JP6366560B2 - Composition for acoustic wave probe, silicone resin for acoustic wave probe using the same, acoustic wave probe and ultrasonic probe, and acoustic wave measuring device, ultrasonic diagnostic device, photoacoustic wave measuring device and ultrasonic endoscope - Google Patents

Description

  The present invention relates to a composition for an acoustic wave probe, a silicone resin for an acoustic wave probe using the same, an acoustic wave probe, and an ultrasonic probe. Furthermore, the present invention relates to an acoustic wave measuring device, an ultrasonic diagnostic device, a photoacoustic wave measuring device, and an ultrasonic endoscope.

  In an acoustic wave measuring apparatus, an acoustic wave probe that irradiates an object or a part (hereinafter simply referred to as an object) with an acoustic wave, receives a reflected wave (echo), and outputs a signal is used. The electric signal converted from the reflected wave received by the acoustic wave probe is displayed as an image. Thereby, the inside of the object is visualized and observed.

As the acoustic wave, an appropriate frequency is selected according to the test object, measurement conditions, etc., such as ultrasonic waves and photoacoustic waves.
For example, the ultrasonic diagnostic apparatus transmits an ultrasonic wave toward the inside of the subject, receives the ultrasonic wave reflected by the tissue inside the subject, and displays it as an image. The photoacoustic wave measuring apparatus receives an acoustic wave radiated from the inside of the subject by the photoacoustic effect and displays it as an image. The photoacoustic effect is an acoustic wave (typical) when an object is irradiated with an electromagnetic pulse such as visible light, near-infrared light, or microwave, and the object absorbs the electromagnetic wave to generate heat and thermally expands. Is a phenomenon in which ultrasonic waves are generated.
Since an acoustic wave measuring apparatus transmits and receives acoustic waves to and from a living body that is a subject to be examined, it is required to satisfy requirements such as consistency of acoustic impedance with the living body and reduction of acoustic wave attenuation.

For example, a probe for an ultrasonic diagnostic apparatus (also referred to as an ultrasonic probe), which is a kind of acoustic wave probe, includes a piezoelectric element that transmits and receives ultrasonic waves and an acoustic lens that is a part that contacts a living body. The ultrasonic wave oscillated from the piezoelectric element passes through the acoustic lens and enters the living body. If the difference between the acoustic impedance (density x speed of sound) of the acoustic lens and the acoustic impedance of the living body is large, the ultrasonic wave is reflected from the living body surface, so that the ultrasonic wave is not efficiently incident on the living body and high resolution is obtained. Is difficult. In order to transmit and receive ultrasonic waves with high sensitivity, it is desired that the acoustic lens has a small ultrasonic attenuation.
For this reason, as one of the materials of the acoustic lens, a silicone resin that is close to the acoustic impedance (1.4 to 1.7 × 10 ⁶ kg / m ² / sec) of the living body and has a small ultrasonic attenuation is mainly used. ing.

For example, Patent Document 1 proposes adding an inorganic filler and a thermoplastic resin powder such as nylon powder to silicone rubber as a composition for an acoustic lens.
Further, since the acoustic lens is used in contact with the subject, the acoustic lens is required to have mechanical strength that can withstand long-term use. Therefore, in Patent Document 2, as a composition for an acoustic lens that satisfies acoustic lens characteristics (acoustic impedance, ultrasonic attenuation, mechanical strength, etc.), a composition containing powders such as silicone rubber and ytterbium oxide and silica particles is proposed. Has been.

JP 62-011897 A JP 2005-125071 A

Silicone resin alone is soft and has low mechanical strength. Therefore, for the purpose of improving hardness and mechanical strength, blending inorganic filler (also referred to as inorganic filler) and vinyl group-containing resin (also referred to as reinforcing agent) while increasing the molecular weight of both ends vinyl silicone resin To be done. However, when trying to achieve the required mechanical strength, the amount of inorganic filler and vinyl group-containing resin added to the silicone resin inevitably increases, and conversely, the silicone resin has a large acoustic attenuation. was there.
For this reason, it has been difficult for conventional silicone resins to satisfy all of high resin hardness, mechanical strength, and reduction in acoustic wave attenuation at a high level.
Therefore, in the present invention, in view of the above circumstances, the hardness and mechanical strength (tensile rupture strength, tensile rupture elongation, tear strength and folding fatigue resistance) of the silicone resin are greatly improved while keeping the acoustic wave attenuation amount low. It is an object of the present invention to provide a composition for an acoustic wave probe, a silicone resin for an acoustic wave probe using the composition, an acoustic wave probe, an acoustic wave measuring device, and an ultrasonic diagnostic device.

  It is another object of the present invention to provide an ultrasonic probe that can use a capacitive micromachined ultrasonic transducer (cMUT) with insufficient sensitivity as a transducer array for ultrasonic diagnosis. In addition, the composition for an acoustic wave probe that can improve sensitivity in a photoacoustic wave measuring apparatus that has low sensitivity because the amount of ultrasonic waves generated by the photoacoustic wave is small and that makes it difficult to observe the deep part of the human body. It is another object of the present invention to provide a silicone resin for acoustic wave probes. In addition to this, it is possible to improve the sensitivity of ultrasonic endoscopes where the sensitivity is low because the signal cable is longer than that for the body surface, and it is difficult to improve the sensitivity in terms of structure, physical characteristics, and process suitability. An object is to provide a composition for an acoustic wave probe and a silicone resin for an acoustic wave probe.

  As a result of studying an inorganic compound added to the silicone resin composition for an acoustic wave probe composition, the present inventors have found that an inorganic material having a specific range of particle diameter and specific gravity is contained in the acoustic wave probe composition. It has been found that the above problems can be solved by including compound particles, and the present invention has been made based on this finding.

The above problem has been solved by the following means.
<1> A composition for an acoustic wave probe comprising a polysiloxane having a vinyl group, a polysiloxane having two or more Si-H groups in a molecular chain, and a polysiloxane mixture containing one or more inorganic compound particles. ,
When a silicone resin sheet having a thickness of 2 mm is obtained by heat treatment at 60 ° C. for 3 hours, the type A durometer hardness according to JIS K6253-3 (2012) of the silicone resin sheet is 15 or more and 45 or less,
The inorganic compound particles are selected from the group consisting of silicon carbide, boron nitride, alumina, barium sulfate and cerium oxide, and
A composition for an acoustic wave probe, wherein the inorganic compound particles have an average primary particle diameter of less than 25 nm and a specific gravity of 2.0 or more and 10.0 or less.
<2> A composition for an acoustic wave probe comprising a polysiloxane having a vinyl group, a polysiloxane having two or more Si-H groups in a molecular chain, and a polysiloxane mixture containing one or more inorganic compound particles. ,
The inorganic compound particles are selected from the group consisting of silicon carbide, boron nitride, alumina, barium sulfate and cerium oxide, and
A composition for an acoustic wave probe, wherein the inorganic compound particles have an average primary particle diameter of more than 3 nm and less than 15 nm and a specific gravity of 2.0 or more and 10.0 or less.
< 3 > The composition for an acoustic wave probe according to <1> or <2> , wherein 10 to 60 parts by mass of inorganic compound particles having an average primary particle diameter of less than 25 nm are contained in a total of 100 parts by mass of the polysiloxane mixture.
< 4 > A composition for an acoustic wave probe, wherein the specific gravity of the inorganic compound particles according to any one of <1> to <3> is 3.5 or more and 10.0 or less.
< 5 > A composition for an acoustic wave probe, wherein the inorganic compound particles according to < 4 > are selected from the group consisting of alumina, barium sulfate and cerium oxide.
< 6 > The composition for acoustic wave probes whose specific gravity of the inorganic compound particle as described in any one of <1> to <3> is 5.0 or more and 10.0 or less.
< 7 > A composition for an acoustic wave probe, wherein the inorganic compound particles according to < 6 > are cerium oxide.
<8> In a total of 100 parts by mass of the polysiloxane mixture, 10 to 99.4 parts by mass of a polysiloxane having a vinyl group, and 0.5 to 3 of a polysiloxane having two or more Si—H groups in a molecular chain. The composition for acoustic wave probes according to any one of <1> to <7>, containing 90 parts by mass.
<9> The composition for an acoustic wave probe according to any one of <1> to <8>, wherein the inorganic compound particles having an average primary particle diameter of less than 25 nm are surface-treated with a silane compound.
<10> The composition for an acoustic wave probe according to any one of <1> to <9>, wherein the polysiloxane having a vinyl group has a mass average molecular weight of 20,000 to 200,000.
<11> The composition for an acoustic wave probe according to any one of <1> to <10>, wherein the polysiloxane having a vinyl group has a mass average molecular weight of 40,000 to 150,000.
The composition for acoustic wave probes as described in any one of <1>-<11> which contains 0.00001-0.05 mass part of platinum or a platinum compound with respect to 100 mass parts of <12> polysiloxane mixtures.
<13> A silicone resin for an acoustic wave probe obtained by curing the composition for an acoustic wave probe according to any one of <1> to <12>.
<14> An acoustic wave probe having an acoustic lens made of the silicone resin for acoustic wave probes according to <13> and / or an acoustic matching layer made of the silicone resin for acoustic wave probes according to <13>.
<15> An ultrasonic probe comprising a capacitive micromachined ultrasonic transducer as an ultrasonic transducer array, and an acoustic lens comprising the silicone resin for acoustic wave probes according to <13>.
<16> An acoustic wave measuring device including the acoustic wave probe according to <14>.
<17> An ultrasonic diagnostic apparatus including the acoustic wave probe according to <14>.
<18> A photoacoustic wave measurement apparatus including an acoustic lens including the silicone resin for an acoustic wave probe according to <13>.
<19> An ultrasonic endoscope comprising an acoustic lens comprising the silicone resin for acoustic wave probes according to <13>.

