JP6374816B2 - Input device - Google Patents

Description

  The present invention relates to an input device capable of connecting a jumper member formed on an insulating layer and a wiring layer on a substrate surface without being affected by the forming tolerance of the insulating layer.

Patent Document 1 describes a capacitance type input device.
The input device includes a display area and a non-display area surrounding the display area. In the display area, a plurality of transparent electrodes are formed on one surface of a transparent substrate. The first transparent electrode has a rhombus shape and forms a row in the X direction and the Y direction, and the other second electrode layer is formed elongated in the X direction. A row of rhombic electrode layers arranged in the X direction and elongated electrode layers are alternately arranged in the Y direction.

  On the surface of the transparent substrate, a plurality of first wiring layers connected to each of the rhombic transparent electrodes and extending in the X direction are formed, and the first wiring layers extend to the non-display area. An insulating layer is formed on the surface of the transparent substrate, and each first wiring layer is covered with the insulating layer. In the non-display region, a plurality of second wiring layers extending linearly in the Y direction are formed in parallel on the insulating layer. The first wiring layer extending in the X direction under the insulating layer extends across a number of the second wiring layers to a position overlapping the second wiring layer to be connected. Then, the first wiring layer and the second wiring layer are overlapped and connected via a contact hole formed in the insulating layer.

  The first wiring layer that is located at the right end in the X direction and extends from each of the plurality of rhombus electrodes arranged in the Y direction is connected to the common second wiring layer. The first wiring layer that is second from the right end in the X direction and extends from each of the plurality of rhomboid electrode layers arranged in the Y direction is also commonly connected to another second wiring layer different from the above. ing. This also applies to the first wiring layer extending from the rhombic electrodes arranged at the third, fourth,... From the right end. With this wiring structure, a plurality of rhomboid electrode layers arranged in the Y direction in the same row are electrically connected to each other through any second wiring layer.

  In the detection operation of this input device, a driving voltage is sequentially applied to the elongated electrodes in the Y direction. At this time, by sequentially detecting the current flowing in the second wiring layer, the current flowing in the rhombic electrode layers arranged in each column extending in the Y direction can be detected simultaneously and sequentially in the X direction. Can be calculated.

JP2013-167992A

  In the input device described in Patent Document 1, the first wiring layer extending from the rhombic electrode layer crosses the plurality of second wiring layers formed on the insulating layer in the non-display region, and the first wiring layer The wiring layer is connected to the second wiring layer to be electrically connected to the transparent electrode inside the contact hole formed in the insulating layer.

  In the input device described in Patent Document 1, the opening width dimension of the contact hole formed in the insulating layer is set to be shorter than the width dimension of the first wiring layer, and the opening area of the contact hole is that of the second wiring layer. It is formed in a narrow region so as to be overlaid on one first wiring layer located below it.

  In this configuration, the tolerance when patterning the first wiring layer, the tolerance when forming the contact hole by exposing and developing the insulating layer, and the second wiring layer on the contact hole are connected to the first wiring. There is a tolerance in forming the layer so as to overlap with the end of the layer, and the accuracy of the connection portion between the first wiring layer and the second wiring layer is affected by the accumulated value of each intersection. In addition, in order to ensure the dielectric strength between the second wiring layer and the first wiring layer, it is necessary to form the insulating layer in multiple layers and increase the thickness. In this case, each insulating layer Therefore, it is necessary to form contact holes, and tolerances corresponding to the number of insulating layers are further accumulated.

  When the error increases within each intersection, the positional deviation between the end of the first wiring layer and the contact hole increases, and the positional deviation between the contact hole and the end of the second wiring layer on the insulating layer also increases. The contact area between the first wiring layer and the second wiring layer is reduced and the reliability of the connection portion may be lowered.

  Also, if the area of the end of the first wiring layer located under the contact hole is increased and the opening area of the contact hole is increased correspondingly, the first wiring can be accumulated even if errors due to intersections accumulate. It becomes possible to overlap the layer and the second wiring layer with a relatively large area. However, in this case, since the end portion of the first wiring layer becomes wide and the contact hole becomes large, the space occupied by the connection portion in the non-display area becomes wide, and the non-display area Therefore, the area of the display area is reduced accordingly.

