JP6474686B2 - Wiring body, wiring board and touch sensor - Google Patents

Description

  The present invention relates to a wiring body, a wiring board, and a touch sensor.

  A touch panel having a detection electrode constituted by a conductive thin wire and a lead-out wiring connected to the detection electrode is known (see, for example, Patent Document 1). Generally, the lead-out wiring is located in an outer area that avoids an input area that can be visually recognized by the operator, and is arranged while being bent in the outer area.

JP 2014-182436 A

  When the lead wiring is formed in a mesh shape (mesh shape) in which the mesh is uniformly arranged in the whole, a straight portion located on one side of the bent portion where the extending direction of the lead wire changes, and the bent There is a problem that an electrical resistance value of the lead-out wiring is increased due to a decrease in the conduction path between the linear portion located on the other side of the portion and an increase in the conduction distance.

  The problem to be solved by the present invention is to provide a wiring body, a wiring board, and a touch sensor capable of suppressing an increase in electrical resistance value of a lead wiring layer.

[1] A wiring body according to the present invention includes a first resin layer, an electrode layer provided on the first resin layer, and provided on the first resin layer and connected to the electrode layer. A network-like lead wiring layer, wherein the lead wiring layer extends along a second direction different from the first direction, and a first straight line portion extending along the first direction. A second linear portion that exists and a bent portion that connects the first and second linear portions to each other, and the first and second linear portions are formed by a first conductor line. The plurality of first unit nets having substantially the same shape are arranged to satisfy the following expression (1).
α ₁ = α ₂ (1)
However, in the above formula (1), α ₁ is a virtual straight line extending along the arrangement direction of the first unit mesh in the first straight line portion and a virtual straight line extending along the first direction. Α ₂ is an imaginary straight line extending along the arrangement direction of the first unit mesh in the second straight line portion and a virtual straight line extending along the second direction. It is an angle to make.

[2] In the above invention, the bent portion may include a second unit mesh having a shape different from the shape of the first unit mesh.

[3] In the above invention, the one end portion of the first straight portion and the one end portion of the second straight portion overlap each other to form the bent portion, and the second unit mesh May include the first conductor line constituting the first straight line portion and the first conductor line constituting the second straight line portion.

[4] In the above invention, one end portion of the first straight portion and one end portion of the second straight portion are spaced apart from each other, and the bent portion is one of the first straight portions. It has a 2nd conductor line which mutually connects an end part and one end part of the 2nd above-mentioned straight line part, and the 2nd unit network may contain the 2nd conductor line.

[5] In the above invention, the second conductor wire includes an apex of the first unit mesh constituting the first straight line portion and a first unit mesh constituting the second straight line portion. The vertices may be connected to each other.

[6] In the above invention, the width of the first conductor line may be substantially equal to the width of the second conductor line.

[7] In the above invention, with respect to the plurality of first unit meshes arranged along the arrangement direction in the first straight line portion, one vertex of the first unit mesh and the other corresponding to the vertex A plurality of the first unit meshes arranged on the virtual straight line extending along the first direction and arranged along the arrangement direction in the second straight line portion. On the virtual straight line in which the vertex of one of the first unit mesh and the vertex of the other first unit mesh corresponding to the vertex extend along the second direction. May be located.

[8] In the above invention, the aspect ratio of the first unit mesh in plan view is greater than 1, and the aspect ratio of the first unit mesh in plan view is in relation to the extending direction of the extraction wiring layer. It may be a ratio of the length of the first unit mesh along the extending direction of the lead wiring layer to the length of the first unit mesh along the substantially vertical direction.

[9] In the above invention, both side end portions of the lead-out wiring layer have a first outermost position among vertices constituting the first unit network located on the outermost side in the lead-out wiring layer. The width of the lead-out wiring layer includes the first vertex included in one of the side end portions in the direction substantially perpendicular to the extending direction of the lead-out wiring layer, and the other side It may be a distance between the first vertex included in the end portion.

[10] In the above invention, a plurality of the electrode layers, and a plurality of lead wiring layers connected to the plurality of electrode layers and arranged substantially parallel to each other, the extending direction of the lead wiring The one first vertex of the adjacent lead wiring layer and the other first vertex of the adjacent lead wiring layer may be shifted from each other.

[11] In the above invention, the lead-out wiring layer may have an aperture ratio of 50% or less.

[12] A wiring board according to the present invention includes the wiring body, and a support body that supports the electrode layer and the lead-out wiring layer.

[13] A touch sensor according to the present invention includes the wiring board.

  According to the present invention, the arrangement direction of the unit mesh with respect to the first direction in the first straight line portion substantially matches the arrangement direction of the unit mesh with respect to the second direction in the second straight line portion. As a result, one of the first and second straight portions connected to each other via the bent portion has a reduced conduction path or a longer conduction distance than the other of the first and second straight portions. Deter. As a result, an increase in the electrical resistance value of the lead wiring layer can be suppressed.

FIG. 1 is a perspective view showing a touch sensor according to an embodiment of the present invention. FIG. 2 is a plan view showing a wiring board according to an embodiment of the present invention. 3A is a cross-sectional view taken along line IIIa-IIIa in FIG. 2, and FIG. 3B is a cross-sectional view taken along line IIIb-IIIb in FIG. FIG. 4 is an enlarged plan view of a portion IV in FIG. FIG. 5 is an explanatory diagram for explaining the aperture ratio. 6 is an enlarged plan view of a VI part in FIG. FIG. 7A to FIG. 7E are cross-sectional views showing a method for manufacturing a wiring board in an embodiment of the present invention. FIG. 8 is a plan view showing a first modification of the lead wiring layer according to the embodiment of the present invention. FIG. 9A is a plan view showing a second modification of the lead-out wiring layer according to one embodiment of the present invention, and FIG. 9B is a diagram for explaining a bent portion. FIGS. 10A and 10B are plan views respectively showing a third modification and a fourth modification of the lead-out wiring layer according to one embodiment of the present invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  1 is a perspective view showing a touch sensor according to one embodiment of the present invention, FIG. 2 is a plan view showing a wiring board according to one embodiment of the present invention, and FIG. 3A is IIIa-IIIa in FIG. 3B is a cross-sectional view taken along the line IIIb-IIIb in FIG. 2, FIG. 4 is an enlarged plan view of the IV part in FIG. 2, and FIG. 5 is an explanation for explaining the aperture ratio. 6 and 6 are enlarged plan views of the VI part of FIG.

  The touch sensor 1 including the wiring body 4 of the present embodiment is a touch input device used for, for example, a capacitive touch panel and a touch pad. As shown in FIGS. 1 and 2, the touch sensor 1 includes a wiring board 2 including a base material 3 and a wiring body 4, and a mesh laminated on the wiring board 2 (wiring body 4) via a resin layer 8. The electrode layer 9 and the lead-out wiring layer 10 are provided.

  The mesh electrode layer 6 provided in the wiring body 4 is a plurality of (three in this embodiment) detection electrodes extending in the Y direction, and the mesh electrode layer 9 is opposed to the mesh electrode layer 6. And a plurality of (four in the present embodiment) detection electrodes respectively extending in the X direction. In the touch sensor 1, the mesh electrode layer 6 is connected to an external circuit via a lead wiring layer 7, and the mesh electrode layer 9 is connected to an external circuit via a lead wiring layer 10. Then, a predetermined voltage is periodically applied between the mesh electrode layers 6 and 9, and an operator's operation on the touch sensor 1 is performed based on a change in capacitance at each intersection of the two mesh electrode layers 6 and 9. Determine the position (contact position).

  In this embodiment, the resin layer 8 has the same configuration as that of the adhesive layer 5, and the mesh electrode layer 9 has the same configuration as that of the mesh electrode layer 6. 10 has the same configuration as that of the lead-out wiring layer 7. Therefore, in the present specification, in the following description, detailed description of the resin layer 8, the mesh electrode layer 9, and the lead-out wiring layer 10 is omitted. The “wiring board 2” in the present embodiment corresponds to an example of the “wiring board” and the “touch sensor” in the present invention.

  Base material 3 is polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyimide resin (PI), polyetherimide resin (PEI), polycarbonate (PC), polyetheretherketone (PEEK), liquid crystal polymer (LCP) Examples thereof include materials such as cycloolefin polymer (COP), silicone resin (SI), acrylic resin, phenol resin, epoxy resin, green sheet, and glass. The base material may be formed with an easy adhesion layer or an optical adjustment layer. In addition, when using the wiring board 2 for the electrode board | substrate of a touch panel, as a material which comprises the base material 3, a transparent thing is selected. The “base 3” in the present embodiment corresponds to an example of the “support” in the present invention.

