used in the present invention is not particularly limited, but is preferably in the range of 0.5 to 20 μm. If it is less than 0.5 μm, it may be too thin to handle and may be damaged during processing or use, and if it exceeds 20 μm, the rigidity may become unnecessarily strong and may hinder processing or use. From the viewpoint of providing flexibility, the thickness of the base film is more preferably in the range of 0.5 to 10 μm.
本発明における金属層の形成方法は特に限定されず、例えば、金属箔のラミネート、あるいは蒸着、スパッタリング、イオンプレーティングあるいはメッキなどの方法を用いて形成することができる。なかでも好ましくは真空蒸着法を用いて形成された金属層である。真空蒸着法を用いると、効率的に本発明の積層フィルムを製造することができる。 The method for forming the metal layer in the present invention is not particularly limited, and for example, it can be formed by laminating a metal foil or using a method such as vapor deposition, sputtering, ion plating or plating. Among them, a metal layer formed using a vacuum deposition method is preferable. The use of the vacuum evaporation method allows the laminated film of the present invention to be manufactured efficiently.
本発明における金属層の材質としては、例えば、銅、アルミニウム、亜鉛、スズ、ニッケル、クロム、鉄、チタン、あるいはこれらを含有する合金等が挙げられる。遮蔽特性の面から、銅が好ましく用いられる。 Examples of the material of the metal layer in the present invention include copper, aluminum, zinc, tin, nickel, chromium, iron, titanium, and alloys containing these. Copper is preferably used from the viewpoint of shielding properties.
本発明における金属層の厚みは、減衰特性を向上させる観点から、１００〜１００００ｎｍであることが好ましい。１００ｎｍより薄いと、減衰特性を維持することができなくなることがあり、１００００ｎｍより厚いと折り曲げた際にクラックなどが発生し好ましくない。より好ましくは１００〜２０００ｎｍの範囲である。 The thickness of the metal layer in the present invention is preferably 100 to 10000 nm from the viewpoint of improving the attenuation characteristics. If it is thinner than 100 nm, it may not be possible to maintain the attenuation characteristics. If it is thicker than 10,000 nm, cracks or the like may be generated when bent, which is not preferable. More preferably, it is in the range of 100 to 2000 nm.
本発明における接着層は、熱硬化性接着剤が好ましく、種類としては特に限定されないが、例えば、不飽和ポリエステル樹脂、メラミン樹脂、エポキシ樹脂、フェノール樹脂が挙げられる。取り扱いや加工性の良さや良好な機械的特性を持つことから、不飽和ポリエステル樹脂が好ましく用いられる。接着層の厚みは、薄すぎると接着せず、厚すぎると金属層と接触しなくなるため、０．０５〜１．０μｍであることが好ましい。 The adhesive layer in the present invention is preferably a thermosetting adhesive, and the type thereof is not particularly limited, and examples thereof include an unsaturated polyester resin, a melamine resin, an epoxy resin, and a phenol resin. Unsaturated polyester resins are preferably used because of their good handling and workability and good mechanical properties. If the thickness of the adhesive layer is too small, it will not adhere, and if it is too thick, it will not be in contact with the metal layer, so it is preferably 0.05 to 1.0 μm.
本発明の積層フィルムは、導体と接着した際に該導体と積層フィルムの金属層の導通が保たれるように構成される。積層フィルムと該導体との間の電気抵抗値が１０Ω以下であることが好ましく、更に１Ω以下であればより好ましい。 The laminated film of the present invention is configured such that conduction between the conductor and the metal layer of the laminated film is maintained when the laminated film is adhered to the conductor. The electrical resistance between the laminated film and the conductor is preferably 10Ω or less, more preferably 1Ω or less.
本発明の積層フィルムは、接着層が全面に構成されておらず、金属層の一部の金属が接着面側で露出していることにより、接着層が導体と接した際に、該導体と該積層フィルムの金属層の導通が保たれる。 The laminated film of the present invention, the adhesive layer is not formed on the entire surface, a part of the metal of the metal layer is exposed on the adhesive surface side, when the adhesive layer is in contact with the conductor, the conductor The conduction of the metal layer of the laminated film is maintained.