  The present invention solves the above-described conventional problems, and provides an input device that can reliably connect wiring layers in a narrow area by adopting a structure that is not affected by the forming tolerance of the insulating layer. The purpose is that.

The present invention provides an input device in which a plurality of electrode layers, an electrode wiring layer extending from each of the electrode layers, and a connection wiring layer that connects the plurality of electrode wiring layers are formed on the surface of the substrate.
An electrode-side connection region in which a plurality of electrode land portions electrically connected to the respective electrode wiring layers are arranged on the surface of the substrate, and a connection-side connection region in which a plurality of connection land portions electrically connected to the respective connection wiring layers are arranged. And
An insulating layer covering at least one of the electrode wiring layer and the connection wiring layer is provided, and in the electrode side connection region, the insulating layer is not provided between the adjacent electrode land portions, and the connection side In the connection region, the insulating layer is not provided between the adjacent connecting land portions,
A jumper member formed on the insulating layer is connected to the electrode land portion and the connection land portion.

  In the input device of the present invention, the insulating layer is not provided between the adjacent electrode land portions in the electrode side connection region, and the insulating layer is provided between the adjacent connection land portions in the connection side connection region. Absent. Therefore, with regard to the displacement of the connection part of the wiring, it is only necessary to consider the forming tolerance of the electrode land part and the connecting land part and the forming tolerance of the jumper member, and the forming error of the opening (contact hole) formed in the insulating layer Is no longer involved. Therefore, the connection area between the end of the jumper member and the electrode land part and the connection area between the jumper member and the connection land part can be sufficiently increased without making the width dimensions of the electrode land part and the connection land part larger than necessary. It is possible to ensure the reliability of conduction.

  In the input device of the present invention, a plurality of openings are formed in the insulating layer, and internal regions of the openings are the electrode side connection region and the connection side connection region.

  In the input device of the present invention, the connection portions between the respective electrode land portions and the respective jumper members are arranged side by side, and the opening is formed in an elongated shape along the alignment direction of the connection portions. ing.

  Or the connection part of each said connection land part and each said jumper member is arrange | positioned along with the said opening part, and the said opening part is formed in the elongate shape along the arrangement direction of the said connection part.

  By arranging the connecting portions between the land portions and the jumper members in a row as described above, the jumper members that connect the land portions can also be arranged side by side, and the arrangement structure of the wiring members can be made efficient.

  In the input device according to the present invention, the insulating layer is formed by stacking a plurality of layers, and the lower insulating layer is the upper insulating layer at the edge of the insulating layer where the jumper member crosses. What protrudes in the said electrode side connection area | region is more preferable.

  In addition, the insulating layer is formed by overlapping a plurality of layers, and at the edge of the insulating layer where the jumper member crosses, the lower insulating layer is more on the coupling side than the upper insulating layer. What protrudes in the connection region is preferable.

  In the input device having the above configuration, since the rising angle of the step formed at the edge of the insulating layer becomes gentle, it is possible to prevent the jumper member passing therethrough from becoming extremely thin.

  In the present invention, the displacement of the connection portion of the wiring may be determined by considering the forming tolerance of the electrode land portion and the connecting land portion and the forming tolerance of the jumper member, and forming the opening (contact hole) formed in the insulating layer. Errors are no longer involved. Therefore, the connection area between the end of the jumper member and the electrode land part and the connection area between the jumper member and the connection land part can be sufficiently increased without making the width dimensions of the electrode land part and the connection land part larger than necessary. It is possible to ensure the reliability of conduction.

The top view which shows schematic structure of the input device which shows embodiment of this invention, Sectional drawing which cut | disconnected the input device shown in FIG. 1 by the II-II line | wire, FIG. 2 is an enlarged plan view showing a connection structure and a wiring structure of an electrode layer and a wiring layer of the input device shown in FIG. The top view which expands and shows the IV arrow part of FIG. Sectional drawing which cut | disconnected FIG. 4 by the VV line, Sectional drawing which cut | disconnected FIG. 4 by the VI-VI line, The top view which expands and shows the VII arrow part of FIG.