  The wiring body 4 is formed on the main surface 31 of the base material 3 and is supported by the base material 3. The wiring body 4 includes an adhesive layer 5, a mesh electrode layer 6, and a lead wiring layer 7. The “wiring body 4” in the present embodiment corresponds to an example of the “wiring body” in the present invention.

  The adhesive layer 5 in the present embodiment is a member that adheres and fixes the base material 3 and the mesh electrode layer 6 to each other. Similarly, the adhesive layer 5 also bonds and fixes the base material 3 and the lead-out wiring layer 7 to each other. Examples of the material constituting the adhesive layer 5 include epoxy resins, acrylic resins, polyester resins, urethane resins, vinyl resins, silicone resins, phenol resins, polyimide resins, and other UV curable resins, thermosetting resins, and thermoplastics. Resin etc. can be illustrated. As shown in FIG. 3A and FIG. 3B, the adhesive layer 5 in the present embodiment includes a flat portion 51 provided on the main surface 31 of the base material 3 with a substantially constant thickness, and the flat portion 51. And a support portion 52 formed on the portion 51.

  The flat portion 51 is uniformly provided so as to cover the main surface 31 of the base material 3, and the main surface 511 of the flat portion 51 is a surface substantially parallel to the main surface 31 of the base material 3. . The support portion 52 is formed between the flat portion 51 and the mesh electrode layer 6 and between the flat portion 51 and the lead-out wiring layer 7 and is away from the base material 3 (+ Z direction in FIG. 2). ) So as to protrude toward the center). For this reason, the thickness (height) of the adhesive layer 5 in the portion where the support portion 52 is provided is larger than the thickness (height) of the adhesive layer 5 in the flat portion 51.

  The adhesive layer 5 has a mesh electrode layer 6 (specifically, a contact surface 61 (described later)) and a lead wiring layer 7 (specifically, a contact surface 71) on the contact surface 522 that is the upper surface of the support portion 52. (Described later). The support portion 52 has two side surfaces 521 and 521 that are linearly inclined so as to approach each other as they are separated from the base material 3 in a cross-sectional view in the short direction.

  As shown in FIG. 2, the mesh electrode layer 6 is a detection electrode of the touch sensor 1 extending in the Y direction, and is laminated on the support portion 52 of the adhesive layer 5 so as to protrude toward the + Z direction. It is formed (see FIG. 3A). “Reticulated electrode layer 6” in the present embodiment corresponds to an example of “electrode layer” in the present invention.

  The mesh electrode layer 6 is composed of conductive powder and a binder resin. In the mesh electrode layer 6, the conductive powder is present in a substantially uniform dispersion in the binder resin, and the conductivity is imparted to the mesh electrode layer 6 by the conductive powders contacting each other. Has been. Examples of the conductive powder constituting the mesh electrode layer 6 include metals such as silver, copper, nickel, tin, bismuth, zinc, indium and palladium, and graphite. In addition to the conductive powder, a metal salt that is a salt of the metal described above may be used.

  Examples of the binder resin constituting the mesh electrode layer 6 include acrylic resin, polyester resin, epoxy resin, vinyl resin, urethane resin, phenol resin, and polyimide resin. In addition, you may abbreviate | omit binder resin from the material which comprises the mesh electrode layer 6. FIG.

  As shown in FIG. 2, the mesh electrode layer 6 of the present embodiment is configured by intersecting a plurality of conductive fourth conductor lines 64 a and 64 b, and has a rectangular shape as a whole. The mesh 65 has a repeatedly arranged shape. The “fourth conductor wires 64a and 64b” in the present embodiment correspond to an example of the “fourth conductor wire” in the present invention, and the “mesh 65” in the present embodiment corresponds to an example of the “mesh” in the present invention. To do. In the following description, “fourth conductor line 64a” and “fourth conductor line 64b” are collectively referred to as “fourth conductor line 64” as necessary.

  As shown in FIG. 3A, the outer shape of the fourth conductor wire 64 of the present embodiment includes a contact surface 61, a top surface 62, and two side surfaces 63 and 63. The contact surface 61 is a surface in contact with the adhesive layer 5 (specifically, the contact surface 522). The mesh electrode layer 6 of the present embodiment is supported by the base material 3 through the adhesive layer 5, but in this case, the contact surface 61 is positioned on the base material 3 side with respect to the top surface 62. It becomes a surface. Further, the contact surface 61 is a concavo-convex surface composed of fine concavo-convex portions in the cross section in the short direction.

  On the other hand, the top surface 62 is a surface opposite to the contact surface 61 and is a substantially flat surface. The top surface 62 is a surface substantially parallel to the main surface 31 of the base material 3 (or the surface of the adhesive layer 5 facing the main surface 31).

  The side surfaces 63, 63 are straight surfaces that are inclined so as to approach each other as they are separated from the adhesive layer 5 in the short-side sectional view. Further, in the present embodiment, the side surfaces 63 and 63 are continuously connected to the side surfaces 521 and 521 at a portion connected to the interface of the contact surfaces 522 and 61 in the short-side cross-sectional view.

  The surface roughness of the contact surface 61 of the mesh electrode layer 6 (fourth conductor wire) in the present embodiment is the surface of the top surface 62 from the viewpoint of firmly fixing the mesh electrode layer 6 and the adhesive layer 5. Relative to the roughness is preferred. Specifically, the surface roughness Ra of the contact surface 61 is about 0.1 to 3.0 μm, whereas the surface roughness Ra of the top surface 62 is about 0.001 to 1.0 μm. It is even more preferable that the surface roughness Ra of the top surface 62 is 0.001 to 0.3 μm. Such surface roughness can be measured by the JIS method (JIS B0601 (revised on March 21, 2013)).

In the mesh electrode layer 6 of the present embodiment, the fourth conductor wire 64 is provided as follows. That is, as shown in FIG. 2, the fourth conductor line 64a extends linearly along a direction inclined at + 45 ° with respect to the X direction (hereinafter simply referred to as “third direction”). and Mashimashi, the plurality of fourth conductor wire 64a is a direction substantially orthogonal to the first direction (hereinafter, simply referred to as "fourth direction".) is at an equal pitch P ₁ Are lined up. In contrast, the fourth conductor wire 64b extends in the fourth linearly along the direction of, the plurality of fourth conductor wires 64b are arranged at equal pitches P ₂ in the third direction It has been. The fourth conductor lines 64a and 64b are orthogonal to each other, thereby forming a mesh electrode layer 6 in which square (rhombus) mesh 65 is repeatedly arranged.

The configuration of the mesh electrode layer 6 is not particularly limited to the above. For example, in the present embodiment, the pitch P ₁ of the fourth conductor wires 64a are substantially the same and the pitch P ₂ of the fourth conductor wire 64b (P 1 _{= P 2),} limited to It not, may be made different from the pitch _{P 2} between the pitch _{P 1} of the fourth conductor wire 64a fourth conductor wires 64b _{(P 1} ≠ _P 2). In this case, the mesh has a rectangular outer shape.

  In the present embodiment, the third direction, which is the extending direction of the fourth conductor line 64a, is a direction inclined by + 45 ° with respect to the X direction, and is the extending direction of the fourth conductor line 64b. The fourth direction is a direction substantially orthogonal to the third direction, but the extending direction of the third and fourth directions (that is, the angle of the third direction with respect to the X axis, The angle in the fourth direction with respect to the X axis) can be arbitrary.

  The shape of the mesh 65 of the mesh electrode layer 6 may be a geometric pattern. That is, the shape of the mesh 65 may be a triangle such as a regular triangle, an isosceles triangle, a right triangle, or a rectangle such as a rectangle, a square, a rhombus, a parallelogram, or a trapezoid. The shape of the mesh 65 may be an n-gon such as a hexagon, an octagon, a dodecagon, or an icosahedron, a circle, an ellipse, or a star.

  As described above, a geometric pattern obtained by repeating various graphic units can be used as the mesh electrode layer 6 as the mesh 65 of the mesh electrode layer 6. In the present embodiment, the fourth conductor wire 64 is linear, but is not particularly limited to this, and may be, for example, a curved shape, a horseshoe shape, a zigzag line shape, or the like.

  As shown in FIG. 2, the lead wiring layer 7 is provided corresponding to the mesh electrode layer 6. In this embodiment, three lead wiring layers 7 are formed for the three mesh electrode layers 6. Has been. The lead wiring layer 7 is led out from a linear outer edge portion 66 provided on the mesh electrode layer 6 on the −Y direction side in the drawing. The lead wiring layer 7 is integrally formed of the same material as that of the mesh electrode layer 6 described above.

