JP6536096B2 - Electronic component transfer apparatus, electronic component inspection apparatus and inspection method of condensation or frost formation - Google Patents

Description

  The present invention relates to an electronic component transfer device, an electronic component inspection device, and a method of inspecting condensation or frost formation.

  Conventionally, an electronic component inspection apparatus for inspecting the electrical characteristics of an electronic component such as an IC device is known, and in this electronic component inspection apparatus, an electronic component for conveying the IC device to the holding unit of the inspection unit A transport device is incorporated. When testing an IC device, the IC device is disposed in the holder, and a plurality of probe pins provided in the holder are brought into contact with the respective terminals of the IC device.

  Such inspection of the IC device may be performed by cooling the IC device to a predetermined temperature. In that case, it is necessary to cool the IC device and to reduce the humidity of the atmosphere of the member in which the IC device is disposed so as not to cause condensation.

  Patent Document 1 describes an IC handler configured to detect a short circuit when condensation occurs between electrodes of an IC device and to detect the occurrence of condensation.

JP 2005-300285 A

  However, in the apparatus as disclosed in Patent Document 1, the mechanical response is required to detect the occurrence of condensation, which complicates the apparatus and also makes the apparatus expensive. Moreover, in the case of ice like frost, a short circuit may not occur between the electrodes.

  An object of the present invention is to provide an electronic component conveyance device, an electronic component inspection device, and a method of inspecting condensation or frost, which can easily detect the occurrence of condensation or frost formation on electronic components in the device. is there.

  The present invention has been made to solve at least a part of the above-described problems, and can be realized as the following modes or application examples.

Application Example 1
The electronic component transfer apparatus of the present invention is characterized by having an imaging unit capable of imaging a member to which liquid water or solid water is attached.

  As a result, the occurrence of condensation or frost formation on the electronic components in the apparatus can be easily detected.

Application Example 2
In the electronic component transfer apparatus according to the present invention, it is preferable that the image pickup section picks up an image of the member which has been subjected to dew condensation or frost formation.

  As a result, the occurrence of condensation or frost formation on the electronic components in the apparatus can be more easily inspected.

Application Example 3
In the electronic component transfer apparatus of the present invention, the member is preferably an electronic component or a test piece for inspection.

  As a result, the occurrence of condensation or frost formation on the electronic components in the apparatus can be more easily inspected.

Application Example 4
In the electronic component transfer apparatus of the present invention, it is preferable to have a light emitting unit that emits light to the member.

  This makes it possible to more reliably detect the occurrence of condensation or frost formation due to light scattering.

Application Example 5
In the electronic component transport apparatus according to the present invention, preferably, the light emitting unit emits light from a direction inclined with respect to a normal to the imaging surface of the member.

  This makes it possible to more easily detect the occurrence of condensation or frost formation on the electronic components in the apparatus.

Application Example 6
In the electronic component transfer apparatus of the present invention, the imaging surface of the member is preferably a mirror surface.

  This makes it possible to more easily detect the occurrence of condensation or frost formation on the electronic components in the apparatus.

Application Example 7
An electronic component inspection device according to the present invention is an imaging unit capable of imaging a member having dew condensation or frost formation;
And an inspection unit that inspects the electronic component.

  As a result, the occurrence of condensation or frost formation on the electronic components in the apparatus can be easily detected.

Application Example 8
The inspection method of dew condensation or frost formation according to the present invention is characterized in that the member which has dew condensation or frost formation is imaged to detect dew condensation or frost formation.

  As a result, the occurrence of condensation or frost formation on the electronic components in the apparatus can be easily detected.

FIG. 1 is a schematic plan view showing a preferred embodiment of the electronic component inspection device of the present invention. FIG. 2 is a cross-sectional view of the imaging unit. FIG. 3 is a cross-sectional view of the imaging unit. FIG. 4 is a cross-sectional view of the imaging unit.

  Hereinafter, an electronic component transfer apparatus, an electronic component inspection apparatus, and an inspection method of condensation or frost formation according to the present invention will be described in detail based on preferred embodiments shown in the attached drawings.

