JP6630117B2 - Contact unit and inspection jig - Google Patents

Description

  The present invention relates to an inspection jig such as a contact unit and a probe card used for inspecting electrical characteristics of a semiconductor integrated circuit.

  2. Description of the Related Art Generally, an inspection jig such as a probe card used for inspecting electrical characteristics of a semiconductor integrated circuit includes a flexible substrate on which a contact portion for contacting an electrode of an inspection object (for example, a wafer) is formed. A block for pressing the flexible substrate against the inspection object is provided on the back side of the contact portion of the flexible substrate. The block is urged toward the inspection object side by an urging means such as a spring to apply a contact force to the inspection object to the flexible substrate.

  In the inspection of the electrical characteristics, a high-frequency electric signal is transmitted between an inspection jig and an inspection device (tester) by a coaxial cable. The inspection jig is provided with a coaxial connector for detachably connecting a coaxial cable extending from the tester. The coaxial connector is electrically connected to the flexible board by soldering or the like. Electrical connection between the contact portion of the flexible substrate and the coaxial connector is performed by a conductive pattern provided on the flexible substrate.

JP 2006-177971 A

  The conductive pattern drawn from the contact on the flexible substrate has inductance, but in recent years, the speed of signals handled in the measurement of the inspection jig has been increased (higher frequency), and the influence of noise generated by the inductance of the conductive pattern has been increasing. It is a problem. As a countermeasure against noise, it is conceivable to provide a bypass capacitor. The closer the bypass capacitor is provided to the contact section, the higher the noise removal effect is. However, in order to avoid interference with the inspection object at the time of measurement, it is necessary to arrange the bypass capacitor at a predetermined distance or more from the contact section. In the case of a high-speed signal of several GHz or more, if the bypass capacitor is separated from the contact portion, it is difficult to perform accurate measurement due to the influence of noise on the conductive pattern between the bypass capacitor and the contact portion.

  The present invention has been made in view of such a situation, and an object of the present invention is to provide a contact unit and an inspection jig capable of performing accurate measurement even with a high-frequency signal.

One embodiment of the present invention is a contact unit detachable from a main body of an inspection jig,
A flexible substrate provided with a contact portion with the inspection object on one side,
A support member for supporting the flexible substrate,
A block provided on the other surface side of the flexible substrate,
The block has a flat portion that contacts the back surface of the contact portion of the flexible substrate, and a concave portion that is recessed from the flat portion,
An electronic component electrically connected to one of the contact portions is provided on the other surface of the flexible substrate, and the electronic component is located in the concave portion of the block ,
The concave portion is provided at a position that does not overlap with the contact portion electrically connected to the electronic component and is close to the contact portion when viewed from a direction perpendicular to the plane portion of the block. .

Another embodiment of the present invention relates to an inspection jig. This inspection jig
A flexible substrate provided with a contact portion with the inspection object on one side,
A support member for supporting the flexible substrate,
A block provided on the other surface side of the flexible substrate,
The block has a flat portion that contacts the back surface of the contact portion of the flexible substrate, and a concave portion that is recessed from the flat portion,
An electronic component electrically connected to one of the contact portions is provided on the other surface of the flexible substrate, and the electronic component is located in the concave portion of the block ,
The concave portion is provided at a position that does not overlap with the contact portion electrically connected to the electronic component and is close to the contact portion when viewed from a direction perpendicular to the plane portion of the block. .

  A conductive pattern electrically connected to the contact portion and a ground pattern may be provided on the other surface of the flexible substrate, and the electronic component may be provided across the conductive pattern and the ground pattern. .

  The recess may be filled with an insulating filler.

  The contact part electrically connected to the electronic component may be a power supply contact part.

An urging means for urging the block toward the inspection object may be provided.
The flexible board is provided with a through hole adjacent to the contact section at a position different from the contact section, and the electronic component mounting pad provided on the other surface of the flexible board by the through hole and the contact section. The electronic component in the form of a chip may be electrically connected and provided on the electronic component mounting pad.

  In addition, any combination of the above-described components, and any conversion of the expression of the present invention between a method, a system, and the like are also effective as embodiments of the present invention.