  The term “integrally” means that the members are not separated from each other and are formed as an integrated structure of the same material (conductive particles having the same particle diameter, binder resin, etc.). The position where the lead wiring layer 7 is provided on the outer edge of the mesh electrode layer 6 is not particularly limited. Further, the outer edge portion 66 may be omitted from the configuration of the wiring body 4. In this case, the lead-out wiring layer 7 and the mesh electrode layer 6 are directly connected.

  As shown in FIG. 3B, the outer shape of the lead wiring layer 7 (specifically, the first conductor wire 741 (described later)) of the present embodiment is similar to that of the mesh electrode layer 6 and the contact surface 71. , A top surface 72 and two side surfaces 73 and 73. The contact surface 71 is a surface that comes into contact with the adhesive layer 5, and has an uneven shape composed of fine unevenness in the cross section in the short-side direction. On the other hand, the top surface 72 is a substantially flat surface located on the opposite side of the contact surface 71 and extends so as to be substantially parallel to the main surface 31 of the substrate 3.

  The side surfaces 73, 73 are straight surfaces that are inclined so as to approach each other as they are separated from the adhesive layer 5 in the short-side direction sectional view. Further, in the present embodiment, the side surfaces 73 and 73 are continuously connected to the side surfaces 521 and 521 at a portion connected to the interface of the contact surfaces 522 and 71 in the short-side direction sectional view.

  The lead-out wiring layer 7 of the present embodiment has a surface roughness of the top surface 72 of the contact surface 71 from the viewpoint of firmly fixing the lead-out wiring layer 7 and the adhesive layer 5 in the same manner as the mesh electrode layer 6 described above. Relative to the surface roughness is preferable. Specifically, the surface roughness Ra of the contact surface 71 is about 0.1 to 3.0 μm, whereas the surface roughness Ra of the top surface 72 is about 0.001 to 1.0 μm. Is preferable, and it is even more preferable that the surface roughness Ra of the top surface 72 is 0.001 to 0.3 μm.

  In the touch sensor 1, the mesh electrode layer 6 is formed in a detection region where an operation by an operator can be detected, while the lead-out wiring layer 7 is formed in an outer region (frame region) located outside the detection region. In this case, the lead-out wiring layer 7 is disposed while bending the outer region so as not to pass through the detection region (see FIG. 1).

  As shown in FIG. 4, the lead-out wiring layer 7 of the present embodiment includes a first straight line portion 74a extending along the first direction and a second straight line portion extending along the second direction. 74b and a bent portion 75 for connecting the first and second straight portions 74a and 74b to each other. In the lead-out wiring layer 7 of the present embodiment, the end portion 744a of the first straight portion 74a and the end portion 744b of the second straight portion 74b are formed apart from each other.

  The “first straight line portion 74a” in the present embodiment corresponds to an example of the “first straight line portion” in the present invention, and the “second straight line portion 74b” in the present embodiment is the “second straight line portion” in the present invention. The “bending portion” in the present embodiment corresponds to an example of the “bending portion” in the present invention.

  In the present embodiment, the first direction is a direction substantially parallel to the X direction. The first straight portion 74a extending in the first direction is configured by intersecting a plurality of conductive first conductor lines 741a and 741b, and the first linear portion 74a is formed in a rectangular shape as a whole. The unit meshes 742 are repeatedly arranged.

  On the other hand, the second direction is a direction inclined by 30 ° with respect to the X direction. The second straight line portion 74b extending in the second direction is configured by intersecting a plurality of conductive first conductor lines 741a and 741b, like the first straight line portion 74a described above. As a whole, the first unit network 742 having a quadrangular shape is repeatedly arranged. In the present embodiment, the first unit mesh 742 constituting the first straight line portion 74a and the first unit mesh 742 constituting the second straight line portion 74b have substantially the same shape.

  The “first conductor lines 741a and 741b” in the present embodiment correspond to an example of the “first conductor lines” in the present invention, and the “first unit network 742” in the present embodiment is the “first conductor network” in the present invention. Corresponds to an example of “unit network of“. In the following description, “first conductor line 741a” and “first conductor line 741b” are collectively referred to as “first conductor line 741” as necessary.

In the first straight line portion 74a, the first conductor wire 741a extends linearly along a direction (that is, a fourth direction) inclined at −45 ° with respect to the first direction (that is, the X direction). and Mashimashi, the plurality of first conductor lines 741a are aligned at an equal pitch P ₃ in a direction substantially perpendicular (i.e., the third direction) with respect to the fourth direction. In contrast, the first conductive line 741b extends in a straight line along the third direction, the plurality of first conductor line 741b is arranged in equal pitch P ₄ in the third direction It has been.

  Thus, in the first straight line portion 74a, the first conductor line 741a extending in the fourth direction and the first conductor line 741b extending in the third direction are orthogonal to each other. A plurality of quadrangular first unit meshes 742 having substantially the same shape are formed. Here, the direction substantially coincident with the virtual straight line extending along the fourth direction is set as the arrangement direction of the first unit meshes 742 in the first straight line portion 74a.

  The direction substantially coincident with the virtual straight line extending along the fourth direction is the arrangement direction of the first unit meshes 742 in the first straight line portion 74a. A virtual straight line that intersects one unit mesh 742 and substantially coincides with a straight line that bisects the area of all the first unit meshes 742 arranged in parallel in the extending direction of the virtual straight line. For example, the arrangement direction of the first unit mesh 742 is not particularly limited to the above. For example, in the first straight line portion 74a of the present embodiment, the arrangement direction of the first unit meshes 742 may be a direction that substantially coincides with a virtual straight line extending along the third direction. Or it is good also as a direction substantially corresponding to the virtual straight line extended in the direction orthogonal to the 1st direction.

On the other hand, in the second straight line portion 74b, the first conductor wire 741a is linear along a direction inclined at −45 ° with respect to the second direction (hereinafter also simply referred to as “fifth direction”). The plurality of first conductor lines 741a are arranged at an equal pitch P in a direction substantially perpendicular to the fifth direction (hereinafter also simply referred to as “sixth direction”). They are arranged in _three . In contrast, the first conductive line 741b extends in a sixth straight line along the direction of, the plurality of first conductor line 741b is arranged in equal pitch P ₄ in the fifth direction It has been.

In the present embodiment, since the first unit mesh 742 has the same shape in the first and second straight portions 74a and 74b, a plurality of first conductor lines 741a in the first straight portion 74a. the pitch of each other and a plurality of first conductor lines 741a pitch between the second straight portion 74b, and substantially equal pitch P _3. Similarly, a pitch P between the plurality of first conductor lines 741b in the first straight line portion 74a and a pitch between the plurality of first conductor lines 741b in the second straight line portion 74b are substantially equal to the pitch P. ₄

  In the second straight line portion 74b, the first conductor line 741a extending in the fifth direction and the first conductor line 741b extending in the sixth direction are substantially orthogonal to each other, so that A plurality of quadrangular first unit nets 742 having the same shape are formed. The direction substantially coincident with the virtual straight line extending along the fifth direction is taken as the arrangement direction of the first unit meshes 742 in the second straight line portion 74b.

As described above, the following expression (2) is established in the lead-out wiring layer 7 of the present embodiment.
α ₁ = α ₂ (2)
However, in the above equation (2), α ₁ is along the imaginary straight line extending along the arrangement direction (fourth direction) of the first unit mesh 742 in the first straight line portion 74a and the first direction. The angle formed by the extending virtual straight line, α ₂ is the virtual straight line extending along the arrangement direction (fifth direction) of the first unit mesh 742 in the second straight line portion 74b and the second direction Is an angle formed by a virtual straight line extending along the line.

  By satisfying the above expression (2), the arrangement direction (fourth direction) of the first unit mesh 742 with respect to the first direction in the first straight line portion 74a and the second straight line portion 74b in the first direction. The arrangement direction (fifth direction) of the first unit mesh 742 with respect to the direction of 2 substantially matches. As a result, one of the first and second straight portions 74a and 74b prevents the conduction path from decreasing compared to the other of the first and second straight portions 74a and 74b.

