JP6522331B2 - Board work equipment - Google Patents

Description

  The present invention relates to an apparatus for working on a substrate in which a high viscosity fluid such as a bonding material or solder is applied to a circuit board (hereinafter abbreviated as a board), or parts are mounted.

Patent Document 1 describes a substrate working apparatus that applies a bonding material to a substrate or mounts a component. A unit provided with a trial operation station is removably attached to the apparatus body of the substrate-to-substrate operation apparatus. At the trial run station, a trial run is performed by the application nozzle to check the state of application of the bonding material.
Patent Document 2 describes a coating apparatus for applying a paste to a substrate. The coating device is provided with a touch sensor, and the height of the coating nozzle is zero when the touch sensor detects that the tip of the coating nozzle is in contact with the upper surface of the substrate.

Japanese Patent Application Laid-Open No. 2002-059056 JP-A-1-122127

  An object of the present invention is an improvement of a substrate working apparatus in which high viscosity fluid is applied to a substrate or components are attached. For example, application is performed without using a touch sensor for a suction nozzle. This is to ensure that the elevation control of the nozzle is performed well.

Means, action and effect for solving the problem

  The substrate working apparatus according to the present invention is provided with a touch sensor for an application nozzle. The application nozzle uses the touch sensor for the application nozzle, and the touch sensor for the suction nozzle is not used. Therefore, the stain | pollution | contamination resulting from use of the application nozzle of the touch sensor for adsorption | suction nozzles can be prevented favorably. In addition, if the touch sensor for the coating nozzle is used, elevation control of the coating nozzle can be favorably performed.

It is a perspective view of the board | substrate operation | work apparatus which is one Embodiment of this invention. It is a perspective view of a feeder etc. holding member of the said board | substrate operation | work apparatus. It is a perspective view which shows the head moving apparatus of the said board | substrate working apparatus. FIG. 6 is a perspective view of a mounting head that is detachably held by the head moving device. FIG. 5 is a partial cross-sectional view conceptually showing an application head detachably held by the head moving device. It is a front view of the unit for coating nozzles attached to the said holding members, such as a feeder. It is a rear view of the unit for said coating nozzles. It is a top view of the unit for said coating nozzles. It is a figure which shows notionally the control apparatus of the said board | substrate operation | work apparatus. It is a flowchart showing the operation | movement permission * prohibition program memorize | stored in the memory | storage part of the said control apparatus. It is a flowchart showing the adsorption nozzle raising / lowering control program memorize | stored in the said memory | storage part. It is a flowchart showing the application | coating nozzle raising / lowering control program memorize | stored in the said memory | storage part. It is a figure which shows notionally the action | operation of the said application | coating nozzle.

Embodiments of the invention

Hereinafter, a substrate work apparatus according to an embodiment of the present invention will be described in detail based on the drawings.
The substrate-to-substrate operation apparatus shown in FIG. 1 includes an apparatus main body 2, a substrate conveyance / holding device 4, a component supply device 6, a head moving device 8 and the like.
The substrate conveyance and holding device 4 conveys and holds the circuit board P (hereinafter referred to as a substrate P) in a horizontal posture, and (a) a substrate conveyance and holding device provided by being positioned on the apparatus main body 2 4 includes a main body 10, (b) a substrate holding device 12 (see FIG. 13) provided on the main body 10, and (c) a transport device whose illustration is omitted. The substrate P is transported by the transport device and held by the substrate holding device 12 at a predetermined position. In FIG. 1, x is the transport direction of the substrate P, y is the width direction of the substrate P, and z is the thickness direction of the substrate P, that is, the vertical direction of the substrate working apparatus. The x direction, the y direction, and the z direction are orthogonal to one another.

  The substrate holding device 12 clamps and holds the substrate P in the vertical direction, and the substrate upper surface S which is the upper surface of the substrate P held by the substrate holding device 12 is substantially the same regardless of the thickness of the substrate P It is considered to be the height. The main body 10 has a touch sensor 14 having a contacted portion 13 at the same height as the upper surface S of the substrate and a second reflecting surface at the same height as the upper surface S of the substrate (also the same height as the contacted portion 13). A height measuring jig 16 having a reflected surface 15 is provided. The touch sensor 14 detects whether or not the tip of the suction nozzle abuts on the contacted portion 13. The reflection surface 15 of the height measurement jig 16 is a surface on which electron beams such as light are easily reflected, and as described later, it is used as a surface to be irradiated with electron beams such as light of a noncontact distance sensor. .