  The input device of the present invention is a light transmissive type, and is a touch panel used for a mobile phone, other portable information terminals, home appliances, in-vehicle electronic devices, medical devices, and the like. The input device of the present invention is not limited to a light transmissive touch panel, and may be configured as a light non-transmissive type.

1 and 2 show a light transmission type input device 1 as an embodiment of the present invention.
The input device 1 is provided with a transparent substrate 10. The transparent substrate 10 is formed of PET (polyethylene terephthalate), which is a synthetic resin having strength and heat resistance suitable for forming an electrode layer and a wiring layer. Alternatively, COP (cyclic polyolefin) can also be used.

  As shown in FIG. 1, the transparent substrate 10 is divided into a detection substrate portion 11 and a wiring substrate portion 12. The detection board portion 11 has a rectangular shape, and the wiring board portion 12 has a width smaller than that of the detection board portion 11 and extends integrally from the lower edge of the detection board portion 11.

  As shown in FIG. 2, the surface panel 3 is fixed on the detection substrate portion 11 via an OCA layer (optical transparent adhesive layer) 2. The front panel 3 is a light-transmitting acrylic synthetic resin material, and is made of, for example, PMMA (polymethyl methacrylate). Or it is formed with the glass plate.

  A decorative layer 4 is formed on the lower surface of the front panel 3. The decorative layer 4 is formed by being printed on the front panel 3 or is formed by bonding a film. The decorative layer 4 is non-light-transmitting so that the underlying structure cannot be seen from the front of the front panel 3. The decorative layer 4 has a frame shape, and a region surrounded by the inner edge portion 4 a is light transmissive and is a display / operation region 5. In FIG. 1, the inner edge part 4a of the decoration layer 4 is shown with the broken line.

  The frame-shaped part in which the decoration layer 4 is formed is a non-display area that cannot be seen from the surface. As shown in FIGS. 1 and 2, the Y1 side from the display / operation area 5 is the lower non-display area 6a, and the Y2 side from the display / operation area 5 is the upper non-display area 6b. The X1 side of the display / operation area 5 is a right non-display area 6c, and the X2 side is a left non-display area 6d.

  A plurality of first electrode layers 21 and a plurality of second electrode layers 41 made of a transparent conductive material are formed on the surface of the detection substrate unit 11. The first electrode layer 21 and the second electrode layer 41 are arranged in the display / operation area 5.

  As shown in FIG. 1 and FIG. 3, the first electrode layer 21 is rectangular (rectangular or square), and is arranged at regular intervals in the X direction along each row of X1, X2, X3,. Yes. The first electrode layers 21 are also arranged at regular intervals in the column direction (Y direction), and a plurality of columns (four columns in the embodiment) are provided.

  As shown in FIG. 3, electrode wiring layers 22a, 22a,... Extend from the plurality of first electrode layers 21, 21,. Are extended from the first electrode layers 21, 21,..., And a plurality of first electrode layers 21, 21,. The electrode wiring layers 22c, 22c,. The electrode wiring layers 22d, 22d,... Extend from the plurality of first electrode layers 21, 21,... Located in the X4 row, and the plurality of first electrode layers 21 located in the X5 row. , 21,... Extend from the electrode wiring layers 22e, 22e,.

  In FIG. 1, the first electrode layer 21 is arranged along six rows of X1, X2, X3, X4, X5, and X6. However, in FIG. 3 and subsequent figures, the description using the drawings is simplified. The electrode wiring layers extending from the first electrode layers 21 in the X6 rows are not shown. In FIG. 1, the second electrode layers 41 are arranged in four rows along the Y direction. However, in FIG. 3, only the second electrode layers 41 are shown in three rows. Although illustration of the electrode wiring layer extending from the second electrode layer 41 is omitted, the electrode wiring layer extending from the second electrode layer 41 includes the upper non-display area 6a, the right non-display area 6c, and the left non-display. It passes through the region 6d and extends to the wiring board part 12.