  FIG. 1 is a schematic plan view showing a preferred embodiment of the electronic component inspection device of the present invention. 2 to 4 are cross-sectional views of the imaging unit. In the following, for convenience of explanation, as shown in FIG. 1, three axes orthogonal to each other are taken as an X axis, a Y axis, and a Z axis. Further, the XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. Also, a direction parallel to the X axis is also referred to as "X direction", a direction parallel to the Y axis is also referred to as "Y direction", and a direction parallel to the Z axis is also referred to as "Z direction". Further, the upstream side in the transport direction of the electronic component is simply referred to as "upstream side", and the downstream side is simply referred to as "downstream side". In addition, “horizontal” referred to in the specification of the present application is not limited to perfect horizontal, and includes a state of being slightly inclined (for example, less than about 5 °) with respect to horizontal unless transport of electronic components is inhibited.

  The inspection apparatus (electronic component inspection apparatus) 1 shown in FIG. 1 is, for example, an IC device such as a BGA (Ball grid array) package or an LGA (Land grid array) package, an LCD (Liquid Crystal Display), a CIS (CMOS Image Sensor) Etc. for testing and testing the electrical characteristics of electronic components (hereinafter simply referred to as "checking"). In the following, for convenience of explanation, the case of using an IC device as the electronic component to be inspected will be representatively described, and this will be referred to as “IC device 90”.

  As shown in FIG. 1, the inspection apparatus 1 includes a tray supply area A1, a device supply area (hereinafter simply referred to as "supply area") A2, an inspection area A3, and a device recovery area (hereinafter simply "recovery area"). It is divided into A4 and tray removal area A5. Then, the IC device 90 performs inspections in the inspection area A3 halfway through the above-described areas in order from the tray supply area A1 to the tray removal area A5. As described above, the inspection apparatus 1 is provided with the electronic component conveying apparatus for conveying the IC device 90 in each area, the inspection unit 16 for inspecting in the inspection area A3, and the control unit 80.

  In the inspection apparatus 1, the side where the tray supply area A1 and the tray removal area A5 are disposed (lower side in FIG. 1) is the front side, and the opposite side, that is, the side where the inspection area A3 is disposed (figure The upper side in 1) is used as the back side.

  The tray supply area A1 is a feeding unit to which a tray (electronic component placement unit) 200 in which a plurality of untested IC devices 90 are arrayed is supplied. In the tray supply area A1, a large number of trays 200 can be stacked.

  The supply area A2 is an area where a plurality of IC devices 90 arranged on the tray 200 from the tray supply area A1 are supplied to the inspection area A3. Tray conveyance mechanisms 11A and 11B for conveying the trays 200 one by one are provided so as to straddle the tray supply area A1 and the supply area A2.

  In the supply area A2, a temperature control unit (soak plate) 12, a device transport head 13, and a tray transport mechanism (first transport device) 15 are provided.

  The temperature control unit 12 is a device that heats or cools the plurality of IC devices 90 and adjusts the temperature of the IC devices 90 to a temperature suitable for inspection. In the configuration shown in FIG. 1, two temperature adjustment units 12 are arranged and fixed in the Y direction. Then, the IC device 90 on the tray 200 carried in (conveyed) from the tray supply area A1 by the tray conveyance mechanism 11A is conveyed to any one of the temperature adjustment units 12 and placed.

  The device transport head 13 is movably supported in the supply area A2. Thus, the device transport head 13 transports the IC device 90 between the tray 200 carried in from the tray supply area A1 and the temperature adjustment unit 12, and between the temperature adjustment unit 12 and the device supply unit 14 described later. The transfer of the IC device 90 can be performed.

  The tray transport mechanism 15 transports the empty tray 200 in a state in which all the IC devices 90 have been removed in the X direction in the supply area A2. Then, after this conveyance, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the tray conveyance mechanism 11B.