接着層側で金属層の一部の金属を露出するためには、印刷などの方法で接着層に一定のパターンを形成するのが好ましい。形成するパターンは、ストライプ状、ドット状、市松模様などが挙げられるが特に限定されるものではない。使用上は接着層と接着層のない箇所が概ね１〜１０ｍｍ程度の繰り返しで形成されるパターンが好ましい。より好ましくは、２〜５ｍｍ単位のストライプ状に形成されていることが好ましい。ストライプ状に形成されている場合の角度は、特に限定されるものではないが、例えばシールドケーブルのシールド導体に用いられる場合、シガレット巻きで巻き回した場合、接着層と接着層のない箇所がぴったり合わさることから、３０°あるいは６０°が好ましい。 In order to expose a part of the metal of the metal layer on the adhesive layer side, it is preferable to form a certain pattern on the adhesive layer by a method such as printing. The pattern to be formed includes a stripe shape, a dot shape, a checkered pattern, and the like, but is not particularly limited. In use, a pattern in which an adhesive layer and a portion having no adhesive layer are formed by repeating about 1 to 10 mm is preferable. More preferably, it is preferably formed in a stripe shape of 2 to 5 mm units. The angle in the case of being formed in a stripe shape is not particularly limited, but, for example, when used for a shield conductor of a shielded cable, when wound in a cigarette winding, an adhesive layer and a portion without an adhesive layer are exactly aligned. 30 ° or 60 ° is preferable because they are combined.
本発明の積層フィルムは、電磁波遮蔽ガスケットの導電性被覆材に好適に用いられる。本発明の積層フィルムを誘電性被覆材に用いると、本発明の積層フィルムが接着機能を有しているので、積層フィルムの重ね合わせ部分で接着させることで上記の熱可塑性の接着剤を塗布せずに形成することができ、従来のものより簡便に電磁波遮蔽ガスケットを得ることができる。同時に、ガスケットを筐体にはめ込む際に熱融着させることにより容易に筐体に固定することができる。 The laminated film of the present invention is suitably used for a conductive covering material of an electromagnetic wave shielding gasket. When the laminated film of the present invention is used for a dielectric covering material, the laminated film of the present invention has an adhesive function, so that the above-mentioned thermoplastic adhesive is applied by bonding at the overlapping portion of the laminated film. The electromagnetic wave shielding gasket can be obtained more easily than conventional ones. At the same time, when the gasket is fitted into the housing, it can be easily fixed to the housing by heat fusion.
また、本発明の積層フィルムは、シールドケーブルのシールド導体にも好適に用いられる。本発明の積層フィルムをシールド導体に用いると、本発明の積層フィルムが接着機能を有しているので、図４に示すように、上記の外被を用いずにシールドケーブルを形成することができる。また、螺旋巻きではなくシガレット巻きで巻き回す場合、本発明の積層フィルムは接着機能を有しているので、工程中で巻きほぐれることもなく、従来のものより簡便にシールドケーブルを得ることができる。
［物性の測定方法並びに効果の評価方法］
（１）減衰量
シールドケーブルをベクトルネットワークアナライザのポート１とポート２に接続し、挿入損失等性試験を行った。周波数について７ＧＨｚの減衰量を評価した。７ＧＨｚの減衰量が−５ｄＢ／ｍ以上のものを良好「○」、−５ｄＢ／ｍ未満を不良「×」とした。
Further, the laminated film of the present invention is suitably used for a shield conductor of a shielded cable. When the laminated film of the present invention is used for a shield conductor, since the laminated film of the present invention has an adhesive function, a shielded cable can be formed without using the above-described jacket, as shown in FIG. . Further, when wound by cigarette winding instead of spiral winding, the laminated film of the present invention has an adhesive function, so that it does not become unwound during the process and a shielded cable can be obtained more easily than conventional ones. .
[Method of measuring physical properties and method of evaluating effects]
(1) Attenuation A shielded cable was connected to
以下、実施例に基づいて本発明を具体的に説明するが、本発明はこれらの実施例により限定されるものではない。なお、以下の説明で、実施例４、実施例５をそれぞれ参考例４、参考例５と読み替える。
Hereinafter, the present invention will be specifically described based on examples, but the present invention is not limited to these examples. In the following description, the fourth embodiment and the fifth embodiment are replaced with the fourth embodiment and the fifth embodiment, respectively.