  According to the present invention, it is possible to provide a contact unit and an inspection jig capable of performing accurate measurement even with a high-frequency signal.

FIG. 2 is an exploded lower perspective view of the contact unit 30 according to Embodiment 1 of the present invention. FIG. 4 is an exploded upper perspective view of the contact unit 30. FIG. 2 is an exploded lower perspective view of the inspection jig 1 according to Embodiment 1 of the present invention. FIG. 2 is an exploded upper perspective view of the inspection jig 1. FIG. 4 is a lower perspective view in which the unit holding member 90 is omitted from the inspection jig 1. FIG. 3 is an upper perspective view in which the unit holding member 90 is omitted from the inspection jig 1. FIG. 3 is an enlarged view of a central portion of a surface (lower surface) of the inspection jig 1 on the inspection object side of a flexible substrate 40. FIG. 3 is an enlarged view of a central portion of a surface (upper surface) on the tester side of the flexible substrate 40. FIG. 8 is an enlarged cross-sectional view taken along the line AA of FIG. 7 in a combined state with the block 70. FIG. 10 is an enlarged view of the electronic component 44 of FIG. 9 and its periphery. The enlarged view which further expanded the center part of FIG. FIG. 12 is a sectional view taken along line BB of FIG. 11. The principal part expanded sectional view of the inspection jig concerning Embodiment 2 of this invention. FIG. 14 is a view of the block 70 of FIG. 13 as viewed from the direction C in FIG. The electronic component 44 is a chip capacitor, the test object is a 2.5 GHz amplifier, and the power transmission characteristic (S parameter S21) from the input to the output of the amplifier is 2 GHz to 3 GHz by changing the position of the electronic component 44. FIG. 4 is a characteristic diagram showing the results measured in FIG.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. Note that the same or equivalent components, members, and the like shown in the drawings are denoted by the same reference numerals, and the repeated description will be omitted as appropriate. In addition, the embodiments do not limit the invention but are exemplifications, and all features and combinations described in the embodiments are not necessarily essential to the invention.

Embodiment 1
FIG. 1 is an exploded lower perspective view of a contact unit 30 according to an embodiment of the present invention. FIG. 2 is an exploded upper perspective view of the same. FIG. 3 is an exploded lower perspective view of the inspection jig 1 according to the embodiment of the present invention. FIG. 4 is an exploded upper perspective view of the same. FIG. 5 is a lower perspective view in which the unit holding member 90 is omitted from the inspection jig 1. FIG. 6 is a top perspective view of the same. FIG. 7 is an enlarged view of the center of the surface (lower surface) of the inspection jig 1 on the inspection object side of the flexible substrate 40. 7, the concave portion 75 of the block 70 shown in FIG. 1 is indicated by a broken line. FIG. 8 is an enlarged view of a central portion of a surface (upper surface) on the tester side of the flexible substrate 40. FIG. 9 is an enlarged cross-sectional view taken along the line AA of FIG. FIG. 10 is an enlarged view of the electronic component 44 of FIG. 9 and its periphery. FIG. 11 is an enlarged view of the central portion of FIG. 7 further enlarged. In FIG. 11, as in FIG. 7, the concave portion 75 of the block 70 is indicated by a broken line. FIG. 12 is a sectional view taken along line BB of FIG.

  The contact unit 30 is a contact unit for replacing an inspection jig such as a probe card, and is detachably fixed to the main board 10 of the inspection jig 1 as shown in FIGS. The contact unit 30 includes a flexible substrate 40, four coaxial connectors 50 such as SMA connectors, a sub-substrate 60 as a support member made of a hard substrate such as a glass epoxy substrate, and a block 70 made of a resin molded body, for example. Have. Since the block 70 is provided to support contact between the flexible substrate 40 and the inspection target, when the flexible substrate 40 is pressed against the inspection target, the flexible substrate 40 is reliably pressed against the inspection target, and The block 70 must be made of a hard material because it must be supported so that it cannot move, and it must be made of a material with high workability in order to form the recess 75 for the electronic component 44. For example, a material such as polyimide or polyimide amide is optimal.