  When there are a plurality of arrangement directions of the first unit mesh 742 in each of the first and second straight portions 74a and 74b, the first straight portion 74a is based on the extending direction of the lead-out wiring layer 7. The positional relationship between adjacent first unit meshes 742 in the arrangement direction of the first unit meshes 742 and the first adjacent ones in the arrangement direction of the first unit meshes 742 in the second straight line portion 74b. The arrangement directions in which the positional relationships between the unit meshes 742 are the same are selected. The “positional relationship between the adjacent first unit networks 742” indicates the other arrangement of the adjacent first unit networks 742 with respect to one of the adjacent first unit networks 742.

  Furthermore, in the present embodiment, for the first unit meshes 742a and 742b arranged in the arrangement direction in the first straight line portion 74a, the vertex 743A of the first unit mesh 742a and the first unit mesh 742A corresponding to the vertex 743A. The vertex 743B of one unit mesh 742b is located on an imaginary straight line extending along the first direction.

  As described above, in the present embodiment, since the plurality of first unit networks 742 are periodically and repeatedly arranged in the first direction, if one first unit network 742a is not defective, A new defect does not occur in the other first unit mesh 742b. For this reason, it can suppress that a defect | deletion arises in a part of 1st unit mesh 742 in the 1st linear part 74a whole. Further, by suppressing the occurrence of defects in the first unit mesh 742, conduction is stably ensured in the entire first straight portion 74a, and the contact portion between the arranged first unit meshes 742 increases. As a result, the number of conduction paths can be increased. In the present embodiment, in the first straight line portion 74a, one of the arrangement directions of the plurality of first unit nets 742 substantially matches the extending direction of the first straight line portion 74a. The above relationship is established.

  Further, also in the second straight line portion 74b, as in the first straight line portion 74a, with respect to the plurality of first unit meshes 742 arranged in the arrangement direction, the vertexes 743 of one first unit mesh 742, The vertex 743 of the other first unit mesh 742 corresponding to the vertex 743 is located on a virtual straight line extending in the second direction. Thereby, it is possible to suppress the occurrence of a defect in a part of the first unit mesh 742 in the entire second linear portion 74b. Further, by suppressing the occurrence of defects in the first unit mesh 742, conduction is stably ensured in the entire second linear portion 74b, and the contact portion between the arranged first unit meshes 742 increases. As a result, the number of conduction paths can be increased.

The configuration of the first and second straight portions 74a and 74b of the lead wiring layer 7 is not particularly limited to the above. For example, in the present embodiment, the first and second linear portions 74a, in 74b, but is substantially the same as the pitch _{P 3} of the first conductor line 741a and the pitch _{P 4} of the first conductor line 741b (P ₃ = P ₄ ), but not limited to this, the pitch P ₃ of the first conductor wire 741a may be different from the pitch P _{4 of} the first conductor wire 741b (P ₃ ≠ P ₄ ). . In this case, the first unit mesh has a rectangular outer shape.

  In the present embodiment, in the first straight portion 74a, the extending direction of the first conductor wire 741a is the fourth direction inclined by −45 ° with respect to the X direction, and the first conductor The extending direction of the line 741b is a third direction substantially orthogonal to the fourth direction, but the extending direction of the first conductor lines 741a and 741b (that is, an angle with respect to the X axis). Can be arbitrary.

  In this case, in the second straight line portion 74b, the fifth direction, which is the extending direction of the first conductor wire 741a, and the sixth direction, which is the extending direction of the first conductor wire 741b, are The first unit network 742 formed by one conductor line 741a and 741b is extended so that the arrangement direction satisfies the above expression (2).

  Further, the shape of the first unit mesh 742 may be a geometric pattern. That is, the shape of the first unit mesh 742 may be a triangle such as a regular triangle, an isosceles triangle, a right triangle, or a rectangle such as a rectangle, a square, a rhombus, a parallelogram, or a trapezoid. The shape of the first unit mesh 742 may be an n-gon such as a hexagon, an octagon, a dodecagon, or an icosahedron, a circle, an ellipse, or a star. Furthermore, an aggregate in which a plurality of different shapes are aggregated may be employed as the first unit network 742. In this case, the above-mentioned aggregate that is the first unit network 742 is repeatedly arranged along a predetermined arrangement direction.

  As described above, a geometric pattern obtained by repeating various graphic units can be used as the first unit mesh 742 as the first and second straight portions 74 a and 74 b of the lead-out wiring layer 7. In the present embodiment, the first conductor wire 741 is linear, but is not particularly limited thereto, and may be, for example, a curved shape, a horseshoe shape, a zigzag line shape, or the like.

  When the lead wiring layer 7 is formed so as to satisfy the above expression (2), the first lead wiring layer 7 is extended along the Y direction as shown in the lower enlarged view of FIG. The conductor line 741a extends in the third direction, and the first conductor line 741b extends in the fourth direction.

  As shown in FIG. 4, the bent portion 75 of the present embodiment is located between the end portions 744a and 744b, and connects the end portions 744a and 744b to each other. As a result, in the bent portion 75, the lead-out wiring layer 7 extends from the first direction that is the extending direction of the first straight portion 74a to the second direction that is the extending direction of the second straight portion 74b. The extending direction is changing.

  The bent portion 75 has a second unit mesh 752 including a second conductor wire 751 that connects the end portions 744a and 744b that are separated from each other.

  The second conductor wire 751 is integrally formed of a material having the same composition as that of the first conductor wire 741 constituting the first and second straight portions 74a and 74b. The second conductor line 751 includes an apex 743 of the first unit mesh 742 constituting the first straight line portion 74a and an apex 743 of the first unit mesh 742 constituting the second straight line portion 74b. Conductor wires connected to each other.

  When the conductor line connecting the vertex 743 of the first straight line portion 74a and the vertex 743 of the second straight line portion 74b is formed as the second conductor line 751, it is exposed from the end portion 744a of the first straight line portion 74a. Each of the apex and the apex exposed from the end 744b of the second straight line portion 74b is preferably connected to at least one second conductor line 751. The number of the second conductor wires 751 is the number of vertices exposed from the end portion 744a of the first straight portion 74a or the number of vertices exposed from the end portion 744b of the second straight portion 74b. It is preferable that it is more than the quantity of the larger side. Thereby, it is possible to suppress an increase in the electrical resistance value at the bent portion 75.

  Further, from the viewpoint of ensuring the flexibility of the lead-out wiring layer 7, the second conductor line 751 does not intersect with the first conductor line 741 constituting the first and second straight portions 74a and 74b. It is preferable to form. Note that the width of the second conductor wire 751 is the first conductor from the viewpoint of suppressing an increase in electrical resistance value in the lead-out wiring layer 7 and suppressing a decrease in visibility of the wiring body 4. Preferably, the width of the line 741 is substantially equal.

  The second conductor wire 751 of the present embodiment connects the vertices 743 and 743 constituting the first and second straight line portions 74a and 74b to each other, but is not limited to this. One conductor line 741 and 741 may be connected to each other.

  The second unit network 752 includes at least one side of the sides constituting the second unit network 752 constituted by the second conductor wire 751. The second unit mesh 752 has a different external shape from the first unit mesh 742.

  Various shapes can be used as the shape of the second unit mesh 752. The plurality of second unit meshes 752 formed in the bent portion 75 may have different external shapes, but the aperture ratio of the second unit mesh 752 is the aperture ratio of the first unit mesh 742. Is preferably approximately equal to

  When the aperture ratio of the second unit mesh is extremely smaller than the aperture ratio of the first unit mesh, the flexibility of the lead-out wiring layer is impaired at the bent portion, and the lead-out wiring layer may be disconnected. is there. On the other hand, when the aperture ratio of the second unit mesh is extremely larger than the aperture ratio of the first unit mesh, the conduction path is reduced at the bent portion, which may increase the electrical resistance value of the lead-out wiring layer. There is.

  Incidentally, in this embodiment, it is preferable that the aperture ratio of the lead-out wiring layer 7 is 50% or less. Furthermore, the aperture ratio of the lead-out wiring layer 7 is from the viewpoint of reducing the difference in rigidity between the mesh electrode layer 6 and the lead-out wiring layer 7 and from the viewpoint of improving the effect of suppressing the increase in electric resistance value in the lead-out wiring layer 7. More preferably, it is 10% or more and 50% or less.

The “aperture ratio” refers to a ratio represented by the following formula (3) (see FIG. 5).
(Aperture ratio) = b × b / (a × a) (3)
However, in the above equation (3), a is a pitch (a distance between the center lines CL) between an arbitrary conductor line 20 and another conductor line 20 adjacent to the conductor line 20, and b is an arbitrary The distance between the conductor line 20 and another conductor line 20 adjacent to the conductor line 20 is represented.