（実施例１）
ＰＥＴフィルム（厚み６．０μｍ）（東レ（株）“ルミラー”（登録商標））に、金属層を銅蒸着にて１０００ｎｍの厚みで形成し、その上に接着層として東特塗料株式会社製のポリエステル系樹脂ＰＫ−２１を硬化剤とともに塗工した。接着層の乾燥後の厚みは１００ｎｍになるようにし、形状は接着層と接着層なしの部分とが交互に２．５ｍｍのピッチとなる斜めストライプ状とし、角度は３０°とした。
(Example 1)
A metal layer is formed on a PET film (thickness: 6.0 μm) (Toray Co., Ltd. “Lumirror” (registered trademark)) to a thickness of 1000 nm by copper vapor deposition, and an adhesive layer is formed thereon by Totoku Paint Co. Polyester resin PK-21 was applied together with a curing agent. The thickness of the adhesive layer after drying was set to 100 nm, and the shape was an oblique stripe shape in which the adhesive layer and the portion without the adhesive layer alternately had a pitch of 2.5 mm, and the angle was 30 °.
このように作製した積層フィルムを、４ｍｍ幅にスリットした。 The laminated film thus produced was slit to a width of 4 mm.
中心導体としてＡＷＧ２６の銅線を中心導体（素線）で用い、絶縁体としてフッ素樹脂、ドレインワイヤを縦添えし、シールド導体として上記の４ｍｍ幅にスリットした積層フィルムをドレインワイヤと接触するようシガレット巻きにて巻き回し、シールドケーブルを作製した。このシールドケーブルの減衰量を評価したところ、７ＧＨｚで−２ｄＢ／ｍと良好であった。 A copper wire of AWG26 is used as a center conductor (element wire) as a center conductor, a fluororesin and a drain wire are vertically attached as an insulator, and the above-mentioned laminated film slit to a width of 4 mm as a shield conductor is brought into contact with the drain wire. A shielded cable was produced by winding. When the amount of attenuation of this shielded cable was evaluated, it was as good as -2 dB / m at 7 GHz.
（実施例２）
金属層を銅蒸着にて２００ｎｍの厚みで形成する以外は、実施例１と同じ積層フィルムを作成し、これを用いて実施例１と同じ構成でシールドケーブルを作製し、減衰量を評価した。結果、７ＧＨｚで−３ｄＢ／ｍと良好であった。
(Example 2)
A laminated film was formed in the same manner as in Example 1 except that the metal layer was formed to a thickness of 200 nm by copper vapor deposition, and a shielded cable having the same structure as in Example 1 was manufactured using this, and the attenuation was evaluated. The result was as good as -3 dB / m at 7 GHz.
（実施例３）
金属層を銅蒸着にて７０００ｎｍの厚みで形成する以外は、実施例１と同じ積層フィルムを作成し、これを用いて実施例１と同じ構成でシールドケーブルを作成し、減衰量を評価した。結果、７ＧＨｚで−３ｄＢ／ｍと良好であった。
(Example 3)
A laminated film was formed in the same manner as in Example 1 except that the metal layer was formed to have a thickness of 7000 nm by copper vapor deposition, and a shielded cable having the same configuration as in Example 1 was formed using the same, and the attenuation was evaluated. The result was as good as -3 dB / m at 7 GHz.
（実施例４）
金属層を銅蒸着にて５０ｎｍの厚みで形成する以外は、実施例１と同じ積層フィルムを作製し、これを用いて実施例１と同じ構成でシールド同軸ケーブルを作製した。減衰量を測定した結果、７ＧＨｚで−４ｄＢ／ｍと良好であった。
(Example 4)
A laminated film was produced in the same manner as in Example 1 except that the metal layer was formed to a thickness of 50 nm by copper vapor deposition, and a shielded coaxial cable was produced using this in the same configuration as in Example 1. As a result of measuring the amount of attenuation, it was as good as -4 dB / m at 7 GHz.