  As shown in FIG. 3, the electrode wiring layers 22a, 22b, 22c, 22d, and 22e extending from the first electrode layer 21 located in the rightmost column (X1 side) are pulled out in the Y1 direction in the right non-display area 6c. It is. The electrode wiring layers 22 a, 22 b, 22 c, 22 d, and 22 e extending from the first electrode layer 21 arranged in the other row pass through the region between the first electrode layer 21 and the second electrode layer 41. Pulled out in one direction.

  As shown in FIGS. 1 and 3, the second electrode layer 41 is elongated in the Y direction, and its long side extends in the column direction of Y1, Y2, Y3, and Y4. In the second electrode layer 41, an electrode wiring layer extends from the upper end portion of FIG. 3, and this electrode wiring layer is drawn out to the upper non-display area 6 b and extends along the edge of the detection substrate section 11. Then, it passes through the left non-display area 6 d and the lower non-display area 6 a and is drawn to the surface of the wiring board portion 12.

  As shown in FIG. 3, connection wiring layers 23a, 23b, 23c, 23d, and 23e are formed in the lower non-display area 6a. The connection wiring layers 23a, 23b, 23c, 23d, and 23e are parallel to each other and extend linearly in the X direction.

  Due to the jumper connection structure described later, the electrode wiring layers 22a extending from all the first electrode layers 21 located on the X1 row are electrically connected to one common connection wiring layer 23a. The electrode wiring layers 22b extending from all the first electrode layers 21 located on the X2 row are electrically connected to one common connection wiring layer 23b. Similarly, the electrode wiring layer 22c extending from all the first electrode layers 21 located on the X3 row is connected to one common connection wiring layer 23c of the first electrode layer 21 on the X4 row. The electrode wiring layer 22d is electrically connected to one common connection wiring layer 23d, and the electrode wiring layer 22e of the first electrode layer 21 on the X5 row is electrically connected to one common connection wiring layer 23e. .

  As shown in FIG. 3, lead wiring layers 24 a, 24 b, 24 c, 24 d, and 24 e are formed from the lower non-display area 6 a to the surface of the wiring board portion 12. The lead wiring layer 24a is electrically connected to the connection wiring layer 23a, and the lead wiring layers 24b, 24c, 24d, and 24e are electrically connected to the connection wiring layers 23b, 23c, 23d, and 23e, respectively.

  The first electrode layer 21 and the second electrode layer 41 are made of ITO (Indium Tin Oxide). The electrode wiring layers 22a to 22e, the connection wiring layers 23a to 23e, and the lead wiring layers 24a to 24e are formed of a laminate of ITO and a metal layer. In this case, a composite material in which an ITO layer and a metal layer are formed on the surface of the transparent substrate is used, and the first electrode layer 21 and the second electrode layer 21 are etched by removing the metal layer and etching the ITO layer. An electrode layer 41 is formed. In addition, each wiring layer is formed by etching the ITO layer and the metal layer.

  The first electrode layer 21 and the second electrode layer 41 may be formed of a conductive nanowire layer. The conductive nanowire is a metal nanowire such as a silver nanowire or a carbon nanotube. Moreover, the electrode wiring layers 22a to 22e, the connection wiring layers 23a to 23e, and the lead wiring layers 24a to 24e may be formed in a printing process using a silver paste.

  4 to 6 show the connection structure between the wiring layer and the jumper member taken along the line IV in FIG.

  In the IV arrow portion, the electrode wiring layers 22a, 22b, 22c, 22d, and 22e extending from the first electrode layer 21 arranged in the Y direction at the end in the X1 direction pass through the right non-display area 6c. It is drawn out to the lower non-display area 6a.