  Returning to FIG. 4, in the first straight line portion 74 a, both side end portions 76 and 76 of the lead-out wiring layer 7 include a first vertex 743 a, a second vertex 743 b, and these first and second vertices. The first conductor line 741 connects the 743a and 743b.

  Similarly, in the second straight line portion 74b, both side end portions 76, 76 of the lead-out wiring layer 7 have a first vertex 743a, a second vertex 743b, and these first and second vertices 743a, It is comprised from the 1st conductor line 741 which connects between 743b.

  The first vertex 743 a is the outermost vertex among the vertexes 743 (see FIG. 1) constituting the first unit network 742 located on the outermost side in the lead-out wiring layer 7. The second vertex 743b is a vertex 743 constituting the first unit network 742 located on the outermost side in the lead-out wiring layer 7, and is exposed to the outside of the lead-out wiring layer 7 different from the first vertex 743a. It is a vertex. At the first vertex 743a, the first conductor lines 741a and 741b are in contact with each other, whereas at the second vertex 743b, the first conductor lines 741a and 741b intersect each other.

In the side end portion 76 of the present embodiment, the first vertex 743a adjacent, 743a to each other are substantially equally spaced at a distance _{D 1,} a second apex 743b adjacent, substantially evenly distributed in 743b between the distance _{D 2} Has been. In the side end portion 76, the first and second vertices 743a and 743b are alternately continued along the extending direction of the lead-out wiring layer 7, and the first and second vertices 743a and 743b are connected between the first and second vertices 743a and 743b. 1 conductor lines 741a and 741b. As a result, the side end portion 76 has a wave shape along the extending direction of the lead wiring layer 7.

  Further, since the side end portion 76 is configured to include the first vertex 743a, the first wiring unit 742 located on the outermost side is present in the lead wiring layer 7 without being lost. In this case, the width of the lead-out wiring layer 7 of the present embodiment is such that the first vertex 743a included in one side end portion 76 in a direction substantially perpendicular to the extending direction of the lead-out wiring layer 7; This is the distance between the first apex 743a included in the other side end portion 76. As described above, since the conduction path is secured in the entire width L of the lead-out wiring layer 7, an increase in the electrical resistance value of the lead-out wiring layer 7 is suppressed.

  The side end portion 76 in the bent portion 75 includes a first vertex 743a that constitutes the side end portion 76 in the first straight portion 74a and a first vertex 743a that constitutes the side end portion 76 in the second straight portion 74b. And a second conductor line 751 connecting the first vertices 743a and 743a of the first and second straight line portions 74a and 74b. In addition, the side edge part 76 in the bending part 75 is not specifically limited above, You may be comprised including the 2nd vertex. Or you may be comprised including the 1st conductor wire.

  In the bent portion 75, from the viewpoint of reducing the electrical resistance value of the lead-out wiring layer 7, the width of the lead-out wiring layer 7 in the bent portion 75 is set to be the lead-out wiring layer 7 in the first and second straight portions 74a and 74b. It is preferable to form it so as to be substantially equal to the width of.

  As shown in FIGS. 1 and 2, the lead wiring layer 7 is formed at a position where the end opposite to the end connected to the mesh electrode layer 6 faces the outer edge of the substrate 3. At this time, in order to easily connect the plurality of lead-out wiring layers 7 to the external circuit, the plurality of lead-out wiring layers 7 are assembled so as to be arranged close to each other in the vicinity of the outer edge of the base material 3. In the present embodiment, the assembled plurality of lead wiring layers 7 are arranged substantially parallel to each other along the Y direction.

  In this case, as shown in FIG. 6, in the extending direction of the lead-out wiring layer 7 (that is, the Y direction), a plurality of lead-out wiring layers 7 arranged substantially in parallel with each other, One first vertex 743a and the other first vertex 743a of the adjacent lead-out wiring layer 7 are arranged with a distance S offset.

That is, the lead-out wiring layer 7 has a maximum portion 77 whose width is the distance between the first vertices 743a and 743a constituting both side end portions 76 and 76, but one of the adjacent lead-out wiring layers 7 The position of the local maximum portion 77 and the position of the other local maximum portion 77 of the adjacent lead-out wiring layer 7 are arranged with a distance S shifted. The distance S is, the first apex 743a along the extending direction of the lead wiring layer 7 is smaller than the distance _{D 1} of the inter-743a (S _<D 1).

  As a result, the gap between the adjacent lead wiring layers 7 can be made as small as possible, and the lead wiring layers 7 can be formed with high density. In addition, since a predetermined gap is secured between the adjacent lead-out wiring layers 7, it is possible to suppress the occurrence of migration between the adjacent lead-out wiring layers 7.

In the wiring body 4 of the present embodiment, as described above, both the mesh electrode layer 6 and the lead wiring layer 7 are formed in a mesh shape (mesh shape). In this case, from the viewpoint of suppressing an increase in the electrical resistance value of the lead-out wiring layer 7, it is preferable that the following expression (4) is satisfied in the wiring body 4 of the present embodiment (FIG. 3A and FIG. 3 (b)).
W ₄ ≦ W ₁ (4)
However, in the above equation (4), W ₁ is the width of the first conductor line 741, and W ₄ is the width of the fourth conductor line 64.

Note that the width W ₁ of the first conductor wire 741 is less than or equal to four times the width W ₄ of the fourth conductor wire 64 (W ₁ ≦ 4 × W ₄ ) from the viewpoint of reducing the number of disconnections. preferable.

The specific value of the width W ₄ of the fourth conductor line 64 is preferably 100 nm to 100 μm, more preferably 500 nm to 10 μm or less from the viewpoint of improving the visibility of the touch sensor 1, and 500 nm to More preferably, it is 5 μm or less. Further, the specific value of the width W ₁ of the first conductor line 741 is preferably ₁ μm to 500 μm, and the durability of the wiring body 4 is improved while suppressing an increase in the electrical resistance value of the lead wiring layer 7. From a viewpoint of making it, it is more preferable that it is 3-100 micrometers, and it is still more preferable that it is 5-20 micrometers.

Moreover, in the wiring body 4 in this embodiment, it is preferable that the following expression (5) is satisfied (see an enlarged view of FIG. 2).
_{P 1, P 2> P 3} , P 4 ··· (5)
However, in the above equation (5), P ₁ is the pitch between the adjacent fourth conductor lines 64 a in the mesh electrode layer 6, and P ₂ is the adjacent fourth conductor lines 64 b in the mesh electrode layer 6. is a pitch, P ₃ is the pitch between the first conductor line 741b between the pitch, P ₄ is adjacent in the lead wiring layer 7 between the first conductor lines 741a adjacent the lead wiring layer 7 between the . By satisfy | filling said Formula (5), the increase in the electrical resistance value of the lead-out wiring layer 7 is suppressed.

  Next, a method for manufacturing a wiring board in the present embodiment will be described. FIG. 7A to FIG. 7E are cross-sectional views showing a method for manufacturing a wiring board in an embodiment of the present invention.

  First, as shown in FIG. 7A, a first recess 111 having a shape corresponding to the shape of the mesh electrode layer 6 and a second recess 112 having a shape corresponding to the shape of the lead-out wiring layer 7 were formed. An intaglio 11 is prepared.

  Examples of the material constituting the intaglio 11 include glasses such as nickel, silicon and silicon dioxide, organic silicas, glassy carbon, thermoplastic resins, and photocurable resins. The depth of the first recess 111 is preferably 100 nm to 100 μm, more preferably 500 nm to 10 μm, and still more preferably 1 μm to 5 μm. On the other hand, the width of the second recess 112 is preferably 1 μm to 500 μm, more preferably 3 μm to 100 μm, and even more preferably 5 to 20 μm. The depth of the second recess 112 is preferably 1 μm to 500 μm, more preferably 1 μm to 100 μm, and even more preferably 5 μm to 30 μm. In the present embodiment, the first and second recesses 111 and 112 have a tapered shape in which the cross-sectional shape becomes narrower toward the bottom.

  In addition, on the surfaces of the first and second recesses 111 and 112, a mold release made of a graphite-based material, a silicone-based material, a fluorine-based material, a ceramic-based material, an aluminum-based material, or the like in order to improve the releasability. A layer (not shown) is preferably formed in advance.