In the description of the present specification, unless otherwise specified, when a plurality of groups having the same sign are present in the general formula showing the compound, they may be the same or different from each other, and are specified by each group. A group (for example, an alkyl group) may further have a substituent. Further, “Si—H group” means a group having three bonds on a silicon atom, but the description of these bonds is omitted and the notation is simplified.
Further, in the present specification, “to” is used in the sense of including numerical values described before and after it as a lower limit value and an upper limit value.
In addition, unless otherwise indicated, the mass average molecular weight in this specification is a measured value (polystyrene conversion) by gel permeation chromatography (GPC).

According to the present invention, the hardness and mechanical strength (tensile rupture strength, tensile rupture elongation, tear strength, and bending fatigue resistance) of the silicone resin are greatly improved while the acoustic wave (particularly preferably ultrasonic wave) attenuation is kept low. It is possible to provide a composition for an acoustic wave probe, a silicone resin for an acoustic wave probe using the same, an acoustic wave probe, an acoustic wave measuring device, and an ultrasonic diagnostic device.
In addition, it is possible to provide an ultrasonic probe, a photoacoustic wave measurement apparatus, and a silicone resin for an acoustic wave probe that can improve sensitivity in an ultrasonic endoscope using cMUT as an ultrasonic diagnostic transducer array.

Such an effect is considered because inorganic compound particles having a small average primary particle diameter in a specific range function as a stopper when mechanical stress is applied to the silicone resin for acoustic wave probes. In particular, since the average primary particle size is small, the interparticle distance is small, so that the function as a stopper is exhibited more and the tear strength of the silicone resin is greatly improved.
As a result, it is considered that the increase in acoustic wave attenuation is suppressed, and the hardness and mechanical strength (tensile rupture strength, tensile rupture elongation, tear strength, and folding fatigue resistance) of the silicone resin for an acoustic wave probe are improved.

It is a perspective transmissive view about an example of a convex type ultrasonic probe which is one mode of an acoustic wave probe.

<< Composition for acoustic wave probe >>
The composition for an acoustic wave probe of the present invention (hereinafter also simply referred to as a composition) includes a polysiloxane having a vinyl group, a polysiloxane having two or more Si—H groups in a molecular chain, and one or more inorganic compounds. The composition for an acoustic wave probe contains a polysiloxane mixture containing at least particles, and the inorganic compound particles have an average primary particle diameter of less than 25 nm and a specific gravity of 2.0 or more and 10.0 or less.

The average primary particle diameter in the total 100 parts by mass of the polysiloxane mixture is less than 25 nm, and the content of the inorganic compound particles having a specific gravity of 2.0 or more and 10.0 or less is preferably 10 to 60 parts by mass, 15-50 mass parts is more preferable, and 20-40 mass parts is further more preferable.
Further, the content of the polysiloxane having a vinyl group in the total 100 parts by mass of the polysiloxane mixture is preferably 10 to 99.4 parts by mass, and the polysiloxane having two or more Si—H groups in the molecular chain. The content is preferably 0.5 to 90 parts by mass. In addition, the content of the polysiloxane having a vinyl group is more preferably 50 to 90 parts by mass, and the content of the polysiloxane having two or more Si—H groups in the molecular chain is more preferably 1 to 50 parts by mass. preferable.
The polysiloxane mixture is a mixture that does not contain a catalyst for cross-linking (curing) a polysiloxane having a vinyl group and a polysiloxane having two or more Si—H groups in the molecular chain. Therefore, the polysiloxane mixture contains inorganic compound particles having an average primary particle diameter of less than 25 nm and a specific gravity of 2.0 or more and 10.0 or less, but does not contain a catalyst.
The total 100 parts by mass of the polysiloxane mixture means that the total of individual components contained in the polysiloxane mixture is 100 parts by mass.

Each polysiloxane contained in the polysiloxane mixture may be any polysiloxane as long as it has a vinyl group or two or more Si-H groups in the molecular chain. However, in the present invention, polyorganosiloxane (A) having a vinyl group and polyorganosiloxane (B) having two or more Si—H groups in the molecular chain are preferred.
Therefore, in the present invention, a polyorganosiloxane mixture (A) having a vinyl group, a polyorganosiloxane (B) having two or more Si-H groups in a molecular chain, and an average primary particle size in the polyorganosiloxane mixture. A composition containing at least inorganic compound particles (C) having a specific gravity of less than 25 nm and a specific gravity of 2.0 or more and 10.0 or less is preferred.
In the following detailed description, preferred embodiments, the polysiloxane mixture contains a polyorganosiloxane (A) having a vinyl group and a polyorganosiloxane (B) having two or more Si-H groups in the molecular chain. Describe what to do. However, each polysiloxane contained in the polysiloxane mixture is not limited to these polysiloxanes (A) and (B).

<Polyorganosiloxane having vinyl group (A)>
The polyorganosiloxane (A) having a vinyl group used in the present invention (hereinafter also simply referred to as polyorganosiloxane (A)) has two or more vinyl groups in the molecular chain.
As the polyorganosiloxane (A) having a vinyl group, for example, a polyorganosiloxane (a) having vinyl groups at least at both ends of the molecular chain (hereinafter, also simply referred to as polyorganosiloxane (a)), or in the molecular chain. And polyorganosiloxane (b) having at least two —O—Si (CH ₃ ) ₂ (CH═CH ₂ ) (hereinafter also simply referred to as polyorganosiloxane (b)). Among these, polyorganosiloxane (a) having vinyl groups at least at both ends of the molecular chain is preferable.
The polyorganosiloxane (a) is preferably linear, and the polyorganosiloxane (b) is a polyorganosiloxane in which —O—Si (CH ₃ ) ₂ (CH═CH ₂ ) is bonded to Si atoms constituting the main chain. Organosiloxane (b) is preferred.

  The polyorganosiloxane (A) having a vinyl group is hydrosilylated by reaction with a polyorganosiloxane (B) having two or more Si—H groups, for example, in the presence of a platinum catalyst. By this hydrosilylation reaction (addition reaction), a crosslinked structure (cured) is formed.

The vinyl group content of the polyorganosiloxane (A) is not particularly limited. From the viewpoint of forming a sufficient network with each component contained in the composition for acoustic wave probes, for example, the content of vinyl groups is preferably 0.01 to 5 mol%, and 0.05 to 2 mol. % Is more preferable.
Here, the content of the vinyl group is the mol% of the vinyl group-containing siloxane unit when the total units constituting the polyorganosiloxane (A) are 100 mol%. One vinyl group-containing siloxane unit has 1 to 3 vinyl groups. Especially, it is preferable that it is one vinyl group with respect to one vinyl group containing siloxane unit. For example, when all Si atoms of the Si—O unit constituting the main chain and the terminal Si have at least one vinyl group, the amount is 100 mol%.

Moreover, it is also preferable that polyorganosiloxane (A) has a phenyl group, and content of the phenyl group of polyorganosiloxane (A) is not specifically limited. From the viewpoint of mechanical strength when a silicone resin for acoustic wave probes is used, for example, it is preferably 1 to 80 mol%, more preferably 2 to 40 mol%.
Here, the phenyl group content is the mol% of the phenyl group-containing siloxane unit when the total units constituting the polyorganosiloxane (A) are 100 mol%. One phenyl group-containing siloxane unit has 1 to 3 phenyl groups. Especially, it is preferable that it is two phenyl groups with respect to one phenyl group containing siloxane unit. For example, when all Si atoms of the Si—O unit constituting the main chain and the terminal Si have at least one phenyl group, the amount is 100 mol%.
In addition, a unit means the Si-O unit which comprises a principal chain, and terminal Si.

  The degree of polymerization and specific gravity are not particularly limited. The degree of polymerization is preferably from 200 to 3000, and preferably from 400 to 2000, from the viewpoint of improving the mechanical strength, hardness, chemical stability, etc. of the obtained silicone resin for acoustic wave probes (hereinafter also simply referred to as silicone resin). More preferably, the specific gravity is preferably 0.9 to 1.1.

  The mass average molecular weight of the polyorganosiloxane having a vinyl group is preferably 20,000 to 200,000, more preferably 40,000 to 150,000, in view of mechanical strength, hardness, and ease of processing. 000 to 120,000 is more preferable.

  For example, GPC apparatus HLC-8220 (manufactured by Tosoh Corporation) is prepared, toluene (Shonan Wako Pure Chemical Industries, Ltd.) is used as the eluent, and TSKgel (registered trademark) G3000HXL + TSKgel (registered trademark) is used as the column. Using G2000HXL, measurement can be performed using an RI detector under conditions of a temperature of 23 ° C. and a flow rate of 1 mL / min.

Kinematic viscosity at 25 ° C. is preferably ^{1 × 10 -5 ~10m 2 / s} , more preferably ^{1 × 10 -4 ~1m 2 / s} , 1 × 10 -3 ~0.5m 2 / s is more preferable.
The kinematic viscosity can be determined according to JIS Z8803 by measuring at a temperature of 25 ° C. using an Ubbelohde viscometer (for example, trade name SU, manufactured by Shibata Chemical Co., Ltd.).

  The polyorganosiloxane (a) having vinyl groups at least at both ends of the molecular chain is preferably a polyorganosiloxane represented by the following general formula (A).

In the general formula (A), R ^a1 represents a vinyl group, and R ^a2 and R ^a3 each independently represents an alkyl group, a cycloalkyl group, an alkenyl group, or an aryl group. x1 and x2 each independently represents an integer of 1 or more. Here, the plurality of R ^a2 and the plurality of R ^a3 may be the same as or different from each other. Each group of R ^a2 and R ^a3 may further have a substituent.