The component supply device 6 supplies components which are electronic components to be mounted on the substrate P, and includes a plurality of tape feeders 20 and the like. The plurality of tape feeders 20 are held by a holding member 22 such as a feeder shown in FIG. The feeder holding member 22 includes a holder 23 for holding the tape feeder 20 and the like, and a positioning plate 24 for positioning the tape feeder 20. The holding table 23 is provided with a plurality of holding grooves 25 extending in parallel to one another, and an engaging groove 26 extending in a direction perpendicular to the holding grooves 25. The positioning plate 24 is provided with two positioning recesses 27a and 27b corresponding to the holding grooves 25 and a connector connection portion 27n. The feeder holding member 22 is attached to the apparatus main body 2 in a state in which the holding groove 25 extends in the y direction and the positioning plate 24 is substantially parallel to the xz plane.
On the other hand, the feeder main body of the tape feeder 20 is provided with positioning protrusions, connectors, engaging protrusions and the like which are not shown, and the tape feeder 20 is positioned in the holding groove 25 of the holding member 22 such as a feeder. Is fitted into the positioning recesses 27a and 27b, the connector is fitted into the connector connection portion 27n, and the engaging projection is attached to the engaging groove 26. A unit for coating nozzles, which will be described later, is also attached to the feeder holding member 22.

As shown in FIG. 3, the head moving device 8 holds the working head 30 and moves it in the horizontal direction, and includes an x-direction moving device 32 and a y-direction moving device 34.
The y-direction moving device 34 includes (a) a y-axis motor 36 as a drive source, (b) a feed screw mechanism 37 as a drive transmission unit, (c) a pair of guide rails 38 extending in the y direction, and (d) a pair of It includes a slider 39 or the like engaged with the guide rail 38. The feed screw mechanism 37 includes a feed screw and a nut 40 fitted to the feed screw, and the slider 39 is attached to the nut 40. The drive of the y-axis motor 36 is transmitted to the slider 39 via the feed screw mechanism 37, and the slider 39 is linearly moved in the y direction along the guide rail 38.
The x-direction moving device 32 is provided on the slider 39 and has a double structure including the first and second moving devices 41 and 42. The slider 39 is provided with a first moving device 41, and the plate 43 as a slider of the first moving device 41 is provided with a second moving device 42. The second moving device 42 includes (a) an x-axis motor 45 as a drive source, (b) a feed screw mechanism 46 as a drive transmission unit, (c) a pair of guide rails 47 extending in the x direction, and (d) a slider 48 Etc. The drive of the x-axis motor 45 is transmitted to the slider 48 via the feed screw mechanism 46, and the slider 48 is linearly moved in the x direction along the pair of guide rails 47.
One of the mounting head 50 as the working head 30 shown in FIG. 4 and the application head 52 shown in FIG. 5 is selectively attached to the slider 48 through the mounting and demounting device 54. The attaching / detaching device 54 connects or disconnects the head main body of the working head 30 to the slider 48 in a state of being positioned in the vertical direction, and as the attaching / detaching device 54, for example, described in JP-A 2004-221518 Can be adopted.

  The mounting head 50 includes (1) a head main body 56, (2) a suction nozzle 57, (3) an elevation device 58 for raising and lowering a nozzle holding portion holding the suction nozzle 57 with respect to the head main body 56; And a positive pressure negative pressure selective supply device 59 (see FIG. 9) capable of selectively supplying positive pressure and negative pressure. Lifting device 58 includes z-axis motor 60 and the like shown in FIG. 9, and the drive of z-axis motor 60 is transmitted to the slider via the drive transmission portion, and the nozzle holding portion held by the slider and suction nozzle 57 are vertically moved. Moved to Further, the components are held or released by the suction nozzle 57 by the control of the positive pressure / negative pressure selective supply device 59.

The coating head 52 includes (1) a head main body 64, (2) a syringe 67 having a coating nozzle 65, (3) an elevation device 68 for moving the syringe 67 up and down relative to the head main body 64, (4) air control shown in FIG. Apparatus 69 and the like. The highly viscous fluid is accommodated in the syringe 67, and the air pressure in the upper air chamber, the air supply state, and the like are controlled by the air control device 69. By control of the air control device 69, the amount (diameter) and the like of the highly viscous fluid discharged from the discharge pipe 70 at the tip of the application nozzle 65 is controlled.
The lifting device 68 includes the z-axis motor 72 and the like shown in FIG. 9, and the drive of the z-axis motor 72 is transmitted to the slider 73 via the drive transmission unit. The slider 73 holds the syringe 67 so as to be integrally movable in the vertical direction, and along with the movement of the slider 73 in the vertical direction, the syringe 67 and the application nozzle 65 are moved in the vertical direction.