  The conductive material 12 is filled into the first and second recesses 111 and 112 of the intaglio 11. Examples of such a conductive material 12 include conductive paste and conductive ink configured by mixing conductive powder or metal salt, binder resin, water or solvent, and various additives. Examples of the conductive powder include metals such as silver, copper, nickel, tin, bismuth, zinc, indium, and palladium, graphite, and the like. Examples of the metal salt include salts of the above metals. As the conductive particles contained in the conductive material 12, for example, conductive particles having a diameter φ (0.5 μm ≦ φ ≦ 2 μm) of 0.5 μm to 2 μm are used according to the width of the conductor pattern to be formed. be able to. In addition, it is preferable to use conductive particles having an average diameter φ that is not more than half the width of the conductor pattern to be formed.

  Examples of the binder resin contained in the conductive material 12 include acrylic resin, polyester resin, epoxy resin, vinyl resin, urethane resin, phenol resin, polyimide resin, silicone resin, and fluorine resin.

  Examples of the solvent contained in the conductive material 12 include α-terpineol, butyl carbitol acetate, butyl carbitol, 1-decanol, butyl cellosolve, diethylene glycol monoethyl ether acetate, and tetradecane.

  Examples of the method of filling the conductive material 12 in the first and second concave portions 111 and 112 of the intaglio 11 include a dispensing method, an ink jet method, and a screen printing method. Alternatively, a conductive material coated in addition to the first and second recesses 111 and 112 after coating by the slit coating method, bar coating method, blade coating method, dip coating method, spray coating method, and spin coating method. Examples of the method include wiping or scraping, sucking, pasting, washing away, and blowing off. It can be properly used depending on the composition of the conductive material, the shape of the intaglio, and the like.

  Next, as shown in FIG. 7B, by heating the conductive material 12 filled in the first and second recesses 111 and 112 of the intaglio plate 11, the mesh electrode layer 6 and the lead wiring layer 7 are formed. Form. The heating conditions of the conductive material 12 can be appropriately set according to the composition of the conductive material and the like. By this heat treatment, the conductive material 12 shrinks in volume, and a curved shape is formed on the surface 121 of the lead-out wiring layer 7 in the conductive material 12. In addition, a slightly uneven shape is formed on the surface 121 of the conductive material 12. At this time, the outer surface except the upper surface of the conductive material 12 is formed in a shape along the first and second recesses 111 and 112.

  Note that the method for treating the conductive material 12 is not limited to heating. Energy rays such as infrared rays, ultraviolet rays, and laser beams may be irradiated, or only drying may be performed. Moreover, you may combine these 2 or more types of processing methods. Due to the presence of the uneven shape or curved shape of the surface 121, the contact area between the mesh electrode layer 6 and the lead-out wiring layer 7 and the adhesive layer 5 increases, and the mesh electrode layer 6 and the lead-out wiring layer 7 are more firmly bonded to the adhesive layer. 5 can be fixed.

  Subsequently, as shown in FIG. 7C, a material in which the adhesive material 13 for forming the adhesive layer 5 is applied on the base material 3 substantially uniformly is prepared. Examples of the adhesive material 13 include UV curable resins such as epoxy resins, acrylic resins, polyester resins, urethane resins, vinyl resins, silicone resins, phenol resins, polyimide resins, thermosetting resins, thermoplastic resins, and the like. can do. Examples of the method for applying the adhesive material 13 on the substrate 3 include screen printing, spray coating, bar coating, dip, and inkjet.

  Next, as shown in FIG. 7D, the base material 3 and the adhesive material 13 are arranged on the intaglio 11 so that the adhesive material 13 enters the first and second concave portions 111 and 112 of the intaglio 11. 3 is pressed against the intaglio 11 to cure the adhesive material 13. Examples of the method for curing the adhesive material 13 include irradiation with energy rays such as ultraviolet rays and infrared laser light, heating, heating and cooling, and drying. Thereby, the adhesive layer 5 is formed, and the substrate 3, the mesh electrode layer 6, and the lead-out wiring layer 7 are bonded and fixed to each other through the adhesive layer 5.

  The method for forming the adhesive layer 5 is not particularly limited to the above. For example, the adhesive material 13 is applied on the intaglio 11 (the intaglio 11 in the state shown in FIG. 7B) on which the mesh electrode layer 6 and the lead wiring layer 7 are formed, and the base material 3 is applied on the adhesive material 13. After the placement, the adhesive layer 5 may be formed by curing the adhesive material 13 in a state where the base material 3 is placed on the intaglio 11 and pressed. In the case where a thermoplastic material is used as the adhesive material 13, the adhesive layer 5 can be formed by cooling after applying heat or the like and then melting.

  Subsequently, as shown in FIG. 7 (e), the base material 3, the adhesive layer 5, the mesh electrode layer 6, and the lead-out wiring layer 7 are released from the intaglio 11 to obtain the wiring substrate 2 provided with the wiring body 4. be able to.

  Although not particularly illustrated, a resin material is applied and cured on the obtained wiring substrate 2 so as to cover the mesh electrode layer 6 and the lead-out wiring layer 7 after the above-described steps are performed. Layer 8 is formed. Then, the mesh electrode layer 9 is formed so as to face the mesh electrode layer 6 through the formed resin layer 8. Further, the lead wiring layer 10 connected to the mesh electrode layer 9 is formed. As described above, the touch sensor 1 including the wiring body 4 can be obtained.

  Examples of the method for forming the resin layer 8 include the same method as the method for forming the adhesive layer 5. The method for forming the mesh electrode layer 9 and the lead wiring layer 10 can be the same as the method for forming the mesh electrode layer 6 and the lead wiring layer 7.

  The method for forming the mesh electrode layer 9 and the lead-out wiring layer 10 is not particularly limited to the above. For example, after the resin layer 8 is cured, screen printing, gravure offset printing, ink jetting is performed on the resin layer 8. You may form by printing a conductive material using printing etc. Or you may form by patterning the metal layer laminated | stacked on the resin layer 8 in mesh shape. Alternatively, it may be formed on the resin layer 8 by using a sputtering method, a vacuum deposition method, a chemical vapor deposition method (CVD method), an electroless plating method, an electrolytic plating method, or a combination thereof.

  The wiring body 4 and the wiring board 2 in this embodiment have the following effects.

  In the present embodiment, since the above expression (2) is established, the arrangement direction of the first unit mesh 742 with respect to the first direction in the first straight line portion 74a and the second direction in the second straight line portion 74b. The arrangement direction of the first unit meshes 742 with respect to the direction substantially coincides with this direction. As a result, one of the first and second straight portions 74a and 74b connected to each other via the bent portion 75 has a reduced conduction path compared to the other of the first and second straight portions 74a and 74b. Suppress it. As a result, an increase in electrical resistance value of the lead wiring layer 7 can be suppressed.

  In the present embodiment, the end portion 744a of the first straight line portion 74a and the end portion 744b of the second straight line portion 74b are separated from each other, and the second conductor wire is formed between the end portions 744a and 744b. In this case, the vertex 743 constituting the first unit mesh 742 of the first straight line portion 74a and the vertex 743 constituting the first unit mesh 742 of the second straight line portion 74b are connected. Are connected to each other by the second conductor line 751 so that the conduction of the lead-out wiring layer 7 can be made as compared with the case where the first conductor lines 741 and 741 constituting the first unit meshes 742 and 742 are connected to each other. The route can be secured efficiently.

  That is, by connecting the first and second conductor lines 741 and 751 constituting the first unit mesh 742 and the second unit mesh 752 to the vertex 743 constituting the first unit mesh 742, a plurality of lines are formed. Conductor wires can conduct each other. Therefore, in the first and second straight line portions 74a and 74b, the vertices 743 and 743 that are in contact with the plurality of conductor lines are connected by the second conductor line 751, so that the one second conductor line 751 Multiple conduction paths are ensured. If the conduction path of the lead-out wiring layer 7 is efficiently secured in the bent portion 75, the flexibility of the lead-out wiring layer 7 can be improved. Further, in the bent portion 75, the conduction of the lead wiring layer 7 can be stably secured.

  In the present embodiment, the second conductor wire 751 is integrally formed of a material having the same composition as the first conductor wire 741 constituting the first and second straight portions 74a and 74b. It is possible to stably ensure conduction between the first straight portion 74a and the bent portion 75 and between the second straight portion 74b and the bent portion 75.

  In the present embodiment, for a plurality of first unit meshes 742 arranged along the arrangement direction in the first straight line portion 74a, the vertex 743A of one first unit mesh 742a corresponds to the vertex 743A. The vertex 743B of the other first unit mesh 742b is located on an imaginary straight line extending along the first direction. Thereby, it is possible to suppress the occurrence of a defect in a part of the first unit mesh 742 in the entire first linear portion 74a. Further, by suppressing the occurrence of defects in the first unit mesh 742, conduction is stably ensured in the entire first straight portion 74a, and the contact portion between the arranged first unit meshes 742 increases. As a result, the number of conduction paths can be increased. The second straight line portion 74b also has the same configuration as the first straight line portion 74a. Therefore, the second straight line portion 74b as a whole can stably secure conduction and be arranged. Since the contact portions between the unit meshes 742 of the one increase, the conduction path can be increased.