  As shown in FIG. 4, in the lower non-display area 6a, an electrode land portion 25a is integrally formed at the lower end portion of the electrode wiring layer 22a. Similarly, electrode land portions 25b, 25c, 25d, and 25e are integrally formed at the lower ends of the electrode wiring layers 22b, 22c, 22d, and 22e. The electrode land portions 25a, 25b, 25c, 25d, and 25e all have the same width in the X direction, and the pitch in the X direction, that is, the interval in the X direction is the same. The electrode land portions 25a to 25e are arranged in the X direction. That is, the lower edge of each electrode land portion 25a to 25e on the Y1 side is at the same position in the Y direction, and the lower edge is located on a straight line extending in the X direction.

  In the lower non-display area 6a, connection wiring layers 23a, 23b, 23c, 23d, and 23e extend linearly in the X direction and are formed in parallel to each other. As shown in FIG. 4, a connecting land portion 26a is integrally formed at the end portion on the X1 side of the connecting wiring layer 23a. Similarly, connection land portions 26b, 26c, 26d, and 26e are integrally formed at the end portion on the X1 side of the connection wiring layers 23b, 23c, 23d, and 23e. The connection land portions 26a, 26b, 26c, 26d, and 26e are bent at a right angle from the connection wiring layer and extend in the Y1 direction. The connecting land portions 26a, 26b, 26c, 26d, and 26e all have the same width in the X direction, and the pitch in the X direction, that is, the interval in the X direction is the same. The connecting land portions 26a, 26b, 26c, 26d, and 26e are arranged in the X direction. That is, the lower edge of each connecting land portion on the Y1 side is at the same position in the Y direction, and the lower edge is positioned on a straight line extending in the X direction.

  As shown in FIG. 2, an insulating layer 15 is formed on the surface of the transparent substrate 10. In the display / operation area 5 of the detection substrate unit 11, the first electrode layer 21 and the second electrode layer 41 are covered with the insulating layer 15. In the lower non-display area 6a and the upper non-display area 6b and the right non-display area 6c and the left non-display area 6d of the detection substrate unit 11, each wiring layer is covered with the insulating layer 15, and in the wiring board unit 12, The lead wiring layers 24a, 24b, 24c, and 24d are covered with the insulating layer 15. The insulating layer 15 is made of a light-transmitting organic insulating material. In the first display / operation area, the first electrode layer 21 and the second electrode layer 41 are not covered with the insulating layer 15, and the insulating layer 15 includes the lower non-display area 6 a and the upper non-display area 6 b. It may be formed only in the right non-display area 6 c and the left non-display area 6 d and the wiring board portion 12.

  As shown in FIGS. 4 and 5, the first opening 31 is formed in the insulating layer 15 in the IV arrow portion. The first opening 31 is a rectangular opening having a uniform width in the Y direction and a long side directed in the X direction. Inside the first opening 31, the surface of the transparent substrate 10 and a plurality of electrode land portions 25a, 25b, 25c, 25d, and 25e appear. Preferably, all the electrode land portions that are electrically connected to all the first electrode layers 21 arranged in the Y direction at the end portion in the X1 direction are preferably located inside the first opening 31. Within the first opening 31, the insulating layer 15 does not exist between adjacent electrode land portions. A space inside the first opening 31 is an electrode side connection region.

  As shown in FIG. 4, a second opening 32 is formed in the insulating layer 15 at a position further away from the first opening 31 on the Y1 side. The second opening 32 has a uniform width in the Y direction, but the long side is formed so as to be inclined away from the first opening 31 in the X2 direction. Inside the second opening 32, the surface of the transparent substrate 10 and a plurality of connecting land portions 26a, 26b, 26c, 26d, and 26e appear. Preferably, the electrode land portions integral with all the connection wiring layers 23 a, 23 b, 23 c, 23 d, and 23 e located in the lower non-display area 6 a are preferably located inside the second opening 32. . Inside the second opening 32, the insulating layer 15 does not exist between adjacent connecting land portions. A space inside the second opening 33 is a connection side connection region.