  As shown in FIG. 1, an application nozzle unit (hereinafter referred to as a unit) 78 for checking the application nozzle 65 is detachably attached to the feeder holding member 22. As shown in FIGS. 6-8, the unit 78 is provided with a main body 79 which is generally in the form of a rectangular parallelepiped, and two positioning projections 80a, b and a connector 80n are provided on one end surface of the main body 79. 81 are provided movably between the projecting position and the retracted position. The positioning protrusions 80a and 80b fit in the positioning recesses 27a and 27b, the connector 80n fits in the connector connection portion 27n, and the engagement protrusion 81 is engaged with the engagement recess 26 so that the unit 78 is a feeder. It is attached to the equal holding member 22 while being positioned and electrically connected.

  The unit 78 includes a paper supply device 82, a touch sensor 83, a height measurement jig 84, a container 85, and the like. The paper feeding device 82 feeds the paper Y from the roll PR formed by winding the paper Y to the test hitting area A, and (a) a roll holding roller 86 which holds the roll PR, (b) the test hitting area A And a winding motor 88 (see FIG. 9) for driving the winding roller 87, and (d) a plurality of feed rollers 89 and the like. The paper Y is fed from the roll PR held by the roll holding roller 86 by the drive of the winding motor 88, supplied to the test hitting area A and taken up by the winding roller 87. The paper Y may be substantially the same as the substrate P in the degree of penetration of the highly viscous fluid.

The touch sensor 83 and the height measurement jig 84 have the same structure as the touch sensor 14 and the height measurement jig 16 provided in the substrate transport holding device 4. The touch sensor 83 is a contact portion 91 located at a predetermined height (for example, the height assumed to be the same height as the upper surface S of the substrate held by the substrate conveyance and holding device 4). And detects whether the tip of the discharge pipe 70 abuts on the contacted portion 91. The height measurement jig 84 includes a reflected surface 92 as a first reference surface provided at the same height as the contact portion 91 of the touch sensor 83.
The container 85 is for receiving the highly viscous fluid discharged from the application nozzle 65. For example, by discharging the highly viscous fluid from the application nozzle 65 at high air pressure, clogging and the like in the nozzle can be eliminated. The partition plate provided at the center of the container 85 is for wiping the highly viscous fluid attached to the discharge pipe 70.

The high viscosity fluid applied on the paper Y by the application nozzle 65 in the trial shot area A is imaged by the camera 90 attached to the slider 48, and the shape such as the size of the high viscosity fluid is based on the imaged image It is checked whether the center point of the high viscosity fluid coincides with the center point of the application nozzle 65, etc. Based on the check result, the air pressure supplied to the air chamber, the air supply time, and the like are adjusted, and the clogging of the coating nozzle 65 is eliminated.
Further, the test hitting area A, the touch sensor 83, the height measuring jig 84, and the container 85 are within the movable range of the working head 30 with the unit 78 of the main body 79 attached to the holding member 22 such as a feeder. It is provided in the part where it is located. The movable range of the working head 30 is determined by the structure of the head moving device 8 and the lifting device 68.

  As shown in FIG. 1, an opening 97 is provided in the upper portion (frame) of the apparatus main body 2 of the substrate handling apparatus. The opening 97 has a size that allows a part of the worker's human body (for example, a hand, an arm, and the like) to enter, and maintenance of the substrate conveyance and holding device 4 and the head moving device 8 provided in the device main body 2 is performed. It is used for cases. A safety door 98 is attached to the opening 97 in an openable / closable manner, and the operation of the substrate handling apparatus is permitted when the safety door 98 is closed. Whether or not the safety door 98 is open is detected by a safety door open / close sensor 99 (see FIG. 9) as a detection device.

  As shown in FIG. 9, the control apparatus 100 mainly composed of a computer is provided in the substrate-to-substrate operation apparatus. Control device 100 includes an execution unit, a storage unit, an input / output unit, etc., and is connected with touch sensors 14, 83, camera 90, safety door open / close sensor 99, distance sensor 110, etc. A motor 36, z-axis motors 60 and 72, a winding motor 88, a positive pressure / negative pressure selective supply device 59, an air control device 69 and the like are connected. The distance sensor 110 is a non-contact type provided on the slider 48 and irradiates an electron beam such as light to the surface to be reflected 15, 92 to be irradiated and receives the reflected electron beam to be reflected. Detect the distance between 15 and 92.