  The flexible substrate 40 is provided for contact with an inspection object such as a wafer. The flexible substrate 40 is located on one surface (lower surface) of the sub substrate 60. As shown in FIG. 1, the center of the lower surface of the cross portion of the flexible substrate 40 (the surface opposite to the sub-substrate 60) is a contact area 41 with an inspection target such as a wafer. 7 and 11, specifically, a high-speed signal bump 41a, a low-speed signal bump 41b, a power supply bump 41c, and a ground bump 41d. Provided.

  A conductive pattern for signal transmission is drawn out from each bump except the ground bump 41d. Specifically, the high-speed signal pattern 42a is drawn out from each high-speed signal bump 41a, and is directly electrically connected to the signal leg 52 of the coaxial connector 50 by soldering or the like. On both sides of the high-speed signal pattern 42a, ground patterns 43a are provided close to each other. The ground pattern 43a is provided from a ground pattern (not shown) around the coaxial connector 50 to the vicinity of the high-speed signal bump 41a so as to form a coplanar line with the high-speed signal pattern 42a interposed therebetween. Each ground pattern 43a is electrically connected to a ground pattern 43b on the back surface of the flexible substrate 40 through a ground through hole 45a. The ground bump 41d is electrically connected to the ground pattern 43b on the back surface of the flexible substrate 40 by a through hole provided at the same position as itself.

  A low-speed signal pattern 42b is drawn out of each low-speed signal bump 41b. The power supply pattern 42c is drawn out of the power supply bump 41c. The low-speed signal pattern 42b and the power supply pattern 42c are each electrically connected to one of the through holes 45c (FIG. 2 and the like) provided at the end of the cross portion of the flexible substrate 40. The through hole 45c is provided for electrical connection with the main board 10.

  As shown in FIG. 12, the power supply pattern 42c is electrically connected to the electronic component mounting pad 42d on the surface on the opposite side of the flexible substrate 40 by the power supply through hole 45b. The power supply through hole 45b is located at a position different from the power supply bump 41c when viewed from a direction perpendicular to the plane portion 74 of the block 70 (when the flexible substrate 40 is viewed from the plane portion 74 of the block 70), and It is provided at a position close to the bump 41c. By forming the power supply bump 41c and the power supply through-hole 45b at the same position, the electronic component 44 can be arranged closest to the power supply bump 41c. When this is applied, a force is also applied to the power supply through-hole 45b at the same time, a force is applied to the electronic component 44, and the electronic component 44 and the flexible substrate 40 may be separated. Therefore, the power supply bump 41c and the power supply through hole 45b are arranged at different positions.

  As shown in FIG. 8, a ground pattern 43b is provided on the entire upper surface (the surface on the tester side) of the flexible substrate 40 except for the electronic component mounting pads 42d and the pattern non-formation region 42e. The electronic component mounting pad 42d is insulated from the ground pattern 43b by the non-pattern forming region 42e. The electronic component 44 is provided across the electronic component mounting pad 42d and the ground pattern 43b. One terminal electrode is electrically connected to the electronic component mounting pad 42d by soldering or the like, and the other terminal electrode is connected to the ground pattern. 43b is electrically connected by soldering or the like. The electronic component 44 is, for example, a chip capacitor functioning as a bypass capacitor, and removes noise on the power supply pattern 42c (flows noise to the ground pattern 43b and prevents noise from flowing to the power supply bump 41c side). ).

  In addition to the above, as shown in FIGS. 1 and 2, the flexible board 40 is provided with through holes 46 for connector legs, through holes 47 and 48 for screwing, and through holes 49 for positioning. The connector leg through hole 46 is provided for inserting the signal leg 52 and the ground leg 53 of the coaxial connector 50. The screw through hole 47 is provided for passing a screw (fastening component) 107 for fixing the contact unit 30 to the main board 10 of the inspection jig 1. The screw 107 shown in FIGS. 1 and 2 does not need to be a component of the contact unit 30. The screw-through holes 48 are provided for passing screws (fastening parts) 108 for fixing the unit holding member 90 of the inspection jig 1 shown in FIGS. 3 and 4 to the main board 10. The screw-through holes 48 are provided on both sides of the through-hole 45c. The positioning through-hole 49 is provided for passing a positioning pin 109 (FIG. 4) for positioning the contact unit 30 with respect to the main board 10. The positioning through hole 49 is provided on the side of the screwing through hole 48. When attaching the contact unit 30 to the inspection jig 1, the flexible substrate 40 is not joined to the main substrate 10 described later by soldering or the like.