  As shown in FIGS. 4 and 6, jumper members 35 a, 35 b, 35 c, 35 d, and 35 e are formed on the insulating layer 15. The jumper members 35a to 35e can also be referred to as jumper wiring layers or jumper conductive layers. In the embodiment, the jumper members 35a to 35e are formed by screen printing using a conductive paste (conductive ink) containing silver or the like. Alternatively, the jumper members 35a to 35e are formed of a metal layer such as gold or silver, or are formed by laminating a metal layer of gold or silver on amorphous ITO. In this case, the metal layer or the laminated body of amorphous ITO and the metal layer is etched to form jumper members 35a to 35e.

  The end portion on the Y2 side of the jumper member 35a is overlapped and connected to the electrode land portion 25a exposed in the first opening (electrode side connection region) 31, and the end portion on the Y1 side is connected to the second end portion. The connection land portion 26a exposed in the opening (connection-side connection region) 32 is overlapped and connected, and the electrode land portion 25a and the connection land portion 26a are electrically connected by the jumper member 35a. Similarly, the electrode land portions 25b, 25c, 25d, 25e and the connecting land portions 26b, 26c, 26d, 26e are individually connected in a one-to-one relationship by the jumper members 35b, 35c, 35d, 35e.

  As shown in FIGS. 5 and 6, the insulating layer 15 is formed in multiple layers, and in the embodiment, has a two-layer structure of a lower layer 15a and an upper layer 15b. Since the insulating layer 15 has a multilayer structure, the jumper members 35b, 35c, 35d, and 35e formed on the insulating layer 15 and the connecting wiring layers 23a, 23b, 23c, 23d, and 23e located therebelow. Withstand voltage can be increased.

  In the formation process of the insulating layer 15, the insulating layer to be the lower layer 15a is formed and cured, and then the holes to be the openings 31 and 32 are formed by exposure and development. An insulating layer to be the upper layer 15b is formed thereon and cured, and then holes to be the openings 31 and 32 are formed by exposure and development. When forming the insulating layer 15, the areas of the holes formed in the lower layer 15a and the holes formed in the upper layer 15b are made different, or the positions of the holes formed in the lower layer 15a and the holes formed in the upper layer 15b are shifted. Thus, as shown in FIG. 6, at least in the part where the jumper members 35a, 35b, 35c, 35d, and 35e pass, the edge 17a of the lower layer 15a is connected to the first opening 31 than the edge 17b of the upper layer 15b. The second opening 32 can be protruded to the inside.

  With this configuration, as shown in FIG. 6, the stepped portion of the insulating layer 15 does not suddenly rise at the edge of the first opening 31 and the second opening 32, but gradually increases. Formed as follows. Therefore, the jumper members 35a, 35b, 35c, 35d, and 35e formed thereon rise smoothly at the edge portion of the insulating layer 15, and the jumper members 35a to 35a at the portions that pass through the edge portion of the insulating layer 15 are formed. A sufficient thickness of 35e can be secured, and the jumper members 35a to 35e can be prevented from becoming extremely thin partially.

  FIG. 7 shows a connection structure between the wiring layer and the jumper member taken along the line VII in FIG.

  In the VII arrow view portion, in the lower non-display area 6a, the electrode land portion 28a is integrally formed on the electrode wiring layer 22a extending from the first electrode layer 21. Similarly, electrode land portions 28b, 28c, 28d, and 28e are integrally formed on the electrode wiring layers 22b, 22c, 22d, and 22e. In the lower non-display area 6a, a connection land portion 29a is integrally formed in the middle of the connection wiring layer 23a, and the connection land portions 29b, 29c, 29d, 29e is integrally formed.

  A third opening 33 and a fourth opening 34 are formed in the insulating layer 15 covering the lower non-display area 6a. The third opening 33 forms an electrode-side connection region, and is a long hole that extends linearly in the X direction. In the third opening 33, the surface of the transparent substrate 10 and the electrode land portions 28a, 28b, 28c, 28d, and 28e are exposed. The fourth opening 34 forms a connection side connection region and extends obliquely with respect to the X direction and the Y direction. In the fourth opening 34, the surface of the transparent substrate 10 and the connecting land portions 29a, 29b, 29c, 29d, and 29e are exposed.