1-10 are preferable, as for carbon number of the alkyl group in R ^{< a2>} and R ^<a3> , 1-4 are more preferable, 1 or 2 is more preferable, and 1 is especially preferable. Examples of the alkyl group include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, n-hexyl, n-octyl, 2-ethylhexyl and n-decyl.

3-10 are preferable, as for carbon number of the cycloalkyl group in R ^{< a2>} and R ^<a3 >, 5-10 are more preferable, and 5 or 6 is still more preferable. The cycloalkyl group is preferably a 3-membered ring, 5-membered ring or 6-membered ring, more preferably a 5-membered ring or 6-membered ring. Examples of the cycloalkyl group include cyclopropyl, cyclopentyl, and cyclohexyl.

2-10 are preferable, as for carbon number of the alkenyl group in R ^{< a2>} and R ^<a3 >, 2-4 are more preferable, and 2 is more preferable. Examples of the alkenyl group include vinyl, allyl, and butenyl.

6-12 are preferable, as for carbon number of the aryl group in R ^{< a2>} and R ^<a3 >, 6-10 are more preferable, and 6-8 are more preferable. Examples of the aryl group include phenyl, tolyl, and naphthyl.

These alkyl group, cycloalkyl group, alkenyl group and aryl group may have a substituent. Examples of such a substituent include a halogen atom, an alkyl group, a cycloalkyl group, an alkenyl group, an aryl group, an alkoxy group, an aryloxy group, an alkylthio group, an arylthio group, a silyl group, and a cyano group.
Examples of the group having a substituent include a halogenated alkyl group.

R ^a2 and R ^a3 are preferably an alkyl group, an alkenyl group or an aryl group, more preferably an alkyl group having 1 to 4 carbon atoms, a vinyl group or a phenyl group, and further preferably a methyl group, a vinyl group or a phenyl group.
Among them, R ^a2 is preferably a methyl group, and R ^a3 is preferably a methyl group, a vinyl group or a phenyl group, more preferably a methyl group or a phenyl group, and particularly preferably a methyl group. It is also preferred that both R ^{a2 in} the repetition of x1 are phenyl groups.

x1 is preferably an integer of 200 to 3000, and more preferably an integer of 400 to 2000.
x2 is preferably an integer of 1 to 3000, more preferably an integer of 1 to 1000, still more preferably an integer of 40 to 1000, and particularly preferably an integer of 40 to 700.
Moreover, as another aspect, x1 is preferably an integer of 1 to 3000, and more preferably an integer of 5 to 1000.

Polyorganosiloxanes having vinyl groups at least at both ends of the molecular chain are, for example, trade names manufactured by Gelest Co., Ltd., DMS series (for example, DMS-V31, DMS-V31S15, DMS-V33, DMS-V35, DMS- V35R, DMS-V41, DMS-V42, DMS-V46, DMS-V51, DMS-V52), PDV series (for example, PDV-0341, PDV-0346, PDV-0535, PDV-0541, PDV-1631, PDV- 1635, PDV-1641, PDV-2335), PMV-9925, PVV-3522, FMV-4031, and EDV-2022.
In addition, since DMS-V31S15 is previously blended with fumed silica, kneading with a special apparatus is unnecessary.

  The polyorganosiloxane (A) having a vinyl group in the present invention may be used alone or in combination of two or more.

<Polyorganosiloxane (B) having two or more Si-H groups in the molecular chain>
The polyorganosiloxane (B) having two or more Si—H groups in the molecular chain used in the present invention (hereinafter also simply referred to as polyorganosiloxane (B)) has two or more Si in the molecular chain. It has a -H group.
By having two or more Si—H groups in the molecular chain, a polyorganosiloxane having at least two polymerizable unsaturated groups can be crosslinked.

The polyorganosiloxane (B) has a linear structure and a branched structure, and a linear structure is preferable.
The mass average molecular weight of the linear structure is preferably from 500 to 100,000, more preferably from 1,500 to 50,000, from the viewpoint of mechanical strength and hardness.

  The polyorganosiloxane (B) having a linear structure having two or more Si-H groups in the molecular chain is preferably a polyorganosiloxane represented by the following general formula (B).

In the general formula (B), R ^{b1 to} R ^b3 each independently represent a hydrogen atom, an alkyl group, a cycloalkyl group, an alkenyl group, an aryl group, or —O—Si (R ^b5 ) ₂ (R ^b4 ). R ^b4 and R ^b5 each independently represent a hydrogen atom, an alkyl group, a cycloalkyl group, an alkenyl group or an aryl group. y1 and y2 each independently represents an integer of 1 or more. Here, a plurality of R ^b1 , a plurality of R ^b2 , a plurality of R ^b3 , a plurality of R ^b4 and a plurality of R ^b5 may be the same as or different from each other, and each group of R ^{b1 to} R ^b5 is Further, it may be substituted with a substituent. However, it has two or more Si-H groups in the molecular chain.

The alkyl group, cycloalkyl group, alkenyl group and aryl group in R ^{b1 to} R ^{b3 have the same meanings as} the alkyl group, cycloalkyl group, alkenyl group and aryl group in R ^a2 and R ^a3 , and the preferred ranges are also the same.

The alkyl group, cycloalkyl group, alkenyl group and aryl group in R ^b4 and R ^b5 of —O—Si (R ^b5 ) ₂ (R ^b4 ) ^are the alkyl group, cycloalkyl group, alkenyl group in R ^{b1 to} R ^b3 , and It is synonymous with an aryl group, and its preferable range is also the same.

R ^{b1 to} R ^b3 are preferably a hydrogen atom, an alkyl group, an alkenyl group, an aryl group, or —O—Si (R ^b5 ) ₂ (R ^b4 ). A hydrogen atom, an alkyl group having 1 to 4 carbon atoms, a vinyl group, phenyl The group or —O—Si (CH ₃ ) ₂ H is more preferred.
Among these, R ^b1 and R ^b2 are preferably a hydrogen atom, an alkyl group, an alkenyl group or an aryl group, more preferably a hydrogen atom or an alkyl group, and even more preferably a hydrogen atom or a methyl group.
R ^b3 is preferably a hydrogen atom, an alkyl group, an alkenyl group, an aryl group or —O—Si (R ^b5 ) ₂ (R ^b4 ), more preferably a hydrogen atom or —O—Si (CH ₃ ) ₂ H.

y1 and y2 are preferably an integer of 1 to 2000, more preferably an integer of 1 to 50, and still more preferably an integer of 1 to 30.
y1 + y2 is preferably an integer of 5 to 2000, more preferably an integer of 7 to 1000, still more preferably 10 to 50, and particularly preferably an integer of 15 to 30.

As a combination of R ^{b1 to} R ^b3 , R ^b1 is preferably a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, R ^b2 is an alkyl group having 1 to 4 carbon atoms, and R ^b3 is a combination of hydrogen atoms, and R ^b1 is alkyl group having 1 to 4 carbon ^{atoms, R b2} is an alkyl group having 1 to 4 carbon ^{atoms, R b3} is more preferably a combination of hydrogen atoms.
In this preferable combination, the content of the hydrosilyl group represented by y2 / (y1 + y2) is preferably more than 0.1 and less than 0.6, more preferably more than 0.1 and less than 0.4.

The polyorganosiloxane (B) having a linear structure is, for example, a methylhydrosiloxane-dimethylsiloxane copolymer (trimethylsiloxane terminated) manufactured by Gelest, HMS-064 (MeHSiO: 5-7 mol%), HMS- 082 (MeHSiO: 7-8 mol%), HMS-301 (MeHSiO: 25-30 mol%), HMS-501 (MeHSiO: 50-55 mol%).
Here, mol% of MeHSiO has the same meaning as multiplied by 100 to y2 / (y1 + y2) in the preferable combination of the ^R b1 ^{to R b3.}

  In addition, it is preferable that both the linear structure and the branched structure have no vinyl group from the viewpoint of preventing the progress of the cross-linking reaction in the molecule, and in particular, the branched structure does not have a vinyl group. It is preferable.

The branched polyorganosiloxane (B) having two or more Si—H groups in the molecular chain has a branched structure and two or more hydrosilyl groups (Si—H groups).
The specific gravity is preferably 0.9 to 0.95.
The branched structure polyorganosiloxane (B) is preferably represented by the following average composition formula (b).

Average composition formula (b): [H _a (R ^b6 ) _3-a SiO _1/2 ] _y3 [SiO _4/2 ] _y4

Here, R ^b6 represents an alkyl group, a cycloalkyl group, an alkenyl group, or an aryl group, a represents 0.1 to 3, and y3 and y4 each independently represents an integer of 1 or more.

The alkyl group, cycloalkyl group, alkenyl group and aryl group in R ^{b6 have the same meanings as} the alkyl group, cycloalkyl group, alkenyl group and aryl group in R ^a2 and R ^a3 , and the preferred ranges are also the same.
a is preferably 1.
The content of the hydrosilyl group represented by a / 3 is preferably more than 0.1 and less than 0.6, more preferably more than 0.1 and less than 0.4.

On the other hand, when the polyorganosiloxane (B) having a branched structure is represented by a chemical structural formula, polyorganosiloxane in which —O—Si (CH ₃ ) ₂ (H) is bonded to Si atoms constituting the main chain is preferable. Those having a structure represented by the following general formula (Bb) are more preferable.

  In the general formula (Bb), * means that it is bonded to at least a Si atom of siloxane.