  The four coaxial connectors 50 are directly electrically connected to the flexible substrate 40 at positions surrounding the contact area 41 of the flexible substrate 40, and can detachably connect a coaxial cable extending from a not-shown inspection device (tester). . The coaxial connector 50 includes a main body 51, one signal leg 52, and four ground legs 53. The other end of the coaxial cable having one end connected to the inspection device is detachably connected to (attached to) the main body 51. The main body 51 is located on the other surface (upper surface) side of the sub-board 60. The flange portion 51a of the main body 51 is fixed to a connector fixing land (not shown) of the sub-board 60 by soldering or the like. The signal leg 52 and the ground leg 53 extend from the main body 51 and penetrate through the connector leg through hole 66 of the sub-board 60 and the connector leg through hole 46 of the flexible substrate 40. 40 is electrically connected directly to the surface opposite to the sub-board 60 by soldering or the like. Specifically, the signal leg 52 is directly electrically connected to the high-speed signal pattern 42a of the flexible substrate 40, and the ground leg 53 is directly electrically connected to the ground pattern 43a of the flexible substrate 40. You. When attaching the contact unit 30 to the inspection jig 1, the coaxial connector 50 is not joined to the main board 10 described later by soldering or the like.

  The sub-board 60 as a support member (support board) is for preventing a large load from being applied to a joint (soldering section) between the flexible board 40 and the coaxial connector 50 when the coaxial cable is attached to and detached from the coaxial connector 50. Provided. The sub-substrate 60 is provided with a central through hole 61, a through hole 66 for a connector leg, a through hole 67 for screwing, and a through hole 69 for positioning. The central through-hole 61 serves as a space for disposing the block 70. The connector leg through-hole 66 is provided for inserting the signal leg 52 and the ground leg 53 of the coaxial connector 50. The screw-through hole 67 is provided for passing a screw 107 for fixing the contact unit 30 to the main board 10 of the inspection jig 1. The positioning through-hole 69 is provided for passing a positioning pin 109 (FIG. 4) for positioning the contact unit 30 with respect to the main board 10.

  The block 70 is urged downward by the spring 91 in a state where the block 70 is incorporated in the inspection jig 1, and holds the flexible substrate 40 in a state where the contact area 41 projects downward from the lower surface of the main substrate 10. The block 70 has four legs 72 around a central truncated pyramid 71 that is convex downward. A parallelism adjusting screw 73 is attached to each leg 72 of the block 70. The tip of the parallelism adjusting screw 73 contacts a block base 22 of the retainer 20 described later. The vertical position of the block 70 urged by the spring 91 is determined by the tip of the parallelism adjusting screw 73 contacting the block base 22 of the retainer 20. The block 70 holds two positioning pins 103 and protrudes upward. The positioning pin 103 has a role of positioning a unit pressing member 90 described later with respect to the contact unit 30. Although the spring 91 is shown on the block 70 in FIG. 2, the spring 91 may be supported on the unit holding member 90 of the inspection jig 1 by bonding or the like, and is a component of the contact unit 30. No need. The block 70 has a flat portion 74 at the top of the truncated pyramid portion 71. The flat portion 74 contacts the back surface of the contact portion region 41 of the flexible substrate 40. The block 70 also has a recess 75 recessed from the plane portion 74. The above-described electronic component 44 mounted on the flexible substrate 40 is located in the concave portion 75. The concave portion 75 is a position which does not overlap with the power supply bump 41c (bump (contact portion) electrically connected to the electronic component 44) when viewed from a direction perpendicular to the plane portion 74, and It is provided at a position close to the bump 41c. Therefore, as shown in FIG. 12, the flat portion 74 of the block 70 comes into contact directly behind the power supply bump 41c.