  Further, conventionally, when the lead wiring layer is simply formed in a mesh shape, a part of the unit mesh located on the outermost side of the lead wiring layer is lost, and the conductor lines constituting the lead wiring layer protrude outward. It may be arranged in a state of being. In this case, the protruding conductor line located on the outermost side of the lead-out wiring layer does not substantially contribute to the conduction of the lead-out wiring layer. For this reason, a region where conduction is achieved in the lead-out wiring layer is narrowed, and the electrical resistance value is larger than the electrical resistance value assumed from the width of the lead-out wiring layer.

  On the other hand, in the wiring body 4 in the present embodiment, both side end portions 76 of the lead-out wiring layer 7 are located in the vertexes 743 constituting the first unit mesh 742 located on the outermost side in the lead-out wiring layer 7. The width L of the lead-out wiring layer 7 is one side end portion 76 in a direction substantially perpendicular to the extending direction of the lead-out wiring layer 7. This corresponds to the distance between the first vertex 743a included in the first vertex 743a and the first vertex 743a included in the other side end portion 76.

  For this reason, since the lead wiring layer 7 can be electrically connected to the whole lead wiring layer 7 in the width direction, the lead wiring layer 7 is prevented from disconnecting the mesh electrode layer 6 and the lead wiring layer 7. The increase in the electrical resistance value of the touch sensor 1 can be suppressed, and the detection sensitivity of the touch sensor 1 can be improved. This effect becomes more prominent because the proportion of the width of the first unit mesh 742 in the width L increases as the width L of the lead-out wiring layer 7 decreases.

  In general, when the side end portion of the lead-out wiring layer protrudes sharply, electric field concentration tends to occur in the protruding portion, so that the possibility of causing migration between adjacent wirings increases. On the other hand, in the wiring body 4 in the present embodiment, the side end portion 76 of the lead-out wiring layer 7 is constituted by the first vertex 743a, and the first vertex 743a is formed by the first conductor lines 741a and 741b. Since these points are in contact with each other, they do not protrude sharply, and the possibility of causing migration between adjacent lead-out wiring layers 7 can be reduced.

  In the present embodiment, in the extending direction of the lead wiring layers 7 arranged in parallel to each other, one first vertex 743a of the adjacent lead wiring layers 7 and the other of the adjacent lead wiring layers 7 are provided. Since the first vertex 743a is displaced from each other, the possibility of causing migration between the adjacent lead wiring layers 7 and 7 is further reduced.

  Further, since the lead wiring layer 7 has a mesh shape, it is possible to suppress the occurrence of filling failure when the conductive material 12 is filled in the intaglio 11 using, for example, a doctor blade when the wiring board 2 is manufactured. (See FIG. 7 (a)). That is, when the lead wiring layer is a linear solid pattern, when the conductive material is filled, the tip of the doctor blade approaches or contacts the bottom of the concave portion of the intaglio corresponding to the lead wiring layer. In some cases, poor filling of the conductive material may occur.

  In this regard, in the present embodiment, since the lead wiring layer 7 has a mesh shape, the possibility that the tip of the doctor blade approaches or contacts the bottom of the second recess 112 of the intaglio 11 is reduced. Occurrence of poor filling can be suppressed. Along with this, it is possible to suppress the occurrence of poor conduction of the lead-out wiring layer 7 in the completed touch sensor 1.

  The embodiment described above is described for facilitating the understanding of the present invention, and is not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

  FIG. 8 is a plan view showing a first modification of the lead wiring layer according to the embodiment of the present invention, and FIG. 9A shows a second modification of the lead wiring layer according to the embodiment of the present invention. FIG. 9B is a plan view, FIG. 9B is a diagram for explaining a bent portion, and FIGS. 10A and 10B are a third modification and a fourth modification of the lead-out wiring layer according to the embodiment of the present invention. It is a top view which shows each modification.

For example, as shown in FIG. 8, in the first straight portion 74aB of the lead wiring layer 7B, the first conductor line 741aB extends at an angle θ1 with respect to the first direction, and the first conductor The line 741bB may extend at an angle θ2 with respect to the first direction. In this case, the angle .theta.1, by the absolute value of θ2 is smaller than either _{45 ° (-45 ° <θ 1} , θ 2 <45 °), the aspect ratio of the first unit mesh 742B (lead-out wiring layers 7B The ratio of the length D ₄ of the first unit mesh 742 along the extending direction of the lead-out wiring layer 7B to the length D ₃ of the first unit mesh 742 along the width direction with respect to the extending direction (D ₃ / D ₄ )) can be greater than 1.

In this example, the shape of the first unit mesh 742B of the lead-out wiring layer 7B is a shape extended along the extending direction of the lead-out wiring layer 7B. The angles θ ₁ and θ ₂ are preferably 10 ° or more, and the aspect ratio (D ₃ / D ₄ ) of the first unit network 742 is greater than 1 and 5 or less (1 <(D ₃ / D ₄ ) ≦ 5) is preferred.

In the second straight line portion 74bB, the first conductor line 741aB extends at an angle θ3 with respect to the second direction, and the first conductor line 741bB has an angle θ4 with respect to the second direction. Inclined and extended. When the absolute values of the angles θ3 and θ4 are both smaller than 45 ° (−45 ° <θ _3, θ ₄ <45 °), the aspect ratio of the first unit network 742B is larger than 1. Also in this case, the first unit mesh 742B of the second straight portion 74bB and the first unit mesh 742B of the first straight portion 74aB have substantially the same shape.

  Thus, by making the aspect ratio of the first unit mesh 742B larger than 1, the total distance of the first conductor lines 741B included in the predetermined distance along the extending direction of the lead wiring layer 7B is shortened. Therefore, an increase in the electrical resistance value of the lead wiring layer 7B can be further suppressed.

  Further, when the aspect ratio of the first unit mesh 742B is larger than 1, the maximum portion 77B does not have an acute angle shape, so that the possibility of causing migration between the adjacent lead wiring layers 7B and 7B can be further reduced.

In this example, in the relationship between the mesh electrode 6 and the lead-out wiring layer 7, the aspect ratio of the first unit mesh 742B is the aspect ratio of the mesh 65 (along the width direction with respect to the extending direction of the mesh electrode layer 6). All mesh to the length D _5, the ratio of the length D ₆ mesh 65 along the extending direction of the mesh-like electrode layer 6 _(D 6 _/ D 5 (see FIG. 1))) is greater than.

  For example, as shown in FIG. 9A, in the lead-out wiring layer 7C, the end portion 744aC of the first straight portion 74aC and the end portion 744bC of the second straight portion 74bC overlap each other. The bent portion 75C may be formed. In this example, a first region Z1 having a width corresponding to the width of the first straight portion 74aC, extending in the first direction and having the same central axis as the first straight portion 74aC, A region overlapping with the second region Z2 having a width corresponding to the width of the second straight portion 74bC and extending in the second direction and having the same central axis as the second straight portion 74bC is bent. A portion 75C is formed (the hatched region in FIG. 9B).

  The bent portion 75C includes a first unit mesh 742 and a second unit mesh 752C. In the present example, the first unit mesh is formed by intersecting the first conductor line 741 constituting the first straight line portion 74aC and the first conductor line 741 constituting the second straight line portion 74bC with each other. A plurality of second unit meshes 752C smaller than 742 are formed.

  As described above, the second unit mesh 752C is densely arranged as compared with the arrangement of the first unit mesh 742, thereby suppressing disconnection of the lead wiring layer 7C at the bent portion 75C. Although not particularly illustrated, even when the first unit mesh constituting the first and second linear portions is formed to have an aspect ratio larger than 1, as in the example described above, the first The same effect as described above can be obtained by overlapping one end portion of the straight line portion and one end portion of the second straight line portion.

  For example, as illustrated in FIG. 10A, the lead-out wiring layer 7 </ b> D may include a third conductor line 78 that connects the first vertices 743 a to each other. In the lead wiring layer 7 </ b> D of this example, the side end portion 76 is configured by the third conductor wire 78. Such a third conductor wire 78 is integrally formed of a material having the same composition as the first conductor wire 741. In FIG. 10A, the third conductor wire 78 is linear, but is not particularly limited to this, and as shown in FIG. 10B, a conductive material at the time of manufacturing the wiring board. From the viewpoint of filling properties, the third conductor wire 78B may be curved. Note that the third conductor wire is preferably formed so as not to intersect the first conductor wire 741.

