JP6312472B2 - Sheet sticking device and sticking method - Google Patents

Description

  The present invention relates to a sheet sticking apparatus and a sticking method for sticking an adhesive sheet to an adherend.

2. Description of the Related Art Conventionally, there has been known a sheet sticking apparatus for sticking an adhesive sheet to an adherend such as a semiconductor wafer (hereinafter sometimes simply referred to as “wafer”) (for example, see Patent Document 1).
The sheet sticking device described in Patent Document 1 relatively moves the feeding means for feeding out the adhesive sheet, the pressing means for pressing the adhesive sheet against the adherend surface of the wafer (the adherend), and the adherend and the pressing means. Moving means, and the pressing force of the pressing means to the wafer is adjustable, and the pressing force of the pressing means is made uniform by sticking the adhesive sheet to the wafer by changing the pressing force depending on the part of the wafer. Yes.

JP 2002-134438 A

  However, since the conventional sheet sticking device as described in Patent Document 1 presses the entire adhesive sheet with a uniform pressing force, when the pressing force is increased, the stress acting on the adherend increases. When the pressing force is reduced, there is a disadvantage that the outer edge portion of the adhesive sheet floats from the adherend.

  An object of the present invention is to provide a sheet sticking apparatus and a sticking method capable of reducing stress acting on an adherend and preventing an outer edge portion of an adhesive sheet from floating from the adherend.

  The sheet sticking apparatus of the present invention includes a supply means for supplying an adhesive sheet, a pressing means for pressing and sticking the adhesive sheet supplied from the supply means to an adherend, the pressing means and the adherend. Moving means for relatively moving along the adherend surface of the adherend, and the pressing means gradually reduces the pressing force from one end of the adhesive sheet toward the central portion, and the central portion of the adhesive sheet. A pressing force changing operation for gradually increasing the pressing force toward the other end, and a first pressing operation for performing the pressing force changing operation while relatively moving in the first sticking direction by the moving means; A second pressing operation for performing the pressing force changing operation is performed while relatively moving in a second pasting direction intersecting the first pasting direction.

  It is preferable that the sheet sticking device of the present invention includes an adhesive force increasing means for increasing the adhesive force of the outer edge portion of the adhesive sheet.

  The sheet sticking method of the present invention includes a step of supplying an adhesive sheet, a pressing means for pressing the supplied adhesive sheet against the adherend, and the adherend along the adherend surface of the adherend. The pressing force of the pressing means is gradually decreased from one end of the adhesive sheet toward the central portion while being relatively moved in the first sticking direction, and the pressing force is gradually decreased toward the other end from the central portion of the adhesive sheet. A first pressing step for performing a pressing force changing operation for increasing the pressure, and the relative movement of the pressing means and the adherend along the adherend surface in a second pasting direction intersecting the first pasting direction, A second pressing step for performing the pressing force changing operation is performed.

  According to the present invention as described above, since the pasting operation for performing the pressing force changing operation is performed in a plurality of different directions, the pressing force of the entire outer edge portion of the adhesive sheet is kept small while the pressing force of the central portion of the adhesive sheet is kept small. Can be increased. For this reason, the stress which acts on a to-be-adhered body can be reduced, and it can prevent that the outer edge part of an adhesive sheet floats from an to-be-adhered body.

  Further, if the adhesion increasing means is provided, the outer edge portion of the adhesive sheet can be brought into close contact with the adherend, so that the outer edge portion of the adhesive sheet can be more reliably prevented from floating from the adherend. it can.

The side view of the sheet sticking apparatus which concerns on one Embodiment of this invention. Operation | movement explanatory drawing of a sheet sticking apparatus.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
In the present embodiment, for example, when a direction such as up, down, left, right, front, or back is shown without giving a reference figure, all of FIG. The direction from which the image is viewed in the appropriate direction) is the direction in which the top, bottom, left, and right directions are parallel to the page, the front is the front direction perpendicular to the page, and the back is the back side orthogonal to the page. The direction.

  In FIG. 1, a sheet sticking apparatus 10 includes a supply means 20 for supplying an adhesive sheet AS, a pressing means 30 for pressing and sticking the adhesive sheet AS supplied from the supply means 20 to a wafer WF as an adherend, Moving means 40 for relatively moving the pressing means 30 and the wafer WF along the adherend surface WF1 of the wafer WF, an adhesive force increasing means 50 for increasing the adhesive force of the outer edge portion of the adhesive sheet AS, and the outer edge of the adhesive sheet AS And an adhesive strength reducing means 60 for reducing the adhesive strength inside the portion. Note that a pattern WF2 such as a plurality of bumps and circuits is provided on the adherend surface WF1.