  In the substrate working apparatus, the operation permission / prohibition program represented by the flow chart of FIG. 10 is executed every predetermined set time. In step 1 (hereinafter abbreviated as S1; the same applies to other steps), it is determined based on the output of the safety door open / close sensor 99 whether the safety door 98 is in the open state. When in the closed state, the operation is permitted in S2, and in the open state, the operation is inhibited in S3. For example, when the safety door 98 is opened in the operation state of the substrate working apparatus, the determination in S1 is YES, and the operation is prohibited in S3, and the operation of the substrate working apparatus is stopped.

The mounting control is performed when the mounting head 50 is mounted on the slider 48 in the operation permitting state of the substrate working apparatus. The mounting head 50 is moved horizontally and vertically between the component supply position and the component mounting position under the control of the head moving device 8 and the lifting device 58. When the suction nozzle 57 reaches a height determined on the predetermined position of the upper surface S of the substrate based on the dimensions and the like of the component, the component is released by the control of the negative pressure selective supply device 59 and mounted on the substrate P. The height of the suction nozzle 57 is controlled based on the suction nozzle reference descent amount. The suction nozzle reference lowering amount is a lowering amount until the suction nozzle 57 comes in contact with the substrate upper surface S from the reference height, and the reference height is a predetermined relative height of the suction nozzle 57 with respect to the head main body 56 . The suction nozzle reference descent amount is acquired in advance and stored.
The height of the suction nozzle 57 is determined by executing the suction nozzle elevation control program represented by the flowchart of FIG. In S11, the suction nozzle 57 is lowered above the touch sensor 14 with the suction nozzle 57 at the reference height. In S12, it is determined by the touch sensor 14 whether or not the suction nozzle 57 is in contact with the contacted portion 13. The lowering of the suction nozzle 57 is continued while the contact of the suction nozzle 57 is not detected, but when the contact is detected, the lifting device 58 of the suction nozzle 57 from the reference height to the contact in S13. The suction nozzle actual descent amount D, which is the descent amount by d, is acquired. The suction nozzle actual lowering amount D is made the suction nozzle reference lowering amount Da (D → Da), and is stored in S14. Thereafter, mounting control is performed in S15, and the elevation device 58 is controlled based on the suction nozzle reference descent amount Da to control the height of the suction nozzle 57.

When the application head 52 is attached to the slider 48, application control is performed. The application nozzle 65 is moved horizontally and vertically by the control of the head moving device 8 and the lifting device 68. When the application nozzle 65 reaches a predetermined height of a predetermined position on the upper surface S of the substrate, the highly viscous fluid is applied by the control of the air control device 69. The height of the application nozzle 65 is controlled based on the application nozzle reference descent amount. The application nozzle reference descent amount is a descent amount from the reference height of the application nozzle 65 to contact with the upper surface S of the substrate, and the reference height is a predetermined relative height of the application nozzle 65 with respect to the head main body 64 . The application nozzle reference descent amount is obtained in advance and stored.
The application nozzle 65 is normally lowered to a position higher by a set distance g than the upper surface S of the substrate, as shown in FIG. 13B, and a highly viscous fluid is discharged. In a conventional coating head, a protruding bar is provided separately from the coating nozzle and protrudes downward by a distance g from the tip of the discharge pipe, and after the protruding bar is lowered until it abuts on the upper surface S of the substrate, highly viscous fluid Was being discharged. However, there has been a problem in mounting the parts with high density, such as the protruding bar interfering with the already mounted parts. In addition, since the highly viscous fluid is discharged after the protruding bar is pressed against the upper surface S of the substrate, there has been a problem that the time required for coating becomes longer accordingly. Therefore, there has been a demand for accurately lowering the coating nozzle 65 to a position higher than the upper surface S of the substrate by the set distance g without using a protruding bar.

On the other hand, if the touch sensor 14 is used, the application nozzle reference descent amount can be accurately obtained, but the touch sensor 14 is used by the suction nozzle 57 and the tip of the application nozzle 65 is in contact with the contact portion 13. If it contacts, highly viscous fluid adheres, which is not desirable. Therefore, the unit 78 is provided with the touch sensor 83 dedicated to the coating head. However, since the unit 78 is detachably attached to the apparatus main body 2, the height of the contact portion 91 of the touch sensor 83 is The height may not be the same as the top surface S of the substrate.
From the above circumstances, in the present embodiment, the difference ΔH between the heights of the reflection surfaces 15 and 92 of the height measurement jigs 16 and 84 using the non-contact distance sensor 110 attached to the slider 48 That is, the difference ΔH between the heights of the contact portions 13 and 91 of the touch sensors 14 and 83 is acquired, and the difference ΔH and the amount of lowering D until the application nozzle 65 abuts on the contact portion 91 of the touch sensor 83. The application nozzle reference descent amount is obtained based on the above.