Examples of the branched polyorganosiloxane (B) include HQM-107 (trade name, manufactured by Gelest, hydrogenated Q resin), HDP-111 (trade name, manufactured by Gelest, polyphenyl- (dimethylhydroxy) siloxane. (Hydrogen end), [(HMe ₂ SiO) (C ₆ H ₃ Si) O]: 99-100 mol%).

  The polyorganosiloxane (B) having two or more Si-H groups in the molecular chain used in the present invention may be used alone or in combination of two or more. Further, a linear polyorganosiloxane (B) and a branched polyorganosiloxane (B) may be used in combination.

<Inorganic compound particles (C) having an average primary particle diameter of less than 25 nm and a specific gravity of 2.0 or more and 10.0 or less>
The inorganic compound particles (C) having an average primary particle diameter of less than 25 nm and a specific gravity of 2.0 or more and 10.0 or less (hereinafter also simply referred to as inorganic compound particles (C)) used in the present invention are as follows. improved hardness and mechanical strength of the obtained silicone resin, Ru component der added as particularly in order to improve the tear strength.
The inorganic compound particles (C) used in the present invention are inorganic compound particles selected from the group consisting of silicon carbide, boron nitride, alumina, barium sulfate and cerium oxide.

In the present invention, by reducing the average primary particle diameter of the inorganic compound particles (C) to less than 25 nm, an increase in acoustic wave attenuation can be suppressed and the tear strength of the silicone resin can be improved. It seems to be.
That is, it is thought that the crack of the silicone resin due to mechanical stress is suppressed by the fine inorganic compound particles (C) functioning as a stopper. In particular, since the average primary particle size is small, the interparticle distance is small, so that the function as a stopper is exhibited more and the tear strength of the silicone resin is estimated to be greatly improved.

  The average primary particle diameter of the inorganic compound particles (C) used in the present invention is less than 25 nm from the viewpoint of suppressing an increase in acoustic wave attenuation of the silicone resin and improving the tear strength, and more than 3 nm and less than 25 nm. Preferably, it is more than 3 nm and less than 20 nm, more preferably more than 3 nm and less than 15 nm.

The average primary particle diameter is described in the catalog of the manufacturer of inorganic compound particles. However, a product whose average primary particle size is not described in the catalog or a newly produced product can be obtained by averaging the particle size measured by a transmission electron microscope (TEM). That is, the short diameter and the long diameter are measured for one particle of an electron micrograph taken by TEM, and the average value is obtained as the particle diameter of one particle. In this specification, the particle diameters of 300 or more particles are averaged to obtain the average primary particle diameter.
Moreover, when the surface treatment mentioned later is given to the inorganic compound particle (C), it means the average primary particle diameter in the surface-treated state.

The specific gravity of the inorganic compound particles (C) used in the present invention is 2.0 or more and 10.0 or less, and the lower limit is preferably 3.5 or more, more preferably 5.0 or more.
Specifically, inorganic compound particles (C) selected from the group consisting of silicon carbide, boron nitride, alumina, barium sulfate and cerium oxide are preferred, and inorganic compounds selected from the group consisting of alumina, barium sulfate and cerium oxide. Is more preferable, and cerium oxide is more preferable.

  As the inorganic compound particles (C), only one kind may be used alone, or two or more kinds may be used in combination.

Inorganic compound particles used in the present invention (C), from the viewpoint of improving the hardness and mechanical strength of the obtained silicone resin, the specific surface area is preferably ^{50~400m 2 / g, 100~400m 2 /} g is more preferable.

The inorganic compound particles (C) used in the present invention are preferably inorganic compound particles whose surface is surface-treated, and more preferably inorganic compound particles whose surface is treated with a silane compound.
Surface treatment of inorganic compound particles with a silane compound enhances the interaction with the silicone resin and increases the affinity with the silicone resin, enabling fine dispersion of inorganic compound particles with a small average primary particle size. It is considered to be. For this reason, it is considered that the inorganic compound fine particles (C) exhibit more functions as a stopper when mechanical stress is applied, and the hardness and mechanical strength of the silicone resin are improved.
The surface treatment method may be a normal method. Examples of the surface treatment method with a silane compound include a method of surface treatment with a silane coupling agent and a method of coating with a silicone compound.

(I) Silane coupling agent The silane coupling agent is preferably a silane coupling agent having a hydrolyzable group from the viewpoint of improving the hardness and mechanical strength of the silicone resin. The hydrolyzable group in the silane coupling agent is hydrolyzed with water to become a hydroxyl group, and this hydroxyl group undergoes a dehydration condensation reaction with a hydroxyl group on the surface of the inorganic compound particle, whereby the surface modification of the inorganic compound particle is performed and obtained. The hardness and mechanical strength of the silicone resin are improved. Examples of the hydrolyzable group include an alkoxy group, an acyloxy group, and a halogen atom.
When the surface of the inorganic compound particles is hydrophobically modified, the affinity between the inorganic compound particles (C) and the polyorganosiloxane (A) and (B) is improved, and the hardness of the resulting silicone resin Further, it is preferable because the mechanical strength is improved.

  Examples of the silane coupling agent having a hydrophobic group as a functional group include methyltrimethoxysilane, dimethyldimethoxysilane, phenyltrimethoxysilane, methyltriethoxysilane, dimethyldiethoxysilane, phenyltriethoxysilane, and n-propyltrisilane. Alkoxysilanes such as methoxysilane, n-propyltriethoxysilane, hexyltrimethoxysilane, hexyltriethoxysilane, decyltrimethoxysilane; chlorosilanes such as methyltrichlorosilane, dimethyldichlorosilane, trimethylchlorosilane, phenyltrichlorosilane; hexa And methyl disilazane (HMDS).

  Examples of the silane coupling agent having a vinyl group as a functional group include methacryloxypropyltriethoxysilane, methacryloxypropyltrimethoxysilane, methacryloxypropylmethyldiethoxysilane, methacryloxypropylmethyldimethoxysilane, and vinyltriethoxy. Examples thereof include alkoxysilanes such as silane, vinyltrimethoxysilane and vinylmethyldimethoxysilane; chlorosilanes such as vinyltrichlorosilane and vinylmethyldichlorosilane; divinyltetramethyldisilazane.

The inorganic compound particles (C) surface-treated with the silane coupling agent are preferably inorganic compound particles treated with a trialkylsilylating agent, and more preferably inorganic compound particles treated with a trimethylsilylating agent.
Examples of the silane compound include the above silane coupling agents and silane coupling agents in which functional groups in the silane coupling agent are substituted with alkyl groups.
Examples of the trimethylsilylating agent include trimethylchlorosilane and hexamethyldisilazane (HMDS) described in the above silane coupling agent and trimethylmethoxysilane which is a silane coupling agent in which a functional group is substituted with an alkyl group. It is done.

Examples of commercially available silane coupling agents include hexamethyldisilazane (HMDS) (trade name: HEXAMETHYLDISILAZAN (SIH6110.1), manufactured by Gelest).
Hydroxyl groups present on the surface of the inorganic compound particles are covered with trimethylsilyl groups by reaction with hexamethyldisilazane (HMDS), and the surface of the inorganic compound particles is modified to be hydrophobic.

(Ii) Silicone Compound The silicone compound that coats the inorganic compound particles (C) may be a polymer composed of siloxane bonds.
Examples of the silicone compound include a silicone compound in which all or part of the side chain or terminal of polysiloxane is a methyl group, a silicone compound in which part of the side chain is a hydrogen atom, or all or one of the side chain or terminal. Examples thereof include a modified silicone compound in which an organic group such as an amino group or an epoxy group is introduced into the part, and a silicone resin having a branched structure. The silicone compound may have a linear or cyclic structure.

  Examples of silicone compounds in which all or part of the side chain or terminal of polysiloxane are methyl groups include polymethylhydrosiloxane (hydrogen terminal), polymethylhydrosiloxane (trimethylsiloxy terminal), polymethylphenylsiloxane ( Hydrogen-terminated), monomethylpolysiloxanes such as polymethylphenylsiloxane (trimethylsiloxy-terminated), such as dimethylpolysiloxane (hydrogen-terminated), dimethylpolysiloxane (trimethylsiloxy-terminated), and dimethylpolysiloxanes such as cyclic dimethylpolysiloxane. Can be mentioned.

  Examples of silicone compounds in which a part of the side chain is a hydrogen atom include methylhydrosiloxane-dimethylsiloxane copolymer (trimethylsiloxy-terminated), methylhydrosiloxane-dimethylsiloxane copolymer (hydrogen-terminated), and polymethylhydrosiloxane (hydrogen-terminated). Polymethylhydrosiloxane (trimethylsiloxy-terminated), polyethylhydrosiloxane (triethylsiloxy-terminated), polyphenyl- (dimethylhydrosiloxy) siloxane (hydrogen-terminated), methylhydrosiloxane-phenylmethylsiloxane copolymer (hydrogen-terminated), methylhydro Examples thereof include siloxane-octylmethylsiloxane copolymer / terpolymer.

  Examples of the modified silicone introduced with an organic group include amino groups, epoxy groups, methoxy groups, (meth) acryloyl groups, phenol groups, carboxylic anhydride groups, hydroxy groups, mercapto groups, carboxy groups, and hydrogen atoms. Non-reactive silicones modified with, for example, polyethers, aralkyls, fluoroalkyls, long-chain alkyls, long-chain aralkyls, higher fatty acid esters, higher fatty acid amides, and polyether methoxys. It is done.

The inorganic compound particles coated with the silicone compound can be obtained by a conventional method. For example, it can be obtained by mixing and stirring inorganic compound particles in dimethylpolysiloxane for a certain time and filtering.
In addition, when a reactive modified silicone is used as the silicone compound, the organic group reacts with the hydroxyl group on the surface of the inorganic compound particle, whereby the surface modification of the inorganic compound particle is performed, and the hardness and machine of the resulting silicone resin Strength is improved.