  On the insulating layer 15, jumper members 36a, 36b, 36c, 36d, and 36e are formed. The configuration of the jumper members 36a to 36e is the same as that of the jumper members 35a to 35e shown in FIG. End portions of the jumper members 36a to 36e extend into the third opening portion 33 and the fourth opening portion 34, and the electrode land portion 28a and the connecting land portion 29a are connected by the jumper member 36a. Yes. Similarly, the electrode land portions 28b, 28c, 28d, 28e and the connecting land portions 29b, 29c, 29d, 29e are individually connected in a one-to-one relationship by the jumper members 36b, 36c, 36d, 36e.

  The cross-sectional structure of the wiring region in the VII portion is substantially the same as that in FIGS.

  In the wiring structure using the jumper member shown in FIGS. 4 and 7, the electrode land portions 25 a to 25 e and 28 a to 28 e are provided inside the first opening 31 and the third opening 33 which are electrode side connection regions. The insulating layers 15 are arranged in a line and are not formed between adjacent electrode lands. Similarly, the connection land portions 26a to 26e and 29a to 29e are obliquely aligned in the second opening portion 32 and the fourth opening portion 34, which are connection side connection regions, and adjacent connection lands. The insulating layer 15 is not formed between the portions.

  The openings 31, 32, 33, and 34 formed in the insulating layer 15 include the area of the junction between the electrode land portions 25a to 25e and 28a to 28e and the jumper members 35a to 35e and 36a to 36e, and the connection land portion 26a. It is sufficiently larger than the area of the connecting portion between .about.26e, 29a.about.29e and the jumper members 35a.about.35e, 36a.about.36e.

  Therefore, the tolerance when the openings 31, 32, 33, and 34 are formed in the insulating layer 15, that is, the tolerance when the opening is formed in the lower layer 15a of the insulating layer 15, and the opening when the opening is formed in the upper layer 15b. The accumulated tolerance with the tolerance does not affect the dimensional accuracy of the joint portion between the electrode land portion and the jumper member and the joint portion between the connection land portion and the jumper member.

  Therefore, the accuracy of the junction between the electrode land portion and the jumper member and the junction between the connection land portion and the jumper member are determined only by the molding accuracy of the electrode land portion and the connection land portion, and the molding accuracy of the jumper member.

  Accordingly, even if the width dimensions of the electrode land portions 25a to 25e, 28a to 28e and the connecting land portions 26a to 26e and 29a to 29e are not made larger than necessary, the electrode land portion and the jumper member, and the connecting land portion and the jumper portion are used. Can be joined to each other without being greatly displaced.

  Since the width dimensions of the electrode land portions 25a to 25e and 28a to 28e and the connecting land portions 26a to 26e and 29a to 29e need not be made larger than necessary, the space of the lower non-display area 6a can be used effectively. As a result, the lower non-display area 6a can be narrowed.

  In the embodiment of FIG. 4, connection wiring layers 23 a to 23 e are formed between the first opening 31 and the second opening 32, and the connection wiring layers are covered with the insulating layer 15 and insulated. Jumper members 35a to 35e formed on the layer 15 pass over the connection wiring layers 23a to 23e. However, in the present invention, in FIG. 4, the first opening 31 and the second opening 32 are formed to be elongated in the Y direction with an interval in the X direction, The electrode wiring layers 22 a to 22 e may be disposed between the second openings 32. In this case, the electrode wiring layers 22a to 22e are covered with the insulating layer 15, and jumper members 35a to 35e for individually connecting the electrode land portions 25a to 25e and the connecting land portions 26a to 26e are formed on the insulating layer 15. It is formed and crosses over the electrode wiring layers 22a to 22e.