  The height of the coating nozzle is controlled by the execution of the coating nozzle elevation control program represented by the flowchart of FIG. As shown in FIG. 13A, in S21, the head moving device 8 moves the coating head 52 (slider 48) above the height measuring jig 16 of the substrate transport and holding device 4, and the distance sensor 110 The distance between the upper surfaces (the distance between the second reference surfaces) H2 which is the distance to the second reference surface 15 is acquired, and in S22, it is moved above the height measuring jig 84 of the unit 78. A first reference plane distance H1 which is a distance to the 1 reference plane 92 is acquired, and in S23, a difference (distance difference) ΔH (H2−H1) of these distances is obtained. Then, it is moved to the upper side of the touch sensor 83, and in S24, 25, whether the coating nozzle 65 is lowered from the reference height by the lifting device 68 and the touch sensor 83 abuts the coating nozzle 65 on the contact portion 91 It is determined whether or not. The lowering of the application nozzle 65 is continued while the contact of the application nozzle 65 is not detected, but when the contact is detected, the actual lowering amount of the application nozzle D, which is the amount of descent up to that time, is acquired in S26. At S27 and S28, a value obtained by adding the distance difference ΔH to the application nozzle actual descent amount D is acquired as the application nozzle reference descent amount Db (D + ΔH → Db) and stored. Thereafter, the application control is performed in S29, but the height control of the application nozzle 65 is performed by the control of the lifting and lowering device 68 based on the application nozzle reference descent amount Db.

As described above, since the touch sensor 83 dedicated to the coating nozzle is provided, the coating nozzle reference descent amount can be accurately acquired without soiling the touch sensor 14. The height of the application nozzle 65 can be accurately controlled to a position higher than the substrate upper surface S by the set distance g, and the highly viscous fluid can be applied to the substrate upper surface S accurately and stably. In addition, since no protruding bar is used, it is also effective in mounting components at high density. Furthermore, the time required to apply the highly viscous fluid can also be shortened.
In addition, since the unit 78 provided with the touch sensor 83 dedicated to the application nozzle is detachably attached to the holding member 22 such as a feeder, it can be removed from the holding member 22 such as a feeder without opening the safety door 98. Therefore, while the work is being performed on the substrate P in the substrate working apparatus, the unit 78 is taken out without stopping the operation of the substrate working apparatus, and maintenance such as cleaning of the contacted portion 91 of the touch sensor 83 is performed. It can be performed.

  Hereinafter, the touch sensor 14 and the contact portion 13 correspond to the suction nozzle touch sensor and the suction nozzle contact portion, and the touch sensor 83 and the contact portion 91 correspond to the coating nozzle touch sensor and the coating nozzle contact portion. It corresponds. Further, the lifting and lowering devices 58 and 68 and the like constitute a nozzle lifting and lowering device. Furthermore, the suction nozzle elevation control device is configured by the portion storing and executing the suction nozzle elevation control program of the control device 100, etc., and the suction nozzle reference lowering by the portion storing S11 to 14 and the portion executed thereof. A quantity acquisition unit is configured. In addition, the coating nozzle elevation control device is configured by the portion storing and executing the coating nozzle elevation control program of the control device 100, the distance sensor 110 and the like, and the portion storing the S21 to 28 among them, the portion to be executed A nozzle reference descent amount acquisition unit is configured. The suction nozzle elevation control device and the suction nozzle elevation control device are respectively also a suction nozzle height control unit and an application nozzle height control unit. The operation stop device is configured by a portion storing S1 and 3 of the operation permission / stop program of the control device 100, a portion to be executed, and the like.