  Examples of commercially available silicone compounds include methyl hydrogen silicone oil (MHS) (trade name: KF-99, manufactured by Shin-Etsu Chemical Co., Ltd.), which is polymethylhydrosiloxane (trimethylsiloxy terminal).

The vinyl group possessed by the polyorganosiloxane (A) and the Si—H group possessed by the polyorganosiloxane (B) usually react in a stoichiometric ratio of 1: 1.
However, in the present invention, since the average primary particle diameter of the inorganic compound particles (C) is small and the gaps between the polyorganosiloxanes (A) and (B) are closely packed, the polyorganosiloxanes (A) and ( The movement of the molecular chain of B) is limited.
Therefore, in order for all vinyl groups to react with the Si—H group, the equivalent of the Si—H group of the polyorganosiloxane (B) to the vinyl group of the polyorganosiloxane (A) is vinyl group: Si— H group is preferably 1: 1.1-1: 8, more preferably 1: 1.2-1: 5.

<Other ingredients>
The composition for an acoustic wave probe of the present invention comprises a polyorganosiloxane having a vinyl group (A), a polyorganosiloxane having two or more Si-H groups in the molecular chain, and an average primary particle size of less than 25 nm. In addition to inorganic compound particles (C) having a specific gravity of 2.0 or more and 10.0 or less, a platinum catalyst, a curing retarder, a solvent, a dispersant, a pigment, a dye, and an antistatic agent for addition polymerization reaction An antioxidant, a flame retardant, a thermal conductivity improver, and the like can be appropriately blended.

− Catalyst −
Examples of the catalyst include platinum or a platinum-containing compound (hereinafter also referred to as a platinum compound). Any platinum or platinum compound can be used.
Specifically, platinum black, platinum supported on an inorganic compound or carbon black, chloroplatinic acid or chloroplatinic acid alcohol solution, chloroplatinic acid and olefin complex salt, chloroplatinic acid and vinylsiloxane complex salt Etc. A catalyst may be used individually by 1 type and may be used in combination of 2 or more type.

The content of the catalyst can be appropriately set within the range of the catalyst amount.
The catalyst is necessary in the hydrosilylation reaction in which the Si—H group of the polyorganosiloxane (B) is added to the vinyl group of the polyorganosiloxane (A). The polyorganosiloxane (A) is crosslinked with the polyorganosiloxane (B) by an addition curing reaction by hydrosilylation to form a silicone resin.
Here, the catalyst may be contained in the composition for acoustic wave probes of the present invention, or may be brought into contact with the composition for acoustic wave probes without being contained in the composition for acoustic wave probes. The latter is preferred.

  As a commercially available platinum catalyst, a platinum compound (Brand name: PLATINUM CYCLOVINYLMETHYLSLOOXANE COMPLEX IN CYCLIC METHYLVINYLSILOXANES (SIP6832.2), Pt density | concentration 2 mass%, the product made from Gelest) is mentioned, for example.

  When the catalyst is contained in the acoustic wave probe composition of the present invention, the content of the catalyst is preferably 0.00001 to 0.05 parts by mass with respect to 100 parts by mass of the polysiloxane mixture from the viewpoint of reactivity. 0.00001 to 0.01 parts by mass is more preferable, 0.00002 to 0.01 parts by mass is further preferable, and 0.00005 to 0.005 parts by mass is particularly preferable.

  Further, the curing temperature can be adjusted by selecting an appropriate platinum catalyst. For example, platinum-vinyldisiloxane is used for room temperature curing (RTV) at 50 ° C. or lower, and platinum-cyclic vinylsiloxane is used for high temperature curing (HTV) at 130 ° C. or higher.

− Cure retarder −
In the present invention, a curing retarder for the curing reaction can be appropriately used. The curing retarder is used for delaying an addition curing reaction by a platinum catalyst, and examples thereof include a low molecular weight vinylmethylsiloxane homopolymer (trade name: VMS-005, manufactured by Gelest).
The curing rate, that is, the working time can be adjusted by the content of the curing retarder.

<Method for Producing Acoustic Wave Probe Composition and Silicone Resin for Acoustic Wave Probe>
The composition for acoustic wave probes of the present invention can be produced by any method.
For example, the components constituting the composition for acoustic wave probes can be obtained by kneading with a kneader, a pressure kneader, a Banbury mixer (continuous kneader), or a two-roll kneader. The mixing order of each component is not particularly limited.
From the viewpoint of obtaining a uniform composition, first, the average primary particles are added to the polyorganosiloxane (A) having a vinyl group and the polyorganosiloxane (B) having two or more Si—H groups in the molecular chain. It is preferable to use a polyorganosiloxane mixture in which inorganic compound particles (C) having a diameter of less than 25 nm and a specific gravity of 2.0 to 10.0 are dispersed. Then, the composition for acoustic wave probes can be produced by adding a catalyst to the polyorganosiloxane mixture in which the inorganic compound particles (C) are dispersed and degassing under reduced pressure.

  The silicone resin for acoustic wave probes of the present invention can be obtained by curing the composition for acoustic wave probes of the present invention thus obtained. Specifically, for example, a silicone resin for acoustic wave probes can be obtained by heat curing at 20 to 200 ° C. for 5 to 500 minutes.

<Mechanical strength and acoustic wave characteristics of silicone resin>
Hereinafter, the mechanical strength and acoustic wave characteristics of the silicone resin will be described in detail.
Here, the acoustic wave characteristic describes the ultrasonic characteristic. However, the acoustic wave characteristic is not limited to the ultrasonic characteristic, but relates to the acoustic wave characteristic of an appropriate frequency selected according to the object to be examined, measurement conditions, and the like.

[hardness]
About a 2 mm-thick silicone resin sheet, according to JISK6253-3 (2012), type A durometer hardness is measured using a rubber hardness meter (for example, the product name "RH-201A" by the Excel company).
The hardness is preferably 15 or more, and more preferably 25 or more, from the viewpoint of preventing deformation when incorporated and used as a part of the acoustic wave probe. The practical upper limit is 80 or less.

[Tensile test]
A dumbbell-shaped test piece is produced according to JIS K6251 (2010) for a 1 mm thick silicone resin sheet, and the tensile breaking strength and tensile breaking elongation (elongation) are measured.
The tensile breaking strength is preferably 1.2 MPa or more, and the tensile breaking elongation is preferably 500% or more. The realistic upper limit is that the tensile strength at break is 10 MPa or less and the tensile elongation at break is 1500% or less.

[Tear strength test]
A trouser type test piece is prepared according to JIS K6252 (2007) for a 2 mm thick silicone resin sheet, and the tear strength is measured.
The tear strength is preferably 15 N / cm or more, more preferably 20 N / cm or more, and further preferably 30 N / cm or more. The realistic upper limit is 100 N / cm or less.

[Folding fatigue test]
For the obtained 2 mm thick silicone resin sheet, for example, according to the fold strength test method-MIT test machine method described in JIS P8115 (2001), for example, an MIT fold resistance fatigue tester (manufactured by Toyo Seiki Seisakusho, model number: DA) is used to perform a bending fatigue test. The test speed is 175 cpm, the bending angle is 135 degrees, the load is 19.6 N, and the bending clamp R is 2.0 mm.
“A” indicates that the material breaks when the number of bending is 5000 times or more, “B” indicates that the material breaks after 1000 times or more and less than 5000 times, “C” indicates that the material breaks 100 times or more and less than 1000 times, and breaks when less than 100 times Let the thing be “D”.
Here, the evaluations “A” and “B” indicate that the fatigue resistance is considerably excellent, “C” indicates that it can be used, and “D” indicates that it cannot be used.

[Acoustic impedance]
For a silicone resin sheet having a thickness of 2 mm, the density at 25 ° C. was measured according to the density measurement method of Method A (underwater substitution method) described in JIS K7112 (1999). SD-200L "). The sound velocity of the acoustic wave was measured at 25 ° C. according to JIS Z2353 (2003) using a single-around sound velocity measuring device (for example, trade name “UVM-2” manufactured by Ultrasonic Industry Co., Ltd.), and the measured density The acoustic impedance is obtained from the product of sound speed.

[Acoustic wave (ultrasonic wave) attenuation, sensitivity]
A 5 MHz sine wave signal (one wave) output from an ultrasonic oscillator (for example, Iwatsu Measurement Co., Ltd., function generator, product name “FG-350”) is used as an ultrasonic probe (for example, Japan Probe Co., Ltd.). ) And an ultrasonic pulse wave having a center frequency of 5 MHz is generated in the water from the ultrasonic probe. The amplitude of the generated ultrasonic wave before and after passing through the 2 mm-thick silicone resin sheet is measured by an ultrasonic receiver (for example, Matsushita Electric Industrial Co., Ltd., oscilloscope, trade name “VP-5204A”). The acoustic wave (ultrasonic wave) attenuation of each sheet is compared by measuring in an environment where the water temperature is 25 ° C. and comparing the acoustic wave (ultrasonic wave) sensitivity.
The acoustic wave (ultrasonic wave) sensitivity is a numerical value given by the following calculation formula.
In the following calculation formula, Vin represents a voltage peak value of an input wave having a half width of 50 nsec or less by an ultrasonic oscillator. Vs represents a voltage value obtained when the generated acoustic wave (ultrasonic wave) passes through the sheet and the ultrasonic oscillator receives the acoustic wave (ultrasonic wave) reflected from the facing surface of the sheet.

    Acoustic wave (ultrasound) sensitivity = 20 x Log (Vs / Vin)

  In the evaluation system of the present invention, the acoustic wave (ultrasonic wave) sensitivity is preferably −72 dB or more, and more preferably −71 dB or more.