  The inspection jig 1 is, for example, a probe card, and is used for inspecting electrical characteristics of a semiconductor integrated circuit in a wafer state. The inspection jig 1 includes a main substrate 10 made of, for example, a glass epoxy substrate, a retainer 20 made of metal such as stainless steel, the above-described contact unit 30, and a unit pressing member 90 made of, for example, a resin molded body.

  As shown in FIG. 4, the main board 10 is provided with a through hole 11 for a contact, a through hole 15, a through hole 16 for a connector leg, and through holes 17 and 18 for screwing. The contact through-hole 11 is provided for projecting the contact area 41 of the flexible board 40 downward. The through hole 15 is provided for electrical connection with the through hole 45c of the flexible substrate 40. The connector leg through-hole 16 is provided to escape the signal leg 52 and the ground leg 53 of the coaxial connector 50. The screw-through hole 17 is provided for passing a screw 107 for fixing the contact unit 30 to the main board 10. The screw-through hole 18 is provided for passing a screw 108 for fixing the unit holding member 90 to the main board 10. A ground pattern (not shown) is provided around the connector leg portion through hole 16 and the screw through hole 17 on the upper surface of the main substrate 10 (the surface facing the flexible substrate 40). The fastening of the screw 107 causes the ground pattern of the main board 10 and the ground pattern of the flexible board 40 to face each other. Since both ground patterns extend around the screw through holes 17 and 47, they come into particularly strong face-to-face contact around the location fixed by the screw 107.

  As shown in FIG. 4, the retainer 20 is, for example, a thin metal plate, and has a role of restricting a protruding amount of the contact unit 30 from the main board 10 downward. The retainer 20 is attached (fixed) to the lower surface of the main board 10 by screws (fasteners) 106. The retainer 20 is provided with a cross-shaped contact through hole 21 and screw holes 27 and 28. The periphery of the contact through hole 21 forms a block base 22 (FIG. 4). The contact through-hole 21 is provided for projecting the contact area 41 of the flexible substrate 40 downward. The screw hole 27 is provided for screwing a screw 107 for fixing the contact unit 30 to the main board 10 of the inspection jig 1. The screw hole 28 is provided for screwing a screw 108 for fixing the unit holding member 90 to the main board 10. The block base 22 is located below each leg 72 of the block 70, and receives (supports) the tip of a parallelism adjusting screw 73 attached to each leg 72 and extending downward from each leg 72. . The retainer 20 is provided with positioning pins 104 and 109 and protrudes upward from the upper surface of the main board 10. The positioning pin 104 has a role of positioning the unit holding member 90 with respect to the main board 10. The positioning pins 109 have a role of positioning the contact unit 30 with respect to the main board 10. The main board 10 and the retainer 20 form a main body of the inspection jig 1.

  The unit holding member 90 is a member that holds down the contact unit 30 from above. As shown in FIG. 4, the unit holding member 90 is provided with positioning through holes 93 and 94, a connector body through hole 95, and a spring recess 96 (FIG. 3). The positioning through hole 93 is provided for inserting a positioning pin 103 for positioning the unit holding member 90 with respect to the contact unit 30. The positioning through-hole 94 is provided for inserting a positioning pin 104 for positioning the unit holding member 90 with respect to the main board 10. The connector body through-hole 95 is provided for projecting the body 51 of the coaxial connector 50 upward. The spring recess 96 is provided to support one end of the spring 91 shown in FIG. The spring 91 urges the block 70 downward (that is, urges the contact area 41 of the flexible substrate 40 downward) in a state where the unit holding member 90 is fixed to the main substrate 10 with the screw 108. A contact force with an inspection object such as a wafer is applied to the contact portion region 41 of the substrate. Two string-shaped (linear) elastic members 92 (FIG. 3) made of silicon rubber or the like are held on the lower surface of the unit holding member 90 (the surface facing the flexible substrate 40). The elastic member 92 is provided at a position directly above the through-hole 45c of the flexible board 40 and the through-hole 15 of the main board 10. In a state where the unit holding member 90 is fixed to the main board 10 with the screw 108, the flexible board 40 is fixed. Is pressed toward the through hole 15 of the main board 10. Since the screws 108 fix the unit holding members 90 to the main board 10 on both sides of the elastic member 92, the pressing effect of the elastic member 92 is enhanced. The through holes 15, 45c are pressed against each other by the elastic member 92 to be electrically connected.