  The supply means 20 is a support roller that supports an original fabric RS in which an adhesive sheet AS having an adhesive AD layer on one surface of the base material BS is temporarily attached to one surface of the release sheet RL via the adhesive AD layer. 21, a plurality of guide rollers 22 for guiding the raw fabric RS, a peeling plate 23 as a peeling means for folding the peeling sheet RL and peeling the adhesive sheet AS from the peeling sheet RL, and a rotation motor 24A as a driving device Are provided with a pinch roller 25 that sandwiches the release sheet RL between the drive roller 24 and the recovery roller 26 that recovers the release sheet RL, and the whole is supported by the frame 27.

  The pressing means 30 is a pressing force adjusting means for adjusting the pressing force, and is a linear motion motor 31 as a driving device and a pressure member as a pressing member supported by an output shaft 31A of the linear motion motor 31 via a bracket 32. A roller 33 and a detection means (not shown) such as a pressure sensor and a load cell for detecting the pressing force of the pressing roller 33 are provided. The rotational axis of the pressing roller 33 is directed in a direction perpendicular to the relative movement direction of the wafer WF and the pressing roller 33.

  The moving means 40 is supported by a linear motor 41 as a driving device, a rotating motor 42 as a driving device supported by a slider 41A of the linear motor 41, and an output shaft 42A of the rotating motor 42, and is used as a decompression pump or a vacuum. And a table 43 having a holding surface 43A capable of sucking and holding the wafer WF by decompression means (not shown) such as an ejector.

  The adhesive force increasing means 50 includes a heating means 51 such as a coil heater or an infrared heater provided at the outer edge of the table 43, and is annularly arranged at a position corresponding to the outer edge of the adhesive sheet AS attached to the wafer WF. Has been.

  The adhesive force reducing means 60 includes a cooling means 61 such as a Peltier element provided on the inner side of the heating means 51 or the cooling side of the heat pipe, and is disposed at a position corresponding to the region where the pattern WF2 is formed.

In the sheet sticking apparatus 10 described above, a procedure for sticking the adhesive sheet AS to the wafer WF will be described.
First, the raw fabric RS is set as shown in FIG. Then, when an operation start signal is input via an input unit such as an operation panel or a personal computer (not shown), the supply unit 20 drives the rotation motor 24A to feed out the original fabric RS. Next, when a detection unit (not shown) such as an optical sensor or an imaging unit detects that the leading adhesive sheet AS positioned on the peeling plate 23 has reached a predetermined position, the supply unit 20 stops driving the rotation motor 24A. The sheet sticking device 10 is in a standby state. Then, when a wafer WF is placed on the table 43 such that a transfer means (not shown) such as a manual or multi-joint robot or a belt conveyor places the adherend surface WF1 upward as shown by a two-dot chain line in FIG. The moving means 40 drives a decompression means (not shown), and holds the wafer WF by suction with the holding surface 43A. Then, the adhesion increasing means 50 drives the heating means 51 to heat the outer edge of the wafer WF, and the adhesion reducing means 60 drives the cooling means 61 to cool the central part of the wafer WF.

  Next, the moving means 40 drives the linear motor 41 to move the table 43 leftward. When the detection means (not shown) such as an optical sensor or an imaging means detects that the wafer WF has reached a predetermined position below the supply means 20, the supply means 20 synchronizes with the movement of the table 43 and rotates the motor 24 </ b> A. To feed out the original fabric RS. As a result, the adhesive sheet AS is peeled off from the release sheet RL by the release plate 23, and as shown in FIG. 2A, the wafer WF moves in the left direction, which is the first sticking direction WX, and the pressing roller 33 A first pressing operation for pressing and adhering the adhesive sheet AS to the wafer WF is performed. Note that when a detection unit (not shown) detects that the next adhesive sheet AS has reached a predetermined position, the supply unit 20 stops driving the rotation motor 24A, and the sheet sticking device 10 is again in a standby state.

  Here, in the first pressing operation, the pressing means 30 drives the linear motion motor 31 to gradually reduce the pressing force from one end (left end) of the adhesive sheet AS toward the central portion, and in the central portion of the adhesive sheet AS. The pressing force is set to a second pressing force that is smaller than the first pressing force at one end of the adhesive sheet AS, and then the pressing force is gradually increased from the central portion to the other end (right end) of the adhesive sheet AS. Then, a pressing force changing operation is performed in which the pressing force at the other end of the adhesive sheet AS is the first pressing force (the black portion in FIG. 2A is a portion where the pressing force is high).