The composition for an acoustic wave probe of the present invention is useful for a medical member, and can be preferably used for, for example, an acoustic wave probe or an acoustic wave measuring device. The acoustic wave measuring device of the present invention is not limited to an ultrasonic diagnostic device or a photoacoustic wave measuring device, but refers to a device that receives an acoustic wave reflected or generated by an object and displays it as an image or signal intensity.
In particular, the composition for an acoustic wave probe of the present invention is provided between an acoustic lens of an ultrasonic diagnostic apparatus or a piezoelectric element and an acoustic lens, and has a role of matching acoustic impedance between the piezoelectric element and the acoustic lens. Acoustic matching layer material, acoustic lens material in photoacoustic wave measuring device and ultrasonic endoscope, and acoustic in ultrasonic probe with capacitive micromachined ultrasonic transducer (cMUT) as ultrasonic transducer array It can be suitably used for a lens material or the like.
Specifically, the silicone resin for an acoustic wave probe of the present invention is, for example, an ultrasonic diagnostic apparatus described in JP-A-2005-253751, JP-A-2003-169802, or JP-A-2013-202050. , Preferably applied to an acoustic wave measuring apparatus such as the photoacoustic wave measuring apparatus described in JP 2013-188465 A, JP 2013-180330 A, JP 2013-158435 A, JP 2013-154139 A, etc. Is done.

<< Acoustic wave probe (probe) >>
Hereinafter, the configuration of the acoustic wave probe of the present invention will be described in more detail based on the configuration of the ultrasonic probe in the ultrasonic diagnostic apparatus shown in FIG. In addition, an ultrasonic probe is a probe which uses an ultrasonic wave especially as an acoustic wave in an acoustic wave probe. Therefore, the basic structure of the ultrasonic probe can be applied to the acoustic wave probe as it is.

− Ultrasonic probe −
The ultrasonic probe 10 is a main component of the ultrasonic diagnostic apparatus, and has a function of generating ultrasonic waves and transmitting / receiving ultrasonic beams. As shown in FIG. 1, the configuration of the ultrasonic probe 10 is provided in the order of an acoustic lens 1, an acoustic matching layer 2, a piezoelectric element layer 3, and a backing material 4 from the tip (surface in contact with a living body as a subject). Yes. In recent years, for the purpose of receiving high-order harmonics, a transmitting ultrasonic transducer (piezoelectric element) and a receiving ultrasonic transducer (piezoelectric element) are made of different materials to form a laminated structure. Has also been proposed.

<Piezoelectric element layer>
The piezoelectric element layer 3 is a part that generates ultrasonic waves, and electrodes are attached to both sides of the piezoelectric element. When a voltage is applied, the piezoelectric element repeatedly vibrates and expands and expands to generate ultrasonic waves. To do.

As a material constituting the piezoelectric element, a single crystal such as quartz, LiNbO ₃ , LiTaO ₃ , KNbO ₃ , a thin film such as ZnO or AlN, or a sintered body such as Pb (Zr, Ti) O ₃ system is subjected to polarization treatment. So-called ceramic inorganic piezoelectric materials are widely used. In general, piezoelectric ceramics such as PZT: lead zirconate titanate with high conversion efficiency are used.
In addition, a piezoelectric element that detects a received wave on the high frequency side needs sensitivity with a wider bandwidth. For this reason, an organic piezoelectric body using an organic polymer material such as polyvinylidene fluoride (PVDF) is used as a piezoelectric element suitable for a high frequency and a wide band.
Furthermore, Japanese Patent Application Laid-Open No. 2011-071842 uses MEMS (Micro Electro Mechanical Systems) technology that exhibits excellent short pulse characteristics and wide band characteristics, and that provides an array structure with excellent mass productivity and little variation in characteristics. cMUT is described.
In the present invention, any piezoelectric element material can be preferably used.

<Backing material>
The backing material 4 is provided on the back surface of the piezoelectric element layer 3, and reduces the pulse width of the ultrasonic wave by suppressing excessive vibration, thereby contributing to the improvement of the distance resolution in the ultrasonic diagnostic image.

<Acoustic matching layer>
The acoustic matching layer 2 is provided to reduce the difference in acoustic impedance between the piezoelectric element layer 3 and the subject and to efficiently transmit and receive ultrasonic waves.
The composition for an ultrasonic probe of the present invention is preferably used as a material for an acoustic matching layer because the difference from the acoustic impedance of a living body (1.4 to 1.7 × 10 ⁶ kg / m ² / sec) is small. Can do. The acoustic matching layer of the present invention preferably contains 10% by mass or more of a silicone resin for acoustic wave probes obtained by curing reaction of the composition for acoustic wave probes of the present invention.

<Acoustic lens>
The acoustic lens 1 is provided to focus the ultrasonic wave in the slice direction using refraction and improve the resolution. In addition, the ultrasonic wave is brought into close contact with the living body as the subject, and the ultrasonic wave is matched with the acoustic impedance of the living body (1.4 to 1.7 × 10 ⁶ kg / m ² / sec in the human body), and the acoustic lens 1 itself. Is required to have a small amount of ultrasonic attenuation.
That is, the acoustic lens 1 is made of a material whose sound velocity is sufficiently smaller than the sound velocity of the human body, the attenuation of the ultrasonic wave is small, and the acoustic impedance is close to the value of the human skin. Sensitivity is improved.
The composition for an acoustic wave probe which is the composition for an ultrasonic probe of the present invention can be preferably used as an acoustic lens material.

  The operation of the ultrasonic probe 10 having such a configuration will be described. A voltage is applied to the electrodes provided on both sides of the piezoelectric element to resonate the piezoelectric element layer 3, and an ultrasonic signal is transmitted from the acoustic lens to the subject. At the time of reception, the piezoelectric element layer 3 is vibrated by a reflected signal (echo signal) from the subject, and the vibration is electrically converted into a signal to obtain an image.

In particular, the acoustic lens obtained from the composition for an ultrasonic probe of the present invention can confirm a remarkable sensitivity improvement effect at an ultrasonic transmission frequency of about 5 MHz or more as a general medical ultrasonic transducer. Particularly significant sensitivity improvement effect can be expected at an ultrasonic transmission frequency of 10 MHz or more.
Hereinafter, an apparatus in which the acoustic lens obtained from the composition for an ultrasonic probe according to the present invention particularly functions will be described in detail.
In addition, the composition for ultrasonic probes of this invention shows the outstanding effect also with respect to apparatuses other than what is described below.

-Ultrasonic probe with cMUT (capacitive micromachined ultrasonic transducer)-
When the cMUT device described in JP 2006-157320 A, JP 2011-71842 A, or the like is used for a transducer array for ultrasonic diagnosis, it is generally compared with a transducer using general piezoelectric ceramics (PZT). Specifically, the sensitivity becomes low.
However, it is possible to compensate for the lack of sensitivity of cMUT by using an acoustic lens obtained from the composition for acoustic wave probes of the present invention. Thereby, the sensitivity of the cMUT can be brought close to the performance of the conventional transducer.
Since the cMUT device is manufactured by the MEMS technology, it is possible to provide an ultrasonic probe having a higher productivity and a lower cost than the piezoelectric ceramic probe to the market.

− Photoacoustic wave measurement device by photoacoustic imaging −
Photoacoustic imaging (PAI) described in Japanese Patent Application Laid-Open No. 2013-158435 or the like is a supersonic wave generated when a human body tissue is adiabatically expanded by irradiating light (electromagnetic waves) into the human body. Displays the image of the sound wave or the signal strength of the ultrasonic wave.
Here, since the sound pressure of the ultrasonic wave generated by light irradiation is very small, there is a problem that it is difficult to observe the deep part of the human body.
However, by using an acoustic lens obtained from the acoustic wave probe composition of the present invention, an effective effect on this problem can be exhibited.

− Ultrasound endoscope −
Since the ultrasonic wave in the ultrasonic endoscope described in Japanese Patent Application Laid-Open No. 2008-311700 is longer than the body surface transducer due to its structure, the improvement of the sensitivity of the transducer due to the cable loss is a problem. is there. Moreover, it is said that there is no effective sensitivity improvement means for this problem for the following reasons.

First, in the case of an ultrasonic diagnostic apparatus for the body surface, an amplifier circuit, an AD conversion IC, etc. can be installed at the tip of the transducer. On the other hand, since an ultrasonic endoscope is used by being inserted into the body, the installation space for the transducer is narrow, and it is difficult to install an amplifier circuit, an AD conversion IC, or the like at the tip of the transducer.
Second, the piezoelectric single crystal employed in the transducer in the ultrasonic diagnostic apparatus for the body surface is difficult to apply to a transducer having an ultrasonic transmission frequency of 7 to 8 MHz or more due to its physical characteristics and process suitability. . However, since the ultrasonic waves for endoscopes are generally probes having an ultrasonic transmission frequency of 7 to 8 MHz or higher, it is difficult to improve the sensitivity with the piezoelectric single crystal material.

However, it is possible to improve the sensitivity of the endoscope ultrasonic transducer by using an acoustic lens obtained from the composition for acoustic wave probes of the present invention.
Even when the same ultrasonic transmission frequency (for example, 10 MHz) is used, the present invention is particularly effective when an acoustic lens obtained from the acoustic probe composition of the present invention is used in an ultrasonic transducer for an endoscope. Demonstrated.

  Hereinafter, the present invention will be described in more detail based on examples using ultrasonic waves as acoustic waves. Note that the present invention is not limited to ultrasonic waves, and an acoustic wave having an audible frequency may be used as long as an appropriate frequency is selected in accordance with an object to be examined and measurement conditions.