  The inspection area A3 is an area for inspecting the IC device 90. A device supply unit (supply shuttle) 14, an inspection unit 16, a device transport head 17, and a device recovery unit (recovery shuttle) 18 are provided in the inspection area A3.

  The device supply unit 14 is a device for transporting the temperature-controlled IC device 90 to the vicinity of the inspection unit 16. The device supply unit 14 is supported so as to be movable along the X direction between the supply area A2 and the inspection area A3. Further, in the configuration shown in FIG. 1, two device supply units 14 are arranged in the Y direction, and the IC devices 90 on the temperature adjustment unit 12 are transported to and mounted on any of the device supply units 14. Ru.

  The inspection unit 16 is a unit that inspects and tests the electrical characteristics of the IC device 90. The inspection unit 16 is provided with a plurality of probe pins electrically connected to the terminals of the IC device 90 while holding the IC device 90. Then, the terminals of the IC device 90 and the probe pins are electrically connected (contacted), and the inspection of the IC device 90 is performed via the probe pins. The inspection of the IC device 90 is performed based on a program stored in an inspection control unit provided in a tester connected to the inspection unit 16. In the inspection unit 16, as in the temperature adjustment unit 12, the IC device 90 can be heated or cooled to adjust the IC device 90 to a temperature suitable for inspection.

  The device transport head 17 is movably supported in the inspection area A3. As a result, the device transfer head 17 can transfer the IC device 90 on the device supply unit 14 carried in from the supply area A2 onto the inspection unit 16 and place it.

  The device recovery unit 18 is a device for transporting the IC device 90 whose inspection in the inspection unit 16 is completed to the recovery area A4. The device recovery unit 18 is supported movably along the X direction between the inspection region A3 and the recovery region A4. Further, in the configuration shown in FIG. 1, two device recovery units 18 are arranged in the Y direction as in the device supply unit 14, and the IC devices 90 on the inspection unit 16 are either device recovery units 18. Transported and placed. This transfer is performed by the device transfer head 17.

  The recovery area A4 is an area in which the plurality of IC devices 90 for which the inspection has been completed are recovered. In the recovery area A4, a recovery tray 19, a device transport head 20, and a tray transport mechanism (second transport device) 21 are provided. In addition, an empty tray 200 is also prepared in the collection area A4.

  The recovery trays 19 are fixed in the recovery area A4, and in the configuration shown in FIG. 1, three are disposed along the X direction. Further, three empty trays 200 are also arranged along the X direction. Then, the IC device 90 on the device recovery unit 18 that has moved to the recovery area A4 is transported to and placed on any of the recovery tray 19 and the empty tray 200. As a result, the IC device 90 is collected and classified for each inspection result.

  The device transport head 20 is movably supported in the recovery area A4. As a result, the device transfer head 20 can transfer the IC device 90 from the device recovery unit 18 to the recovery tray 19 or the empty tray 200.

  The tray transport mechanism 21 transports the empty tray 200 carried in from the tray removal area A5 in the collection area A4 in the X direction. Then, after this conveyance, the empty tray 200 will be disposed at a position where the IC device 90 is collected, that is, it can be any of the three empty trays 200. As described above, in the inspection apparatus 1, the tray conveyance mechanism 21 is provided in the collection area A4, and in addition, the tray conveyance mechanism 15 is provided in the supply area A2. As a result, for example, throughput (the number of transported IC devices 90 per unit time) can be improved as compared with the case where the transport of the empty tray 200 in the X direction is performed by one transport mechanism.

  The tray removal area A5 is a removing unit from which the tray 200 in which the plurality of IC devices 90 in the inspected state are arranged is collected and removed. In the tray removal area A5, a large number of trays 200 can be stacked.

  Further, tray conveyance mechanisms 22A and 22B for conveying the trays 200 one by one are provided so as to straddle the recovery area A4 and the tray removal area A5. The tray transport mechanism 22A transports the tray 200 on which the tested IC device 90 is placed from the recovery area A4 to the tray removal area A5. The tray transport mechanism 22B transports an empty tray 200 for recovering the IC device 90 from the tray removal area A5 to the recovery area A4.