  Thereafter, when the table 43 moves to the position indicated by the solid line in FIG. 1, the moving means 40 stops driving the linear motor 41, and then drives the rotation motor 42. As shown in FIG. Is rotated counterclockwise by a predetermined angle θ (90 degrees in this embodiment). Then, the moving means 40 drives the linear motor 41 and the pressing means 30 drives the linear motor 31 while moving the table 43 in the right direction which is the second pasting direction WY intersecting the first pasting direction WX. The same pressing force changing operation as described above is performed, and the pressing roller 33 performs the second pressing operation of pressing the adhesive sheet AS again on the wafer WF to stick (the black portion in FIG. 2B is a portion where the pressing force is high). . As a result, the adhesive sheet AS peeled from the release sheet RL is pressed against the wafer WF with a pressing force that gradually increases from the center to the outer edge as shown by the black part on the right side in FIG. Become. At this time, since the outer edge portion of the wafer WF is heated by the heating means 51, the adhesive force of the outer edge portion of the adhesive sheet AS increases. Thereby, since the outer edge part of adhesive sheet AS can be stuck to wafer WF, it can prevent reliably that the outer edge part of adhesive sheet AS floats from wafer WF. Further, since the region where the pattern WF2 is formed on the wafer WF is cooled by the cooling means 61, the adhesive force of the adhesive sheet AS corresponding to the region is reduced. As a result, the adhesive sheet AS can be prevented from sticking to the pattern WF2, and when the adhesive sheet AS is peeled from the wafer WF, the pattern WF2 is peeled off, or the adhesive residue of the adhesive AD layer is left on the pattern WF2. It is possible to suppress the occurrence.

  Then, after the table 43 has moved to the position indicated by the two-dot chain line in FIG. 1 and the moving means 40 has stopped driving the linear motor 41 and the decompressing means (not shown), the manual or conveying means (not shown) moves the wafer WF to the next process. Thereafter, the same operation is repeated.

  According to the embodiment as described above, since the pasting operation for performing the pressing force changing operation is performed in a plurality of different directions, the pressing force at the central portion of the adhesive sheet AS is kept small, and the entire outer edge portion of the adhesive sheet AS is reduced. The pressing force can be increased. For this reason, the stress which acts on the wafer WF can be reduced, and the outer edge portion of the adhesive sheet AS can be prevented from floating from the wafer WF.

  As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description of the shape, material, and the like disclosed above is exemplary for ease of understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of some or all of such restrictions is included in this invention.

For example, as shown by AA in FIG. 1, the pressing unit 30 is supported by a linear motor 31, a pressing roller 33, and a slider 44 </ b> A of a linear motor 44 as a driving device that constitutes a part of the moving unit 40. A linear motion motor 34 as a drive device and a pressing roller 36 as a pressing member supported by an output shaft 34A of the linear motion motor 34 via a bracket 35 may be provided. In this case, the rotation motor 42 can be omitted. Further, the rotational axis of the pressing roller 36 may be directed in a direction parallel to the relative movement direction of the wafer WF and the pressing roller 36, or may be directed in a direction obliquely intersecting the relative movement direction.
Furthermore, the pressing means 30 can employ a pressing member made of a blade material, rubber, resin, sponge, or the like.

The moving means 40 may move the supply means 20 and the pressing means 30 while fixing the table 43, or may move the table 43, the supply means 20, and the pressing means 30. Furthermore, after rotating the table 43 by a predetermined angle θ, the table 43 may be fixed and the supply unit 20 and the pressing unit 30 may be moved in the left direction.
Further, the predetermined angle θ for rotating the table 43 can be arbitrarily determined, for example, 1 degree, 30 degrees, 45 degrees, 60 degrees, etc., and the pressing means 30 applies the adhesive sheet AS in accordance with the predetermined angle θ. The operation may be performed three times or more. For example, after the second pressing operation, the table 43 is rotated 45 degrees counterclockwise to perform the third pressing operation, and then the table 43 is rotated 90 degrees clockwise to perform the fourth pressing operation. As shown in FIG. 2 (C), the pressing force can be increased along the outer edge portion of the adhesive sheet AS (the black portion in FIG. 2 (C) is a portion where the pressing force is high). Thus, if the predetermined angle θ is set finely and the pressing operation is increased, a region where the adhesive force of the adhesive sheet AS is increased can be formed along the outer edge portion of the adhesive sheet AS.
Further, the table 43 includes, for example, a so-called hollow table that is provided with a recess in the holding surface 43A and can hold only the outer edge portion of the wafer WF, an outer edge table that holds the outer edge portion of the wafer WF, and a central table that holds the center portion. The above-described pressing operation may be performed in a state where the wafer WF is bent so that the outer edge portion of the wafer WF before the adhesive sheet AS is attached is located closer to the pressing member than the center portion. You may go.