[Example 1]
68 parts by mass of vinyl-terminated polydimethylsiloxane (manufactured by Gelest, trade name “DMS-V42”, mass average molecular weight 72,000), methylhydrosiloxane-dimethylsiloxane copolymer (manufactured by Gelest, trade name “HMS-301”, mass) 2 parts by mass of average molecular weight 2,000, methylhydrosiloxane ratio 27 mol%), boron nitride (specific gravity 2.3, average primary particle size 22 nm, methyl hydrogen silicone (MHS) surface treatment) 30 parts by mass in a kneader for 2 hours Kneaded to make a uniform paste. After adding 0.05 parts by mass of a platinum catalyst solution (trade name “SIP6832.2”, Pt concentration: 2% by mass) manufactured by Gelest Co. to this, the mixture was degassed under reduced pressure and placed in a metal mold of 150 mm × 150 mm. Heat treatment was performed at 60 ° C. for 3 hours to obtain silicone resin sheets having a thickness of 1 mm and 2 mm, respectively.

[Example 2]
The same silicone resin was treated as in Example 1 except that 30 parts by mass of silicon carbide (specific gravity 3.2, average primary particle size 18 nm, methyl hydrogen silicone (MHS) surface treatment) was used as the inorganic compound particles. A sheet was obtained.

[Example 3]
Except for using 30 parts by mass of alumina (specific gravity 3.9, average primary particle size 15 nm, hexamethyldisilazane (HMDS) surface treatment) as inorganic compound particles, the same silicone resin sheet was treated as in Example 1. Got.

[Example 4]
Except for using 30 parts by mass of alumina (specific gravity 3.9, average primary particle diameter 10 nm, hexamethyldisilazane (HMDS) surface treatment) as inorganic compound particles, the same silicone resin sheet was treated as in Example 1. Got.

[Example 5]
Except for using 30 parts by mass of barium sulfate (specific gravity 4.5, average primary particle diameter 20 nm, methyl hydrogen silicone (MHS) surface treatment) as inorganic compound particles, the same silicone resin was treated as in Example 1. A sheet was obtained.

[Example 6]
Except for using 30 parts by mass of barium sulfate (specific gravity 4.5, average primary particle size 12 nm, methyl hydrogen silicone (MHS) surface treatment) as inorganic compound particles, the same silicone resin was treated as in Example 1. A sheet was obtained.

[Example 7]
68 parts by mass of vinyl-terminated polydimethylsiloxane (manufactured by Gelest, trade name “DMS-V42”, mass average molecular weight 72,000), methylhydrosiloxane-dimethylsiloxane copolymer (manufactured by Gelest, trade name “HMS-301”, mass) 2 parts by mass of an average molecular weight of 2,000, a methylhydrosiloxane ratio of 27 mol%), 30 parts by mass of cerium oxide (specific gravity 7.1, average primary particle size 19 nm, hexamethyldisilazane (HMDS) surface treatment) are the same as in Example 1. In the same manner as in Example 1, it was thermoset with a platinum catalyst to obtain a predetermined silicone resin sheet.

[Example 8]
The same treatment as in Example 7 was carried out except that 30 parts by mass of cerium oxide (specific gravity 7.1, average primary particle diameter 7 nm, hexamethyldisilazane (HMDS) surface treatment) was used as the inorganic compound particles, and the prescribed silicone resin A sheet was obtained.

[Example 9]
A predetermined silicone resin sheet was obtained in the same manner as in Example 7 except that 30 parts by mass of cerium oxide (specific gravity 7.1, average primary particle diameter 19 nm, no surface treatment) was used as the inorganic compound particles.

[Example 10]
65 parts by mass of vinyl-terminated polydimethylsiloxane (manufactured by Gelest, trade name “DMS-V31”, weight average molecular weight 28,000) as polyorganosiloxane having vinyl group, and methylhydrosiloxane as polyorganosiloxane having Si—H group -Treated in the same manner as in Example 8 except that 5 parts by mass of dimethylsiloxane copolymer (manufactured by Gelest Co., Ltd., trade name “HMS-301”, mass average molecular weight 2,000, methylhydrosiloxane ratio 27 mol%) was used. The silicone resin sheet was obtained.

[Example 11]
67 parts by mass of vinyl-terminated polydimethylsiloxane (manufactured by Gelest, trade name “DMS-V35”, weight average molecular weight 49,500) as polyorganosiloxane having vinyl group, and methylhydrosiloxane as polyorganosiloxane having Si—H group -Treated in the same manner as in Example 8 except that 3 parts by mass of dimethylsiloxane copolymer (manufactured by Gelest, trade name “HMS-301”, mass average molecular weight 2,000, methylhydrosiloxane ratio 27 mol%) was used. The silicone resin sheet was obtained.

[Example 12]
69 parts by mass of vinyl-terminated polydimethylsiloxane (manufactured by Gelest, trade name “DMS-V46”, mass average molecular weight 117,000) as polyorganosiloxane having vinyl group, and methylhydrosiloxane as polyorganosiloxane having Si—H group -Treated in the same manner as in Example 8 except that 1 part by mass of dimethylsiloxane copolymer (manufactured by Gelest, trade name “HMS-301”, mass average molecular weight 2,000, methylhydrosiloxane ratio 27 mol%) was used. The silicone resin sheet was obtained.

[Example 13]
69 parts by mass of vinyl-terminated polydimethylsiloxane (manufactured by Gelest, trade name “DMS-V52”, weight average molecular weight 155,000) as polyorganosiloxane having vinyl groups, and methylhydrosiloxane as polyorganosiloxane having Si—H groups -Treated in the same manner as in Example 8 except that 1 part by mass of dimethylsiloxane copolymer (manufactured by Gelest, trade name “HMS-301”, mass average molecular weight 2,000, methylhydrosiloxane ratio 27 mol%) was used. The silicone resin sheet was obtained.

[Example 14]
78 parts by mass of vinyl-terminated polydimethylsiloxane (trade name “DMS-V42”, mass average molecular weight 72,000, manufactured by Gelest Co., Ltd.) as polyorganosiloxane having vinyl group, and methylhydrosiloxane as polyorganosiloxane having Si—H group -Dimethylsiloxane copolymer (manufactured by Gelest Co., Ltd., trade name “HMS-301”, mass average molecular weight 2,000, methylhydrosiloxane ratio 27 mol%) 2 parts by mass, cerium oxide (specific gravity 7.1, average primary particles) as inorganic compound particles A predetermined silicone resin sheet was obtained in the same manner as in Example 8, except that 20 parts by mass of 7 nm in diameter and hexamethyldisilazane (HMDS) surface treatment) was used.

[Example 15]
59 parts by mass of vinyl-terminated polydimethylsiloxane (manufactured by Gelest, trade name “DMS-V42”, mass average molecular weight 72,000) as polyorganosiloxane having vinyl group, and methylhydrosiloxane as polyorganosiloxane having Si—H group -1 part by weight of dimethylsiloxane copolymer (Gelest, trade name “HMS-301”, mass average molecular weight 2,000, methylhydrosiloxane ratio 27 mol%), cerium oxide (specific gravity 7.1, average primary particles) as inorganic compound particles A predetermined silicone resin sheet was obtained in the same manner as in Example 8, except that 40 parts by mass of 7 nm in diameter and hexamethyldisilazane (HMDS) surface treatment) was used.

[Example 16]
Except for using 68 parts by mass of vinyl-terminated diphenylsiloxane-dimethylsiloxane copolymer (manufactured by Gelest, trade name “PDV-0535”, mass average molecular weight 47,500, diphenylsiloxane amount 5 mol%) as a polyorganosiloxane having a vinyl group. In the same manner as in Example 8, a predetermined silicone resin sheet was obtained.

[Example 17]
Except for using 68 parts by mass of a vinyl-terminated diphenylsiloxane-dimethylsiloxane copolymer (manufactured by Gelest, trade name “PDV-1635”, mass average molecular weight 35,300, diphenylsiloxane amount 16 mol%) as a polyorganosiloxane having a vinyl group. In the same manner as in Example 8, a predetermined silicone resin sheet was obtained.

[Comparative Example 1]
The same treatment as in Example 1 was carried out except that 30 parts by mass of boron nitride (specific gravity 2.3, average primary particle size 63 nm, methyl hydrogen silicone (MHS) surface treatment) was used as the inorganic compound particles, and a predetermined silicone resin was used. A sheet was obtained.

[Comparative Example 2]
The same silicone resin was treated as in Example 1 except that 30 parts by mass of silicon carbide (specific gravity 3.2, average primary particle size 50 nm, methyl hydrogen silicone (MHS) surface treatment) was used as inorganic compound particles. A sheet was obtained.

[Comparative Example 3]
Except for using 30 parts by mass of alumina (specific gravity 3.9, average primary particle size 50 nm, hexamethyldisilazane (HMDS) surface treatment) as inorganic compound particles, the same silicone resin sheet was treated as in Example 1. Got.

[Comparative Example 4]
Except for using 30 parts by mass of barium sulfate (specific gravity 4.5, average primary particle size 30 nm, methyl hydrogen silicone (MHS) surface treatment) as inorganic compound particles, the same silicone resin was treated as in Example 1. A sheet was obtained.

[Comparative Example 5]
The same treatment as in Example 1 was carried out except that 30 parts by mass of cerium oxide (specific gravity 7.1, average primary particle size 35 nm, hexamethyldisilazane (HMDS) surface treatment) was used as the inorganic compound particles, and a predetermined silicone resin A sheet was obtained.

[Comparative Example 6]
The same silicone resin was treated in the same manner as in Example 1 except that 30 parts by mass of ytterbium oxide (specific gravity 9.2, average primary particle size 25 nm, hexamethyldisilazane (HMDS) surface treatment) was used as the inorganic compound particles. A sheet was obtained.