  The control unit 80 has, for example, a drive control unit. The drive control unit includes, for example, tray conveyance mechanisms 11A and 11B, a temperature adjustment unit 12, a device conveyance head 13, a device supply unit 14, a tray conveyance mechanism 15, an inspection unit 16, and a device conveyance head 17. The drive of each part of the device recovery unit 18, the device conveyance head 20, the tray conveyance mechanism 21, and the tray conveyance mechanisms 22A and 22B is controlled.

  The inspection control unit of the tester performs, for example, an inspection of the electrical characteristics of the IC device 90 disposed in the inspection unit 16 based on a program stored in a memory (not shown).

  In the inspection apparatus 1 as described above, in addition to the temperature adjustment unit 12 and the inspection unit 16, the device transport head 13, the device supply unit 14, and the device transport head 17 are also configured to be able to heat or cool the IC device 90. Thus, the temperature of the IC device 90 is maintained constant while being transported. And, in the following, the case where the IC device 90 is cooled and inspected in a low temperature environment in the range of, for example, -60 ° C to -40 ° C will be described.

  As shown in FIG. 1, in the inspection apparatus 1, the space between the tray supply area A1 and the supply area A2 is divided by the first partition wall 61, and the space between the supply area A2 and the inspection area A3 is The second partition 62 divides the space between the inspection area A3 and the recovery area A4 between the third partition 63 and the fourth area 64 between the recovery area A4 and the tray removal area A5. ing. Further, the fifth partition wall 65 also divides between the supply area A2 and the recovery area A4. These partitions have a function to keep the airtightness of each area. Further, the inspection apparatus 1 is covered with a cover at the outermost part, and the cover includes, for example, a front cover 70, side covers 71 and 72, and a rear cover 73.

  The supply area A2 is a first chamber R1 defined by the first partition 61, the second partition 62, the fifth partition 65, the side cover 71, and the rear cover 73. A plurality of IC devices 90 in an uninspected state are carried into the first chamber R1 together with the tray 200.

  The inspection area A3 is a second chamber R2 defined by the second partition wall 62, the third partition wall 63, and the rear cover 73. A plurality of IC devices 90 are carried into the second chamber R2 from the first chamber R1.

  The recovery area A4 is a third chamber R3 defined by the third partition 63, the fourth partition 64, the fifth partition 65, the side cover 72, and the rear cover 73. A plurality of IC devices 90 for which inspection has been completed are carried into the third chamber R3 from the second chamber R2.

  As shown in FIG. 1, the side cover 71 is provided with a first door (first left door) 711 and a second door (second left door) 712. By opening the first door 711 and the second door 712, for example, maintenance in the first chamber R1, cancellation of jamming in the IC device 90, etc. (hereinafter, these may be generically referred to as "work") can be performed. . In addition, the 1st door 711 and the 2nd door 712 become what is called "a door open" which opens and closes in a mutually opposite direction. Further, at the time of work in the first chamber R1, the movable portion of the device transport head 13 or the like in the first chamber R1 is stopped. The first door 711 and the second door 712 can be collectively locked and unlocked by the operation of the cylinder 740.

  Similarly, the side cover 72 is provided with a first door (first right door) 721 and a second door (second right door) 722. By opening the first door 721 and the second door 722, for example, work in the third chamber R3 can be performed. Note that the first door 721 and the second door 722 are also so-called "open doors" that open and close in opposite directions. Further, at the time of work in the third chamber R3, the movable portion of the device transport head 20 or the like in the third chamber R3 is stopped. The first door 721 and the second door 722 can be collectively locked and unlocked by the operation of the cylinder 745.

  Further, the rear cover 73 is also provided with a first door (rear side first door) 731, a second door (rear side second door) 732 and a third door (rear side third door) 733. By opening the first door 731, for example, work in the first chamber R <b> 1 can be performed. By opening the third door 733, for example, work in the third chamber R3 can be performed.