Further, the adhesive force increasing means 50 and the adhesive force reducing means 60 may be provided separately from the table 43, for example, may be provided in the pressing rollers 33 and 36.
Further, the adhesive force increasing means 50 and the adhesive force reducing means 60 are configured by irradiation means for irradiating energy rays such as ultraviolet rays, infrared rays, and microwaves in consideration of the characteristics of the adhesive sheet AS, vibrators, ultrasonic vibration devices, and the like. May be. The adhesive force increasing means 50 may be constituted by the cooling means 61, and the adhesive force reducing means 60 may be constituted by the heating means 51.
Further, the adhesive force reducing means 60 may reduce a part of the adhesive force inside the outer edge portion of the adhesive sheet AS, and is provided only in the vicinity of the outer edge portion without being provided in the central portion in the table 43. Alternatively, it may be provided only in the central portion without being provided in the vicinity of the outer edge portion.

  Moreover, the supply means 20 may be provided with the recessed part formation means which forms a recessed part in the center part of adhesive sheet AS temporarily attached to peeling sheet RL, and the said recessed part means is the base material BS and / or adhesion | attachment, for example. The adhesive sheet AS may be ground or pressed from the agent AD layer side to form a recess in the adhesive sheet AS.

  Further, the material, type, shape and the like of the adhesive sheet AS and the adherend in the present invention are not particularly limited. For example, the adhesive sheet AS may be a circle, an ellipse, a polygon such as a triangle or a quadrangle, or other shapes, or may be of an adhesive form such as pressure sensitive adhesive or heat sensitive adhesive, When the heat-sensitive adhesive sheet AS is employed, it may be bonded by an appropriate method such as providing a heating means such as an appropriate coil heater or heat pipe for heating the adhesive sheet AS. Also, the adhesive sheet AS is, for example, a single layer having only an adhesive AD layer, an adhesive layer having an intermediate layer between the base material BS and the adhesive AD layer, or an adhesive AD layer at a position corresponding to the pattern WF2. Three or more layers such as a part or all of which is removed, a cover layer on the upper surface of the base material BS, and a so-called double-sided adhesive sheet that can peel the base material BS from the adhesive AD layer The double-sided adhesive sheet may have a single layer or a multi-layer intermediate layer, or may be a single layer or a multi-layer without an intermediate layer. Examples of the adherend include, for example, foods, resin containers, semiconductor wafers such as silicon semiconductor wafers and compound semiconductor wafers, circuit board, information recording substrates such as optical disks, glass plates, steel plates, ceramics, wood plates or resin plates, Arbitrary forms of members and articles can be targeted, and the adherend may be composed of a semiconductor wafer and an annular frame. In addition, the adhesive sheet AS is replaced with a functional and intended reading, for example, any information label, decorative label, protective sheet, dicing tape, die attach film, die bonding tape, recording layer forming resin sheet, etc. Arbitrary sheets, films, tapes and the like can be attached to any adherend as described above.

The means and steps in the present invention are not limited in any way as long as they can perform the operations, functions, or steps described with respect to those means and steps. The process is not limited at all. For example, the supply means is not limited insofar as it can supply an adhesive sheet in light of the common general technical knowledge at the time of filing, and is within the technical scope (for other means and processes). (Description is omitted).
The drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single axis robot, an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to these, a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).

DESCRIPTION OF SYMBOLS 10 Sheet sticking apparatus 20 Supply means 30 Press means 40 Moving means AS Adhesive sheet WF Wafer (Substrate)
WF1 Adhering surface WX First application direction WY Second application direction

Claims (3)

Supply means for supplying an adhesive sheet;
A pressing unit that presses and adheres the adhesive sheet supplied from the supplying unit to the adherend;
A moving means for relatively moving the pressing means and the adherend along the adherend surface of the adherend;
The pressing means can perform a pressing force changing operation that gradually decreases the pressing force from one end of the adhesive sheet toward the central portion and gradually increases the pressing force from the central portion to the other end of the adhesive sheet. Provided,
A first pressing operation for performing the pressing force changing operation while relatively moving in the first sticking direction by the moving means;
A sheet pasting apparatus that performs a second pressing operation for performing the pressing force changing operation while relatively moving in a second pasting direction that intersects the first pasting direction.   The sheet sticking apparatus according to claim 1, further comprising: an adhesive force increasing unit that increases an adhesive force of an outer edge portion of the adhesive sheet. Supplying an adhesive sheet;
One end of the adhesive sheet while relatively moving the pressing means for pressing and feeding the supplied adhesive sheet to the adherend and the adherend along the adherend surface of the adherend in the first sticking direction A first pressing step of performing a pressing force changing operation for gradually decreasing the pressing force of the pressing means as it goes from the central portion to the other end, and gradually increasing the pressing force from the central portion to the other end of the adhesive sheet;
Performing a second pressing step of performing the pressing force changing operation while relatively moving the pressing means and the adherend in a second sticking direction intersecting the first sticking direction along the adherend surface. The sheet sticking method characterized by this.