Next, the operation of the input device 1 having the above structure will be described.
The input device 1 is driven by a mutual capacitance detection method. One of the first detection electrode layer 21 and the second detection electrode layer 41 is used as a drive electrode, and the other is used as a detection electrode. For example, power is sequentially applied to the connection wiring layers 23 a, 23 b, 23 c, 23 d, and 23 e, and the rectangular wave voltage is sequentially applied to the first detection electrode layer 21 for each row X 1, X 2, X 3,. Is applied at a constant period. The second detection electrode layer 41 is used as a detection electrode, and is connected to the detection circuit in the order of Y1, Y2, Y3,.

  Alternatively, a rectangular wave voltage is applied to the second detection electrode layer 41 in the order of Y1, Y2, Y3,... At a constant period, and the first detection electrode layer 21 is X1, X2, X3,. ..Connected to detection circuit in row order. That is, the connection wiring layers 23a, 23b, 23c, 23d, and 23e are sequentially connected to the detection circuit.

  When a voltage is applied to the first detection electrode layer 21 or the second detection electrode layer 41 that is the drive electrode, the first detection electrode layer 21 that is the detection electrode or the timing at which the rectangular wave rises and falls A current flows through the second detection electrode layer 41. The amount of current at this time is determined by the capacitance between the detection electrode layers. When a finger or hand approaches the front of the front panel 3, a large capacitance is formed between the finger or hand and the detection electrode layer, so that the current flowing through the detection electrode changes when a voltage is applied to the drive electrode. To do. The control unit determines which part of the operation panel 3 the finger or hand is approaching from the information on which drive electrode the voltage is applied to and the information on which column's electrode current amount has changed. Can be determined.

DESCRIPTION OF SYMBOLS 1 Input device 3 Front panel 4 Decoration layer 5 Display / operation area | region 6a Lower non-display area | region 10 Transparent substrate 11 Detection board | substrate part 12 Wiring board | substrate part 15 Insulating layer 15a Lower layer 15b Upper layer 21 1st electrode layer 22a, 22b, 22c , 22d, 22e Electrode wiring layers 23a, 23b, 23c, 23d, 23e Connection wiring layers 25a, 25b, 25c, 25d, 25e Electrode land portions 26a, 26b, 26c, 26d, 26e Connection land portions 29a, 29b, 29c, 29d , 29e Connecting land portions 31, 32, 33, 34 Openings 35a, 35b, 35c, 35d, 35e Jumper members 36a, 36b, 36c, 36d, 36e Jumper members

Claims (6)

In the input device in which a plurality of electrode layers, an electrode wiring layer extending from each of the electrode layers, and a connection wiring layer for connecting the plurality of electrode wiring layers to each other are formed on the surface of the substrate.
An electrode-side connection region in which a plurality of electrode land portions electrically connected to the respective electrode wiring layers are arranged on the surface of the substrate, and a connection-side connection region in which a plurality of connection land portions electrically connected to the respective connection wiring layers are arranged. And
An insulating layer covering at least one of the electrode wiring layer and the connection wiring layer is provided, and in the electrode side connection region, the insulating layer is not provided between the adjacent electrode land portions, and the connection side In the connection region, the insulating layer is not provided between the adjacent connecting land portions,
A jumper member formed on the insulating layer is connected to the electrode land portion and the connection land portion.   The input device according to claim 1, wherein a plurality of openings are formed in the insulating layer, and internal regions of the openings are the electrode side connection region and the connection side connection region.   The connection part of each said electrode land part and each said jumper member is arrange | positioned along with it, and the said opening part is formed in the elongate shape along the arrangement direction of the said connection part. Input device.   The connection part of each said connection land part and each said jumper member is arrange | positioned along with the said opening part, and the said opening part is formed in the elongate shape along the arrangement direction of the said connection part. The input device described.   The insulating layer is formed by stacking a plurality of layers, and at the edge of the insulating layer where the jumper member crosses, the lower insulating layer is more than the upper insulating layer in the electrode side connection region. The input device according to any one of claims 1 to 4, wherein the input device projects.   The insulating layer is formed by stacking a plurality of layers, and at the edge of the insulating layer where the jumper member crosses, the lower insulating layer is connected to the connection side connection region more than the upper insulating layer. The input device according to any one of claims 1 to 5, wherein the input device projects.

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