[Comparative Example 7]
98 parts by mass of vinyl-terminated polydimethylsiloxane (manufactured by Gelest, trade name “DMS-V42”, mass average molecular weight 72,000), methylhydrosiloxane-dimethylsiloxane copolymer (manufactured by Gelest, trade name “HMS-301”, mass) 2 parts by mass (average molecular weight: 2,000, methylhydrosiloxane ratio: 27 mol%) were mixed in the same manner as in Example 1, and then thermally cured with a platinum catalyst in the same manner as in Example 1 to obtain a predetermined silicone resin sheet. It was.

<Evaluation of mechanical strength and ultrasonic characteristics>
The following evaluation was performed about the silicone resin sheet of Examples 1-17 and Comparative Examples 1-7.

[hardness]
About the obtained 2 mm-thick silicone resin sheet, according to JIS K6253-3 (2012), the type A durometer hardness was measured using the rubber hardness meter (the Excel company make, "RH-201A").

[Tensile test]
With respect to the obtained silicone resin sheet having a thickness of 1 mm, a dumbbell-shaped test piece was prepared according to JIS K6251 (2010), and the tensile breaking strength and the tensile breaking elongation were measured.

[Tear strength test]
About the obtained 2 mm-thick silicone resin sheet, a trouser type test piece was prepared according to JIS K6252 (2007), and tear strength was measured.

[Folding fatigue test]
With respect to the obtained silicone resin sheet having a thickness of 2 mm, according to the fold strength test method described in JIS P8115 (2001) -MIT test machine method, an MIT fold fatigue tester (manufactured by Toyo Seiki Seisakusho, model number: DA) Fracture resistance test was conducted using The test speed was 175 cpm, the bending angle was 135 degrees, the load was 19.6 N, and the bending clamp R was 2.0 mm.
“A” indicates that the material breaks when the number of bending is 5000 times or more, “B” indicates that the material breaks after 1000 times or more and less than 5000 times, “C” indicates that the material breaks 100 times or more and less than 1000 times, and breaks when less than 100 times The thing was made into "D".
Here, the evaluations “A” and “B” indicate that the fatigue resistance is considerably excellent, “C” indicates that it can be used, and “D” indicates that it cannot be used.

[Acoustic impedance]
For the obtained silicone resin sheet having a thickness of 2 mm, an electronic hydrometer (trade name, manufactured by Alpha Mirage Co., Ltd.) was used in accordance with the density measurement method of A method (underwater substitution method) described in JIS K7112 (1999). “SD-200L”). The ultrasonic sound velocity was measured at 25 ° C. using a sing-around sound velocity measuring device (trade name “UVM-2 type” manufactured by Ultrasonic Industry Co., Ltd.) according to JIS Z2353 (2003), and the measured density and sound velocity were measured. The acoustic impedance was obtained from the product.

[Acoustic wave (ultrasonic wave) sensitivity]
A 5 MHz sine wave signal (1 wave) output from an ultrasonic oscillator (Iwadori Measurement Co., Ltd., function generator, product name “FG-350”) is input to an ultrasonic probe (Japan Probe Co., Ltd.). Then, an ultrasonic pulse wave having a center frequency of 5 MHz was generated from the ultrasonic probe in water. The amplitude of the generated ultrasonic wave before and after passing through the obtained 2 mm thick silicone resin sheet is measured with an ultrasonic receiver (Matsushita Electric Industrial Co., Ltd., oscilloscope, trade name “VP-5204A”). Thus, the acoustic wave (ultrasonic wave) attenuation amount of each sheet was compared by measuring in an environment with a water temperature of 25 ° C. and comparing the acoustic wave (ultrasonic wave) sensitivity.
The acoustic wave (ultrasonic wave) sensitivity is a numerical value given by the following calculation formula.
In the following calculation formula, Vin represents a voltage peak value of an input wave having a half width of 50 nsec or less by an ultrasonic oscillator. Vs represents a voltage value obtained when the generated acoustic wave (ultrasonic wave) passes through the sheet and the ultrasonic oscillator receives the acoustic wave (ultrasonic wave) reflected from the facing surface of the sheet.

    Acoustic wave (ultrasound) sensitivity = 20 x Log (Vs / Vin)

The obtained results are summarized and shown in Tables 1 to 3 below.
In Tables 1 to 3 below, the mass average molecular weights of the polyorganosiloxanes (A) and (B) are simply described as molecular weights, and the name of each component is a trade name.

  As shown in Tables 1 to 3, the silicone resins for acoustic wave probes of Examples 1 to 17 all have high resin hardness, tensile breaking strength, tensile strength while maintaining an acoustic wave (ultrasonic wave) sensitivity of −72 dB or more. The elongation at break, tear strength and bending fatigue resistance could be obtained. On the other hand, none of the silicone resins for acoustic wave probes of Comparative Examples 1 to 7 obtained sufficient tensile elongation at break, tear strength, and bending fatigue resistance.

  This result shows that the composition for acoustic wave probes of this invention is useful for a medical member. The silicone resin of the present invention can also be suitably used for an acoustic lens and / or acoustic matching layer of an acoustic wave probe, an acoustic wave measuring device, and an ultrasonic diagnostic device. In particular, the composition for acoustic wave probes and the silicone resin for acoustic wave probes are used for the purpose of improving sensitivity in ultrasonic probes, photoacoustic wave measuring apparatuses and ultrasonic endoscopes using cMUT as a transducer array for ultrasonic diagnosis. It can be used suitably.

DESCRIPTION OF SYMBOLS 1 Acoustic lens 2 Acoustic matching layer 3 Piezoelectric element layer 4 Backing material 7 Case 9 Code 10 Ultrasonic probe (probe)

Claims (19)

A composition for an acoustic wave probe comprising a polysiloxane having a vinyl group, a polysiloxane having two or more Si-H groups in a molecular chain, and a polysiloxane mixture containing one or more inorganic compound particles,
When a silicone resin sheet having a thickness of 2 mm is obtained by heat treatment at 60 ° C. for 3 hours, the type A durometer hardness according to JIS K6253-3 (2012) of the silicone resin sheet is 15 or more and 45 or less,
The inorganic compound particles are selected from the group consisting of silicon carbide, boron nitride, alumina, barium sulfate and cerium oxide, and
The composition for an acoustic wave probe, wherein the inorganic compound particles have an average primary particle diameter of less than 25 nm and a specific gravity of 2.0 or more and 10.0 or less. A composition for an acoustic wave probe comprising a polysiloxane having a vinyl group, a polysiloxane having two or more Si-H groups in a molecular chain, and a polysiloxane mixture containing one or more inorganic compound particles,
The inorganic compound particles are selected from the group consisting of silicon carbide, boron nitride, alumina, barium sulfate and cerium oxide, and
The composition for an acoustic wave probe, wherein the inorganic compound particles have an average primary particle diameter of more than 3 nm and less than 15 nm and a specific gravity of 2.0 or more and 10.0 or less. The composition for acoustic wave probes according to claim 1 or 2 , wherein 10 to 60 parts by mass of inorganic compound particles having an average primary particle diameter of less than 25 nm are contained in a total of 100 parts by mass of the polysiloxane mixture. The composition for acoustic wave probes whose specific gravity of the inorganic compound particle of any one of Claims 1-3 is 3.5 or more and 10.0 or less. A composition for an acoustic wave probe, wherein the inorganic compound particles according to claim 4 are selected from the group consisting of alumina, barium sulfate and cerium oxide. The composition for acoustic wave probes whose specific gravity of the inorganic compound particle of any one of Claims 1-3 is 5.0 or more and 10.0 or less. The composition for acoustic wave probes whose inorganic compound particle | grains of Claim 6 are cerium oxide.   In a total of 100 parts by mass of the polysiloxane mixture, 10 to 99.4 parts by mass of the polysiloxane having the vinyl group and 0.5 to 90 polysiloxane having two or more Si—H groups in the molecular chain. The composition for acoustic wave probes of any one of Claims 1-7 containing a mass part.   The composition for acoustic wave probes according to any one of claims 1 to 8, wherein the inorganic compound particles having an average primary particle diameter of less than 25 nm are surface-treated with a silane compound.   The composition for acoustic wave probes according to any one of claims 1 to 9, wherein the polysiloxane having a vinyl group has a mass average molecular weight of 20,000 to 200,000.   The composition for acoustic wave probes according to any one of claims 1 to 10, wherein the polysiloxane having a vinyl group has a mass average molecular weight of 40,000 to 150,000.   The composition for acoustic wave probes of any one of Claims 1-11 containing 0.00001-0.05 mass part of platinum or a platinum compound with respect to 100 mass parts of said polysiloxane mixtures.   The silicone resin for acoustic wave probes which hardened the composition for acoustic wave probes of any one of Claims 1-12.   An acoustic wave probe having an acoustic lens made of the silicone resin for acoustic wave probes according to claim 13 and / or an acoustic matching layer made of the silicone resin for acoustic wave probes according to claim 13.   An ultrasonic probe comprising a capacitive micromachine ultrasonic transducer as an ultrasonic transducer array, and an acoustic lens comprising the silicone resin for acoustic probe according to claim 13.   An acoustic wave measuring apparatus comprising the acoustic wave probe according to claim 14.   An ultrasonic diagnostic apparatus comprising the acoustic probe according to claim 14.   A photoacoustic wave measuring apparatus comprising an acoustic lens comprising the silicone resin for an acoustic wave probe according to claim 13. An ultrasonic endoscope comprising an acoustic lens comprising the silicone resin for an acoustic wave probe according to claim 13.

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