  Furthermore, a fourth door 75 is provided on the inner partition wall 66. Then, by opening the second door 732 and the fourth door 75, for example, work in the second chamber R2 can be performed.

  The first door 731, the second door 732 and the fourth door 75 open and close in the same direction, and the third door 733 opens and closes in the opposite direction to these doors. Further, at the time of work in the second chamber R2, the movable portion of the device transport head 17 or the like in the second chamber R2 is stopped. The first door 731 can be locked and unlocked by the operation of the cylinder 741, the second door 732 can be locked and unlocked by the operation of the cylinder 742, and the third door 733 is the actuation of the cylinder 744. Thus, the fourth door 75 can be locked and unlocked by the operation of the cylinder 743.

  And by closing each door, the airtightness and heat insulation in each corresponding room can be secured.

  As described above, in the inspection apparatus 1, the IC device 90 is inspected in a low temperature environment.

  As shown in FIG. 1, a humidity sensor (hygrometer) 24 for detecting the humidity in the room and a temperature sensor (thermometer for detecting the temperature) are respectively provided in the first chamber R1, the second chamber R2 and the third chamber R3. ) And 25 are arranged. The humidity in each room uses the humidity at the position where the humidity sensor 24 is disposed, and the temperature uses the temperature at the position where the temperature sensor 25 is disposed. This makes it possible to obtain the most accurate humidity and temperature possible.

  In the inspection apparatus 1 which performs an inspection under a low temperature environment, the dry air DA can be supplied to each of the first chamber R1, the second chamber R2, and the third chamber R3 to adjust (set) the humidity of the room. This prevents condensation from occurring particularly in the second chamber R2 after cooling.

  Although the number of installed humidity sensors 24 and temperature sensors 25 in the first chamber R1, the second chamber R2 and the third chamber R3 is one in this embodiment, the number is not limited to one, and a plurality is provided. May be In this case, for example, as the humidity of the second chamber R2, an average value of detection values detected by a plurality of humidity sensors 24 may be used, or the lowest or high detection value may be used.

  Further, in the inspection apparatus 1, the humidity sensor 24 and the temperature sensor 25 in the third chamber R3 can be omitted.

  An imaging unit 100 for imaging the upper surface 91 of the IC device 90 is installed vertically above the device recovery unit 18 of the inspection apparatus 1 as described above.

  As shown in FIG. 2, the imaging unit 100 includes a camera unit 101 and a light irradiation unit 102.

  The camera unit 101 is disposed vertically above the device recovery unit 18 and configured to pick up an upper surface 91 of the IC device 90 from above. When condensation or frost formation occurs on the upper surface 91 of the IC device 90, the color of the upper surface 91 of the IC device 90 imaged by the camera unit 101 changes due to the reflection of light.

  The light irradiator 102 is disposed obliquely above the IC device 90 so that light is irradiated to the upper surface 91 of the IC device 90 from a direction inclined with respect to the normal X to the upper surface 91 of the IC device 90. There is.

  When light is irradiated by the light irradiator 102 and light is not condensed or frosted, the light is reflected in a predetermined direction as shown in FIG. As shown in 3, scattering of light occurs. As a result, the change in color of the upper surface 91 of the IC device 90 imaged by the camera unit 101 becomes remarkable, and the occurrence of condensation or frost formation can be detected more reliably. The occurrence of condensation or frost formation can also be detected by a change in the amount of light incident on the camera unit 101.

  The upper surface 91 of the IC device 90 is preferably a mirror surface. By using a mirror surface, the contrast of the color of the upper surface 91 is improved, and the occurrence of condensation or frost formation can be detected more easily.

  In such an inspection apparatus 1, dew condensation or frost formation is inspected at an appropriate interval (for example, about 3 hours). When condensation or frost formation is confirmed, the inspection apparatus 1 displays an error and stops. Thereafter, the inside of the inspection apparatus 1 is dried, and inspection of dew condensation or frost formation is performed again to confirm that no dew condensation or frost formation occurs, and inspection of the IC device 90 is continued.