  The width of the third conductor wire 78 is preferably smaller than the width of the first conductor wire 741 from the viewpoint of filling of the conductive material into the intaglio in manufacturing. In the example of FIGS. 10A and 10B, the third conductor lines 78 and 78B are provided at both side end portions 76 and 76 of the lead wiring layers 7D and 7E, respectively. The third conductor lines 78 and 78B may be provided only on one of the side end portions 76 of the wiring layers 7D and 7E.

  As in this example, the lead wiring layer 7D has the third conductor line 78, so that conduction between the first vertices 743a and 743a is achieved at the side end portion 76 of the lead wiring layer 7D. As a result, an increase in the electrical resistance value of the lead wiring layer 7D can be further suppressed. Further, since the shape of the side end portion 76 is smoothed by the third conductor wire 78, the occurrence of migration can be further suppressed between the adjacent lead wiring layers 7D and 7D. The “third conductor lines 78, 78B” in this example corresponds to an example of the “third conductor line” in the present invention.

  Further, for example, in the wiring body 4 of the present embodiment, the mesh electrode 6 that is a mesh-like electrode layer is used. However, the present invention is not particularly limited thereto, and an electrode layer having a solid pattern may be used. . In this case, as a material constituting the electrode layer, transparent ITO (indium tin oxide), a conductive polymer, or the like can be used.

  Further, for example, the base material 3 may be omitted from the wiring board 2. In this case, for example, a release sheet is provided on the lower surface of the adhesive layer 5, and the release sheet is peeled off at the time of mounting and adhered to a mounting target (film, surface glass, polarizing plate, display, etc.) and mounted as a wiring body or A wiring board may be configured. In this embodiment, “adhesive layer 5” corresponds to an example of “first resin layer” of the present invention, and “mounting object” corresponds to an example of “support” of the present invention. Moreover, you may comprise a wiring body or a wiring board as a form which adhere | attaches and mounts on the above-mentioned mounting object through the resin layer 8 which covers the mesh-shaped conductor layer 6. FIG. In this embodiment, “resin layer 8” corresponds to an example of “second and third resin layers” of the present invention, and “mounting object” corresponds to an example of “support” of the present invention. Further, the adhesive layer 5 may be omitted from the above-described embodiment, and the mesh electrode layer 6 and the lead wiring layer 7 may be provided directly on the base material 3. In this case, the substrate 3 is made of resin. In this embodiment, the “base material 3” corresponds to an example of the “first resin layer” of the present invention.

  Moreover, you may use the flat part 51 of the contact bonding layer 5 as a support body. In this case, the “support portion 52” of the adhesive layer 5 corresponds to an example of the “first resin layer” of the present invention, and the flat portion 51 of the adhesive layer 5 corresponds to an example of the “support” of the present invention.

  In the above-described embodiment, the wiring body is described as being used for a touch sensor, but the use of the wiring body is not particularly limited thereto. For example, the wiring body may be used as a heater by energizing the wiring body and generating heat by resistance heating or the like. Moreover, you may use the said wiring body as an electromagnetic shielding shield by earth | grounding a part of conductor part of a wiring body. Moreover, you may use a wiring body as an antenna.

DESCRIPTION OF SYMBOLS 1 ... Touch sensor 2 ... Wiring board 3 ... Base material 31 ... Main surface 4 ... Wiring body 5 ... Adhesive layer 51 ... Flat part
511 ... Main surface 52 ... Supporting part
521 ... Side
522 ... Adhesive surface 6 ... Mesh electrode layer 61 ... Contact surface 62 ... Top surface 63 ... Side surfaces 64a, 64b ... Fourth conductor wire 65 ... Mesh 66 ... ..Outer edge portions 7, 7B to 7E ... Lead-out wiring layer 71 ... Contact surface 72 ... Top surface 73 ... Side surface 74a, 74b, 74aB, 74bB, 74aC, 74bC ... First and first 2 straight section
741a, 741b, 741aB, 741bB... First conductor wire
742, 742a, 742b, 742B ... 1st unit network
743, 743A, 743B ... vertex
743a ... first vertex
743b ... second vertex
744a, 744b, 744aC, 744bC ... end portion 75, 75C ... bent portion
751... Second conductor wire
752, 752C ... second unit mesh 76 ... side end 77 ... maximum portion 78, 78B ... third conductor wire 8 ... resin layer 9 ... mesh electrode layer 10 ... Lead-out wiring layer 11 ... Intaglio 111 ... First recess 112 ... Second recess 12 ... Conductive material 121 ... Surface 13 ... Adhesive material

Claims (13)

A first resin layer;
An electrode layer provided on the first resin layer;
A network-like lead wiring layer provided on the first resin layer and connected to the electrode layer;
The lead-out wiring layer is
A first straight portion extending along a first direction;
A second straight line portion extending along a second direction different from the first direction;
A bent portion connecting the first and second straight portions to each other;
The first and second straight portions are each configured by arranging a plurality of first unit meshes of substantially the same shape formed by the first conductor wires,
A wiring body that satisfies the following formula (1).
α ₁ = α ₂ (1)
However, in the above formula (1), α ₁ is a virtual straight line extending along the arrangement direction of the first unit mesh in the first straight line portion and a virtual straight line extending along the first direction. Α ₂ is an imaginary straight line extending along the arrangement direction of the first unit mesh in the second straight line portion and a virtual straight line extending along the second direction. It is an angle to make. The wiring body according to claim 1,
The bent portion is a wiring body including a second unit mesh having a shape different from the shape of the first unit mesh. The wiring body according to claim 2,
The bent portion is configured by overlapping one end portion of the first straight portion and one end portion of the second straight portion,
The conductor wire constituting the second unit network is
The first conductor wire constituting the first straight portion;
A wiring body including the first conductor wire constituting the second straight line portion. The wiring body according to claim 2,
One end portion of the first straight portion and one end portion of the second straight portion are spaced apart from each other,
The bent portion has a second conductor wire that connects one end of the first straight portion and one end of the second straight portion to each other,
The second unit network is a wiring body including the second conductor line. The wiring body according to claim 4,
The second conductor line interconnects the vertex of the first unit mesh constituting the first straight line portion and the vertex of the first unit mesh constituting the second straight line portion. Wiring body to be used. The wiring body according to claim 4 or 5,
A wiring body in which a width of the first conductor line is substantially equal to a width of the second conductor line. The wiring body according to any one of claims 1 to 6,
For a plurality of the first unit meshes arranged along the arrangement direction in the first straight line portion, the vertex of one of the first unit meshes and the other first unit mesh corresponding to the vertexes Are located on a virtual straight line extending along the first direction,
For the plurality of first unit meshes arranged along the arrangement direction in the second straight line portion, the vertex of one of the first unit meshes and the other first unit mesh corresponding to the vertexes And a wiring body located on an imaginary straight line extending along the second direction. The wiring body according to any one of claims 1 to 7,
The aspect ratio in plan view of the first unit network is greater than 1,
The aspect ratio of the first unit mesh in plan view is such that the length of the lead wiring layer with respect to the length of the first unit mesh along a direction substantially perpendicular to the extending direction of the lead wiring layer. A wiring body that is a ratio of lengths of the first unit meshes along the extending direction. It is a wiring object given in any 1 paragraph of Claims 1-8,
Both side edges of the lead-out wiring layer include first vertices located on the outermost side among the vertices constituting the first unit network located on the outermost side in the lead-out wiring layer,
The width of the lead-out wiring layer includes the first vertex included in one side end and the other side end in a direction substantially perpendicular to the extending direction of the lead-out wiring layer. A wiring body which is a distance between the first vertex. The wiring body according to claim 9,
A plurality of the electrode layers;
A plurality of the lead wiring layers connected respectively to the plurality of electrode layers and arranged substantially parallel to each other,
A wiring body in which the first vertex of one of the adjacent lead wiring layers and the other first vertex of the adjacent lead wiring layer are shifted from each other in the extending direction of the lead wiring. It is a wiring object given in any 1 paragraph of Claims 1-10,
A wiring body having an opening ratio of the lead-out wiring layer of 50% or less. The wiring body according to any one of claims 1 to 11,
A wiring board comprising: the electrode layer; and a support that supports the lead-out wiring layer.   A touch sensor comprising the wiring board according to claim 12.

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