  Hereinafter, a flow of assembling the inspection jig 1 will be described.

  First, the contact unit 30 is assembled. Specifically, the following procedure is performed. The signal leg 52 and the ground leg 53 of the coaxial connector 50 pass through the connector leg through hole 66 of the sub-board 60, and the flange 51 a of the coaxial connector 50 is connected to a connector fixing land (not shown) on the upper surface of the sub-board 60. It is fixed on the top by soldering or the like. Thereafter, the flexible substrate 40 is sub-assembled while passing the signal leg 52 and the ground leg 53 of the coaxial connector 50 through the connector leg through hole 46 of the flexible substrate 40 on which the electronic component 44 is mounted and the block 70 is bonded. It is set on the lower surface of the substrate 60 (the surface opposite to the fixing surface of the main body 51 of the coaxial connector 50). Then, the signal leg 52 and the ground leg 53 of the coaxial connector 50 are electrically connected directly to the lower surface of the flexible substrate 40 (the surface opposite to the sub substrate 60) by soldering or the like. The signal leg 52 and the ground leg 53 of the coaxial connector 50 are first electrically connected to the lower surface of the flexible board 40, and then the flange 51a of the coaxial connector 50 is fixed to the upper surface of the sub-board 60. Is also good. The flexible board 40 is indirectly fixed to the sub-board 60 by soldering with the signal leg 52 and the ground leg 53 of the coaxial connector 50 fixed to the sub-board 60. Thus, the assembly of the contact unit 30 is completed. Note that the block 70 may be finally fixed to the back surface of the contact portion region 41 of the flexible substrate 40 by bonding through the central through hole 61 of the sub-substrate 60.

  Next, the contact unit 30 is attached (fixed) to the main board 10 with the screws 107. Specifically, four positioning pins 109 projecting from the main board 10 are passed through the positioning through holes 49 of the flexible board 40 and the positioning through holes 69 of the sub board 60, respectively, and the four screws 107 are respectively inserted. A retainer previously fixed to the lower surface of the main board 10 by passing through the screw through hole 67 of the sub-board 60, the screw through hole 47 of the flexible board 40, and the screw through hole 17 of the main board 10. 20 is screwed into the screw hole 27. Thereby, the flexible board 40 is sandwiched between the main board 10 and the sub board 60.

  Subsequently, the unit holding member 90 is fixed to the main board 10 with the screw 108. Specifically, two positioning pins 103 projecting upward from the block 70 and two positioning pins 104 projecting upward from the main board 10 are respectively inserted into the positioning through holes 93 and 94 of the unit holding member 90. The four screws 108 are passed through the through hole of the unit holding member 90, the through hole 48 for screwing the flexible board 40, and the through hole 18 for screwing the main board 10, and the screw hole 28 of the retainer 20 is formed. Screw it into. The parallelism of the contact portion region 41 of the flexible substrate 40 is adjusted as necessary by turning the parallelism adjusting screw 73. Thus, the assembly of the inspection jig 1 is completed. The removal of the contact unit 30 from the main board 10 may be performed in the reverse order of attachment.