（実施例５）
金属層を銅蒸着にて１２０００ｎｍの厚みで形成する以外は、実施例１と同じ積層フィルムを作成し、これを用いて実施例１と同じ構成でシールドケーブルを作製した。減衰量を測定した結果、７ＧＨｚで−４ｄＢ／ｍと良好であった。
(Example 5)
A laminated film was formed in the same manner as in Example 1 except that the metal layer was formed to have a thickness of 12000 nm by copper vapor deposition, and a shielded cable having the same structure as in Example 1 was manufactured using this. As a result of measuring the amount of attenuation, it was as good as -4 dB / m at 7 GHz.
（比較例１）
接着層を全面に形成する以外は、実施例１と同じ積層フィルムを作製し、これを用いて実施例１と同じ構成でシールドケーブルを作製した。本例では接着層が全面に形成しているので積層フィルムの金属層とドレインワイヤが導通しておらず、減衰量を測定した結果、７ＧＨｚで−６ｄＢ／ｍと不良であった。
(Comparative Example 1)
Except for forming the adhesive layer on the entire surface, the same laminated film as in Example 1 was produced, and this was used to produce a shielded cable with the same configuration as in Example 1. In this example, since the adhesive layer was formed on the entire surface, the metal layer of the laminated film and the drain wire were not conducted, and the attenuation was measured to be -6 dB / m at 7 GHz.
（比較例２）
接着層を形成しない以外は、実施例１と同じ積層フィルムを作製し、これを用いて実施例１と同じ構成でシールドケーブルを作製したが、巻きほぐれてシールドケーブルを形成することができなかった。
(Comparative Example 2)
Except that the adhesive layer was not formed, the same laminated film as in Example 1 was produced, and a shielded cable was produced with the same structure as in Example 1 using this. However, the shielded cable could not be formed by unwinding. .
１． 一般的な電磁波遮蔽ガスケット
２． 芯材
３． 導電性被覆材
３ａ． 基材フィルム
３ｂ． 金属層
４． 一般的なシールドケーブル
５． 中心導体（素線）
６． 絶縁体
７． ドレインワイヤ
８． シールド導体（金属積層テープ）
８ａ． 金属層
８ｂ． 基材フィルム
９． 外被（接着積層テープ）
９ａ． 接着層
９ｂ． 基材フィルム
１０． 積層フィルム
１０ａ．基材フィルム
１０ｂ．金属層
１０ｃ．接着層
１１． 積層フィルムを用いたシールドケーブル
１２． 中心導体（素線）
１３． 絶縁体
１４． ドレインワイヤ
１５． シールド導体（積層フィルム）
１５ａ．接着層
１５ｂ．金属層
１５ｃ．基材フィルム
1. 1. General electromagnetic wave shielding gasket Core material3.
6.
8a.
9a.
13.
15a.
Claims (8)
A shielded cable using the laminated film according to any one of claims 1 to 4 as a shield conductor, wherein the central conductor is covered with an insulating layer, and the laminated film is spirally wound or cigarette wound around the periphery thereof in a tape shape. A wound shielded cable.
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| JP6677938B2 true JP6677938B2 (en) | 2020-04-08 |
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Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01175113A (en) * | 1987-12-29 | 1989-07-11 | Totoku Electric Co Ltd | Flexible flat cable with shield |
| JPH0741051Y2 (en) * | 1988-09-12 | 1995-09-20 | 古河電気工業株式会社 | Flat cable with shield |
| JPH0355611U (en) * | 1989-10-03 | 1991-05-29 | ||
| US5008489A (en) * | 1989-10-25 | 1991-04-16 | Facile Holdings, Inc. | Electrical cables and serpentine pattern shielding tape therefor |
| JP2000138489A (en) * | 1998-10-30 | 2000-05-16 | Inoac Corp | Gasket for electromagnetic wave shield applied with adhesive and production thereof |
| JP2008294263A (en) * | 2007-05-25 | 2008-12-04 | Pioneer Electronic Corp | Gasket for electromagnetic shield |
| JP2010165559A (en) * | 2009-01-15 | 2010-07-29 | Sumitomo Electric Ind Ltd | Shielded cable |
| JP2010165561A (en) * | 2009-01-15 | 2010-07-29 | Sumitomo Electric Ind Ltd | Shielded flat cable and method of manufacturing the same |
| JP2010102975A (en) * | 2008-10-24 | 2010-05-06 | Sumitomo Electric Ind Ltd | Shielded flat cable |
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