The touch sensor 83 dedicated to the application nozzle may be provided not on the unit 78 but on the apparatus main body 2 (including the main body 10 of the substrate transport holding apparatus 4) or the like. In that case, the height measurement jigs 16 and 84 become unnecessary, and the amount of descent until the application nozzle 65 abuts on the contact portion of the dedicated touch sensor can be used as the amount of application nozzle descent.
Further, the distance between the upper surfaces may be a fixed value, in which case it is not necessary to measure the distance between the second reference surfaces which is the distance between the upper surfaces, and the height measuring jig 16 can be eliminated. This is because the distance between the slider 48 and the upper surface S of the substrate is determined by the substrate working apparatus. Furthermore, the height measurement jigs 16 and 84 become unnecessary when the main body 10 of the substrate transport holding device 4 and a part of the main body 79 of the unit 78 can be used as a surface to be reflected.
In the present invention, the working head 30 is attached to the slider 48 so as to be able to move up and down, or the slider 48 can hold the two working heads 50 and 52. Besides, various modifications and improvements can be made based on the knowledge of those skilled in the art.

  4: Substrate conveying and holding device 8: Head moving device 14, 83: Touch sensor 13, 91: Contacted portion 16, 84: Height measuring jig 15, 92: Reflected surface 22: Feeding member holding member 30: Working head 32: x-direction moving device 34: y-direction moving device 48: slider 54: detachment mechanism 56, 64: head body 57: suction nozzle 65: application nozzle 58, 68: lifting device 78: unit for application nozzle 99: safety door opening / closing Sensor 100: Control device 110: Distance sensor

Claims (4)

The device body,
A circuit board holding device provided in the device body and holding a circuit board;
An application nozzle for applying a highly viscous fluid to the upper surface of the circuit board, which is the upper surface of the circuit board held by the circuit board holding device, and a suction nozzle for holding electronic components and mounted on the upper surface of the board A nozzle lifter,
A suction nozzle touch sensor provided in the device main body and detecting whether or not the tip of the suction nozzle abuts;
A unit detachably attached to the device body;
An application nozzle touch sensor including an application nozzle contactable portion capable of contacting the tip of the application nozzle, provided in the unit and detecting whether or not the tip of the application nozzle abuts;
A first reference surface provided in the unit and positioned at the same height as the contact portion for the coating nozzle;
The nozzle lifting and lowering device is controlled based on the suction nozzle actual lowering amount which is the lowering amount of the suction nozzle by the nozzle lifting and lowering device until the tip of the suction nozzle abuts on the suction nozzle touch sensor. A suction nozzle elevation control device that controls the amount of descent of the suction nozzle when the nozzle mounts an electronic component on the upper surface of the substrate;
The nozzle lifting and lowering device is controlled based on an actual lowering amount of the application nozzle which is a lowering amount of the application nozzle by the nozzle lifting and lowering device until the tip of the application nozzle abuts on the coating nozzle touch sensor. nozzle at the time of applying the highly viscous fluid to the substrate upper surface, seen including a coating nozzle elevation control unit for controlling the lowering amount of the coating nozzle,
(A) a non-contact distance sensor for detecting the distance between the coating nozzle elevation control device and the irradiation target surface; (b) the first reference as the irradiation target surface detected by the distance sensor Based on the difference between the first reference surface distance which is the distance between the surface and the second reference surface distance which is the distance between the upper surface of the substrate, and the application nozzle actual lowering amount (C) acquisition of the application nozzle reference descent amount of the application nozzle reference descent amount which acquires the application nozzle reference descent amount which is the descent amount of the nozzle elevating device until the application nozzle abuts on the upper surface of the substrate based on the coating nozzle reference descent amount obtained by section, wherein by controlling the nozzle elevating device, the height to control the coating level controller and the including-board work from the substrate top surface of said coating nozzle apparatus. The substrate-to-substrate working device includes a second reference surface provided at the same height as the upper surface of the substrate,
Wherein between the second reference plane distance, the substrate-related-operation performing device according to claim 1 which is the distance between the distance the second reference surface as the irradiation target surface detected by the sensor. The suction nozzle touch sensor has a suction nozzle contactable portion with which the tip of the suction nozzle can contact.
The suction nozzle contact portion is positioned at the same height as the upper surface of the substrate;
The suction nozzle elevation control device controls the nozzle elevation device based on the suction nozzle reference descent amount with the suction nozzle actual descent amount as the suction nozzle reference descent amount, from the upper surface of the substrate of the suction nozzle. The substrate working apparatus according to claim 1, further comprising a mounting height control unit that controls the height. A safety door provided in the substrate-to-substrate work device;
A detection device for detecting whether or not the safety door is in an open state;
An operation stop device for stopping the operation of the substrate handling device when the safety door is in an open state based on the detection of the detection device;
The substrate-to-board operation apparatus according to any one of claims 1 to 3, wherein the coating nozzle touch sensor is provided in a state accessible by an operator in a closed state of the safety door.

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