  FIG. 15 shows a case in which the electronic component 44 is a chip capacitor, the test object is an amplifier for 2.5 GHz, and the power passing characteristic (S parameter S21) from the input to the output of the amplifier is changed by changing the position of the electronic component 44. It is a characteristic view which shows the result measured in 2 GHz-3 GHz, respectively. The three characteristics shown in FIG. 15 are the measured values of the evaluation board and the distance (power supply) between the electrode of the electronic component 44 (the electrode on the power supply pattern 42c) and the power supply bump 41c in the configuration of the embodiment. A simulation value when the length of the supply pattern is 0.4 mm and a simulation value when the distance between the electrode of the electronic component 44 and the power supply bump 41c is 5 mm in the configuration of the comparative example are shown. Here, the evaluation board has a power supply bump and a power supply pattern, and an electrode of the chip capacitor (an electrode on the power supply pattern) and a power supply provided on the power supply pattern extending from the power supply bump. The distance between the bumps was set to 0.5 mm. Further, in the configuration of the comparative example, the concave portion 75 is eliminated from the block 70 of the embodiment, the electronic component 44 is provided on the same surface as the contact portion region 41 of the flexible substrate 40, and the electronic component 44 is in contact with the inspection target at the time of measurement. It is provided at a position on the side surface of the truncated pyramid portion 71 of the block 70 in order to avoid interference. The distance of 5 mm is the shortest distance between the electronic component 44 and the power supply bump 41c in the configuration of the comparative example in which the electronic component 44 is arranged so as to avoid interference with the inspection object during measurement. From FIG. 15, it was found that the configuration according to the embodiment can obtain characteristics closer to the measured values of the reference evaluation board as compared with the configuration of the comparative example. Note that a matching circuit may be mounted as the electronic component 44.

  According to the present embodiment, the following effects can be obtained.

(1) Since the block 70 is provided with the concave portion 75 recessed from the flat portion 74 and the electronic component 44 provided on the back surface of the contact portion region 41 of the flexible substrate 40 is located in the concave portion 75, the inspection object at the time of measurement is measured. In order to avoid interference, the electronic component 44 is arranged on the same surface as the contact portion region 41 of the flexible substrate 40 and on the surface located on the side surface of the truncated pyramid portion 71 of the block 70, The electronic component 44 can be arranged close to the target contact portion (here, the power supply bump 41c) while avoiding interference with the inspection target at the time of measurement. Therefore, noise on the conductive pattern between the electronic component 44 and the power supply bump 41c can be reduced, and accurate measurement can be performed even when the measurement target is a high-speed signal (high-frequency signal) of several GHz or more. (Measurement of true device characteristics with small errors).

(2) A concave portion 75 is provided at a position different from the power supply bump 41c electrically connected to the electronic component 44, and the flat portion 74 of the block 70 abuts directly behind the power supply bump 41c. Is provided, the block 70 can surely press the power supply bump 41c against the inspection object.

Embodiment 2
FIG. 13 is an enlarged sectional view of a main part of an inspection jig according to Embodiment 2 of the present invention. The cross section in FIG. 13 is a cross section that passes through the power supply bump 41c as in FIG. FIG. 14 is a view of the block 70 of FIG. 13 as viewed in the direction of arrow C in FIG. In the inspection jig of the present embodiment, the power supply through hole 45b and the concave portion 75 of the block 70 exist at the same position as the power supply bump 41c as compared with the inspection jig of the first embodiment. In that a relief hole 75a is opened substantially in the center of the bottom surface of the concave portion 75, and the other points are the same. The filler 76 is, for example, an insulating resin, and is solidified (solidified) in a state where the electronic component 44 is located in the concave portion 75. The relief hole 75a is provided by cutting or the like, and penetrates the block 70, and when the block 70 is bonded to the flexible substrate 40 on which the electronic component 44 is mounted, the filling is pushed out by the electronic component 44 entering the concave portion 75. It has a role of releasing the agent 76. According to the present embodiment, even when the electronic component 44 must be disposed directly behind the power supply bump 41c due to physical restrictions, the filler 76 fills the concave portion 75, The contact force necessary for the measurement can be reliably applied to the bump 41c.

  As described above, the present invention has been described by taking the embodiment as an example. However, it is understood by those skilled in the art that various modifications can be made to each component and each processing process of the embodiment within the scope described in the claims. By the way. Hereinafter, modified examples will be described.

  The electronic component 44 may be another type of electronic component other than a capacitor such as a bypass capacitor. The electronic component 44 may be provided for a signal transmission bump (contact portion) other than the power supply bump 41c.