  In the inspection apparatus 1 described above, the occurrence of condensation or frost formation in the IC device 90 in the inspection apparatus 1 can be easily detected.

  In the above description, although the occurrence of condensation or frost formation is detected by imaging the upper surface 91 of the IC device 90, the present invention is not limited to the IC device 90. For example, as shown in FIG. The test specimen 90x used only for the inspection may be transported into the inspection apparatus 1 to detect the occurrence of condensation or frost formation on the upper surface 91x.

  In the above description, although the case where the imaging unit 100 is provided vertically above the device recovery unit 18 is described, the present invention is not limited to this. For example, the imaging unit 100 is provided in the recovery area A4. It is also good.

  The electronic component transfer apparatus and the electronic component inspection apparatus according to the present invention have been described above with reference to the illustrated embodiment, but the present invention is not limited to this, and each component constituting the electronic component transfer apparatus and the electronic component inspection apparatus Can be replaced with any configuration that can perform the same function. Also, any component may be added.

  Further, the electronic component conveyance device and the electronic component inspection device of the present invention may be a combination of any two or more configurations (features) of the respective embodiments.

1 ... Inspection device (Electronic component inspection device)
11A, 11B: tray conveyance mechanism 12: temperature control unit (soak plate)
13 ...... Device transfer head 14 ...... Device supply unit (supply shuttle)
15: Tray transport mechanism (first transport device)
16 ... inspection unit 17 ... device transport head 18 ... device recovery unit (recovery shuttle)
19: Collection tray 20: Device transfer head 21: Tray transfer mechanism (second transfer device)
22A, 22B: Tray transport mechanism 24: Humidity sensor (hygrometer)
25 ...... Temperature sensor (thermometer)
61 ... 1st partition 62 ... 2nd partition 63 ... 3rd partition 64 ... 4th partition 65 ... 5th partition 66 ... inner partition 70 ... front cover 71 ... side cover 71 1 ... 721 ... First door 72 ...... Side cover 712, 722 ... Second door 73 ...... Rear cover 731 ...... First door 732 ...... Second door 733 ...... Third door 740, 741, 742, 743, 744, 745 ... ... Cylinder 75 ... 4th door 80 ... Control section 90 ... IC device 91 ... Top surface 100 ... Imaging section 101 ... Camera section 102 ... Light irradiation section 200 ... Tray (electronic parts placement section)
A1 ... Tray supply area A2 ... Device supply area (supply area)
A3 ... inspection area A4 ... device collection area (collection area)
A5: Tray removal area R1: First room R2: Second room R3: Third room

Claims (7)

An electronic component conveying apparatus for conveying the electronic component to an inspection unit electrically connected to the cooled electronic component to inspect the electrical characteristic of the electronic component,
A light irradiation unit that irradiates light to the electronic component;
An imaging unit for imaging the electronic component to which liquid water is attached or solid water is attached;
Electronic component conveying apparatus provided with   The electronic component conveying apparatus according to claim 1, wherein the imaging unit images the electronic component after the electronic component is inspected by the inspection unit. A device recovery unit on which the electronic component after being inspected by the inspection unit is placed;
The electronic component conveying apparatus according to claim 2, wherein the light is irradiated to the electronic component placed on the device recovery unit. And an examination room in which the examination unit is disposed,
The electronic component transfer apparatus according to any one of claims 1 to 3, wherein dry air is supplied to the inspection room. The said light irradiation part irradiates light from the direction inclined with respect to the normal line of the imaging surface of the said electronic component imaged by the said imaging part, The electronic component conveying apparatus of any one of Claim 1 to 4. The electronic component conveying apparatus according to any one of claims 1 to 5, wherein an imaging surface of the electronic component to be imaged by the imaging unit is a mirror surface. Based on the color of the electronic component imaged by the imaging unit, it is detected whether condensation or frost formation has occurred on the electronic component,
The electronic component conveying apparatus according to any one of claims 1 to 6, wherein an error is notified when it is detected that the condensation or the frost formation has occurred.

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