  The inspection jig may be used for inspecting electrical characteristics of the semiconductor integrated circuit in a state divided into individual products. The inspection jig may not have the sub-board 60 and may directly fix the flexible board 40 to the main board 10 by soldering or the like. In addition, parameters such as the number of coaxial connectors 50, the number of through holes, the number of screws used for fixing each part, the number of positioning pins, and the like are not limited to the specific numbers exemplified in the embodiment, and are necessary. It can be arbitrarily determined according to the performance and design convenience.

1 inspection jig (probe card),
10 Main board, 11 Contact through hole, 15 through hole, 16 Connector leg through hole, 17, 18 Screw fixing through hole,
Reference Signs List 20 retainer, 21 contact through hole, 22 block base, 27, 28 screw hole 30 contact unit,
40 flexible substrate, 41 contact area, 41a high-speed signal bump, 41b low-speed signal bump, 41c power supply bump, 41d ground bump, 42a high-speed signal pattern, 42b low-speed signal pattern, 42c power supply pattern, 42d Electronic component mounting pad, 42e Pattern non-formed area, 43a, 43b ground pattern, 44 Electronic component, 45a Ground through hole, 45b Power supply through hole, 45c through hole, 46 Connector leg through hole, 47, 48 Through hole for screwing, 49 Through hole for positioning,
50 coaxial connector, 51 body, 51a flange, 52 signal leg, 53 ground leg,
60 Sub board (support board), 61 Central through hole, 62 Connector fixing land, 66 Connector leg through hole, 67 Screw through hole, 69 Positioning through hole,
70 block, 71 frustum of pyramid, 72 leg, 73 parallelism adjusting screw, 74 plane, 75 recess, 75a relief hole, 76 filler,
90 unit holding member, 91 spring (biasing means), 92 elastic member, 93, 94 positioning through hole, 95 connector body through hole, 96 spring recess,
103,104 Positioning pins, 106-108 Screws (fasteners), 109 Positioning pins

Claims (7)

A contact unit detachable from the main body of the inspection jig,
A flexible substrate provided with a contact portion with the inspection object on one side,
A support member for supporting the flexible substrate,
A block provided on the other surface side of the flexible substrate,
The block has a flat portion that contacts the back surface of the contact portion of the flexible substrate, and a concave portion that is recessed from the flat portion,
An electronic component electrically connected to one of the contact portions is provided on the other surface of the flexible substrate, and the electronic component is located in the concave portion of the block ,
The concave portion is provided at a position that does not overlap with the contact portion electrically connected to the electronic component and is close to the contact portion when viewed from a direction perpendicular to the plane portion of the block. , Contact unit. A flexible substrate provided with a contact portion with the inspection object on one side,
A support member for supporting the flexible substrate,
A block provided on the other surface side of the flexible substrate,
The block has a flat portion that contacts the back surface of the contact portion of the flexible substrate, and a concave portion that is recessed from the flat portion,
An electronic component electrically connected to one of the contact portions is provided on the other surface of the flexible substrate, and the electronic component is located in the concave portion of the block ,
The concave portion is provided at a position that does not overlap with the contact portion electrically connected to the electronic component and is close to the contact portion when viewed from a direction perpendicular to the plane portion of the block. , Inspection jig. On the other surface of the flexible substrate, a conductive pattern electrically connected to the contact portion and a ground pattern are provided, and the electronic component is provided across the conductive pattern and the ground pattern. Item 2. The inspection jig according to Item 2 . Inspecting jig according to which the recess is filled with an insulating filler, claim 2 or 3. Wherein an electronic component electrically connected to the contact portion of the contact portion for power supply, the inspection jig according to any one of claims 2 to 4. It said block comprising a biasing means for urging the test object side, inspection jig according to any one of claims 2 to 5. The flexible board is provided with a through hole adjacent to the contact section at a position different from the contact section, and the electronic component mounting pad provided on the other surface of the flexible board by the through hole and the contact section. The inspection jig according to claim 2, wherein the electronic component is electrically connected and the chip-shaped electronic component is provided on the electronic component mounting pad.

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